CN110165042B - Transparent LED display screen with metal mesh wires - Google Patents
Transparent LED display screen with metal mesh wires Download PDFInfo
- Publication number
- CN110165042B CN110165042B CN201910584159.5A CN201910584159A CN110165042B CN 110165042 B CN110165042 B CN 110165042B CN 201910584159 A CN201910584159 A CN 201910584159A CN 110165042 B CN110165042 B CN 110165042B
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- Prior art keywords
- display screen
- led
- fine
- structure metal
- metal grid
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 48
- 239000002184 metal Substances 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000005516 engineering process Methods 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 8
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 238000002834 transmittance Methods 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a transparent LED display screen with metal mesh wires, which comprises the following specific schemes: the LED display device comprises a transparent substrate, wherein a fine-structure metal grid wire is fixedly connected to the transparent substrate, a plurality of LED chips are fixedly connected to the fine-structure metal grid wire, the LED chips form an array according to a certain arrangement mode, and the fine-structure metal grid wire is connected with an FPC connector. Wherein the metal mesh grid wire adopts silver or other metal conductive materials with lower resistivity. The fine structure metal grid has low impedance and good conductivity, and can improve the density of LED chips in unit area, thereby improving the resolution of the display screen. At present, the high transparency of the display screen can be realized under the condition of ensuring the micron-sized line width and the high duty ratio of the grid, thereby ensuring the display effect of the multimedia advertisement.
Description
Technical Field
The invention relates to the technical field of electronic display screens, in particular to a transparent LED display screen with metal mesh grid wires.
Background
At present, the technology of a transparent LED display screen is gradually perfected in development, and the transparent LED display screen mainly comprises a substrate with high transparency, an ITO conductive film and an embedded LED chip. The LED chip is connected and electrified on the ITO conductive film by a laser etching method, and the technology is a core technology of the transparent LED display screen. Due to the technical limitation of etched wires and the problem of impedance of the etched wires, the density of LED chips in unit area is smaller, and the resolution of the LED display screen is lower. Meanwhile, because the ITO material is rare and has high cost, an alternative technology needs to be developed to reduce the technical cost, but leads made of various materials cannot achieve low impedance and high light transmittance, and the media advertising effect of the transparent LED display screen cannot be ensured.
Disclosure of Invention
According to the problems existing in the prior art, the invention discloses a transparent LED display screen with metal mesh wires, which comprises the following specific schemes: the LED display device comprises a transparent substrate, wherein a fine-structure metal grid wire is fixedly connected to the transparent substrate, a plurality of LED chips are fixedly connected to the fine-structure metal grid wire, the LED chips form an array according to a certain arrangement mode, and the fine-structure metal grid wire is connected with an FPC connector. The micro-structure metal grid wires are connected in and out through the FPC connectors, and the FPC connectors (4) are arranged at the upper end and the lower end of the display screen.
The fine structure metal grid wire is a transparent conductive film, the surface of the grid is discontinuous, the line width of a single grid needs to be controlled at the micron level, and the grid can be square, circular or hexagonal.
The sheet resistance of the fine structure metal grid wire is inversely proportional to the grid line width, and the light transmittance is inversely proportional to the grid line width. Under the consideration, the line width and the line spacing of the grid are usually required to be designed, so that the duty ratio under the microstructure is ensured to be as high as possible; the sheet resistance of the sample of the metal mesh transparent conductive film is controlled to be as low as possible, and the transmittance of ultraviolet and visible wave bands and the transmittance of infrared wave bands are ensured to be high. Thereby ensuring low impedance and high light transmittance of the metal mesh transparent conductive film.
Furthermore, the fine-structure metal grid wires can be laid on the transparent substrate by adopting a micron printing technology or a micron etching technology.
Furthermore, the transparent substrate can be made of transparent materials such as glass, acrylic plates, flexible transparent films and the like.
Furthermore, the pins of the LED chip and the wires required between the LED chip and the FPC connector are connected by using a micro-structure metal mesh wire, and the wiring mode is a specific wiring mode according to the requirements of the display screen. Meanwhile, the arrangement of the positions of the LED chips is set according to the requirements of the LED display screen.
Further, a layer of transparent filling glue is coated on the LED chip, so that the filling effect is achieved, and a certain insulation protection effect is achieved, so that the upper surface of the LED chip is smooth and clean.
Further, a transparent protective plate or film is paved on the protective adhesive, and the material of the protective plate or film is determined according to actual needs, so that the protective adhesive mainly plays a role in protecting, and the influence on the usability due to direct exposure to air is avoided.
Due to the adoption of the technical scheme, the transparent LED display screen with the metal mesh wire solves the problem that the ITO film applied to the transparent LED display screen is high in cost, the resolution of the display screen can be improved, meanwhile, the performance of an LED chip is guaranteed, the high transparency of the display screen is realized, and therefore the multimedia advertisement presentation effect is guaranteed. The invention is suitable for transparent LED display screens made of various materials, the materials of the display screens can be transparent materials such as glass, acrylic plates, flexible transparent films and the like, the universality is strong, and the advantages of the LED display screens made of various materials can be inherited.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a transparent LED display screen with metal mesh wires according to the present invention;
FIG. 2 is a schematic diagram of the internal structure of an LED display screen (4×4) according to the present invention;
fig. 3 is an enlarged schematic view of a fine-structured square-grid metal wire according to the present invention.
Detailed Description
In order to make the technical scheme and advantages of the present invention more clear, the technical scheme in the embodiment of the present invention is clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention:
the transparent LED display screen with the metal grid wires is shown in fig. 1, and the structure mainly comprises a transparent substrate 1, a microstructure metal grid wire 2, an LED chip 3 and an FPC connector 4. The figure is a schematic diagram of an LED display screen at 8 x 8 resolution, with the arrangement of each module shown.
The transparent substrate 1 can be made of transparent materials such as glass, acrylic plates, flexible transparent films and the like; the fine structure metal grid wire 2 needs to control the grid line width to be in a micron level, and the grid shape can be square grid, circular ring, hexagon and the like; the LED chips 3 are a plurality of and form an array according to a certain arrangement mode; the fine structure metal mesh wire 2 is connected in and out by the FPC connector.
Further, a fine-structure metal grid wire 2 is laid on the transparent substrate 1, and the fine-structure metal grid wire 2 can adopt a micron printing technology or a micron etching technology to control a single grid wire at a micron level, and the line width of the single grid wire exceeds the visual resolution of human eyes, so that a transparent conductive film with low impedance and high light transmittance is formed.
As shown in fig. 2, the internal structure of the LED display screen (4×4) is schematically shown, and wires required between the pins of the LED chip 3 and between the LED chip 3 and the FPC connector 4 are connected by using metal mesh wires, and in this figure, a half-path serpentine wire is adopted as the wiring mode to reduce the wiring length. The wires are connected in and out by FPC connectors, and FPC connectors 4 are arranged at the upper end and the lower end of the display screen.
As shown in fig. 3, which is an enlarged schematic view of the fine-structured square metal grid wire, the surface of the grid is discontinuous, has high light transmittance, the width of single grid lines is controlled at the micron level, i.e. most of the area of the surface of the wire is empty, no metal is contained, and only the place of the grid lines is electrified. The design and fabrication of the fine-structured metal mesh grid wires is typically presented on a transparent substrate by micro-printing or etching techniques.
The fine structure metal grid is square, the square resistance of the metal grid is inversely proportional to the width of the grid, and the light transmittance is inversely proportional to the width of the grid. In this regard, the grid line width is usually 5 μm, the grid line spacing is 350 μm, and the duty ratio under microstructure ((grid line spacing-2×grid line width) 2 /(mesh wire spacing) 2 ) More than 90 percent. The square resistance of the sample wafer of the given square lattice-shaped metal mesh transparent conductive film is 2.1 omega/sq, the transmittance of the ultraviolet visible wave band is up to 90%, and the transmittance of the infrared wave band is still above 88%. And the transparent conductive film of ITO with better manufacture can realize the light transmittance of more than 90 percent and the film resistance approaching 10 omega/sq. Compared with the ITO transparent conductive film, the square grid-shaped metal grid transparent conductive film achieves the effect of low impedance and high light transmittance.
Further, the LED chip 3 is adhered to the fine structure metal mesh wire through a sticky transparent colloid, the placement position of the LED chip 3 is shown in fig. 2, the LED chip controlled by the FPC connector 4 at the upper end of the display screen is placed in the forward direction, and the LED chip controlled by the FPC connector 4 at the lower end of the display screen is required to rotate 180 degrees and is placed upside down.
Further, a layer of transparent filling glue is coated on the LED chip 3, so that the filling effect is achieved, and a certain insulation protection effect is achieved, so that the upper surface of the LED chip 3 is smooth and clean.
Further, a transparent protective plate or film is paved on the protective adhesive, and the material of the protective plate or film is determined according to actual needs, so that the protective adhesive mainly plays a role in protecting, and the influence on the usability due to direct exposure to air is avoided.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (1)
1. A transparent LED display screen of metal mesh wire, characterized by comprising: the LED display screen comprises a transparent substrate (1), wherein a fine structure metal grid wire (2) is fixedly connected to the transparent substrate (1), a plurality of LED chips (3) are fixedly connected to the fine structure metal grid wire (2), the LED chips (3) form an LED array according to a certain arrangement mode, the fine structure metal grid wire (2) is connected with FPC connectors (4), the FPC connectors (4) are arranged at the upper end and the lower end of the LED display screen, and the fine structure metal grid wire (2) is LED in and LED out through the FPC connectors (4);
the micro-structure metal grid wire (2) is paved on the transparent substrate (1) by adopting a micro-printing technology or a micro-etching technology, and the micro-structure metal grid wire (2) controls the line width of the grid at a micro-level, wherein the shape of the grid is square, circular or hexagonal;
the transparent substrate (1) is made of glass, an acrylic plate or a flexible transparent film;
the LED display device is characterized in that pins of the LED chip (3) and the LED chip (3) are connected with the FPC connector (4) through fine-structure metal grid wires (2), wiring modes of the fine-structure metal grid wires (2) are set according to requirements of a display screen, and positions of the LED chip (3) are set according to the requirements of the display screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910584159.5A CN110165042B (en) | 2019-06-28 | 2019-06-28 | Transparent LED display screen with metal mesh wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910584159.5A CN110165042B (en) | 2019-06-28 | 2019-06-28 | Transparent LED display screen with metal mesh wires |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110165042A CN110165042A (en) | 2019-08-23 |
| CN110165042B true CN110165042B (en) | 2024-01-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910584159.5A Active CN110165042B (en) | 2019-06-28 | 2019-06-28 | Transparent LED display screen with metal mesh wires |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110796956A (en) * | 2019-11-15 | 2020-02-14 | 大连集思特科技有限公司 | Flexible transparent display screen and manufacturing method thereof |
| CN111785206A (en) * | 2020-08-13 | 2020-10-16 | 大连集思特科技有限公司 | Wearable flexible transparent display system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585629A (en) * | 2018-11-21 | 2019-04-05 | 大连集思特科技有限公司 | A kind of LED display and preparation method thereof of transparent membrane composition |
| CN209843749U (en) * | 2019-06-28 | 2019-12-24 | 大连集思特科技有限公司 | Transparent LED display screen of metal mesh grid wire |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104503617B (en) * | 2014-12-26 | 2017-10-13 | 合肥鑫晟光电科技有限公司 | Border structure and its manufacture method, the touch-screen and display device of touch-screen |
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2019
- 2019-06-28 CN CN201910584159.5A patent/CN110165042B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585629A (en) * | 2018-11-21 | 2019-04-05 | 大连集思特科技有限公司 | A kind of LED display and preparation method thereof of transparent membrane composition |
| CN209843749U (en) * | 2019-06-28 | 2019-12-24 | 大连集思特科技有限公司 | Transparent LED display screen of metal mesh grid wire |
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| Publication number | Publication date |
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| CN110165042A (en) | 2019-08-23 |
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