CN110165042A - A kind of transparency LED display screen of metallic mesh conducting wire - Google Patents
A kind of transparency LED display screen of metallic mesh conducting wire Download PDFInfo
- Publication number
- CN110165042A CN110165042A CN201910584159.5A CN201910584159A CN110165042A CN 110165042 A CN110165042 A CN 110165042A CN 201910584159 A CN201910584159 A CN 201910584159A CN 110165042 A CN110165042 A CN 110165042A
- Authority
- CN
- China
- Prior art keywords
- conducting wire
- metallic mesh
- display screen
- fine structure
- mesh conducting
- Prior art date
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000005516 engineering process Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003079 width control Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses a kind of transparency LED display screens of metallic mesh conducting wire, concrete scheme includes: transparent substrate, is fixedly connected with fine structure metallic mesh conducting wire on the transparent substrate, multiple LED chips are fixedly connected on the fine structure metallic mesh conducting wire, the multiple LED chip forms array according to certain arrangement mode, and the fine structure metallic mesh conducting wire is connected with the FPC connector.Wherein metallic mesh conducting wire is using the lower silver of resistivity or other metal conductive materials.The fine structure metallic mesh has Low ESR and good electric conductivity, LED chip density in unit area can be improved, to improve the resolution ratio of display screen.The high grade of transparency of display screen can be realized when guaranteeing grid micron order line width and high duty ratio in currently available technology, to ensure that effect is presented in multimedia advertising.
Description
Technical field
The present invention relates to electronic display technical field more particularly to a kind of transparency LED display screens of metallic mesh conducting wire.
Background technique
Currently, transparency LED display screen technology, in development, transparency LED display screen technology is gradually improved, and transparency LED is shown
Screen is mainly made of the LED chip three parts of the substrate of the high grade of transparency, ITO conductive film, insertion.Wherein on ITO conductive film
LED chip is connected with the method for laser ablation and is powered, and the technology is the core technology of transparency LED display screen.Due to being carved
The technical restriction and etching conductor impedance problem for losing conducting wire, cause LED chip density in unit area smaller, LED display point
Resolution is lower.Simultaneously because ITO material itself is rare, higher cost needs to develop substitute technology to reduce technical costs, but each
The conducting wire of kind material can not all accomplish Low ESR, high transparency, not can guarantee the media advertisement effect of transparency LED display screen.
Summary of the invention
According to problem of the existing technology, the invention discloses a kind of transparency LED display screen of metallic mesh conducting wire, tools
Body scheme includes: transparent substrate, is fixedly connected with fine structure metallic mesh conducting wire, the fine structure on the transparent substrate
Multiple LED chips are fixedly connected on metallic mesh conducting wire, the multiple LED chip forms array according to certain arrangement mode,
The fine structure metallic mesh conducting wire is connected with the FPC connector.Fine structure metallic mesh conducting wire is connected by the FPC
It connects device access and picks out, FPC connector (4) is arranged in display screen upper and lower ends.
The fine structure metallic mesh conducting wire is a kind of transparent conductive film, and the surface of grid is discontinuous, need
The control of single grid line width is other in the micron-scale, and mesh grid shape can be the shapes such as grid, annulus or hexagon.
The fine structure metallic mesh conducting wire sheet resistance is inversely proportional with grid line width, and light transmittance is inversely proportional with grid line width.
Under it is considered herein that, it usually needs design grid grid line is wide and net grating spacing, guarantees that duty ratio is as high as possible under micro-structure；Control gold
The print sheet resistance for belonging to grid transparent conductive film is as low as possible, guarantees that UV, visible light wave band transmitance and infrared band transmitance are high.
To guarantee Low ESR, the high transparency of metallic mesh transparent conductive film.
Further, micron printing technology can be used in the fine structure metallic mesh conducting wire or micron etching skill is laid on
On transparent substrate.
Further, the transparent substrate can be using transparent materials such as glass, acrylic board, flexible transparent films.
Further, required line is used between the pin of the LED chip and between LED chip and FPC connector
Fine structure metallic mesh conducting wire connects, and cabling mode is that specific cabling mode is arranged according to display screen demand.Together
The arrangement of Shi Suoshu LED chip position, goes to set according to needed for LED display.
Further, layer of transparent is applied on the LED chip and fill glue, play the effect of filling, also play certain insulation
The effect of protection, so that smooth bright and clean above LED chip.
Further, transparent protection board or film are laid on protective glue, determine according to actual needs protection board or film
Material, mainly shield, avoid being directly exposed to air, influence service performance.
By adopting the above-described technical solution, a kind of transparency LED display screen of metallic mesh conducting wire provided by the invention, it should
Display screen solves the problems, such as that the ito thin film applied in transparency LED display screen is at high cost, which can be improved display screen
Resolution ratio, while guaranteeing the performance of LED chip again, the display screen high grade of transparency is realized, to ensure that effect is presented in multimedia advertising
Fruit.The present invention is suitable for the transparency LED display screen of various materials, and the material of display screen can be glass, acrylic board, flexibility thoroughly
The transparent materials such as bright film, versatile, the advantages of LED display of all kinds of materials can be inherited.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in application, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the transparency LED display screen structure schematic diagram of metallic mesh conducting wire of the present invention；
Fig. 2 is LED display (4 × 4) schematic diagram of internal structure of the invention；
Fig. 3 is the enlarged diagram of fine structure criss-cross metallic mesh conducting wire of the invention.
Specific embodiment
To keep technical solution of the present invention and advantage clearer, with reference to the attached drawing in the embodiment of the present invention, to this
Technical solution in inventive embodiments carries out clear and complete description:
A kind of transparency LED display screen of metallic mesh conducting wire as shown in Figure 1, the structure is mainly by transparent substrate 1, fine
Structural metal grid conducting wire 2, LED chip 3 and FPC connector 4.The figure is with the schematic diagram of the LED display of 8 × 8 resolution ratio, often
The permutation and combination method of one module is as shown in the figure.
The transparent substrate 1 can be the transparent materials such as glass, acrylic board, flexible transparent film；Described is fine
Structural metal grid conducting wire 2 need by grid line width control it is other in the micron-scale, grid shape can be grid, annulus, hexagon
Etc. shapes；The LED chip 3 have it is multiple, according to certain arrangement mode formed array；Fine structure metallic mesh conducting wire 2 by
FPC connector is accessed and is picked out.
Further, fine structure metallic mesh conducting wire 2, the fine structure metallic mesh are laid on transparent substrate 1
Micron printing technology or micron lithographic technique can be used in conducting wire 2, and single grid line traffic control is other in the micron-scale, single grid line
Line width exceeds human eye vision resolution ratio, to form transparent Low ESR high transparency conductive film.
As shown in Fig. 2 LED display (4 × 4) schematic diagram of internal structure, will be between the pin of LED chip 3 and LED
Required line is connected with metallic mesh conducting wire between chip 3 and FPC connector 4, and cabling mode is using half in the figure
Journey serpentine fashion, to reduce length of arrangement wire.Conducting wire is accessed and is picked out by FPC connector, and FPC connector 4 is arranged in display screen
Upper and lower ends.
As shown in Fig. 3 the enlarged diagram of fine structure criss-cross metallic mesh conducting wire, the surface of grid are not connect
Continuous, there is high light transmittance, single grid line thickness control is other in the micron-scale, i.e., conductive line surfaces major part region is sky, no
It is switched on comprising metal, the place of only grid lines.The design and fabrication of fine structure metallic mesh conducting wire is usually logical
It crosses micron printing or lithographic technique is presented on the transparent substrate.
The fine structure metallic mesh grid form made in the present invention, metallic mesh sheet resistance is with grid line width at anti-
Than light transmittance is inversely proportional with grid line width.Under it is considered herein that, usually taking grid line width is 5 μm, and net grating spacing is 350 μm, micro-
Duty ratio ((net -2 × grid of grating spacing line width) under structure2/ (net grating spacing)2) 90% or more.Given criss-cross gold
Belong to 2.1 Ω of print sheet resistance/sq of grid transparent conductive film, UV, visible light wave band transmitance is up to 90%, infrared band transmitance
Still 88% or more.And it makes preferable ITO nesa coating and 90% or more light transmittance may be implemented and close to 10 Ω/sq
Film resistor.Compared to ITO nesa coating, criss-cross metallic mesh transparent conductive film realizes Low ESR, high transparency
Effect.
Further, LED chip 3 is adhered into fine structure metallic mesh conducting wire by the colloidal objects for having viscosity transparent
Above, the placement location of LED chip 3 is as shown in Fig. 2, the LED chip forward direction placement that display screen upper end FPC connector 4 controls, shows
The LED chip that display screen lower end FPC connector 4 controls needs chip to rotate 180 degree, upside down.
Further, layer of transparent is applied on LED chip 3 and fill glue, play the effect of filling, also play certain insulation protection
Effect, it is smooth bright and clean above the LED chip 3 made.
Further, transparent protection board or film are laid on protective glue, determine according to actual needs protection board or film
Material, mainly shield, avoid being directly exposed to air, influence service performance.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (4)
1. a kind of transparency LED display screen of metallic mesh conducting wire, characterized by comprising: transparent substrate (1), the transparent substrate
(1) it is fixedly connected with fine structure metallic mesh conducting wire (2) on, is fixedly connected on the fine structure metallic mesh conducting wire (2)
Have multiple LED chips (3), the multiple LED chip (3) forms LED array, the fine structure gold according to certain arrangement mode
Belong to grid conducting wire (2) to be connected with the FPC connector (4), the upper and lower of the LED display is arranged in the FPC connector (4)
Fine structure metallic mesh conducting wire (2) is introduced and is drawn by FPC connector (4) by both ends.
2. a kind of transparency LED display screen of metallic mesh conducting wire according to claim 1, it is further characterized in that: it is described micro-
Fine texture metallic mesh conducting wire (2) is laid on transparent substrate (1) using micron printing technology or micron lithographic technique, described micro-
Fine texture metallic mesh conducting wire (2) is other in the micron-scale by the control of grid line width, and wherein grid shape is grid, annulus or six sides
Shape.
3. a kind of transparency LED display screen of metallic mesh conducting wire according to claim 1, it is further characterized in that: it is described
Bright substrate (1) uses glass, acrylic board or flexible transparent film transparent material.
4. a kind of transparency LED display screen of metallic mesh conducting wire according to claim 1, it is further characterized in that: the LED
It is connect between the pin of chip (3), between LED chip (3) and FPC connector (4) by fine structure metallic mesh conducting wire (2),
Wherein the cabling mode of fine structure metallic mesh conducting wire (2) is arranged according to display screen demand, the position of the LED chip (3)
It is set according to the demand of display screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910584159.5A CN110165042B (en) | 2019-06-28 | 2019-06-28 | Transparent LED display screen with metal mesh wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910584159.5A CN110165042B (en) | 2019-06-28 | 2019-06-28 | Transparent LED display screen with metal mesh wires |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110165042A true CN110165042A (en) | 2019-08-23 |
| CN110165042B CN110165042B (en) | 2024-01-30 |
Family
ID=67637136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910584159.5A Active CN110165042B (en) | 2019-06-28 | 2019-06-28 | Transparent LED display screen with metal mesh wires |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110165042B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111785206A (en) * | 2020-08-13 | 2020-10-16 | 大连集思特科技有限公司 | Wearable flexible transparent display system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170177105A1 (en) * | 2014-12-26 | 2017-06-22 | Boe Technology Group Co.. Ltd. | Bezel structure of touch screen and method for manufacturing the same, touch screen and display device |
| CN109585629A (en) * | 2018-11-21 | 2019-04-05 | 大连集思特科技有限公司 | A kind of LED display and preparation method thereof of transparent membrane composition |
| CN209843749U (en) * | 2019-06-28 | 2019-12-24 | 大连集思特科技有限公司 | Transparent LED display screen of metal mesh grid wire |
-
2019
- 2019-06-28 CN CN201910584159.5A patent/CN110165042B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170177105A1 (en) * | 2014-12-26 | 2017-06-22 | Boe Technology Group Co.. Ltd. | Bezel structure of touch screen and method for manufacturing the same, touch screen and display device |
| CN109585629A (en) * | 2018-11-21 | 2019-04-05 | 大连集思特科技有限公司 | A kind of LED display and preparation method thereof of transparent membrane composition |
| CN209843749U (en) * | 2019-06-28 | 2019-12-24 | 大连集思特科技有限公司 | Transparent LED display screen of metal mesh grid wire |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111785206A (en) * | 2020-08-13 | 2020-10-16 | 大连集思特科技有限公司 | Wearable flexible transparent display system |
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| Publication number | Publication date |
|---|---|
| CN110165042B (en) | 2024-01-30 |
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