CN110160660B - High-temperature component multispectral temperature measurement method and system based on light field camera - Google Patents
High-temperature component multispectral temperature measurement method and system based on light field camera Download PDFInfo
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Abstract
The invention provides a high-temperature component radiation temperature measurement method and a system based on a light field camera in the technical field of temperature measurement, and the method comprises the following steps: s1, calibrating the multispectral temperature measurement system of the light field camera by using a standard temperature source; s2, collecting a high-temperature component light field multispectral image by using the calibrated multispectral temperature measurement system; s3, decoupling the multispectral image of the high-temperature component light field to obtain decoupling data; and S4, acquiring the real temperature of the object point of the high-temperature component by using the decoupling data. The invention simplifies the optical acquisition system in the traditional multispectral temperature measurement method, combines the advantages of multispectral temperature measurement and area array temperature measurement, can solve a two-dimensional real temperature field, and has certain significance for promoting the development of multispectral radiation temperature measurement technology.
Description
Technical Field
The invention belongs to the technical field of temperature measurement, and particularly relates to a high-temperature component radiation temperature measurement method and system based on a light field camera.
Background
At present, the temperature measurement mode of the high-temperature component can be divided into contact temperature measurement and non-contact temperature measurement. The non-contact temperature measurement is mainly based on a radiation temperature measurement method, and comprises a brightness temperature measurement method, a colorimetric temperature measurement method, a multispectral radiation temperature measurement method and the like.
The multispectral temperature measurement method is widely applied to the radiation temperature measurement field by measuring the radiance of multiple wavelengths (several to dozens of different wavelengths) and calculating the true temperature of a target according to the emissivity. The traditional multispectral pyrometer is generally used for point measurement or has a small measurement area, so that the whole two-dimensional temperature field of the surface of a measured object is difficult to obtain, and the local error of the measured object cannot be avoided. When the surface temperature of an aircraft, a turbine blade and other high-temperature components is measured, in order to obtain a two-dimensional temperature field of the surface of the high-temperature components, avoid local errors and evaluate the overall working state of the high-temperature components more clearly and accurately, researchers provide an optical system based on Charge-coupled Device (CCD) temperature measurement and an applicable algorithm thereof.
In recent years, with the rapid development of software and hardware in the field of computer vision, research on a planar array CCD radiation temperature measurement method at home and abroad is greatly improved. However, at present, one color photosensitive chip can only collect the multi-spectrum of three bands (RGB), and if a camera array or a multi-path light splitting mode is needed to realize more multi-spectrum image collection, the optical collection system is still very complex and is difficult to be practical, and the construction of a proper multi-spectrum imaging system is still an important problem in the field.
Through the search of the prior art, the Chinese invention has the patent number of CN201310633736.8, and the invention name is a multispectral radiation temperature measurement method, which is characterized in that: the method is characterized by comprising the following steps: [1] the spectrometer records and obtains a spectral signal V1 (lambda) of the pulse wide-spectrum light source when the pulse wide-spectrum light source emits light; [2] the spectrometer records the spectrum signals under the simultaneous action of the pulse wide-spectrum light source and the flame, and obtains a signal V2 (lambda) of the flame independently irradiating the spectrometer and a spectrum signal V3 (lambda) of the flame under the simultaneous action of the flame and the wide-spectrum light source; [3] calculating to obtain a flame emissivity coefficient (lambda) ═ V2 (lambda) + V1 (lambda) -V3 (lambda))/V1 (lambda); [4] performing data fitting on the formula to obtain a temperature value on a flame integral path; wherein λ is the working wavelength, T is the working temperature, C1 and C2 are the first radiation constant and the second radiation constant, respectively, and k is the system correction constant; [5] and calculating to obtain flame temperature parameters at different moments. The device used by the method is complex, and the temperature resolving precision of the true temperature field is low.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a high-temperature component multispectral temperature measurement method and system based on a light field camera.
The invention provides a high-temperature component multispectral temperature measurement method based on a light field camera, which comprises the following steps:
s1, calibrating the multispectral temperature measurement system of the light field camera by using a standard temperature source;
s2, collecting a high-temperature component light field multispectral image by using the calibrated multispectral temperature measurement system;
s3, decoupling the multispectral image of the high-temperature component light field to obtain decoupling data;
and S4, acquiring the real temperature of the object point of the high-temperature component by using the decoupling data.
In some embodiments, in step S1, the optical field camera employs a multispectral filter array and a microlens array for coupling modulation, so as to achieve multispectral image acquisition of a standard temperature source and determine a corresponding relationship between a gray value and a temperature value.
In some embodiments, when the temperature of the measured component is measured in step S2, the temperature measurement range and accuracy correspond to the selection of the filter array, for example, to achieve 1% temperature measurement accuracy, a 4 × 4 filter array may be used to collect multispectral images at 16 bands, and to achieve higher temperature measurement accuracy, more filters may be used to collect multispectral images at more bands.
In some embodiments, the decoupling the high temperature component light field multispectral image in the step S3 is decoupling the two-dimensional multispectral image into a single-dimensional multispectral image.
In some embodiments, the calculation of the real temperature of the object point of the high-temperature component in step S4 is obtained by the following formula:
wherein, C2Is a second radiation constant; lambda [ alpha ]iIs the effective wavelength of the ith channel; t is the true temperature of the target; (lambdaiAnd T) is the spectral emissivity of the target true temperature T; viThe output signal strength of the ith channel; t' is a reference temperature, Vi'is the output signal intensity of the ith channel at the reference temperature T'.
A high-temperature component multispectral temperature measurement system based on a light field camera adopts the high-temperature component multispectral temperature measurement method based on the light field camera, and comprises the following steps: the system comprises a calibration module of a multispectral temperature measurement system of the light field camera, an imaging module of the multispectral temperature measurement system, a multispectral image decoupling module and an object point true temperature acquisition module;
the calibration module of the multispectral temperature measurement system of the light field camera calibrates the multispectral temperature measurement system of the light field camera by using a standard temperature source;
the multispectral temperature measurement system imaging module acquires a multispectral image of a high-temperature component light field by using a calibrated multispectral temperature measurement system;
the multispectral image decoupling module obtains decoupling data through decoupling the multispectral image of the high-temperature component light field;
and the object point true temperature acquisition module acquires the object point true temperature of the high-temperature component by using the decoupling data.
In some embodiments, a light field camera in the calibration module of the light field camera multispectral temperature measurement system is modulated by coupling a multispectral filter array and a micro-lens array, so as to realize multispectral image acquisition of a standard temperature source and determine a corresponding relationship between a gray value and a temperature value.
In some embodiments, the standard temperature source used by the calibration module of the multispectral thermometry system of the light field camera is a black body furnace or a tungsten lamp.
In some embodiments, the multispectral image decoupling module obtains the decoupling data by decoupling the two-dimensional multispectral image into a single-dimensional multispectral image.
In some embodiments, when the multispectral temperature measurement system images the measured component during the imaging process, the temperature measurement range and the temperature measurement precision correspond to the selection matching of the filter array.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention provides a high-temperature component multispectral temperature measurement method based on a light field camera.
2. The invention simplifies the optical acquisition system in the traditional multispectral temperature measurement method, combines the advantages of multispectral temperature measurement and area array temperature measurement, can solve a two-dimensional real temperature field, and has certain significance for promoting the development of multispectral radiation temperature measurement technology.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a basic flow diagram of the present invention;
FIG. 2 is a schematic diagram of the operating principle of the multispectral temperature measurement system of the light field camera of the present invention;
FIG. 3 is a schematic view of a multi-spectral image of a light field camera according to the present invention.
FIG. 4 is a schematic diagram of a light field multispectral image decoupling process in the present invention.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
Example 1
The basic operation flow of the invention is shown in fig. 1, and the basic architecture of the imaging system of the multispectral light field camera is shown in fig. 2.
Firstly, a standard temperature source is heated to a proper high temperature T' (for example, to 1000K), the standard temperature source is a black body furnace or a tungsten lamp, and the like, as shown in figure 2, an optical field camera modulated by a multispectral filter array is adopted to image the standard temperature source, and the calibration camera is calibrated at different wave bands lambdaiLower output signal strength Vi'corresponding relation with the standard temperature T', because the general condition is
Then
Wherein,
is a calibration coefficient, the value of which is the product of the sensor sensitivity coefficient, the absorption coefficient and the first radiation constant; (lambdaiAnd T) is the spectral emissivity of the target true temperature T; c2Is a second radiation constant; lambda [ alpha ]iIs the effective wavelength of the ith channel; t' is a reference temperature that is a standard temperature source.
And storing the multispectral light field image at the standard temperature as calibration data.
Secondly, the calibrated multispectral light field camera is used for imaging the high-temperature component to be detected, the imaging basic framework is shown as the attached drawing 2, multispectral images of the light field of the high-temperature component are collected, the schematic diagram of the original image is shown as the attached drawing 3, and the macro-pixel multispectral images are arranged in the square frame.
Thirdly, according to the multispectral imaging process of the light field camera and the multi-view image decoupling method of the light field camera, the multispectral original image is decoupled, the macro-pixel image of the image point S' is decoupled in fig. 4 as an example, it is assumed that the macro-pixel image is composed of 4 × 4 pixels and is a 16-waveband two-dimensional multispectral image, and the multispectral image in a single dimension direction is decoupled from left to right and from top to bottom.
Finally, according to the multispectral radiation temperature measurement theory and the multispectral image decoupling process, the output signal intensity V of the ith channeliCan be written as:
wherein,
is a calibration coefficient, the value of which is the product of the sensor sensitivity coefficient, the absorption coefficient and the first radiation constant; (lambdaiAnd T) is the spectral emissivity of the target true temperature T; c2Is a second radiation constant; lambda [ alpha ]iIs the effective wavelength of the ith channel; t is the true temperature of the target.
After the decoupling of the multispectral image is completed, the real temperature calculation process of a single object point is as follows:
dividing the logarithm of the formula (1) and (2) and finishing to obtain:
equations similar to the above formula can be obtained for different wavelengths, the real temperature T can be solved by solving an equation set formed by the equations under 16 wave bands, the real temperatures of object points on the high-temperature component can be solved one by one, and finally, the two-dimensional real temperature field of the measured high-temperature component can be obtained.
Example 2
As shown in fig. 1 to 4, the present invention provides a high temperature component multispectral temperature measurement system based on a light field camera, and the high temperature component multispectral temperature measurement method based on a light field camera in embodiment 1 is adopted, including: the system comprises a calibration module of a multispectral temperature measurement system of the light field camera, an imaging module of the multispectral temperature measurement system, a multispectral image decoupling module and an object point true temperature acquisition module;
the calibration module of the multispectral temperature measurement system of the light field camera calibrates the multispectral temperature measurement system of the light field camera by using a standard temperature source;
the multispectral temperature measurement system imaging module acquires a multispectral image of a high-temperature component light field by using a calibrated multispectral temperature measurement system;
the multispectral image decoupling module obtains decoupling data through decoupling the multispectral image of the high-temperature component light field;
and the object point true temperature acquisition module acquires the object point true temperature of the high-temperature component by using the decoupling data.
The light field camera in the calibration module of the light field camera multispectral temperature measurement system adopts multispectral filter array and micro-lens array coupling modulation to realize the multispectral image collection of a standard temperature source and determine the corresponding relation between gray values and temperature values.
The standard temperature source used by the calibration module of the multispectral temperature measurement system of the light field camera is a black body furnace or a tungsten lamp.
The multispectral image decoupling module is used for decoupling the two-dimensional multispectral image into a single-dimensional multispectral image to obtain decoupling data.
When the multispectral temperature measurement system images the measured component in the process of imaging, the temperature measurement range and precision correspond to the selection matching of the filter array.
The corresponding solving process in this embodiment 2 is the same as that in embodiment 1, and is not described herein again.
In summary, the invention provides a high-temperature component multispectral temperature measurement method based on a light field camera by adding a filter array to the light field camera to modulate the imaging process of the light field camera, the method adopts a single-lens optical system to realize multispectral temperature measurement, and the optical system is relatively simple; the invention simplifies the optical acquisition system in the traditional multispectral temperature measurement method, combines the advantages of multispectral temperature measurement and area array temperature measurement, can solve a two-dimensional real temperature field, and has certain significance for promoting the development of multispectral radiation temperature measurement technology.
Those skilled in the art will appreciate that, in addition to implementing the systems, apparatus, and various modules thereof provided by the present invention in purely computer readable program code, the same procedures can be implemented entirely by logically programming method steps such that the systems, apparatus, and various modules thereof are provided in the form of logic gates, switches, application specific integrated circuits, programmable logic controllers, embedded microcontrollers and the like. Therefore, the system, the device and the modules thereof provided by the present invention can be considered as a hardware component, and the modules included in the system, the device and the modules thereof for implementing various programs can also be considered as structures in the hardware component; modules for performing various functions may also be considered to be both software programs for performing the methods and structures within hardware components.
Claims (8)
1. A high-temperature component multispectral temperature measurement method based on a light field camera is characterized by comprising the following steps:
s1, calibrating the multispectral temperature measurement system of the light field camera by using a standard temperature source;
s2, collecting a high-temperature component light field multispectral image by using the calibrated multispectral temperature measurement system;
s3, decoupling the multispectral image of the high-temperature component light field to obtain decoupling data;
s4, acquiring the real temperature of the object point of the high-temperature component by using the decoupling data;
in the step S1, the optical field camera adopts coupling modulation of the multispectral filter array and the microlens array to realize multispectral image collection of the standard temperature source and determine a corresponding relationship between a gray value and a temperature value;
the decoupling of the high-temperature component light field multispectral image in the step S3 is to decouple the two-dimensional multispectral image into a single-dimensional multispectral image.
2. The light field camera-based multispectral temperature measurement method for the high-temperature component according to claim 1, wherein the temperature measurement range and the accuracy correspond to the selected matching of the filter array when the temperature of the measured component is measured in step S2.
3. The light field camera-based multispectral thermometry method for high-temperature components according to claim 1, wherein the calculation of the true temperature of the object point of the high-temperature component in the step S4 is obtained by the following formula:
wherein, C2Is a second radiation constant; lambda [ alpha ]iIs the effective wavelength of the ith channel; t is the true temperature of the target; (lambdaiAnd T) is the spectral emissivity of the target true temperature T; viThe output signal strength of the ith channel; t 'is a reference temperature, V'iIs the output signal strength of the ith channel at the reference temperature T'.
4. A high-temperature component multispectral temperature measurement system based on a light field camera, which is characterized in that the high-temperature component multispectral temperature measurement method based on the light field camera as claimed in any one of claims 1 to 3 is adopted, and comprises the following steps: the system comprises a calibration module of a multispectral temperature measurement system of the light field camera, an imaging module of the multispectral temperature measurement system, a multispectral image decoupling module and an object point true temperature acquisition module;
the calibration module of the multispectral temperature measurement system of the light field camera calibrates the multispectral temperature measurement system of the light field camera by using a standard temperature source;
the multispectral temperature measurement system imaging module acquires a multispectral image of a high-temperature component light field by using a calibrated multispectral temperature measurement system;
the multispectral image decoupling module obtains decoupling data through decoupling the multispectral image of the high-temperature component light field;
and the object point true temperature acquisition module acquires the object point true temperature of the high-temperature component by using the decoupling data.
5. The light field camera-based high-temperature component multispectral temperature measurement system according to claim 4, wherein the light field camera in the calibration module of the light field camera multispectral temperature measurement system is modulated by coupling a multispectral filter array and a micro-lens array, so as to realize standard temperature source multispectral image acquisition and determine the corresponding relationship between gray values and temperature values.
6. The light field camera-based high temperature component multispectral temperature measurement system of claim 4, wherein the standard temperature source used by the calibration module of the light field camera multispectral temperature measurement system is a blackbody furnace or a tungsten lamp.
7. The light field camera-based high temperature component multispectral thermometry system of claim 4, wherein the multispectral image decoupling module obtains the decoupling data by decoupling two-dimensional multispectral images into one-dimensional multispectral images.
8. The light field camera based high temperature component multispectral temperature measurement system as claimed in claim 4, wherein the multispectral temperature measurement system corresponds to the selected matching of the filter array in the temperature measurement range and the temperature measurement precision when the temperature measurement is performed on the component to be measured in the imaging process of the imaging module.
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Effective date of registration: 20211222 Address after: 201109 room 1206, building 1, No. 951, Jianchuan Road, Minhang District, Shanghai Patentee after: Yimu (Shanghai) Technology Co.,Ltd. Address before: 200240 No. 800, Dongchuan Road, Shanghai, Minhang District Patentee before: Shi Shengxian |
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| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: Room 102, 1st Floor, Building 98, No. 1441 Humin Road, Minhang District, Shanghai, 2019; Room 302, 3rd Floor, Building 98; Room 402, 4th Floor, Building 98 Patentee after: Yimu (Shanghai) Technology Co.,Ltd. Address before: 201109 room 1206, building 1, No. 951, Jianchuan Road, Minhang District, Shanghai Patentee before: Yimu (Shanghai) Technology Co.,Ltd. |