CN110148618B - Display substrate, manufacturing method thereof and display device - Google Patents
Display substrate, manufacturing method thereof and display device Download PDFInfo
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- CN110148618B CN110148618B CN201910477336.XA CN201910477336A CN110148618B CN 110148618 B CN110148618 B CN 110148618B CN 201910477336 A CN201910477336 A CN 201910477336A CN 110148618 B CN110148618 B CN 110148618B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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Abstract
The invention discloses a display substrate, a manufacturing method thereof and a display device, relates to the technical field of display, and aims to solve the problem of abnormal display of the display device caused by edge deletion or curling of an anode pattern. The manufacturing method of the display substrate comprises the steps of manufacturing a conductive pattern, and the steps specifically comprise: forming a conductive material film layer; forming a fixed structure on the conductive material film layer; and patterning the conductive material film layer to form a plurality of conductive patterns, wherein each conductive pattern comprises a middle area and an edge area surrounding the middle area, and the orthographic projection of the fixed structure on the conductive pattern at least partially overlaps with the edge area. The manufacturing method of the display substrate is used for manufacturing the display substrate.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a manufacturing method of the display substrate and a display device.
Background
Active-matrix organic light emitting diode (AMOLED) display devices are widely focused on their advantages of self-luminescence, wide viewing angle, higher refresh rate, thinner size, etc. The light emitting unit in the AMOLED display device comprises an anode graph and a cathode graph which are oppositely arranged, and an organic light emitting material layer arranged between the anode graph and the cathode graph, and when the AMOLED display device works, holes and electrons are provided through the anode graph and the cathode graph respectively, so that the holes and the electrons are compounded in the light emitting material layer, the organic light emitting material layer emits light, and the display function of the AMOLED display device is achieved.
However, in the related art, when the anode pattern is formed, the edge portion of the anode pattern is easily lost or curled, so that the edge portion of the anode pattern easily breaks the organic light emitting material layer, and further, a short circuit occurs between the anode pattern and the cathode pattern, and the display device has poor display.
Disclosure of Invention
The invention aims to provide a display substrate, a manufacturing method thereof and a display device, which are used for solving the problem of abnormal display of the display device caused by edge loss or curling of an anode pattern.
In order to achieve the above purpose, the invention provides the following technical scheme:
a first aspect of the present invention provides a method for manufacturing a display substrate, including a step of manufacturing a conductive pattern, the step specifically including:
forming a conductive material film layer;
forming a fixed structure on the conductive material film layer;
and patterning the conductive material film layer to form a plurality of conductive patterns, wherein each conductive pattern comprises a middle area and an edge area surrounding the middle area, and the orthographic projection of the fixed structure on the conductive pattern at least partially overlaps with the edge area.
Optionally, the step of forming a fixing structure on the conductive material film layer specifically includes:
forming a fixed film layer on the conductive material film layer;
and patterning the fixed film layer to form the fixed structure.
Optionally, the step of forming a fixing film layer on the conductive material film layer specifically includes:
forming the fixed film layer on the conductive material film layer by adopting a photosensitive resin material;
the step of patterning the fixing film layer to form the fixing structure specifically includes:
exposing the fixed film layer by using a mask plate comprising a light transmitting area and a light shading area to form a fixed film layer reserving area and a fixed film layer removing area, wherein the fixed film layer reserving area corresponds to the area where the fixed structure is located, and the fixed film layer removing area corresponds to other areas except the area where the fixed structure is located;
and developing the exposed fixed film layer by using a developing solution, and removing the fixed film layer positioned in the fixed film layer removing area to form the fixed structure.
Optionally, the step of forming a fixing film layer on the conductive material film layer specifically includes:
forming the fixed film layer on the conductive material film layer by using an inorganic insulating material;
the step of patterning the fixing film layer to form the fixing structure specifically includes:
forming photoresist on the fixed film layer;
exposing the photoresist by using a mask plate comprising a light transmitting area and a light shading area to form a photoresist reserving area and a photoresist removing area, wherein the photoresist reserving area corresponds to the area where the fixed structure is located, and the photoresist removing area corresponds to other areas except the area where the fixed structure is located;
developing the exposed photoresist by using a developing solution to remove the photoresist in the photoresist removing area;
taking the photoresist positioned in the photoresist retention region as a mask, and etching the fixed film layer positioned in the photoresist removal region to remove the fixed film layer positioned in the photoresist removal region;
and stripping the photoresist in the photoresist retention region to form the fixed structure.
Optionally, the step of patterning the conductive material film layer to form a plurality of conductive patterns specifically includes:
forming a photoresist completely covering the conductive material film layer and the fixed structure;
exposing the photoresist by using a mask plate comprising a light transmitting area and a light shading area to form a photoresist reserving area and a photoresist removing area, wherein the photoresist reserving area corresponds to the area where the conductive pattern is located, and the photoresist removing area corresponds to other areas except the area where the conductive pattern is located;
removing the photoresist in the photoresist removing area by using a developing solution;
taking the photoresist in the photoresist retention region as a mask, and etching the conductive material film layer in the photoresist removal region to remove the conductive material film layer in the photoresist removal region;
and stripping the photoresist in the photoresist retention area to form the conductive pattern.
Optionally, the conductive pattern includes an anode pattern of the display substrate, and the manufacturing method further includes:
before the step of manufacturing the conductive pattern, manufacturing a pixel circuit layer on a provided substrate, wherein the pixel circuit layer comprises a plurality of pixel circuits;
the step of making the conductive pattern specifically comprises:
forming the anode patterns corresponding to the pixel circuits one by one on one side of the pixel circuit layer, which is opposite to the substrate, wherein the anode patterns are electrically connected with the output electrodes of the driving transistors in the corresponding pixel circuits;
the manufacturing method further comprises the following steps:
after the step of manufacturing the conductive pattern, manufacturing a pixel defining layer used for defining a plurality of pixel opening areas on one side of the fixed structure, which faces away from the anode pattern, wherein the pixel opening areas expose at least part of the anode pattern in a one-to-one correspondence manner;
and forming a spacer on the surface of the pixel defining layer, which faces away from the substrate.
Based on the technical solution of the manufacturing method of the display substrate, a second aspect of the present invention provides a display substrate manufactured by the manufacturing method of the display substrate, where the display substrate includes:
a plurality of conductive patterns, each of the conductive patterns including a middle region and an edge region surrounding the middle region;
a fixed structure disposed on the conductive pattern, an orthographic projection of the fixed structure on the conductive pattern at least partially overlapping the edge region.
Optionally, an orthographic projection of the fixing structure on the conductive pattern coincides with the edge region.
Optionally, the fixing structure is made of a photosensitive resin material or an inorganic insulating material.
Optionally, the conductive pattern comprises an anode pattern;
the display substrate further includes:
a substrate, a first electrode and a second electrode,
a pixel circuit layer disposed on the substrate, the pixel circuit layer including a plurality of pixel circuits;
the anode electrical pattern is positioned on one side of the pixel circuit layer, which is back to the substrate, and the anode electrical pattern is electrically connected with the output electrodes of the driving transistors in the pixel circuits in a one-to-one correspondence manner;
a pixel defining layer disposed on a side of the fixed structure facing away from the substrate, the pixel defining layer defining a plurality of pixel opening areas, the pixel opening areas exposing at least a portion of the anode pattern in a one-to-one correspondence;
and the spacers are arranged on the surface of the pixel definition layer, which faces away from the substrate.
Based on the technical solution of the display substrate, a third aspect of the present invention provides a display device, including the display substrate.
According to the technical scheme provided by the invention, the conductive material film layer for manufacturing the conductive pattern is formed firstly, then the fixing structure is formed on the conductive material film layer at the position corresponding to the edge area of the conductive pattern, and then the conductive material film layer is patterned to form the conductive pattern, so that the preformed fixing structure can cover the edge area of the conductive pattern in the process of forming the conductive pattern in a patterning mode, and the edge area of the conductive pattern is protected, therefore, even if the conductive pattern is washed by high-pressure water in the process of manufacturing the conductive pattern, the edge part of the conductive pattern cannot be lost or curled, and the manufacturing yield of the conductive pattern is well ensured.
Therefore, when the technical scheme provided by the invention is adopted to manufacture the display substrate, when the manufactured conductive pattern is used as the anode pattern, the edge area of the anode pattern can be ensured not to be lost or curled, so that the yield of the organic light-emitting material layer manufactured on the anode pattern is ensured, and the probability of short circuit between the anode pattern and the cathode pattern is well reduced.
In addition, the technical scheme provided by the invention realizes the technical effect only by manufacturing the fixing structure, has simple process, does not have adverse effect on the subsequent manufacturing process of the display substrate, and does not cause any display failure.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of a manufacturing process of a conductive pattern according to an embodiment of the present invention;
fig. 2 is a schematic view of a manufacturing process of a display substrate according to an embodiment of the invention;
fig. 3 is a schematic cross-sectional view of a display substrate according to an embodiment of the invention.
Reference numerals:
1-a substrate, 20-a conductive material film layer,
21-a conductive pattern, 3-a fixed structure,
4-photoresist, 5-pixel definition layer,
6-spacer, 7-pixel circuit layer,
8-flat layer.
Detailed Description
In order to further explain the display substrate, the manufacturing method thereof and the display device provided by the embodiment of the invention, the following detailed description is made with reference to the accompanying drawings.
In the related art, the specific structure of the AMOLED display device generally includes: the light emitting device comprises a substrate, a pixel circuit layer arranged on the substrate, and a plurality of light emitting units arranged on one side, opposite to the substrate, of the pixel circuit layer; the pixel circuit layer comprises pixel circuits distributed in an array mode, each light-emitting unit comprises an anode pattern, a cathode pattern and an organic light-emitting material layer, the anode pattern and the cathode pattern are arranged oppositely, the organic light-emitting material layer is arranged between the anode pattern and the cathode pattern, the anode patterns correspond to the pixel circuits one to one, and each anode pattern is electrically connected with an output electrode of a driving transistor in the corresponding pixel circuit. When the AMOLED display device displays a picture, the pixel circuit provides a driving signal for the corresponding anode graph, and meanwhile, a common signal line in the AMOLED display device can provide a cathode signal for the cathode graph, so that the anode graph and the cathode graph can respectively provide holes and electrons for the organic light-emitting material layer, and the holes and the electrons are compounded in the organic light-emitting material layer, so that the organic light-emitting material layer emits light rays with corresponding colors.
The inventor of the present invention found through research that, when the light emitting unit is manufactured, an anode pattern is generally manufactured, then an organic light emitting material layer is manufactured on the anode pattern by adopting an evaporation process, and finally a cathode pattern is manufactured on one side of the organic light emitting material layer, which is opposite to the anode pattern; because the thickness of the organic light emitting material layer is thin, when the organic light emitting material layer is damaged, a short circuit is easily caused between the anode pattern and the cathode pattern on the two opposite sides of the organic light emitting material layer, and further the pixel corresponding to the light emitting unit is not bright, so that the display device has poor dark spot when displaying the picture.
The inventors of the present invention further studied and found that factors that easily cause breakage of the organic light emitting material layer are as follows:
the related art generally includes the following steps in fabricating the anode pattern: firstly, forming a film layer for manufacturing an anode pattern, and then patterning the film layer to obtain the anode pattern; wherein the patterning process generally comprises: firstly, forming photoresist on the surface of the film layer, then utilizing a mask plate to expose and develop the photoresist to expose the film layer to be removed, then etching the exposed film layer, and finally stripping the residual photoresist to form an anode pattern.
In the process of stripping the residual photoresist, the surface on which the anode pattern is formed needs to be washed by high-pressure water, so that the edge part of the anode pattern is easy to be lost or blown up, and after the edge part of the anode pattern is lost or curled, the edge part of the anode pattern is easy to damage a pixel defining layer and an organic light-emitting material layer which are subsequently contacted with the anode pattern, so that short circuit is generated between the anode pattern and the cathode pattern, and the normal display of a display device is influenced. Based on the above problems, the present invention proposes the following technical solutions:
referring to fig. 1, an embodiment of the present invention provides a method for manufacturing a display substrate, including a step of manufacturing a conductive pattern 21, where the step includes:
forming a conductive material film layer 20;
forming a fixed structure 3 on the conductive material film layer 20;
the film layer 20 of conductive material is patterned to form a plurality of conductive patterns 21, each conductive pattern 21 includes a middle area and an edge area surrounding the middle area, and an orthographic projection of the fixed structure 3 on the conductive pattern 21 at least partially overlaps the edge area.
Specifically, when the conductive material film 20 is formed, a metal material or indium tin oxide may be selected and deposited to form the conductive material film 20, but the invention is not limited thereto.
After the conductive material film 20 is formed, forming the fixed structure 3 on the conductive material film 20, wherein the specific forming position of the fixed structure 3 depends on the position of the conductive pattern 21 to be formed, and more specifically, the formed conductive material film 20 is used for forming the conductive pattern 21, and the specific forming position of the conductive pattern 21 can be predetermined, so that the fixed structure 3 can be formed at a position corresponding to the edge region of the conductive pattern 21, and the specific positional relationship between the fixed structure 3 and the conductive pattern 21 includes: the orthographic projection of the fixed structure 3 on the conductive pattern 21 at least partially overlaps the edge region of the conductive pattern 21, or the orthographic projection of the fixed structure 3 on the conductive pattern 21 coincides with the edge region of the conductive pattern 21.
After the fixing structure 3 is manufactured, the conductive material film layer 20 can be patterned to form the conductive pattern 21, and since the fixing structure 3 is formed on the conductive material film layer 20 in advance at a position corresponding to the edge region of the conductive pattern 21, the fixing structure 3 can protect the edge region of the conductive pattern 21 to be manufactured during the process of forming the conductive pattern 21, so that the edge region of the conductive pattern 21 is not easy to be lost or curled during the patterning process.
In the manufacturing method of the display substrate provided by the embodiment of the invention, the conductive material film layer 20 for manufacturing the conductive pattern 21 is firstly formed, then the fixing structure 3 is formed on the conductive material film layer 20 at the position corresponding to the edge area of the conductive pattern 21, and then the conductive material film layer 20 is patterned to form the conductive pattern 21, so that in the process of forming the conductive pattern 21 in a patterning manner, the preformed fixing structure 3 can cover the edge area of the conductive pattern 21, and thus the edge area of the conductive pattern 21 is protected, even if the conductive pattern 21 is washed by high-pressure water in the process of manufacturing the conductive pattern 21, the edge part of the conductive pattern 21 cannot be lost or curled, and the manufacturing yield of the conductive pattern 21 is well ensured.
Therefore, when the manufacturing method provided by the embodiment of the invention is adopted to manufacture the display substrate, when the manufactured conductive pattern 21 is used as the anode pattern, the edge area of the anode pattern can be ensured not to be lost or curled, so that the yield of the organic light-emitting material layer manufactured on the anode pattern is ensured, and the probability of short circuit between the anode pattern and the cathode pattern is well reduced.
In addition, the manufacturing method of the display substrate provided by the embodiment of the invention realizes the technical effects only by manufacturing the fixing structure 3, has simple process, does not have adverse effect on the subsequent manufacturing process of the display substrate, and does not cause any display failure.
In some embodiments, the step of forming the fixing structure 3 on the conductive material film layer 20 specifically includes:
forming a fixing film layer on the conductive material film layer 20;
and patterning the fixed film layer to form the fixed structure 3.
Specifically, the fixing structure 3 may be made of various materials, and for example, the fixing structure 3 may be made of a resin material or an inorganic insulating material. In more detail, a fixing film layer for manufacturing the fixing structure 3 may be formed on the conductive material film layer 20, and then the fixing film layer may be patterned by selecting an appropriate method according to a material of the fixing film layer, so as to form the fixing structure 3 on the conductive material film layer 20 at a position corresponding to the edge region of the conductive pattern 21.
When the fixing structure 3 is manufactured by the manufacturing method provided by the embodiment, the manufacturing method is simple, and the fixing structure 3 can be formed at a designated position, so that the edge area of the conductive pattern 21 is well protected.
In some embodiments, the step of forming a fixing film layer on the conductive material film layer 20 specifically includes:
forming the fixing film layer on the conductive material film layer 20 using a photosensitive resin material;
the step of patterning the fixing film layer to form the fixing structure 3 specifically includes:
exposing the fixed film layer by using a mask plate comprising a light transmitting area and a light shading area to form a fixed film layer retaining area and a fixed film layer removing area, wherein the fixed film layer retaining area corresponds to the area where the fixed structure 3 is located, and the fixed film layer removing area corresponds to other areas except the area where the fixed structure 3 is located;
and developing the exposed fixed film layer by using a developing solution, and removing the fixed film layer positioned in the fixed film layer removing area to form the fixed structure 3.
Specifically, a fixed film layer may be formed on the conductive material film layer 20 by using a photosensitive resin material, then a mask plate including a light-transmitting region and a light-shielding region is aligned with the fixed film layer, and then the fixed film layer is exposed by the mask plate to form a fixed film layer retaining region corresponding to a region where the fixed structure 3 is located and a fixed film layer removing region corresponding to a region other than the region where the fixed structure 3 is located; and finally, developing the exposed fixed film layer by using a developing solution, and removing the fixed film layer positioned in the fixed film layer removing area to form the fixed structure 3.
It should be noted that, as shown in fig. 3, the photosensitive resin material may also be used to fabricate the planarization layer 8 or the pixel defining layer 5 in the display substrate, and when the material used for the fixing structure 3 is the same as the planarization layer 8 or the pixel defining layer 5, the fixing structure 3 may be fabricated by using the apparatus for fabricating the planarization layer 8 or the apparatus for fabricating the pixel defining layer 5 during the fabrication of the display substrate, thereby avoiding introducing additional apparatus for fabricating the fixing structure 3 and better reducing the fabrication cost of the display substrate.
In some embodiments, the step of forming a fixing film layer on the conductive material film layer 20 specifically includes:
forming the fixing film layer on the conductive material film layer 20 using an inorganic insulating material;
the step of patterning the fixing film layer to form the fixing structure 3 specifically includes:
forming photoresist on the fixed film layer;
exposing the photoresist by using a mask plate comprising a light transmitting area and a light shading area to form a photoresist reserving area and a photoresist removing area, wherein the photoresist reserving area corresponds to the area where the fixed structure 3 is located, and the photoresist removing area corresponds to other areas except the area where the fixed structure 3 is located;
developing the exposed photoresist by using a developing solution to remove the photoresist in the photoresist removing area;
taking the photoresist positioned in the photoresist retention region as a mask, and etching the fixed film layer positioned in the photoresist removal region to remove the fixed film layer positioned in the photoresist removal region;
and stripping the photoresist in the photoresist reserving area to form the fixed structure 3.
Specifically, when the fixing film layer is formed using an inorganic insulating material, the inorganic insulating material may be specifically selected from silicon oxide, silicon nitride, or the like, but is not limited thereto.
After the fixed film layer is formed, a photoresist may be formed on a surface of the fixed film layer opposite to the conductive material film layer 20, then a mask plate including a light transmitting region and a light shielding region is aligned with the photoresist, and the photoresist is exposed through the mask plate to form a photoresist retaining region corresponding to a region where the fixed structure 3 is located and a photoresist removing region corresponding to a region other than the region where the fixed structure 3 is located.
After the photoresist is exposed, developing the exposed photoresist by using a developing solution, and removing the photoresist in the photoresist removing area to expose the fixed film layer in the photoresist removing area; then, taking the photoresist in the photoresist retention region as a mask, and etching the fixed film layer in the photoresist removal region by an etching process to remove the fixed film layer in the photoresist removal region; and finally, stripping the residual photoresist in the photoresist retention region to form the fixed structure 3.
When the fixing structure 3 is manufactured by the manufacturing method provided by the embodiment, the fixing structure 3 can be accurately formed at the designated position, so that the fixing structure 3 can better play a role in protection.
Referring to fig. 1, in some embodiments, the step of patterning the conductive material film 20 to form a plurality of conductive patterns 21 specifically includes:
forming a photoresist completely covering the conductive material film layer 20 and the fixed structure 3;
exposing the photoresist by using a mask plate comprising a light transmitting area and a light shading area to form a photoresist reserving area and a photoresist removing area, wherein the photoresist reserving area corresponds to the area where the conductive pattern 21 is located, and the photoresist removing area corresponds to other areas except the area where the conductive pattern 21 is located;
removing the photoresist in the photoresist removing area by using a developing solution;
etching the conductive material film layer 20 in the photoresist removing region by using the photoresist in the photoresist retaining region as a mask so as to remove the conductive material film layer 20 in the photoresist removing region;
the photoresist (as indicated by 4 in fig. 1) in the photoresist remaining region is stripped to form the conductive pattern 21.
Specifically, after the fixed structure 3 is manufactured, a photoresist which completely covers the conductive material layer and the fixed structure 3 can be continuously formed, then a mask plate including a light transmitting area and a light shielding area is aligned with the photoresist, the photoresist is exposed through the mask plate, and a photoresist retaining area and a photoresist removing area are formed, wherein the photoresist retaining area corresponds to the area where the conductive pattern 21 is located, and the photoresist removing area corresponds to other areas except the area where the conductive pattern 21 is located; then developing the exposed photoresist by using a developing solution, and removing the photoresist in the photoresist removing area to expose the conductive material film layer 20 in the photoresist removing area; then, with the photoresist in the photoresist retention region as a mask, etching the conductive material film layer 20 in the photoresist removal region by an etching process to remove the conductive material film layer 20 in the photoresist removal region; and finally, stripping the photoresist in the photoresist retention area, and simultaneously washing by using high-pressure water to finally form the conductive pattern 21.
Since the fixing structure 3 is manufactured in the position corresponding to the edge region of the conductive pattern 21 in the conductive material film layer 20 before the conductive pattern 21 is formed through the patterning process, when the conductive pattern 21 is formed by patterning the conductive material film layer 20 through the patterning process, the fixing structure 3 formed in advance can cover the edge region of the conductive pattern 21 to be manufactured, so that the edge region of the conductive pattern 21 is protected, and thus even if the conductive pattern 21 is washed by high-pressure water in the process of manufacturing the conductive pattern 21, the edge part of the conductive pattern 21 is not lost or curled, so that the manufacturing yield of the conductive pattern 21 is well ensured.
Further, as shown in fig. 2 and fig. 3, the conductive pattern 21 includes an anode pattern of the display substrate, and the manufacturing method further includes: before the step of fabricating the conductive pattern 21, fabricating a pixel circuit layer 7 on the provided substrate 1, the pixel circuit layer 7 including a plurality of pixel circuits;
the step of manufacturing the conductive pattern 21 specifically includes: forming the anode patterns corresponding to the pixel circuits one by one on one side of the pixel circuit layer 7 opposite to the substrate 1, wherein the anode patterns are electrically connected with the output electrodes of the driving transistors in the corresponding pixel circuits;
the manufacturing method further comprises the following steps:
after the step of forming the conductive pattern 21, forming a pixel defining layer 5 on a side of the fixed structure 3 facing away from the conductive pattern 21 for defining a plurality of pixel opening areas, the pixel opening areas exposing at least a portion of the anode pattern (such as 21 in fig. 2) in a one-to-one correspondence;
Specifically, the conductive pattern 21 manufactured by the manufacturing method provided in the above embodiment may be used as an anode pattern in a display substrate, and when the conductive pattern 21 is an anode pattern, the manufacturing method for manufacturing a display substrate may specifically include the following processes:
providing a substrate 1, and fabricating a pixel circuit layer 7 on the substrate 1, where the pixel circuit layer 7 may include a plurality of pixel circuits distributed in an array, and each pixel circuit may include a plurality of thin film transistors, such as a 7T1C circuit (including 7 thin film transistors 1 capacitor), a 13T2C circuit (including 13 thin film transistors 2 capacitor) and the like in the related art, and each thin film transistor may include a gate electrode, a gate insulating layer, an active layer, an interlayer insulating layer, a source layer and a drain layer; one of a source layer and a drain layer of a driving transistor in the pixel circuit serves as an output electrode of the driving transistor, and the other of the source layer and the drain layer of the driving transistor in the pixel circuit serves as an input electrode of the driving transistor; after the pixel circuit layer 7 is manufactured, a flat layer 8 can be formed on the surface of the pixel circuit layer 7 opposite to the substrate 1, and through holes corresponding to the output electrodes of the driving transistors in the pixel circuits in a one-to-one mode are formed on the flat layer 8; and then, the anode patterns corresponding to the pixel circuits one to one and the fixing structures 3 positioned at the edge regions of the anode patterns are formed on the surface of the flat layer 8 opposite to the substrate 1, and the anode patterns are electrically connected with the output electrodes of the driving transistors in the corresponding pixel circuits through the corresponding via holes.
It should be noted that the anode pattern is electrically connected to the output electrode of the driving transistor in the corresponding pixel circuit through the corresponding via hole, which includes direct electrical connection and indirect electrical connection; the direct electrical connection means that the output electrode of the corresponding driving transistor can be directly exposed by the via hole, so that the anode pattern can be directly contacted with the via hole to realize electrical connection; the indirect electrical connection means that the pixel circuit further comprises another control transistor electrically connected with the output electrode of the driving transistor, and the via hole corresponding to the driving transistor can expose the output electrode of the control transistor, so that the anode pattern can be directly contacted with the output electrode of the control transistor to realize the electrical connection with the output electrode of the driving transistor corresponding to the anode pattern.
After the anode pattern is manufactured, forming a photosensitive resin film covering all the anode pattern and the fixed structure 3, and then patterning the photosensitive resin film to obtain a pixel defining layer 5, wherein the pixel defining layer 5 defines a plurality of pixel opening areas, and at least parts of the anode pattern are exposed in the pixel opening areas in a one-to-one correspondence manner; then forming a spacer 6 on the surface of the pixel defining layer 5 opposite to the substrate 1; finally, an organic light-emitting material layer may be formed on the surface of the at least part facing away from the substrate 1, and a cathode pattern may be formed on the side of the organic light-emitting material layer facing away from the substrate 1. It should be noted that the material and the specific manufacturing method of the spacer 6 may be the same as those of the pixel defining layer 5, and are not described herein again. In addition, the pixel defining layer 5 may cover the fixed structure 3 completely, or at least a portion of the fixed structure 3.
When the manufacturing method provided by the embodiment is adopted to manufacture the anode pattern in the display substrate, the edge area of the anode pattern can be ensured not to be lost or curled, so that the yield of the organic light-emitting material layer manufactured on the anode pattern is ensured, the probability of short circuit between the anode pattern and the cathode pattern is well reduced, and the good display effect of the display substrate is ensured.
The embodiment of the invention also provides a display substrate which is manufactured by adopting the manufacturing method of the display substrate provided by the embodiment, and the display substrate comprises the following components:
a plurality of conductive patterns 21, each of the conductive patterns 21 including a middle region and an edge region surrounding the middle region;
a fixing structure 3 disposed on the conductive pattern 21, wherein an orthographic projection of the fixing structure 3 on the conductive pattern 21 at least partially overlaps the edge region.
Specifically, the conductive pattern 21 may be made of a metal material or indium tin oxide, and may be specifically used for an anode pattern in a display substrate. The fixing structure 3 may be formed in an edge region of the conductive pattern 21 during the process of manufacturing the conductive pattern 21, and an orthographic projection of the fixing structure 3 on the conductive pattern 21 may be arranged to at least partially overlap the edge region of the conductive pattern 21.
When the display substrate provided by the embodiment of the invention is manufactured by using the manufacturing method of the display substrate provided by the embodiment of the invention, the conductive material film layer 20 for manufacturing the conductive pattern 21 is formed, then the fixing structure 3 is formed on the conductive material film layer 20 at the position corresponding to the edge area of the conductive pattern 21, and then the conductive material film layer 20 is patterned to form the conductive pattern 21, so that in the process of forming the conductive pattern 21 by patterning, the fixing structure 3 formed in advance can cover the edge area of the conductive pattern 21, so as to protect the edge area of the conductive pattern 21, and even if the conductive pattern 21 is washed by using high-pressure water in the process of manufacturing the conductive pattern 21, the edge part of the conductive pattern 21 is not lost or curled, so that the manufacturing yield of the conductive pattern 21 is well ensured. Therefore, when the conductive pattern 21 in the display substrate provided by the embodiment of the invention is used as the anode pattern, the edge area of the anode pattern can be ensured not to be lost or curled, so that the yield of the organic light-emitting material layer manufactured on the anode pattern is ensured, and the probability of short circuit between the anode pattern and the cathode pattern is well reduced.
Further, the orthographic projection of the fixed structure 3 on the conductive pattern 21 may be arranged to coincide with the edge region.
The orthographic projection of the fixing structure 3 on the conductive pattern 21 is overlapped with the edge area, so that the fixing structure 3 can protect the whole edge area of the conductive pattern 21, and the whole edge area of the conductive pattern 21 is better ensured not to be lost or curled.
In some embodiments, the fixing structure 3 may be made of a photosensitive resin material or an inorganic insulating material.
Specifically, when the photosensitive resin material is adopted to manufacture the fixed structure 3, the photoresist does not need to be additionally formed, the fixed structure 3 can be formed by directly exposing and developing the fixed film layer formed by the photosensitive resin material, the introduction of an etching process is avoided, and the manufacturing process of the fixed structure 3 is simpler. Moreover, the photosensitive resin material can also be used for manufacturing the flat layer 8 or the pixel defining layer 5 in the display substrate, and when the material used for the fixed structure 3 is the same as the material used for the flat layer 8 or the pixel defining layer 5, the fixed structure 3 can be manufactured by using the equipment for manufacturing the flat layer 8 or the equipment for manufacturing the pixel defining layer 5 in the process of manufacturing the display substrate, so that the introduction of additional equipment for manufacturing the fixed structure 3 is avoided, and the manufacturing cost of the display substrate is better reduced.
When the fixing structure 3 is made of the inorganic insulating material, although the photoresist needs to be formed and the etching process is added, the fixing structure 3 can be accurately formed at the designated position, so that the fixing structure 3 can better play a role in protection.
As shown in fig. 3, in some embodiments, the conductive pattern 21 includes an anode pattern; the display substrate further includes: a substrate 1, a pixel circuit layer 7 disposed on the substrate 1, the pixel circuit layer 7 including a plurality of pixel circuits; the anode electrical pattern is positioned on one side of the pixel circuit layer 7, which is back to the substrate 1, and the anode electrical pattern is electrically connected with the output electrodes of the driving transistors in the pixel circuits in a one-to-one correspondence manner; a pixel defining layer 5 disposed on a side of the fixed structure 3 facing away from the substrate 1, the pixel defining layer 5 defining a plurality of pixel opening areas, the pixel opening areas exposing at least a portion of the anode pattern in a one-to-one correspondence; and the spacers 6 are arranged on the surface of the pixel defining layer 5, which faces away from the substrate 1.
Specifically, the display substrate provided in the above embodiment specifically includes: the liquid crystal display device comprises a substrate 1, a pixel circuit layer 7 arranged on the substrate 1, wherein the pixel circuit layer 7 comprises a plurality of pixel circuits distributed in an array, each pixel circuit comprises a plurality of thin film transistors, and each thin film transistor comprises a grid electrode, a grid electrode insulating layer, an active layer, an interlayer insulating layer, a source electrode layer and a drain electrode layer; one of a source layer and a drain layer of a driving transistor in the pixel circuit serves as an output electrode of the driving transistor, and the other of the source layer and the drain layer of the driving transistor in the pixel circuit serves as an input electrode of the driving transistor; the display substrate can further comprise a flat layer 8 arranged on the surface of the pixel circuit layer 7 opposite to the substrate 1, and through holes corresponding to the output electrodes in the driving transistors one by one are formed on the flat layer 8; the anode electrical pattern is located on one side of the pixel circuit layer 7, which faces away from the substrate 1, and the anode electrical pattern is electrically connected (including direct electrical connection and indirect electrical connection) with the output electrode of the driving transistor in the corresponding pixel circuit through the corresponding via hole. A pixel defining layer 5 is further disposed on a side of the fixed structure 3 facing away from the substrate 1, the pixel defining layer 5 may be made of a photosensitive resin material, and the pixel defining layer 5 defines a plurality of pixel opening areas, and the pixel opening areas expose at least a portion of the anode patterns in a one-to-one correspondence. The display substrate further comprises an organic light-emitting material layer arranged on the surface of at least one part facing away from the substrate 1, a cathode pattern arranged on the side of the organic light-emitting material layer facing away from the substrate 1, and a spacer 6 arranged on the surface of the pixel defining layer 5 facing away from the substrate 1.
In the display substrate provided by the embodiment, in the process of manufacturing the anode pattern, the fixing structure 3 is arranged in the edge area of the anode pattern, and the edge area of the anode pattern is protected by the fixing structure 3, so that the edge area of the anode pattern is ensured not to be lost or curled, the yield of the organic light-emitting material layer manufactured on the anode pattern is ensured, the probability of short circuit between the anode pattern and the cathode pattern is well reduced, and the good display effect of the display substrate is ensured.
The embodiment of the invention also provides a display device which comprises the display substrate provided by the embodiment.
In the display substrate provided by the embodiment of the invention, the edge area of the included conductive pattern 21 is not lost or curled, so that when the conductive pattern 21 is used as an anode pattern, the edge area of the anode pattern can be ensured not to be lost or curled, thereby ensuring the yield of the organic light-emitting material layer manufactured on the anode pattern, well reducing the probability of short circuit between the anode pattern and the cathode pattern, and enabling the display substrate to have higher display yield.
The display device may be: any product or component with a display function, such as a television, a display, a digital photo frame, a mobile phone, a tablet computer and the like.
It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the product embodiments, since they are substantially similar to the method embodiments, they are described simply, and reference may be made to some descriptions of the product embodiments for relevant points.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (9)
1. A manufacturing method of a display substrate is characterized by comprising a step of manufacturing a conductive pattern, and the step specifically comprises the following steps:
forming a conductive material film layer;
forming a fixed structure on the conductive material film layer; the fixing structure and the flat layer or the pixel defining layer in the display substrate are made of the same material;
patterning the conductive material film layer to form a plurality of conductive patterns, wherein each conductive pattern comprises a middle area and an edge area surrounding the middle area, and an orthographic projection of the fixed structure on the conductive pattern at least partially overlaps with the edge area;
the step of patterning the conductive material film layer to form a plurality of conductive patterns specifically includes:
forming a photoresist completely covering the conductive material film layer and the fixed structure;
exposing the photoresist by using a mask plate comprising a light transmitting area and a light shading area to form a photoresist reserving area and a photoresist removing area, wherein the photoresist reserving area corresponds to the area where the conductive pattern is located, and the photoresist removing area corresponds to other areas except the area where the conductive pattern is located;
removing the photoresist in the photoresist removing area by using a developing solution;
taking the photoresist in the photoresist retention region as a mask, and etching the conductive material film layer in the photoresist removal region to remove the conductive material film layer in the photoresist removal region;
and stripping the photoresist in the photoresist retention area to form the conductive pattern.
2. The method for manufacturing a display substrate according to claim 1, wherein the step of forming a fixing structure on the conductive material film layer specifically comprises:
forming a fixed film layer on the conductive material film layer;
and patterning the fixed film layer to form the fixed structure.
3. The method for manufacturing a display substrate according to claim 2, wherein the step of forming a fixing film layer on the conductive material film layer specifically comprises:
forming the fixed film layer on the conductive material film layer by adopting a photosensitive resin material;
the step of patterning the fixing film layer to form the fixing structure specifically includes:
exposing the fixed film layer by using a mask plate comprising a light transmitting area and a light shading area to form a fixed film layer reserving area and a fixed film layer removing area, wherein the fixed film layer reserving area corresponds to the area where the fixed structure is located, and the fixed film layer removing area corresponds to other areas except the area where the fixed structure is located;
and developing the exposed fixed film layer by using a developing solution, and removing the fixed film layer positioned in the fixed film layer removing area to form the fixed structure.
4. The method for manufacturing a display substrate according to claim 2, wherein the step of forming a fixing film layer on the conductive material film layer specifically comprises:
forming the fixed film layer on the conductive material film layer by using an inorganic insulating material;
the step of patterning the fixing film layer to form the fixing structure specifically includes:
forming photoresist on the fixed film layer;
exposing the photoresist by using a mask plate comprising a light transmitting area and a light shading area to form a photoresist reserving area and a photoresist removing area, wherein the photoresist reserving area corresponds to the area where the fixed structure is located, and the photoresist removing area corresponds to other areas except the area where the fixed structure is located;
developing the exposed photoresist by using a developing solution to remove the photoresist in the photoresist removing area;
taking the photoresist positioned in the photoresist retention region as a mask, and etching the fixed film layer positioned in the photoresist removal region to remove the fixed film layer positioned in the photoresist removal region;
and stripping the photoresist in the photoresist retention region to form the fixed structure.
5. The method for manufacturing a display substrate according to any one of claims 1 to 4, wherein the conductive pattern comprises an anode pattern of the display substrate, the method further comprising:
before the step of manufacturing the conductive pattern, manufacturing a pixel circuit layer on a provided substrate, wherein the pixel circuit layer comprises a plurality of pixel circuits;
the step of making the conductive pattern specifically comprises:
forming the anode patterns corresponding to the pixel circuits one by one on one side of the pixel circuit layer, which is opposite to the substrate, wherein the anode patterns are electrically connected with the output electrodes of the driving transistors in the corresponding pixel circuits;
the manufacturing method further comprises the following steps:
after the step of manufacturing the conductive pattern, manufacturing a pixel defining layer used for defining a plurality of pixel opening areas on one side of the fixed structure, which faces away from the anode pattern, wherein the pixel opening areas expose at least part of the anode pattern in a one-to-one correspondence manner;
and forming a spacer on the surface of the pixel defining layer, which faces away from the substrate.
6. A display substrate manufactured by the method for manufacturing a display substrate according to any one of claims 1 to 5, the display substrate comprising:
a plurality of conductive patterns, each of the conductive patterns including a middle region and an edge region surrounding the middle region;
the fixing structure is arranged on the conductive pattern, the orthographic projection of the fixing structure on the conductive pattern is at least partially overlapped with the edge area, and the fixing structure and the flat layer or the pixel defining layer in the display substrate are made of the same material.
7. A display substrate according to claim 6, wherein an orthographic projection of the fixing structure on the conductive pattern coincides with the edge region.
8. The display substrate according to claim 6 or 7, wherein the conductive pattern comprises an anode pattern;
the display substrate further includes:
a substrate, a first electrode and a second electrode,
a pixel circuit layer disposed on the substrate, the pixel circuit layer including a plurality of pixel circuits;
the anode electrical pattern is positioned on one side of the pixel circuit layer, which is back to the substrate, and the anode electrical pattern is electrically connected with the output electrodes of the driving transistors in the pixel circuits in a one-to-one correspondence manner;
a pixel defining layer disposed on a side of the fixed structure facing away from the substrate, the pixel defining layer defining a plurality of pixel opening areas, the pixel opening areas exposing at least a portion of the anode pattern in a one-to-one correspondence;
and the spacers are arranged on the surface of the pixel definition layer, which faces away from the substrate.
9. A display device comprising the display substrate according to any one of claims 6 to 8.
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| CN1694594A (en) * | 2004-05-08 | 2005-11-09 | 悠景科技股份有限公司 | Organic plane luminous display and its manufacturing method |
| CN107665903A (en) * | 2016-07-29 | 2018-02-06 | 乐金显示有限公司 | Organic light-emitting display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1694594A (en) * | 2004-05-08 | 2005-11-09 | 悠景科技股份有限公司 | Organic plane luminous display and its manufacturing method |
| CN107665903A (en) * | 2016-07-29 | 2018-02-06 | 乐金显示有限公司 | Organic light-emitting display device |
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