CN110146727A - A kind of apparatus for testing chip - Google Patents

A kind of apparatus for testing chip Download PDF

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Publication number
CN110146727A
CN110146727A CN201910509776.9A CN201910509776A CN110146727A CN 110146727 A CN110146727 A CN 110146727A CN 201910509776 A CN201910509776 A CN 201910509776A CN 110146727 A CN110146727 A CN 110146727A
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CN
China
Prior art keywords
ring
chip
ring body
block
base ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910509776.9A
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Chinese (zh)
Other versions
CN110146727B (en
Inventor
王淑琴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Dingyuan Nanotechnology Co.,Ltd.
Zhejiang haizhixin Technology Co.,Ltd.
ZHEJIANG UNISOM NEW MATERIAL TECHNOLOGY Co.,Ltd.
Original Assignee
Huzhou Jingyuan Information Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Huzhou Jingyuan Information Technology Co Ltd filed Critical Huzhou Jingyuan Information Technology Co Ltd
Priority to CN201910509776.9A priority Critical patent/CN110146727B/en
Publication of CN110146727A publication Critical patent/CN110146727A/en
Application granted granted Critical
Publication of CN110146727B publication Critical patent/CN110146727B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

The invention discloses a kind of apparatus for testing chip, the structure of rack includes that chip places ring, frame disk, card slot, mounting blocks, frame disk is equipped with more than two chips and places ring, these chips place ring and are uniformly divided into two groups, it is in be equally spaced that chip between every group, which places ring, the horizontal both ends of frame disk are symmetrically arranged with card slot, wherein one side middle is equipped with mounting blocks to frame disk, wherein one side middle level is welded with mounting blocks to frame disk, the present invention passes through base ring, pressure ring clamps chip jointly and is detected, the mode being movably fastened is not susceptible to deviate, and base ring, the hollow structure of pressure ring makes chip completely exposed, guarantee that the two-sided of chip can be carried out detecting, base ring of the present invention, pressure ring is movably fastened design, as long as chip is put into base ring, when taking out chip, as long as pressure ring is removed, base ring is allowed to be tilted a certain angle Chip is taken out, realizes the purpose that chip Yi Fangyi takes.

Description

A kind of apparatus for testing chip
Technical field
The present invention relates to chip detection fields, particularly with regard to a kind of apparatus for testing chip.
Background technique
Chip testing is a bigger problem, during directly running through the design of entire chip and volume production, chip Defects detection be mainly during monocrystalline silicon production because extraneous factor such as temperature, pull rate and two word mechanics it is each Kind of randomness, causes to will appear dislocation in growth course, not will do it detection after generally encapsulating, only before packaging to chip into Row chip testing, and since fixed device is all metal in chip testing process, cause to coagulate after encountering environment and becoming quenching by heat Dew, the accumulation of dew are easy to influence to cause detection accuracy against chip detection.
Summary of the invention
In view of the above-mentioned deficiencies in the prior art, it is an object of the present invention to provide a kind of apparatus for testing chip.
The present invention is to realize by the following technical solutions:
A kind of apparatus for testing chip, the structure of rack include that chip places ring, frame disk, card slot, mounting blocks, the frame disk Ring is placed equipped with more than two chips, these chips place ring and are uniformly divided into two groups, and the chip placement ring between every group is in etc. Away from distribution, the horizontal both ends of frame disk are symmetrically arranged with card slot, and wherein one side middle is equipped with mounting blocks, the frame to the frame disk Wherein one side middle level is welded with mounting blocks to disk.
As advanced optimizing for the technical program, the chip is placed ring and is mainly made of base ring and pressure ring, the bottom Ring and pressure ring are mutually movably fastened, and the pressure ring is made of wedge mouth, press-ring body and pressing block, on the internal ring wall of the press-ring body It is uniformly equidistantly equipped with more than two pressing blocks, the pressing block and the welding of press-ring body level, is formed between pressing block two-by-two Space be wedge mouth.
As advanced optimizing for the technical program, the overall structure of the pressing block is arcuate structure, and its is transversal Face is inverted right angled triangle, and its downward triangled tip is arc-shaped, and the inclined-plane and base ring of the pressing block match, one Aspect is can precisely to align with base ring, blocks chip, and the triangled tip of another aspect arc-shaped will not be scraped against generating on chip Trace.
As advanced optimizing for the technical program, the base ring by placement block, with healing up, inner ring body, eat dishes without rice or wine, base ring body Composition, the internal ring wall of the base ring body is equipped with more than two placement blocks, the placement block and the welding of base ring body level, described Place the block other end be fixedly connected with the outer wall of inner ring body, the inner ring body is located inside base ring body, the inner ring body it is outer directly Diameter is less than the interior diameter of base ring body, and the inner space of the inner ring body is to eat dishes without rice or wine, and is formed by space between placement block two-by-two and is It is described with healing up and pressing block cooperates with healing up.
As advanced optimizing for the technical program, the block and the horizontal sextant angle of inner ring body top surface placed is-degree, described Place the joining place seamless connection between block and inner ring body, and interface it is smooth,.
As advanced optimizing for the technical program, the joining place for placing block and inner ring body is embedded with one block of arc rubber Block.
As advanced optimizing for the technical program, the inner ring body is up-narrow and down-wide ring body structurc, inclined again Structure design, the drop for allowing fog to condense preferably are discharged.
As advanced optimizing for the technical program, inner ring body internal ring wall bottom is chamfering structure.
A kind of apparatus for testing chip of the present invention has the advantage that compared with prior art
1, the present invention is clamped chip jointly and is detected by base ring, pressure ring, and the mode being movably fastened is not susceptible to deviate, And the hollow structure of base ring, pressure ring makes chip completely exposed, guarantees that the two-sided of chip can be carried out detecting.
2, base ring of the present invention, pressure ring are movably fastened design, as long as chip is put into base ring, are taking out chip When, as long as pressure ring is removed, chip can be taken out by allowing base ring to be tilted a certain angle, and realize the purpose that chip Yi Fangyi takes.
3, the inclined design of present invention placement block, the discharge and drainage of drop made of on the one hand fog being facilitated to condense, On the other hand, the design on inclined-plane can also prevent various sizes of chip, improve the diversity used.
4, the design of arc rubber block of the present invention when chip placement, can reduce the dynamics of placement, reduce impact force Damage to chip.
5, the present invention is designed by the structure of inner ring body, and water droplet made of allowing fog to condense preferably is discharged, and dropping liquid is dry Only, liquid residual is not had.
Detailed description of the invention
Fig. 1 is a kind of floor map of apparatus for testing chip rack of the present invention.
Fig. 2 is the floor map of base ring of the present invention.
Fig. 3 is the floor map of pressure ring of the present invention.
Fig. 4 is the schematic perspective view of base ring of the present invention.
Fig. 5 is the schematic perspective view of inner ring body of the present invention.
Fig. 6 is diagrammatic cross-section when chip of the present invention places ring installation.
In figure: chip places ring 1, frame disk 2, card slot 3, mounting blocks 4, base ring a, pressure ring b, places block a1, with the a2 that heals up, interior Ring body a3, the a4 that eats dishes without rice or wine, base ring body a5, arc rubber block 7.
Specific embodiment
With reference to embodiment and Detailed description of the invention, the preferred embodiment that the present invention is further explained.
Embodiment
Fig. 1-Fig. 6 is please referred to, the present invention provides a kind of apparatus for testing chip, it is characterised in that: the structure of rack includes Chip places ring 1, frame disk 2, card slot 3, mounting blocks 4, and the frame disk 2 is equipped with more than two chips and places ring 1, these chips are put It sets ring 1 and is uniformly divided into two groups, the chip between every group places ring 1 in being equally spaced, and the horizontal both ends of the frame disk 2 are symmetrically arranged with card Slot 3, wherein one side middle is equipped with mounting blocks 4 to the frame disk 2, and wherein one side middle level is welded with the frame disk 2 Mounting blocks 4.
The chip is placed ring 1 and is mainly made of base ring a and pressure ring b, and the base ring a and pressure ring b are mutually movably fastened, institute Pressure ring b is stated to be made of wedge mouth b1, press-ring body b2 and pressing block b3, it is uniformly equidistant on the internal ring wall of the press-ring body b2 to be equipped with two A above pressing block b3, the pressing block b3 and the welding of press-ring body b2 level, are formed by space between pressing block b3 two-by-two For wedge mouth b1.
The overall structure of the pressing block b3 is arcuate structure, and its cross section is inverted right angled triangle, and its Downward triangled tip is arc-shaped, and the inclined-plane and base ring a of the pressing block b3 matches, and being on the one hand can be accurate with base ring a Contraposition, blocks chip, and the triangled tip of another aspect arc-shaped will not generate scratch on opposite chip.
The base ring a is formed by placement block a1, with the a2 that heals up, inner ring body a3, the a4 that eats dishes without rice or wine, base ring body a5, the base ring body The internal ring wall of a5 is equipped with more than two placement block a1, the placement block a1 and the welding of base ring body a5 level, the placement block The a1 other end is fixedly connected with the outer wall of inner ring body a3, and the inner ring body a3 is located inside base ring body a5, the inner ring body a3's Overall diameter is less than the interior diameter of base ring body a5, and the inner space of the inner ring body a3 is the a4 that eats dishes without rice or wine, and places institute between block a1 two-by-two The space of formation is to cooperate with the a2 that heals up, the a2 and pressing block b3 that heals up that matches.
The block a1 and the horizontal sextant angle of the top surface inner ring body a3 of placing is 30-45 degree, the placement block a1 and inner ring body a3 Between joining place seamless connection, and interface is smooth, and joining place is avoided to have corner angle to scratch chip.
The joining place for placing block a1 and inner ring body a3 is embedded with one piece of arc rubber block 7, after chip is put into, can buffer Hardness caused by directly transferring is worn.
The inner ring body a3 is up-narrow and down-wide ring body structurc, again inclined structure design, the drop for allowing fog to condense Preferably it is discharged.
The inner ring body a3 internal ring wall bottom is chamfering structure, prevents fog condensation from causing dropping liquid incomplete, there are also drops It can not the clean phenomenon of dropping liquid.
When environment is become by heat into quenching, fog droplet can be condensed on frame disk 2, many a little makes a mickle can be along placement block a1 It gradually glides, and places the joining place seamless connection between block a1 and inner ring body a3, on the one hand droplet can be allowed smoothly to glide, it is another Aspect is also avoided that joining place has corner angle to scratch chip, furthermore can also install arc rubber block 7 in this position, ties as buffering Structure reduces the impulse force that chip is placed, and guarantees the integrality of chip surface picture and text, the small water to have glided along block a1 is placed Pearl also passes through inner ring body a3 and continues to glide, and does not have retardance sense, can be discharged as early as possible, and inner ring body a3 internal ring wall bottom is chamfering Structure allows that liquid energy transient flow completely without having residual, droplet to be avoided to contact with chip, reduces detection accuracy, to be checked The chip of survey is placed into base ring a, is placed the inclined design of block a1, can be placed the chip of different size, improve test sample Diversity is movably fastened after placement using pressure ring b and base ring a, and chip, which is fixed, to be not susceptible to deviate, and base ring a, pressure ring The design of b can allow chip to carry out two-sided detection.

Claims (8)

1. a kind of apparatus for testing chip, main includes test probe, rack composition, it is characterised in that: the structure packet of rack It includes chip and places ring (1), frame disk (2), card slot (3), mounting blocks (4), the frame disk (2) is equipped with more than two chips and places ring (1), these chips placement ring (1) is uniformly divided into two groups, and it is in be equally spaced that the chip between every group, which places ring (1), the frame disk (2) horizontal both ends are symmetrically arranged with card slot (3), and wherein one side middle is equipped with mounting blocks (4) to the frame disk (2).
2. a kind of apparatus for testing chip according to claim 1, it is characterised in that: the chip place ring (1) mainly by Base ring (a) and pressure ring (b) are constituted, and the base ring (a) and pressure ring (b) are mutually movably fastened, and the pressure ring (b) is by wedge mouth (b1), press-ring body (b2) and pressing block (b3) form, uniformly equidistant on the internal ring wall of the press-ring body (b2) to be equipped with two or more Pressing block (b3), be formed by between pressing block (b3) two-by-two space be wedge mouth (b1).
3. a kind of apparatus for testing chip according to claim 2, it is characterised in that: the overall structure of the pressing block (b3) For arcuate structure, and its cross section is inverted right angled triangle, and its downward triangled tip is arc-shaped.
4. a kind of apparatus for testing chip according to claim 2, it is characterised in that: the base ring (a) by placement block (a1), With heal up (a2), inner ring body (a3), eat dishes without rice or wine (a4), base ring body (a5) composition, the internal ring wall of the base ring body (a5) is equipped with two A above placement block (a1), the placements block (a1) and base ring body (a5) is horizontal welds, placement block (a1) other end with The outer wall of inner ring body (a3) is fixedly connected, and the inner ring body (a3) is located inside base ring body (a5), outside the inner ring body (a3) Diameter is less than the interior diameter of base ring body (a5), and the inner space of the inner ring body (a3) is to eat dishes without rice or wine (a4), places block (a1) two-by-two Between be formed by space be with heal up (a2), it is described with healing up (a2) and pressing block (b3) mutual cooperation.
5. a kind of apparatus for testing chip according to claim 4, it is characterised in that: the placement block (a1) and inner ring body (a3) horizontal sextant angle of top surface is 30-45 degree.
6. a kind of apparatus for testing chip according to claim 4 or 5, it is characterised in that: the placement block (a1) and inner ring The joining place of body (a3) is embedded with one piece of arc rubber block (7).
7. a kind of apparatus for testing chip according to claim 4, it is characterised in that: the inner ring body (a3) is up-narrow and down-wide Ring body structurc.
8. a kind of apparatus for testing chip according to claim 4 or 7, it is characterised in that: inner ring body (a3) internal ring wall Bottom is chamfering structure.
CN201910509776.9A 2019-06-13 2019-06-13 Chip testing device Active CN110146727B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910509776.9A CN110146727B (en) 2019-06-13 2019-06-13 Chip testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910509776.9A CN110146727B (en) 2019-06-13 2019-06-13 Chip testing device

Publications (2)

Publication Number Publication Date
CN110146727A true CN110146727A (en) 2019-08-20
CN110146727B CN110146727B (en) 2021-05-11

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ID=67591134

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910509776.9A Active CN110146727B (en) 2019-06-13 2019-06-13 Chip testing device

Country Status (1)

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CN (1) CN110146727B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101131399A (en) * 2006-08-21 2008-02-27 雅马哈株式会社 Test chip socket
CN101231324A (en) * 2007-01-23 2008-07-30 未来产业株式会社 Test tray and handler using the test tray
CN203932034U (en) * 2014-05-09 2014-11-05 南通华隆微电子有限公司 A kind of chip fixing bracket
CN104181336A (en) * 2013-05-21 2014-12-03 标准科技股份有限公司 Test module
CN207425840U (en) * 2017-09-22 2018-05-29 泉州市君健智能家居设备有限公司 A kind of seal ring structure for being used to protect IC chip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101131399A (en) * 2006-08-21 2008-02-27 雅马哈株式会社 Test chip socket
CN101231324A (en) * 2007-01-23 2008-07-30 未来产业株式会社 Test tray and handler using the test tray
CN104181336A (en) * 2013-05-21 2014-12-03 标准科技股份有限公司 Test module
CN203932034U (en) * 2014-05-09 2014-11-05 南通华隆微电子有限公司 A kind of chip fixing bracket
CN207425840U (en) * 2017-09-22 2018-05-29 泉州市君健智能家居设备有限公司 A kind of seal ring structure for being used to protect IC chip

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Effective date of registration: 20210423

Address after: 316000 No.10 Chuangyuan Avenue, Dinghai Industrial Park, Dinghai District, Zhoushan City, Zhejiang Province

Applicant after: ZHEJIANG UNISOM NEW MATERIAL TECHNOLOGY Co.,Ltd.

Applicant after: Zhejiang haizhixin Technology Co.,Ltd.

Applicant after: Wuxi Dingyuan Nanotechnology Co.,Ltd.

Address before: 313000 Zhejiang Huzhou Huzhou Economic and Technological Development Zone Saige Digital City 2 Huzhou Jingyuan Information Technology Co., Ltd.

Applicant before: HUZHOU JINGYUAN INFORMATION TECHNOLOGY Co.,Ltd.

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