CN110144608A - A kind of nickel plating solution and nickel plating process applied to plating processing - Google Patents
A kind of nickel plating solution and nickel plating process applied to plating processing Download PDFInfo
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- CN110144608A CN110144608A CN201910512874.8A CN201910512874A CN110144608A CN 110144608 A CN110144608 A CN 110144608A CN 201910512874 A CN201910512874 A CN 201910512874A CN 110144608 A CN110144608 A CN 110144608A
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- nickel
- dosage
- nickel plating
- plating
- stabilizer
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
The present invention provides a kind of nickel plating solutions applied to plating processing comprising following components: nickel salt, sodium hypophosphite, stabilizer and water；The dosage of nickel salt is 4-8g/L；The dosage of sodium hypophosphite is 26-34g/L；The dosage of stabilizer is 1-5mg/L；Surplus is water.The present invention also provides a kind of nickel plating process applied to plating processing.The present invention can effectively improve the speed of product nickel plating compared to the prior art, and then effectively improve production efficiency.
Description
Technical field
The present invention relates to field of electroplating, in particular to a kind of nickel plating solution applied to plating processing and nickel plating side
Method.
Background technique
Plating is to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, master
To make the technique of the surface of metal or other materials product attachment layer of metal film using electrolysis prevents metal to play
The effects of oxidation (as corroded), raising wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.
Nickel plating is a specific processing technology in plating, mainly passes through electrolysis or chemical method in metal or certain non-
One layer of nickel is plated on metal, current nickel plating is broadly divided into electronickelling and chemical nickel plating.But conventional plating used at present
Liquid has in nickel plating speed to be had a certain disadvantage, and the raising of production efficiency is unfavorable for.
Summary of the invention
In consideration of it, the present invention provides a kind of nickel plating solution and nickel plating process applied to plating processing, it can be effective
Ground improves the speed of product nickel plating, and then effectively improves production efficiency.
Thus, on the one hand, the present invention provides a kind of nickel plating solutions applied to plating processing comprising following components:
Nickel salt, sodium hypophosphite, stabilizer and water；
The dosage of nickel salt is 4-8g/L；
The dosage of sodium hypophosphite is 26-34g/L；
The dosage of stabilizer is 1-5mg/L；
Surplus is water.
Further, the dosage of above-mentioned nickel salt is 5-7g/L；The dosage of sodium hypophosphite is 28-32g/L；The dosage of stabilizer
For 2-4mg/L.
Further, the dosage of above-mentioned nickel salt is 5-6g/L；The dosage of sodium hypophosphite is 29-31g/L；The dosage of stabilizer
For 3-4mg/L.
Further, the dosage of above-mentioned nickel salt is 5.5-6g/L；The dosage of sodium hypophosphite is 29-30g/L；The use of stabilizer
Amount is 3.5-4mg/L.
Further, the dosage of above-mentioned nickel salt is 6g/L；The dosage of sodium hypophosphite is 30g/L；The dosage of stabilizer is
4mg/L。
On the other hand, the present invention provides a kind of nickel plating process applied to plating processing comprising following steps:
1) nickel plating solution is made into according to above-mentioned proportion after mixing and is poured into nickel bath；
2) product is added in nickel bath, starts to carry out nickel plating operation.
Further, filter basket is installed, product is put into progress nickel plating operation in filter basket in above-mentioned nickel bath.
Further, above-mentioned filter basket is cylindrical filter basket, and its bottom is provided with the oval expansion mouth in cross section.
In a kind of nickel plating solution and nickel plating process applied to plating processing provided by the present invention, nickel is mainly used
The components such as salt, sodium hypophosphite, stabilizer and water can effectively improve product nickel plating by the component and the proportion
Speed, and then effectively improve production efficiency.
Detailed description of the invention
By reading the following detailed description of the preferred embodiment, various other advantages and benefits are common for this field
Technical staff will become clear.The drawings are only for the purpose of illustrating a preferred embodiment, and is not considered as to the present invention
Limitation.And throughout the drawings, the same reference numbers will be used to refer to the same parts.In the accompanying drawings:
Fig. 1 is involved in a kind of nickel plating solution and nickel plating process applied to plating processing provided in an embodiment of the present invention
Nickel bath structural schematic diagram.
Specific embodiment
Exemplary embodiments of the present disclosure are described in more detail below with reference to accompanying drawings.Although showing the disclosure in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here
It is limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure
It is fully disclosed to those skilled in the art.
The embodiment of the invention provides a kind of nickel plating solutions applied to plating processing comprising following components: nickel salt, secondary
Sodium phosphate, stabilizer and water；Wherein, the dosage of nickel salt is 6g/L；The dosage of sodium hypophosphite is 30g/L；The dosage of stabilizer is
4mg/L；Surplus is water.
A kind of nickel plating solution applied to plating processing provided in an embodiment of the present invention can also be carried out using following proportion
Implement.
| Embodiment | Nickel salt | Sodium hypophosphite | Stabilizer | Water |
| 1 | 5g/L | 32g/L | 3.5mg/L | Surplus |
| 2 | 8g/L | 27g/L | 3mg/L | Surplus |
| 3 | 7g/L | 28g/L | 4mg/L | Surplus |
| 4 | 5.5g/L | 31g/L | 3mg/L | Surplus |
| 5 | 4g/L | 33g/L | 2mg/L | Surplus |
| 6 | 6g/L | 29g/L | 1mg/L | Surplus |
It is a kind of applied to being electroplated in the nickel plating solution and nickel plating process of processing provided by the present embodiment, mainly use nickel
The components such as salt, sodium hypophosphite, stabilizer and water can effectively improve product nickel plating by the component and the proportion
Speed, and then effectively improve production efficiency.
Referring to Fig. 1, the embodiment of the invention also provides a kind of nickel plating process applied to plating processing comprising following step
It is rapid:
S1: nickel plating solution is made into according to above-mentioned proportion after mixing and is poured into nickel bath 1；
S2: product is added in nickel bath 1, starts to carry out nickel plating operation.
With continued reference to Fig. 1, wherein nickel bath 1) in filter basket 11 is installed, product is put into progress nickel plating operation in filter basket 11,
Filter basket 11 is cylindrical filter basket, and its bottom is provided with the oval expansion mouth 12 in cross section, can expand heap buildup bottom
The region contacted with nickel plating solution and area, so that nickel plating can be disposably completed herein, done over again without secondary in turn,
And then the yield of product can be improved.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (8)
1. a kind of nickel plating solution applied to plating processing, which is characterized in that including following components: nickel salt, sodium hypophosphite, stabilization
Agent and water；
The dosage of the nickel salt is 4-8g/L；
The dosage of the sodium hypophosphite is 26-34g/L；
The dosage of the stabilizer is 1-5mg/L；
Surplus is the water.
2. a kind of nickel plating solution applied to plating processing according to claim 1, which is characterized in that the use of the nickel salt
Amount is 5-7g/L；The dosage of the sodium hypophosphite is 28-32g/L；The dosage of the stabilizer is 2-4mg/L.
3. a kind of nickel plating solution applied to plating processing according to claim 1, which is characterized in that the use of the nickel salt
Amount is 5-6g/L；The dosage of the sodium hypophosphite is 29-31g/L；The dosage of the stabilizer is 3-4mg/L.
4. a kind of nickel plating solution applied to plating processing according to claim 1, which is characterized in that the use of the nickel salt
Amount is 5.5-6g/L；The dosage of the sodium hypophosphite is 29-30g/L；The dosage of the stabilizer is 3.5-4mg/L.
5. a kind of nickel plating solution applied to plating processing according to claim 1, which is characterized in that the use of the nickel salt
Amount is 6g/L；The dosage of the sodium hypophosphite is 30g/L；The dosage of the stabilizer is 4mg/L.
6. a kind of nickel plating process applied to plating processing, which comprises the following steps:
1) -5 any proportions are made into nickel plating solution after mixing and are poured into nickel bath (1) according to claim 1；
2) product is added in the nickel bath (1), starts to carry out nickel plating operation.
7. a kind of nickel plating process applied to plating processing according to claim 6, which is characterized in that the nickel bath
(1) it is equipped in filter basket (11), product, which is put into the filter basket (11), carries out nickel plating operation.
8. a kind of nickel plating process applied to plating processing according to claim 7, which is characterized in that the filter basket (11)
For cylindrical filter basket, and its bottom is provided with the oval expansion mouth in cross section (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910512874.8A CN110144608A (en) | 2019-06-13 | 2019-06-13 | A kind of nickel plating solution and nickel plating process applied to plating processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910512874.8A CN110144608A (en) | 2019-06-13 | 2019-06-13 | A kind of nickel plating solution and nickel plating process applied to plating processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110144608A true CN110144608A (en) | 2019-08-20 |
Family
ID=67591320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910512874.8A Pending CN110144608A (en) | 2019-06-13 | 2019-06-13 | A kind of nickel plating solution and nickel plating process applied to plating processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110144608A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102828207A (en) * | 2012-09-13 | 2012-12-19 | 广东达志环保科技股份有限公司 | Nickel electroplating solution and electroplating method thereof |
| CN104060302A (en) * | 2014-06-13 | 2014-09-24 | 安徽省宁国天成电工有限公司 | Copper wire nickel-plating electrolyte and preparation method thereof |
| CN105177652A (en) * | 2015-10-29 | 2015-12-23 | 无锡桥阳机械制造有限公司 | Carbon fiber cladding process |
| CN105239125A (en) * | 2015-10-29 | 2016-01-13 | 无锡桥阳机械制造有限公司 | Electroplating technology |
| CN105525320A (en) * | 2014-09-30 | 2016-04-27 | 天津市金鑫利金属制品有限公司 | Nickel plating method used for heating plate |
| CN108315787A (en) * | 2018-05-08 | 2018-07-24 | 大同新成新材料股份有限公司 | A kind of technique of brush plating |
| CN108505079A (en) * | 2018-04-26 | 2018-09-07 | 大同新成新材料股份有限公司 | A kind of magnesium alloy brush nickel plating technology |
-
2019
- 2019-06-13 CN CN201910512874.8A patent/CN110144608A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102828207A (en) * | 2012-09-13 | 2012-12-19 | 广东达志环保科技股份有限公司 | Nickel electroplating solution and electroplating method thereof |
| CN104060302A (en) * | 2014-06-13 | 2014-09-24 | 安徽省宁国天成电工有限公司 | Copper wire nickel-plating electrolyte and preparation method thereof |
| CN105525320A (en) * | 2014-09-30 | 2016-04-27 | 天津市金鑫利金属制品有限公司 | Nickel plating method used for heating plate |
| CN105177652A (en) * | 2015-10-29 | 2015-12-23 | 无锡桥阳机械制造有限公司 | Carbon fiber cladding process |
| CN105239125A (en) * | 2015-10-29 | 2016-01-13 | 无锡桥阳机械制造有限公司 | Electroplating technology |
| CN108505079A (en) * | 2018-04-26 | 2018-09-07 | 大同新成新材料股份有限公司 | A kind of magnesium alloy brush nickel plating technology |
| CN108315787A (en) * | 2018-05-08 | 2018-07-24 | 大同新成新材料股份有限公司 | A kind of technique of brush plating |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190820 |
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| RJ01 | Rejection of invention patent application after publication |