CN110144583B - Wide-beam and adjustable-powder-feeding-angle rapid and efficient semiconductor laser cladding device - Google Patents
Wide-beam and adjustable-powder-feeding-angle rapid and efficient semiconductor laser cladding device Download PDFInfo
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- CN110144583B CN110144583B CN201910450822.2A CN201910450822A CN110144583B CN 110144583 B CN110144583 B CN 110144583B CN 201910450822 A CN201910450822 A CN 201910450822A CN 110144583 B CN110144583 B CN 110144583B
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Abstract
The invention belongs to the technical field of laser surface modification, and discloses a wide-beam and adjustable-powder-feeding-angle rapid and efficient semiconductor laser cladding device which comprises a semiconductor laser (1), a beam shaping and Fresnel focusing system (2), an adjustable-wide-band powder feeding head (3), a powder feeder (6), a high-speed machine tool (5), a six-axis linkage robot (4) and a central control system (9), wherein the beam shaping and Fresnel focusing system (2) is used for shaping and focusing laser into wide-band laser; the adjustable wide-light-band powder feeding head (3) is used for feeding powder and wide-light-band laser to the surface of a large shaft type workpiece to be processed; the diameter of the workpiece is more than 1000mm, and the length of the workpiece is not less than 10 m. By improving the structure and the arrangement mode of the key components, the invention can strengthen the outer surface and repair the surface of large-scale shaft-type workpieces such as petroleum pipelines, marine equipment, natural gas transmission, mining, tunneling and the like, strengthen the wear resistance and corrosion resistance of the surface and greatly improve the service life of the large-scale shaft-type workpieces.
Description
Technical Field
The invention belongs to the technical field of laser surface modification of high-efficiency high-power semiconductor lasers, and particularly relates to a rapid high-efficiency semiconductor laser cladding device with a wide light beam and an adjustable powder feeding angle, in particular to semiconductor laser surface treatment for the surface of an ultra-large shaft workpiece.
Background
The piston rod structure of the ultra-large hydraulic cylinder is widely applied to various industrial fields such as petroleum pipelines, marine equipment, natural gas transmission, mining, tunnel tunneling and the like. Since the mechanical working environment is often in direct contact with silt and corrosive solutions, the corrosion and wear resistance of the outer surface of large rod-shaped workpieces such as piston rods is highly required. Because the damage of the components is likely to affect the function of the whole equipment once the wear-resistant and corrosion-resistant functions of the parts are failed, and the conventional repair technology for the parts is time-consuming, the production shutdown caused by repairing the parts is also a huge economic loss.
The surface treatment technology aiming at the outer surface of the large piston rod at present mainly comprises the following steps:
hard chromium plating technology: the hard chromium plating technology is to soak the workpiece in an acid electrochemical bath at 50-65 ℃, and free chromium ions are separated out in an electrolyte and attached to the surface of the workpiece. However, since the coating is not metallurgically bonded to the workpiece surface, the coating is prone to peeling off. Meanwhile, in order to obtain a protective layer with a thickness of 100-300 microns, the workpiece is usually required to be electroplated for multiple times, a large amount of energy is consumed in the process, and toxic carcinogenic waste liquid is generated. Therefore, in recent years, relevant laws and regulations are developed at home and abroad to limit the implementation of the chromium electroplating technology.
The thermal spraying technology comprises the following steps: thermal spraying is to melt and accelerate the coating material in a combustion chamber to a speed of 600 to 1000 meters per second by using high-temperature fuel, and then spray the coating material on the surface of a workpiece to be coated. However, the technique has the obvious disadvantages that the bonding strength between the coating and the substrate is weak, and the porosity of the coating is high, so that the service life of the coating is not long. Moreover, the coating process consumes a large amount of materials and gases, and the utilization rate of the coating material is not high.
The conventional laser cladding technology comprises the following steps: the laser cladding technology is characterized in that the coating material and the matrix are irradiated by high-energy laser technology and are melted, the coating material and the matrix form tight metallurgical bonding, the laser cladding technology has the characteristics of small heat affected zone, small workpiece deformation, fine layer crystal grains and compact structure, and the technological process is not limited by the coating material. Therefore, the laser cladding technology is often used for producing high-quality firm coatings and is very suitable for workpiece repair work of large steel pipes in severe production environments such as ocean platforms and oil mines. However, the conventional laser cladding technology has low laser scanning speed, the increase of laser power can cause large area heat input, and the internal thermal stress of the cladding layer can cause the cladding layer to generate micro cracks, thereby affecting the coating quality.
Small spot high-speed laser cladding: the small spot high speed laser cladding technology is based on the conventional laser cladding technology, most of powder absorbs laser energy in the space flowing process to reach the material melting point through a proper control means, so that the powder melting time in a molten pool is reduced, and the cladding speed is improved. However, the small spot high-speed laser cladding adopts the circular small spot with the diameter phi of 1 mm-2 mm, and the cladding area in unit time is not greatly improved although the cladding linear speed is high. Meanwhile, the energy distribution of the light spots adopted by the small-light-spot high-speed laser cladding generally meets Gaussian distribution, and the problem that the light spots have high energy in a small central range and rapidly decline far away from the central energy is solved due to the uneven energy distribution of the light spots, and a large number of powder particles cannot sufficiently absorb the light energy. Meanwhile, the large-scale shaft type workpiece is driven to rotate at high speed, so that the load of the lathe is large and the danger is extremely high. Therefore, the existing ultra-high-speed laser cladding is only suitable for processing small and medium-sized workpieces with the diameter of less than 1000mm, and the surface treatment difficulty is very large for ultra-long large steel pipes with the diameter of more than 1000mm (such as 2000mm) and the length of not less than 10 m.
Disclosure of Invention
Aiming at the defects or improvement requirements of the prior art, the invention aims to provide a wide-beam and adjustable-powder-feeding-angle rapid and efficient semiconductor laser cladding device, which can be used for performing surface strengthening and surface repairing on large shaft type workpieces such as petroleum pipelines, marine equipment, natural gas transmission, mining, tunnel tunneling and the like by improving the structure and the arrangement mode of key components and the working mode of the components in mutual cooperation, is suitable for the large shaft type workpieces with the diameter of more than 1000mm (particularly more than or equal to 2000mm) and the length of not less than 10m, and can be used for strengthening the wear resistance, the corrosion resistance and the like of the surface of the selected workpiece and greatly prolonging the service life of the workpiece. And, different from the conventional small-spot high-speed laser cladding, the invention can be used for uniformly heating and melting the powder spot by further preferably arranging the energy homogenized wide-spot semiconductor laser and the wide-band powder feeding head with the adjustable powder feeding angle according to the metal powder materials with partial granularity and different densities, and corresponding modulation parameters, thereby meeting the requirements of high-speed and high-efficiency cladding, having high powder utilization rate and cladding layer thickness of 0.2-0.5 mm, being suitable for surface strengthening treatment of ultra-large shaft type workpieces, and having the capability of replacing the industrial chromium plating technology.
In order to achieve the purpose, the invention provides a rapid and efficient semiconductor laser cladding device with wide light beam and adjustable powder feeding angle, which is characterized by comprising a high-power semiconductor laser (1) with power not lower than 3KW, a light beam shaping and Fresnel focusing system (2), a wide-light-band powder feeding head (3) with adjustable powder feeding angle and powder feeding width of at least 15mm, a powder feeder (6), a high-speed machine tool (5) with continuously adjustable rotating speed of 1-60 r/min, a six-axis linkage robot (4) and a central control system (9), wherein,
the high-power semiconductor laser (1) is used for outputting high-power laser with the power not lower than 3KW, the laser passes through the light beam shaping and Fresnel focusing system (2) and then is output to the adjustable wide light band powder feeding head (3), and the light beam shaping and Fresnel focusing system (2) is used for shaping the laser and focusing the laser into wide light band laser with the light spot width of at least 15 mm; the adjustable wide-band powder feeding head (3) is connected with the powder feeder (6) and is used for simultaneously feeding powder and the wide-band laser to the surface of the large shaft-type workpiece to be subjected to surface laser cladding treatment; the high-speed machine tool (5) is used for bearing the large shaft-shaped workpiece to be subjected to surface laser cladding treatment and driving the large shaft-shaped workpiece to rotate at a rotating speed not lower than 1 r/min; the central control system (9) is connected with the high-speed machine tool (5) and is used for controlling the rotating speed of the high-speed machine tool (5) for driving the large-scale shaft type workpiece to rotate;
the central control system (9) is also connected with the six-axis linkage robot (4) and is used for controlling the six-axis linkage robot (4) to drive the high-power semiconductor laser (1), the light beam shaping and Fresnel focusing system (2) and the adjustable wide light band powder feeding head (3) to integrally move, so that the wide light band laser and the conveyed powder move along the central axis direction of the large-scale axis-type workpiece, the powder can be melted into liquid drops under the action of the wide light band laser by matching with the rotation of the large-scale axis-type workpiece, and finally the liquid drops fall on the surface of the large-scale axis-type workpiece in a spiral line mode integrally, so that the laser cladding processing of the surface of the large-scale axis-type workpiece is realized;
in addition, the diameter of the large-scale shaft-shaped workpiece to be subjected to surface laser cladding treatment is larger than 1000mm, and the length of the large-scale shaft-shaped workpiece is not less than 10 m.
As a further preferable mode of the present invention, the beam shaping and fresnel focusing system (2) includes a fresnel lens (13) and a cylindrical lens (14), wherein collimated light output by the high power semiconductor laser (1) passes through the fresnel lens (13) to split and rearrange the light beam in the fast axis direction, so that the energy of the light spot in the fast axis direction is uniformly distributed and focused to a preset width a with a width not less than 15mm, and then the slow axis light beam is focused by the cylindrical lens (14), so as to output a rectangular wide-band laser with a light cross-sectional size of b × a and uniformly distributed light beam energy, wherein b is a preset length and b is not more than a, and the width direction of the light spot of the wide-band laser is parallel to the main axis direction of the high speed machine tool (5), and the length direction is perpendicular to the main axis direction of the high speed machine tool (5);
preferably, the predetermined width a is 15mm and the predetermined length b is 2 mm.
As a further preferable aspect of the present invention, the six-axis linkage robot (4) is configured to control the beam shaping and fresnel focusing system (2) to focus the shaped laser beam on the surface of the large-scale shaft-type workpiece.
As a further preferable aspect of the present invention, the high power semiconductor laser (1), the beam shaping and fresnel focusing system (2), and the adjustable broadband power transmission head (3) are integrally moved, specifically, the high power semiconductor laser, the beam shaping and fresnel focusing system, and the adjustable broadband power transmission head are moved synchronously along a main axis direction of the high speed machine tool (5) for a translation distance of a/3 to a for each rotation of the large shaft-type workpiece.
As a further preferable aspect of the present invention, the adjustable broadband powder feeding head (3) includes a plurality of synchronous powder feeding pipes (11) and 2 fan-shaped broadband powder feeding hoppers (21), the plurality of synchronous powder feeding pipes (11) are located outside the side length of the width of the outgoing laser and symmetrically arranged with the outgoing laser as the center, the 2 fan-shaped broadband powder feeding hoppers (21) are also located outside the side length of the width of the outgoing laser and symmetrically arranged with the outgoing laser as the center, the plurality of synchronous powder feeding pipes (11) are used for feeding powder to the 2 fan-shaped broadband powder feeding hoppers (21), and the depression angles of the 2 fan-shaped broadband powder feeding hoppers (21) are controlled and adjustable by the rotating shaft system;
the adjustable wide light band powder feeding head (3) is connected with the central control system (9), the central control system (9) is used for adjusting a rotating shaft system of the fan-shaped wide light band powder feeding hopper (21) according to the density, specific types of materials and particle size of used powder, and further adjusting a depression angle of the fan-shaped wide light band powder feeding hopper (21) to control the convergence height of powder on two sides, so that the action time of the powder and laser is controlled, and solid powder particles can fully absorb laser energy and melt into suspension liquid drops to fall on the surface of a workpiece to form a cladding layer.
As a further preferable mode of the present invention, the high power semiconductor laser (1) is used for high power laser with an output power of 3KW to 10 KW.
As a further optimization of the invention, the high-power semiconductor laser (1) is also connected with a water cooling system (8).
In a further preferred embodiment of the present invention, the depression angle of any one of the fan-shaped wide-band powder hoppers (21) is an angle formed by a correspondence between a ray from the rotation center thereof to the center of the wide-band laser spot and a ray from the rotation center thereof to the center of the powder outlet, and the depression angle is adjustable from 5 degrees to 15 degrees.
Compared with the prior art, the technical scheme provided by the invention has the advantages that for the surface treatment of the semiconductor laser for strengthening the surface of the large-scale shaft-type workpiece, the high-power semiconductor laser, the beam shaping and Fresnel focusing system, the adjustable wide-band powder feeding head, the high-speed machine tool and other components are integrally matched to generate the wide-band laser, so that the powder is melted into liquid drops under the action of the wide-band laser, and finally the liquid drops fall on the surface of the large-scale shaft-type workpiece to be treated in a spiral line mode, the laser cladding treatment of the surface of the large-scale shaft-type workpiece is realized, and the laser cladding treatment device is suitable for the ultra-long large-scale steel pipe with the diameter of more than 1000mm (particularly, the diameter of more.
Specifically, the invention has the following beneficial effects:
(1) the invention adopts the semiconductor laser beam with preset size b × a (such as 2mm × 15mm) as the light source of the ultra-high speed laser cladding technology, makes up the problem of low cladding unit area speed when the conventional small facula beam (such as a round facula with the diameter of 1 mm) for high-speed laser cladding is used for processing an ultra-large shaft workpiece, greatly improves the cladding layer width of single-channel cladding while realizing the same cladding effect as the ultra-high speed laser cladding, properly reduces the linear speed so as to reduce the rotating speed of the machine tool, solves the key problem that the large machine tool cannot drive the large workpiece to rotate at high speed, greatly reduces the danger generated under the ultra-high speed rotation of the workpiece, and also ensures the high speed of the cladding process.
(2) Has wide adaptability to different kinds of powder. Aiming at the problems of different sizes of coating powder particles and different densities of powder materials on the market, the powder spraying head with a variable powder feeding angle is adopted to feed powder, and different powder feeding angles are adjusted according to different weights of powder, so that the flight time of the powder in a light beam can be controlled, the powder materials are guaranteed to fully absorb light energy to be melted under laser radiation, and the necessary condition for realizing high-speed laser cladding is achieved.
(3) The uniform distribution and reasonable distribution of the laser power are realized. The invention adopts Fresnel focusing technology to divide and rearrange the light beam and output a rectangular light beam with uniformly distributed light beam energy. When the homogenized rectangular light spot moves at a high speed, the laser energy absorbed in unit time and unit workpiece area is very limited, and the limited laser energy can only form a thin molten pool on the surface of the workpiece, so that the thermal response area in the cladding process is small, and the dissipation of the laser energy to the inside of the workpiece is reduced. Moreover, because the laser energy is uniformly distributed, the thickness of the molten pool and the thermal response area is also uniform, so that the heat of the molten pool is uniformly diffused into the workpiece, the influence of thermal stress on the cladding layer is reduced, the probability of cracking of the obtained cladding layer on the surface and the boundary is lower, and the quality of the cladding layer is improved.
(4) And a uniform powder feeding mode is adopted, so that the utilization rate of the powder is greatly improved. The powder feeding head for multi-tube powder feeding can uniformly distribute powder under a wide band, powder particles in powder spots can fully absorb light energy and heat to a melting point, the probability of powder loss due to elastic collision when the powder reaches the surface of a workpiece is lower, powder waste is greatly avoided, a cladding thin layer with uniform thickness can be obtained, the utilization rate of the powder is improved, the material cost of the technology is reduced, and the high efficiency of the powder feeding head is embodied.
Taking a rectangle with the light section size of the wide-light-band laser being 2mm × 15mm as an example, the central control system is used for driving the six-axis linkage robot to enable the focus of a light spot to be located on the surface of a workpiece in high-speed moving scanning, the rotating speed of the lathe is controlled to achieve the linear speed of the laser scanning to be 5-50 m/min, the robot is controlled to move along the direction of the main shaft of the lathe to perform synchronous movement of 5-15 mm/rotation, and the laser light spot can be scanned on the surface of the workpiece along different thread lines.
In the process that solid powder particles fully absorb laser energy, melt into suspended liquid drops and fall on the surface of a workpiece to form a cladding layer, main laser energy acts on flying powder to melt the flying powder and falls into a molten pool in a liquid state, so that the linear speed of laser scanning is greatly improved without reducing the linear speed of the laser to input a large amount of laser energy for melting the powder into the molten pool. Meanwhile, the system uses the semiconductor laser wide beam with uniform energy distribution, so that the cladding area in unit time is larger, the laser energy can be uniformly absorbed by the powder spot, the thickness of the cladding layer is more uniform, and the utilization rate of powder is higher.
Drawings
Fig. 1 is an overall structure diagram of a wide-beam adjustable powder feeding fast and efficient laser cladding device.
Fig. 2 is a schematic diagram of a beam shaping and fresnel focusing system, where a is a slow axis direction system optical path and b is a fast axis direction system optical path.
FIG. 3 is a structural diagram of the adjustable angle broadband powder feeding head, wherein (a) corresponds to the fast axis direction of the light spot, and (b) corresponds to the slow axis direction of the light spot.
Fig. 4 is a schematic view of spiral ribbon cladding with process end plates added.
FIG. 5 is a schematic view of cladding an annular band prior to spiral band processing.
In the figure, the reference signs are as follows, 1 is a high-power semiconductor laser, 2 is a beam shaping and Fresnel focusing system, 3 is an angle-adjustable wide-light-band powder feeding head, 4 is a six-axis linkage robot, 5 is a high-speed machine tool, 6 is a powder feeder, 7 is argon shielding gas, 8 is a water cooling system, 9 is a central control system, 10 is a shaft-type workpiece, 11 is a multi-path synchronous powder feeding tube (such as 2 x 4), 12 is a wide-band cladding layer, 13 is a Fresnel lens, 14 is a cylindrical lens, 15 is a system focusing focal plane, 16 is a shielding gas inlet, 17 is a powder feeder depression angle adjusting button, 18 is a powder feeding hopper depression angle adjusting range α, 19 is a powder feeding hopper depression angle adjusting driving spring, 20 is a powder feeding hopper rotating shaft, 21 is a powder feeding hopper (namely, a fan-shaped wide-light-band powder feeding hopper), 22 is a powder feeding hopper positioning end plate, 23 is a semiconductor laser spot-slow shaft (width W is 15mm), 24 is a starting end plate tube (Wg) which is a wide-width-band powder feeding hopper), 22 is a wire-feeding hopper (W) which is a welding wire-shaped wide-processed by a welding process ring (W), 23) is a pre-processed by a rotating end-cladding ring (T-cladding process end plate), 25), a pre-cladding ring-cladding process end plate (W) is processed by a pre-cladding ring pre-cladding process end plate), 23), a pre-cladding ring.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
The special device designed by the invention has a very clear purpose, solves the problems of the laser surface treatment device and the process for the surface modification efficiency of the super-large shaft type workpiece, and can be suitable for carrying out laser cladding treatment on the surface of the large shaft type workpiece with the diameter of more than 1000mm and the length of not less than 10 m.
The specific implementation mode is as follows:
1. as shown in fig. 1, the shaft-shaped workpiece to be machined after the surface cleaning treatment is placed on a high-speed machine tool 5, and the axis of the workpiece is adjusted to coincide with the main axis of the machine tool. And controlling a central control system 9 to move the high-power semiconductor laser 1 mounted on the six-axis linkage robot 4 to the position above the workpiece. The central control system can adjust the robot arm, so that the central optical axis of the cladding head is perpendicular to the central axis of the workpiece, and meanwhile, the output laser of the laser can be focused on the surface of the workpiece to form a 2 x 15mm light spot through beam shaping and the Fresnel focusing system 2, wherein the 15mm long edge of the light spot is parallel to the central axis of the workpiece, and the 2mm short edge of the light spot is perpendicular to the central axis of the workpiece. When the lathe drives the workpiece to rotate, the laser scans along the short side direction (namely the central axis direction of the workpiece) of 2mm of the light spot.
2. And driving the workpiece to rotate and planning a laser scanning path. The cladding layer on the surface of the workpiece needs to be completed through linkage of a machine tool and a robot. The machine tool can drive a workpiece to rotate at a high speed, and at the moment, the robot mounted with the laser translates at a constant speed from one end of the workpiece to the other end of the workpiece along the central axis of the rotation of the workpiece. Wherein, the moving distance of the light spot does not exceed the maximum size (namely 15mm) of the light spot in the direction every time the workpiece rotates one circle. Under the cooperation of the two, the scanning path of the light spot on the surface of the workpiece is a uniform spiral line. The central control system 9 is internally provided with a linkage program of lathe rotation and light spot translation, and selects proper rotation speed, translation speed and overlapping rate according to the processing requirement of a cladding layer, so that laser cladding is carried out on the surface of the whole workpiece. Considering that the machined workpiece is a large-sized shaft-type workpiece, the weight of the workpiece reaches several tons or even tens of tons, and considering the potential danger of the workpiece at a high rotating speed, the rotating speed of the lathe needs to be controlled to enable the laser scanning speed to be 5-50 m/min (compared with the conventional laser cladding, the speed is still high), and the spot translation speed to be 5-15 mm/rotation.
3. Adjusting the powder gathering position and the powder feeding amount. The powder feeding device is opened by the central control system for uniform and angle-adjustable powder feeding, and the powder is fed to the wide-band powder feeding head 3 with an adjustable angle.
The method comprises the steps of controlling the powder converging position above a molten pool by changing the powder converging position according to the adjustable amplitude angle α of the database before processing so as to achieve the necessary condition of ultra-high speed laser convergence, namely that the powder falls into the molten pool in a liquid state, and achieving the synergistic effect of the powder feeding and cladding system for achieving the uniform synergistic effect of the powder feeding and cladding effect of the ultra-high speed laser cladding system on the uniform feeding and cladding of the powder, namely, the uniform feeding and cladding of the powder, which is required by the conventional laser cladding system, and the uniform protection of the powder, which is required by the synergistic effect of the powder feeding and cladding system for achieving the uniform feeding and cladding of the powder, of the ultra-high speed laser cladding system, and the ultra-high speed laser cladding system.
4. And (3) the running condition of the omnibearing laser processing pair system.
(1) The central control system can perform cooperative control on laser output power, light spot movement, lathe rotation and a powder feeding switch. When the omnibearing laser processing is carried out, all moving parts are started according to the required switching sequence, namely, the control interfaces are sequentially opened according to the sequence of machine tool rotation, powder feeding switch, facula movement and laser output. When the machining is finished, the machining system is also required to be closed according to the sequence of the laser, the light spot movement, the powder feeding switch and the machine tool rotation.
(2) Before the processing, protective gas is started and blown for 2-3 minutes. The inert gas argon is used as a protective gas, so that a stable inert gas atmosphere can be formed above the molten pool, and the contact air oxidation of the high-temperature powder particles and the surface of the matrix is prevented. Meanwhile, the powder feeding head is kept blowing for 2-3 minutes before processing, so that the powder feeding head is filled with argon, and powder particles are prevented from flying into the powder feeding head in the processing process and contacting with a beam shaping and homogenizing system.
(3) Before and after the shaft-type workpiece is machined, the starting end and the ending end of the workpiece are required to be processed independently.
5. The partition processing mode of the starting end and the ending end.
Because the invention adopts a 15mm wide-band laser light source to clad the shaft-type workpiece in a thread track mode, the starting end and the ending end of the workpiece have regions which are not clad. The workpiece is processed in all directions by adopting a partition processing mode. The main processing strategies are shown in fig. 4 and 5.
(1) The method is characterized in that cladding process plate pipes are additionally arranged at two ends. As shown in FIG. 4, the annular process end plates with the same radius as the workpiece are arranged at two ends of the workpiece in a spot welding mode, meanwhile, the central axis of the end plates is collinear with the central axis of the workpiece, one end of the end plates is tightly contacted with the workpiece, the distance between the two end plates is less than 0.5mm, and the width Wg of the end plates is more than or equal to W (the width of light spots). The workpiece is driven by the machine tool to rotate clockwise at a high speed around the central spindle, the light spot translates along the central axis direction of the workpiece, the relation shown in figure 4 exists between the angular rotation speed omega of the workpiece and the linear translation speed v of the light spot, and the workpiece and the light spot cooperatively move under a central control system. When the processing is started, the light spot is ensured to irradiate on the process plate pipe at the starting end and not irradiate on the workpiece, at the moment, the system is opened to enable the light spot to perform spiral scanning on the workpiece until the light spot moves to the process plate pipe at the terminating end and completely leaves the workpiece, and then the process plate pipes at the two ends are cut off. At this time, the surface of the workpiece will be laser-clad in all directions, i.e., there will be no unfelded area.
(2) The method is characterized in that circular cladding pretreatment is carried out on two ends of a workpiece. As shown in fig. 5, when the thread scanning is started, firstly, the light spot is moved to the starting end of the workpiece, the light spot is adjusted to be irradiated on the surface of the workpiece, the short edge of one side of the light spot exceeds one end of the workpiece by about 1mm, the moving speed of the light spot is set to be zero, the machine tool is opened to rotate for a circle, so that the laser is used for cladding a uniform annular cladding ring on the end of the workpiece, and the width Wp of the cladding ring is slightly smaller than the width of the. And secondly, moving the light spot to the end of the workpiece, and cladding a layer of uniform annular cladding ring by the same operation. And finally, moving the light spot to the starting end of the workpiece, ensuring that the distance x from the left side of the light spot to the starting end of the workpiece is smaller than the width Wp of the cladding ring, opening a central control system to enable the light spot to carry out thread scanning, and stopping scanning when the distance x from the left side of the light spot to the ending end of the workpiece is smaller than the width Wp of the cladding ring, so that the surface of the workpiece is subjected to comprehensive laser cladding.
In the above embodiment, only the wide-band laser is 2 × 15mm (where 15mm is the width of the light spot, and 2mm is the length of the light spot), when the method is used in particular, according to actual requirements, other width values larger than 15mm may also be selected as the preset width value of the wide-band laser, and the length values are similar or may be flexibly adjusted as long as the width value is not exceeded.
The components such as the six-axis linkage robot, the central control system and the like adopted in the invention can directly refer to the related prior art; the related control method can also be set with reference to the prior art.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. A fast and efficient semiconductor laser cladding device with wide light beam and adjustable powder feeding angle is characterized by comprising a high-power semiconductor laser (1) with power not lower than 3KW, a light beam shaping and Fresnel focusing system (2), a wide-light-band powder feeding head (3) with adjustable powder feeding angle and powder feeding width of at least 15mm, a powder feeder (6), a high-speed machine tool (5) with continuously adjustable rotating speed of 1-60 r/m, a six-axis linkage robot (4) and a central control system (9), wherein,
the high-power semiconductor laser (1) is used for outputting high-power laser with the power not lower than 3KW, the laser passes through the light beam shaping and Fresnel focusing system (2) and then is output to the adjustable wide light band powder feeding head (3), and the light beam shaping and Fresnel focusing system (2) is used for shaping the laser and focusing the laser into wide light band laser with the light spot width of at least 15 mm; the adjustable wide-band powder feeding head (3) is connected with the powder feeder (6) and is used for simultaneously feeding powder and the wide-band laser to the surface of the large shaft-type workpiece to be subjected to surface laser cladding treatment; the high-speed machine tool (5) is used for bearing the large shaft-shaped workpiece to be subjected to surface laser cladding treatment and driving the large shaft-shaped workpiece to rotate at a rotating speed not lower than 1 r/min; the central control system (9) is connected with the high-speed machine tool (5) and is used for controlling the rotating speed of the high-speed machine tool (5) for driving the large-scale shaft type workpiece to rotate;
the central control system (9) is also connected with the six-axis linkage robot (4) and is used for controlling the six-axis linkage robot (4) to drive the high-power semiconductor laser (1), the light beam shaping and Fresnel focusing system (2) and the adjustable wide light band powder feeding head (3) to integrally move, so that the wide light band laser and the conveyed powder move along the central axis direction of the large-scale axis-type workpiece, the powder can be melted into liquid drops under the action of the wide light band laser by matching with the rotation of the large-scale axis-type workpiece, and finally the liquid drops fall on the surface of the large-scale axis-type workpiece in a spiral line mode integrally, so that the laser cladding processing of the surface of the large-scale axis-type workpiece is realized;
in addition, the diameter of the large-scale shaft-shaped workpiece to be subjected to surface laser cladding treatment is larger than 1000mm, and the length of the large-scale shaft-shaped workpiece is not less than 10 m;
the beam shaping and Fresnel focusing system (2) comprises a Fresnel lens (13) and a cylindrical lens (14), wherein collimated beams output by the high-power semiconductor laser (1) pass through the Fresnel lens (13) to divide and rearrange beams in the fast axis direction, so that energy of light spots is uniformly distributed in the fast axis direction and is focused to a preset width a with the width not less than 15mm, and then the collimated beams pass through the cylindrical lens (14) to be focused on a slow axis beam, so that a rectangular wide-light-band laser with the light section size of b × a and the light beam energy uniformly distributed is output, wherein b is a preset length and b is not more than a, the width direction of the light spots of the wide-light-band laser is parallel to the main axis direction of the high-speed machine tool (5), and the length direction is perpendicular to the main axis direction of the high-speed machine tool (5);
the adjustable wide light band powder feeding head (3) comprises a plurality of paths of synchronous powder feeding pipes (11) and 2 fan-shaped wide light band powder feeding hoppers (21), the plurality of paths of synchronous powder feeding pipes (11) are positioned outside the side length of the width of the emergent laser and symmetrically arranged by taking the emergent laser as a center, the 2 fan-shaped wide light band powder feeding hoppers (21) are also positioned outside the side length of the width of the emergent laser and symmetrically arranged by taking the emergent laser as a center, the plurality of paths of synchronous powder feeding pipes (11) are used for feeding powder to the 2 fan-shaped wide light band powder feeding hoppers (21), and the depression angles of the 2 fan-shaped wide light band powder feeding hoppers (21) are controlled and adjustable by a rotating shaft system;
the adjustable wide light band powder feeding head (3) is connected with the central control system (9), the central control system (9) is used for adjusting a rotating shaft system of the fan-shaped wide light band powder feeding hopper (21) according to the density, specific types of materials and particle size of used powder, and further adjusting a depression angle of the fan-shaped wide light band powder feeding hopper (21) to control the convergence height of powder on two sides, so that the action time of the powder and laser is controlled, and solid powder particles can fully absorb laser energy and melt into suspension liquid drops to fall on the surface of a workpiece to form a cladding layer.
2. The wide beam, adjustable powder feed angle, rapid and efficient semiconductor laser cladding apparatus of claim 1, wherein the predetermined width a is 15mm and the predetermined length b is 2 mm.
3. The wide-beam, adjustable-powder-feed-angle rapid and efficient semiconductor laser cladding device according to claim 1, wherein the six-axis linkage robot (4) is used for controlling the beam shaping and fresnel focusing system (2) to focus the shaped laser on the surface of the large-scale axis-type workpiece.
4. The wide-beam, adjustable-powder-feeding-angle rapid and efficient semiconductor laser cladding device according to claim 1, wherein the high-power semiconductor laser (1), the beam shaping and fresnel focusing system (2), and the adjustable wide-band powder feeding head (3) are integrally moved, specifically, the large-scale shaft-shaped workpiece is synchronously moved along the main shaft direction of the high-speed machine tool (5) by a translation distance of a/3-a for each rotation.
5. The wide-beam, adjustable-powder-feed-angle, fast and efficient semiconductor laser cladding apparatus according to claim 1, wherein the high-power semiconductor laser (1) is used for outputting high-power laser with power of 3KW to 10 KW.
6. The wide-beam, adjustable-powder-feed-angle, fast and efficient semiconductor laser cladding apparatus according to claim 1, wherein the high-power semiconductor laser (1) is further connected to a water cooling system (8).
7. The wide-beam, adjustable-powder-feeding-angle rapid and efficient semiconductor laser cladding apparatus according to claim 1, wherein for any one of the fan-shaped wide-beam powder-feeding hoppers (21), the depression angle is an angle formed by a ray from the rotation center to the center of the wide-beam laser spot and a ray from the rotation center to the center of the powder outlet, and the depression angle is adjustable between 5 degrees and 15 degrees.
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