CN110139537A - Radiate glass and preparation method thereof - Google Patents
Radiate glass and preparation method thereof Download PDFInfo
- Publication number
- CN110139537A CN110139537A CN201910393111.6A CN201910393111A CN110139537A CN 110139537 A CN110139537 A CN 110139537A CN 201910393111 A CN201910393111 A CN 201910393111A CN 110139537 A CN110139537 A CN 110139537A
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- hole
- glass
- thermal
- heat dissipation
- thermally conductive
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- 239000011521 glass Substances 0.000 title claims abstract description 121
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- 239000002002 slurry Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 150000001247 metal acetylides Chemical class 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000005270 abrasive blasting Methods 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- -1 phthalate ester Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The present invention relates to glass technology fields.Especially a kind of heat dissipation glass, several thermal holes including glass body and scattering device in the glass body are filled with thermally conductive plug in the thermal hole.The present invention also provides the preparation methods of this heat dissipation glass, include the following steps: to provide a glass baseplate as glass body；Punch out step: several thermal holes are formed on the glass body；Consent step: thermally conductive slurry is filled in the thermal hole, forms the glass with heat sinking function.The heat dissipation glass that the present invention obtains enables to heat to be penetrated to outside in inside glass, spread, to provide the radiating efficiency of glass significantly.
Description
Technical field
The present invention relates to the glass with heat sinking function.
Background technique
Currently, people are more and more using the chance of electronic curtain.Electronic product is in integrated, multifunction and lightening
In increasingly developed process, its heat-dissipating space is greatly reduced, heat dissipation problem, which becomes, restricts electronic product stability and use
The critical issue of safety.In electronic product operational process, generated big calorimetric, if cannot distribute in time, meeting
The service life for influencing electronic product even will appear overheat and burn out equipment component.
Such as occur CPU card, frequency reducing even restarting after we are using mobile phone open game or other software etc.
Serious phenomenon, this is because one or two of CPU or GPU component overheat the overheating protection program for triggering chip simultaneously
And there is Caton, frequency reducing and restarting phenomenon.
To solve the above-mentioned problems, at present producer take will on product surface coated, but such method has its cause
The limitation of life, although can radiate, most heat is in interior of mobile phone.It can not quickly radiate away.At present
Phone housing is mainly glass and metal, and metal heat-conducting ability is relatively good, and thermal coefficient is big to radiate quickly, but problem comes out again
, it is easy shielded signal.Glass thermal coefficient is small, and heat is difficult to distribute.
To sum up it can be concluded that, it is clear that research heat dissipation glass be necessary.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of heat dissipation glass, heat can effectively be diffused to outside glass
It encloses.
This heat dissipation glass, several thermal holes including glass body and scattering device in the glass body,
To form the chamber of rapid cooling in the thermal hole.
Preferably, the thermal hole includes boundary thermal hole and internal thermal hole；The boundary thermal hole is set to institute
Internal thermal hole periphery is stated, the boundary thermal hole is linked to be the boundary of a thermal conductive zone, and the area of the thermal conductive zone accounts for the heat dissipation
Transparency area is not less than 5%.
Preferably, it is 5%~70% that the area of the thermal conductive zone, which accounts for the heat dissipation transparency area,.
Preferably, thermally conductive plug is filled in the thermal hole.The thermal coefficient of the thermally conductive plug is that the glass body is led
Hot coefficient is more than or equal to 5.0W/mK.
Preferably, the material of the thermally conductive plug include aluminium, the thermally conductive plug material include the gold such as aluminium, silver, gold, tin, copper
Category, metal oxide, metal carbides, metal nitride, carbonitride, graphite, graphene, carbide or nitride powder
At least one of body.
Preferably, the thermal hole includes blind hole and/or through-hole, and the blind hole and/or through-hole hole depth are glass body
The 20%~100% of thickness.
Preferably, the thermal hole includes the buried via hole being set to inside the glass body.
Preferably, the aperture of the thermal hole is greater than 5 microns, preferably 10 microns~10 millimeters, more preferable 100 microns~5
Millimeter.
Preferably, the distance between each described thermal hole is 50 microns~5000 microns.
Preferably, the pore size of the thermal hole is 5~50 microns.
The present invention also provides the preparation methods of this heat dissipation glass, include the following steps:
A glass baseplate is provided as glass body；
Punch out step: several thermal holes are formed on the glass body；
Preferably, the punch out step includes: at least one of machine drilling method, sandblasting dry etching method, laser drilling method；
The thermal hole includes blind hole, through-hole, buried via hole at least one.
Further include consent step: thermally conductive slurry is filled in the thermal hole, forms the glass with heat sinking function.
Preferably, the consent step includes: that thermally conductive slurry is coated on the glass body.
Preferably, the consent step includes:
One halftone for being coated with thermally conductive slurry is provided, is hung on the thermally conductive slurry in the mesh on the halftone；
The glass body for being formed with through-hole is set to below the halftone, and the through-hole is corresponding with the mesh；
The glass body backwards to the halftone one side be arranged negative pressure, make the thermally conductive slurry under vacuum cavitations from
It removes and is packed into the through-hole on the mesh.
Preferably, the mesh aperture is 2 microns bigger than the through-hole aperture.
The utility model has the advantages that
The present invention changes the mode of former electronic product radiating.Heat dissipation glass provided by the invention, in inside glass point
Heat sink material is dissipated, the speed for outwardly spreading heat is substantially increased, is greatly improved than spreading hot coating radiating rate in glass merely.?
Electronic device fever frequency is reduced to a certain extent.Regardless of showing wide application prospect from economic benefit and social benefit.
Detailed description of the invention
Fig. 1 is the heat dissipation glass partial structural diagram of the embodiment of the present invention 1；
Fig. 2 is the thermal conductive zone area schematic diagram of the heat dissipation glass of the embodiment of the present invention 1；
Fig. 3 is another structural schematic diagram of heat dissipation glass of the embodiment of the present invention 1；
Fig. 4 is the heat dissipation glass structure schematic diagram of the embodiment of the present invention 2；
Fig. 5 is the heat dissipation glass preparation flow chart of the embodiment of the present invention 3；
Fig. 6 is the thermally conductive slurry filling step schematic diagram of the embodiment of the present invention 3.
Specific embodiment
Embodiment one
The present embodiment provides a kind of heat dissipation glass, as shown in Figure 1, its structure include glass body 10 and scattering device in
Several thermal holes 20 in the glass body 10, to form the chamber 11 of rapid cooling in the thermal hole 20.
Wherein, in the present embodiment, to optimize heat dissipation effect, in thermal conductive zone, the distance between each thermal hole is big
In 50 microns.Preferably, each thermally conductive bore edges to another bore edges distance, preferably 100 microns~10 millimeters, more
It is preferred that 1 millimeter~5 millimeters.
In order to not influence the visual effect of glass itself, the pore size of the thermal hole is preferably greater than 5 microns.It is preferred that
Ground, preferably 10 microns~10 millimeters of thermal hole aperture；Further, thermal hole aperture is preferably 100 microns~5 millimeters.Its
In, the aperture cross sectional shape of the thermal hole can multiplicity, including round, ellipse can also be triangle, quadrangle, six
Angular equal one of regular polygons or irregular polygon or a variety of, equally can be realized the object of the invention.
Wherein, as shown in connection with fig. 2, thermal hole is divided into not in the position distribution relationship of glass body according to thermal hole 20
Same type.The thermal hole 20 includes boundary thermal hole 21 and internal thermal hole 22；The boundary thermal hole 21 is set to institute
Internal 22 periphery of thermal hole is stated, the boundary thermal hole 21 surrounds the boundary of a thermal conductive zone 28.As shown in connection with fig. 3, boundary is thermally conductive
The outer most edge in hole 21 connects the thermal conductive zone for surrounding that area is S1, if the area of entire glass body is S, then thermal conductive zone face
The area S ratio that product S1 accounts for glass body is S1/S.
For the promotion for ensuring radiating efficiency, the area of the thermal conductive zone 28 accounts for 10 area of glass body not less than 5%；
Preferably, to guarantee that the intensity of the heat dissipation glass is relatively stable, the area of the thermal conductive zone 28 be should not be too large, and preferably control is led
28 area of hot-zone is not more than 70%.For example, the area of the thermal conductive zone accounts for the heat dissipation transparency area 10~50%；More into one
Step, the area of the thermal conductive zone account for the heat dissipation transparency area not less than 20~40%.
Further, in conjunction with Fig. 1, Fig. 2 it is found that the thermal hole 20 has different positions in the glass body 10
And shape.Wherein, the thermal hole can be for example including having blind hole 23, buried via hole 24 and through-hole 25.
Wherein, as shown in Fig. 2, the glass body 10 includes opposite first surface 11, second surface 12.The blind hole
23 are set on 10 first surface 11 (or second surface 12) of glass body, and the blind hole 23 has and the first surface
The opening 231 of 11 (or second surfaces 12) perforation.Relatively, and blind hole 23 have do not penetrate through second surface 12.In other words, blind
Hole 23 is open 231 and communicates with a wherein surface for glass body.
Preferably, the blind hole hole depth also has required, and the 1/20 of at least described glass body thickness, reach certain
Depth just can ensure that the effect of heat flow.On the other hand, to ensure that the structural strength of glass body is stablized, the blind hole hole depth
The 1/20~19/20 of the preferably described glass body thickness.
In addition, the glass body 10 can also have through-hole 25, the through-hole 25 then runs through the glass body 10
First surface 11, second surface 12 so that glass body 10 two surfaces be interconnected, be more conducive to the heat of inside glass
It measures and scatters and disappears to outside.
In addition, the glass body 10 can also have buried via hole 24, the buried via hole 24 does not run through the glass body
10 12 any surface of first surface 11 or second surface, but the inside of " suspension " Yu Suoshu glass body 10, be located at first
Between surface 11, second surface 12.The structure of buried via hole 24 equally can use thermally conductive Jie for the chamber that radiates in glass and buried via hole 24
The thermal coefficient differences of matter accelerate thermally conductive effect to realize.
Above-mentioned blind hole 23, buried via hole 24 and through-hole 25 can regularly be arranged in the glass body 10 surface and/or
Inside, can also irregularly, scattering device, on the basis of meeting the thermally conductive pitch of holes, pore size, heat-conducting area,
It is equally reached heat dissipation purpose.
Embodiment two
The present embodiment and embodiment 1 are the difference is that in the present embodiment, the heat dissipation glass further includes having thermally conductive plug.
As shown in figure 4, the present embodiment provides middle heat dissipation glass, including glass body 10 and scattering device are in the glass
Several thermal holes 20 in ontology 10, filled with thermally conductive plug 30 in the thermal hole 20.
Wherein, the material of thermally conductive plug 30 is different from glass body；For example, it is thermally conductive plug 30 material be selected from including aluminium, silver,
At least one of gold, tin, copper, graphite, graphene, carbide or nitride powder.Preferably, it is led by what above-mentioned material obtained
Heat plug, the thermal coefficient of the thermally conductive plug be 5 times of the glass body thermal coefficient and its more than, for example, it is preferable to thermally conductive system
Number is more than or equal to the material of 5.0W/mK.The difference of this thermal coefficient greatly promotes heat dissipation effect.
Correspondingly, the thermally conductive plug is preferably sized to match with the shape of thermal hole, wherein the shape of the thermally conductive plug
Shape can be various, including spherical, elliposoidal, can also be in the rule such as cylinder, prism-shaped, polygonal prism or irregular shape
It is one or more, it equally can be realized the object of the invention.
Embodiment three
The present embodiment provides the preparation methods for the glass that radiates involved in embodiment 1, embodiment 2, include the following steps:
S1 provides a glass baseplate as glass body.In the present embodiment as in, use common for glass body.
S2 forms several thermal holes on the glass body.
Specifically, can be using etching boring method in this step, preparation step includes: that photoetching is coated on glass body
Glue is successively exposed, develops and etches according to predetermined pattern, moves back film step, several thermal holes are obtained on glass body.
The thermal hole can be through-hole, blind hole.
In addition, this step can also have other hole knockouts.
In another example preparation step includes: to be rushed according to predetermined pattern using machine on glass body using machine drilling method
The mode hit obtains several thermal holes on glass body.The thermal hole can be through-hole, blind hole.
In another example preparation step includes: to be rushed according to predetermined pattern using laser on glass body using laser drilling method
The mode penetrated obtains several thermal holes on glass body.The thermal hole can be through-hole, blind hole.
In another example using sandblasting dry etching boring method, preparation step includes: the coating photoresist on glass body, according to default
Pattern is successively exposed, develop and dry blasting/wet abrasive blasting, moves back film step, several thermal holes are obtained on glass body.It should
Thermal hole can be through-hole, blind hole.
So far, several thermal holes are obtained on glass body.
Thermally conductive slurry is filled in the thermal hole by S3, consent step, forms the glass with heat sinking function.
Wherein, thermally conductive slurry is exactly thermally conductive ink.Thermally conductive ink is made of varnish and packing material, fills material
Material is by Heat Conduction Materials such as graphene, aluminium powder, copper powder, thermal conductive silicon, heat-conducting silicone grease, BeO thermal conductive ceramic, silicon nitride, silicon carbide.It is poly-
The one or more such as polyimide resin, terpinol, castor oil, phthalate ester coupling agent, dispersing agent, defoaming agent.Then pass through stirring, three rollers
It is made into thermally conductive slurry.
Thermally conductive slurry can be inserted in thermal hole by the modes such as coating, scratching, and can be obtained after to be baked, cleaning thermally conductive
Plug.
Preferably, as shown in connection with fig. 5, the present embodiment is as also provided another thermally conductive slurry filling mode.By thermally conductive slurry
It is packed into the thermal hole of through-hole type, following methods can be used.
S31: in being arranged on meshed halftone 41, thermally conductive slurry 42 is hung on the thermally conductive slurry blade coating that the above method is obtained
In the mesh；
S32: the glass body for being formed with through-hole 23 is set to 41 lower section of halftone, the through-hole and the mesh pair
It answers；
S33: negative pressure source, for example, vacuum pump (vacuum pressure are set backwards to the one side of the halftone in the glass body
Greater than 0.2kg/cm2), it removes the thermally conductive slurry from the mesh under the attraction of negative pressure and is packed into the through-hole
In, it is filled up until by the through-hole.
For the thermally conductive slurry in mesh is sucked out smoothly, the mesh aperture is than greatly at least 2 microns of the through-hole aperture.
At this point, the through-hole of glass body, which is just filled, completes thermally conductive plug.
Finally, the glass for being formed with thermally conductive plug passes through plating steps, (Coating Materials is, for example, SiO2), in glass body two
Face forms film layer.Film layer is covered on the thermally conductive thermal hole for then making part beyond the Great Wall and forms blind hole or buried via hole.By sacker appropriate
After sequence, finished glass shipment can get.
Claims (16)
1. a kind of heat dissipation glass, which is characterized in that several in the glass body including glass body and scattering device
A thermal hole, to form the chamber of rapid cooling in the thermal hole.
2. heat dissipation glass according to claim 1, which is characterized in that the thermal hole includes boundary thermal hole and interior
Portion's thermal hole；The boundary thermal hole is set to the internal thermal hole periphery, and the boundary thermal hole surrounds a thermal conductive zone
Boundary, the area of the thermal conductive zone account for the heat dissipation transparency area not less than 5%.
3. heat dissipation glass according to claim 2, which is characterized in that the area of the thermal conductive zone accounts for the heat dissipation glass surface
Product is 5%~70%.
4. heat dissipation glass according to claim 1, which is characterized in that be filled with thermally conductive plug in the thermal hole.
5. heat dissipation glass according to claim 4, which is characterized in that the thermal coefficient of the thermally conductive plug is more than or equal to
5.0W/mK。
6. heat dissipation glass according to claim 4 or 5, which is characterized in that the material of the thermally conductive plug include aluminium, silver, gold,
Tin, copper, metal oxide, metal carbides, metal nitride, carbonitride, graphite, graphene, carbide or nitridation
At least one of powder.
7. heat dissipation glass according to claim 1, which is characterized in that the thermal hole includes blind hole and/or through-hole, described
Blind hole and/or through-hole hole depth are the 20%~100% of glass body thickness.
8. heat dissipation glass according to claim 7, which is characterized in that the thermal hole includes being set to the glass body
Internal buried via hole.
9. heat dissipation glass according to claim 1, which is characterized in that the aperture of the thermal hole is greater than 5 microns.
10. according to claim 1 or heat dissipation glass described in 9, which is characterized in that the aperture cross sectional shape of the thermal hole includes
One of circle, ellipse, polygon, irregular shape are a variety of.
11. described in any item heat dissipation glass according to claim 1~9, which is characterized in that each thermally conductive bore edges are to separately
The distance of one bore edges is greater than 50 microns.
12. a kind of preparation method for the glass that radiates, which comprises the steps of:
A glass baseplate is provided as glass body；
Punch out step: several thermal holes are formed on the glass body.
13. the preparation method for the glass that radiates according to claim 12, which is characterized in that the punch out step includes: machinery
Boring method, dry type sand-blast, wet blast method, laser drilling method, at least one for etching boring method；The thermal hole includes blind
Hole, through-hole, buried via hole are at least one.
14. the preparation method of the 2 or 13 heat dissipation glass according to claim 1, which is characterized in that further include plug after punch out step
Hole step: thermally conductive slurry is filled in the thermal hole, and being formed has the glass for reinforcing heat sinking function.
15. the preparation method of the 4 heat dissipation glass according to claim 1, which is characterized in that the consent step includes:
One halftone for being coated with thermally conductive slurry is provided, is hung on the thermally conductive slurry in the mesh on the halftone；
The glass body for being formed with through-hole is set to below the halftone, and the through-hole is corresponding with the mesh；
Negative pressure is set backwards to the one side of the halftone in the glass body, makes the thermally conductive slurry under vacuum cavitations from described
It removes and is packed into the through-hole on mesh.
16. the preparation method for the glass that radiates according to claim 15, which is characterized in that the mesh aperture is than the through-hole
Greatly at least 2 microns of aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910393111.6A CN110139537A (en) | 2019-05-11 | 2019-05-11 | Radiate glass and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910393111.6A CN110139537A (en) | 2019-05-11 | 2019-05-11 | Radiate glass and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110139537A true CN110139537A (en) | 2019-08-16 |
Family
ID=67573465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910393111.6A Pending CN110139537A (en) | 2019-05-11 | 2019-05-11 | Radiate glass and preparation method thereof |
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|---|---|
| CN (1) | CN110139537A (en) |
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| CN104349617A (en) * | 2013-07-30 | 2015-02-11 | 富泰华工业（深圳）有限公司 | Electronic device and manufacturing method for shell of electronic device |
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| CN107302035A (en) * | 2017-06-20 | 2017-10-27 | 合肥博之泰电子科技有限公司 | A kind of photovoltaic vacuum glass |
| CN206971495U (en) * | 2017-05-02 | 2018-02-06 | 深圳市中装建设集团股份有限公司 | Photovoltaic glass curtain wall |
| CN107683038A (en) * | 2017-09-29 | 2018-02-09 | 广东欧珀移动通信有限公司 | Housing, the processing method of housing and mobile terminal |
| CN208235764U (en) * | 2018-05-22 | 2018-12-14 | 深圳市中装建设集团股份有限公司 | A kind of solar energy power generating curtain wall |
-
2019
- 2019-05-11 CN CN201910393111.6A patent/CN110139537A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104349617A (en) * | 2013-07-30 | 2015-02-11 | 富泰华工业（深圳）有限公司 | Electronic device and manufacturing method for shell of electronic device |
| CN106440129A (en) * | 2016-07-08 | 2017-02-22 | 苏州暖舍节能科技有限公司 | Porous medium radiant panel |
| CN206971495U (en) * | 2017-05-02 | 2018-02-06 | 深圳市中装建设集团股份有限公司 | Photovoltaic glass curtain wall |
| CN107302035A (en) * | 2017-06-20 | 2017-10-27 | 合肥博之泰电子科技有限公司 | A kind of photovoltaic vacuum glass |
| CN107683038A (en) * | 2017-09-29 | 2018-02-09 | 广东欧珀移动通信有限公司 | Housing, the processing method of housing and mobile terminal |
| CN208235764U (en) * | 2018-05-22 | 2018-12-14 | 深圳市中装建设集团股份有限公司 | A kind of solar energy power generating curtain wall |
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