CN110119073A - Restorative procedure, chuck and the array exposure machine of the chuck of array exposure machine - Google Patents
Restorative procedure, chuck and the array exposure machine of the chuck of array exposure machine Download PDFInfo
- Publication number
- CN110119073A CN110119073A CN201910379632.6A CN201910379632A CN110119073A CN 110119073 A CN110119073 A CN 110119073A CN 201910379632 A CN201910379632 A CN 201910379632A CN 110119073 A CN110119073 A CN 110119073A
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- CN
- China
- Prior art keywords
- chuck
- target area
- exposure machine
- array exposure
- restorative procedure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The present invention provides a kind of restorative procedure of the chuck of array exposure machine, chuck and array exposure machines.The restorative procedure of the chuck of array exposure machine the following steps are included: S1, obtain current original flat degree parameter at the target area of the chuck in advance；If S2, the current flatness parameter are unsatisfactory for the first preset condition, smearing preset times are carried out to the target area using the pen of predetermined material；S3, it polishes the target area after smearing, until the resistance of the target area is less than first threshold；S4, the target area after polishing is cleaned；S5, the target area is detected to obtain the actual measurement flatness parameter of the target area；S6, completion is repaired if the actual measurement flatness parameter meets the first preset condition.The present invention is coated the target area of chuck by using the pen of respective material, to complete the reparation of the abrasion to the target area, without more preferable new chuck, can reduce cost.
Description
Technical field
The present invention relates to array substrate production fields, and in particular to a kind of restorative procedure of the chuck of array exposure machine, card
Disk and array exposure.
Background technique
Array exposure machine is a kind of optical device, and (a kind of photosensitive material can occur chemical anti-photoresist under the irradiation of UV light
Answer) disk body be placed on the chuck platform of exposure machine, mask plate is placed on mask plate platform, be located at chuck platform above,
The UV light that illumination system generates is radiated on mask plate, UV light is radiated at chuck platform through mask plate (part that do not block)
On, chemically react the photoresist on chuck platform, thus on the glass substrate by the pattern 1:1 transfer on mask plate.It is long
Phase, which does, leads to corresponding position chuck abrasion recess, ultimately causes product in lighting because of horizontal black and white band mura.
Therefore, the prior art is defective, needs to improve.
Summary of the invention
The present invention provides restorative procedure, chuck and the array exposure of a kind of chuck of array exposure machine, can repair chuck
Abrasion, reduces cost.
The present invention provides a kind of restorative procedure of the chuck of array exposure machine, comprising the following steps:
S1, current original flat degree parameter at the target area of the chuck is obtained in advance；
If S2, the current flatness parameter are unsatisfactory for the first preset condition, using the pen of predetermined material to the mesh
Mark region carries out smearing preset times；
S3, it polishes the target area after smearing, until the resistance of the target area is less than first threshold；
S4, the target area after polishing is cleaned；
S5, the target area is detected to obtain the actual measurement flatness parameter of the target area；
S6, completion is repaired if the actual measurement flatness parameter meets the first preset condition.
In a kind of restorative procedure of the chuck of array exposure machine of the present invention, the step S6 further include: if institute
It states actual measurement flatness parameter and is unsatisfactory for the first preset condition, then go to the step S2.
In a kind of restorative procedure of the chuck of array exposure machine of the present invention, in the step S2, using DLC material
The pen of material smears the target area.
In a kind of restorative procedure of the chuck of array exposure machine of the present invention, in the step S3, using Rolling Stone
It polishes the target area.
In a kind of restorative procedure of the chuck of array exposure machine of the present invention, in the step S3, using pressure
Sensor come be installed to Rolling Stone by thrust end to detect Resistance Value suffered by the Rolling Stone.
In a kind of restorative procedure of the chuck of array exposure machine of the present invention, using in inorganic in the step S4
Property solution cleans the target area.
In a kind of restorative procedure of the chuck of array exposure machine of the present invention, in the step S5, after answering a pager's call, make
The actual measurement flatness parameter of the target area is measured with control wafer.
In a kind of restorative procedure of the chuck of array exposure machine of the present invention, in the step S1, the mesh
Marking region is the region on the chuck at X=± 760.
A kind of chuck is applied in array exposure machine, and the chuck includes first area and second area, and described first
Region is provided with DLC material deposits and DLC material coating layer.
A kind of array exposure machine, including the chuck.
The present invention is coated the target area of chuck by using the pen of respective material, to complete to the target area
The reparation of the abrasion in domain can reduce cost without more preferable new chuck.
The present invention is coated the target area of chuck by using the pen of respective material, to complete to the target area
The reparation of the abrasion in domain can reduce cost without more preferable new chuck.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the process flow chart of the restorative procedure of the chuck of one of some embodiments of the invention array exposure machine.
Fig. 2 is the structure chart of one of some embodiments of the invention chuck.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
It is that the present invention in some embodiments of the invention provides a kind of chuck of array exposure machine please refer to Fig. 1, Fig. 1
Restorative procedure, comprising the following steps:
S1, current original flat degree parameter at the target area of the chuck is obtained in advance.
Wherein, the original flat degree parameter at the target area is obtained by the way of detection, which is card
Region on disk at X=± 760.The target area of the chuck, which is easy to be worn, to cause to damage.
If S2, the current flatness parameter are unsatisfactory for the first preset condition, using the pen of predetermined material to the mesh
Mark region carries out smearing preset times.
Wherein, which is the flat of the target area of the chuck under the excellent condition of test of many times acquisition
Spend parameter.Wherein, the pen of predetermined material is painting pen made of DLC material.Number is smeared according to the current flatness parameter
The case where be configured, flatness is poorer, the number for needing to be coated with is more.
S3, it polishes the target area after smearing, until the resistance of the target area is less than first threshold.
Wherein, in this step, it is polished using Rolling Stone the target area.It is installed to using pressure sensor
Rolling Stone by thrust end to detect Resistance Value suffered by the Rolling Stone.
S4, the target area after polishing is cleaned.
The target area is cleaned using inorganic neutral solution in step S4.
S5, the target area is detected to obtain the actual measurement flatness parameter of the target area.
In this step, after answering a pager's call, the actual measurement flatness parameter of the target area is measured using control wafer.
S6, completion is repaired if the actual measurement flatness parameter meets the first preset condition.
Step S6 further include: if the actual measurement flatness parameter is unsatisfactory for the first preset condition, go to the step S2.
The present invention is coated the target area of chuck by using the pen of respective material, to complete to the target area
The reparation of the abrasion in domain can reduce cost without more preferable new chuck.
Referring to figure 2., the present invention also provides a kind of chucks, in array exposure machine, which to include the firstth area
Domain and second area, the first area are provided with DLC material deposits 200 and DLC material coating layer 300.Wherein, should
First area is the DLC material deposits of primary deposit, and the second area is worn in original DLC material deposits
Afterwards, the DLC material coating layer being coated with using DLC material pen.The second area is the region on chuck at X=± 760.The chuck
The second area be easy to be worn and cause to damage.
The present invention also provides a kind of array exposure machines, including the chuck in above-described embodiment.
The present invention is coated the target area of chuck by using the pen of respective material, to complete to the target area
The reparation of the abrasion in domain can reduce cost without more preferable new chuck.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of restorative procedure of the chuck of array exposure machine, which comprises the following steps:
S1, current original flat degree parameter at the target area of the chuck is obtained in advance；
If S2, the current flatness parameter are unsatisfactory for the first preset condition, using the pen of predetermined material to the target area
Domain carries out smearing preset times；
S3, it polishes the target area after smearing, until the resistance of the target area is less than first threshold；
S4, the target area after polishing is cleaned；
S5, the target area is detected to obtain the actual measurement flatness parameter of the target area；
S6, completion is repaired if the actual measurement flatness parameter meets the first preset condition.
2. a kind of restorative procedure of the chuck of array exposure machine according to claim 1, which is characterized in that the step S6
If further include: the actual measurement flatness parameter is unsatisfactory for the first preset condition, goes to the step S2.
3. a kind of restorative procedure of the chuck of array exposure machine according to claim 1, which is characterized in that the step S2
In, the target area is smeared using the pen of DLC material.
4. a kind of restorative procedure of the chuck of array exposure machine according to claim 1, which is characterized in that the step S3
In, it is polished using Rolling Stone the target area.
5. a kind of restorative procedure of the chuck of array exposure machine according to claim 4, which is characterized in that the step S3
In, use pressure sensor be installed to Rolling Stone by thrust end to detect Resistance Value suffered by the Rolling Stone.
6. a kind of restorative procedure of the chuck of array exposure machine according to claim 1, which is characterized in that the step S4
It is middle that the target area is cleaned using inorganic neutral solution.
7. a kind of restorative procedure of the chuck of array exposure machine according to claim 1, which is characterized in that the step S5
In, after answering a pager's call, the actual measurement flatness parameter of the target area is measured using control wafer.
8. a kind of restorative procedure of the chuck of array exposure machine according to claim 1, which is characterized in that in the step
In S1, the target area is the region on the chuck at X=± 760.
9. a kind of chuck is applied in array exposure machine, which is characterized in that the chuck includes first area and the secondth area
Domain, the first area are provided with DLC material deposits and DLC material coating layer.
10. a kind of array exposure machine, which is characterized in that including chuck as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910379632.6A CN110119073A (en) | 2019-05-08 | 2019-05-08 | Restorative procedure, chuck and the array exposure machine of the chuck of array exposure machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910379632.6A CN110119073A (en) | 2019-05-08 | 2019-05-08 | Restorative procedure, chuck and the array exposure machine of the chuck of array exposure machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110119073A true CN110119073A (en) | 2019-08-13 |
Family
ID=67521873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910379632.6A Pending CN110119073A (en) | 2019-05-08 | 2019-05-08 | Restorative procedure, chuck and the array exposure machine of the chuck of array exposure machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110119073A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114384770A (en) * | 2020-10-22 | 2022-04-22 | 中国科学院微电子研究所 | Wafer alignment method, wafer alignment device and semiconductor device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201308510A (en) * | 2011-06-02 | 2013-02-16 | Applied Materials Inc | Electrostatic chuck ALN dielectric repair |
| CN103302444A (en) * | 2013-07-05 | 2013-09-18 | 张延洪 | Repairing agent and repairing method for mechanical wear |
| CN103785988A (en) * | 2012-11-02 | 2014-05-14 | 深圳市百安百科技有限公司 | Method for restoring and repairing damaged equipment and parts |
| WO2018111430A1 (en) * | 2016-12-12 | 2018-06-21 | Applied Materials, Inc. | New repair method for electrostatic chuck |
| CN108538776A (en) * | 2018-03-29 | 2018-09-14 | 北京北方华创微电子装备有限公司 | Electrostatic chuck and its manufacturing method |
| CN108842133A (en) * | 2018-05-31 | 2018-11-20 | 北京师范大学 | A kind of preparation method and equipment of graphical electrostatic chuck |
-
2019
- 2019-05-08 CN CN201910379632.6A patent/CN110119073A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201308510A (en) * | 2011-06-02 | 2013-02-16 | Applied Materials Inc | Electrostatic chuck ALN dielectric repair |
| CN103785988A (en) * | 2012-11-02 | 2014-05-14 | 深圳市百安百科技有限公司 | Method for restoring and repairing damaged equipment and parts |
| CN103302444A (en) * | 2013-07-05 | 2013-09-18 | 张延洪 | Repairing agent and repairing method for mechanical wear |
| WO2018111430A1 (en) * | 2016-12-12 | 2018-06-21 | Applied Materials, Inc. | New repair method for electrostatic chuck |
| CN108538776A (en) * | 2018-03-29 | 2018-09-14 | 北京北方华创微电子装备有限公司 | Electrostatic chuck and its manufacturing method |
| CN108842133A (en) * | 2018-05-31 | 2018-11-20 | 北京师范大学 | A kind of preparation method and equipment of graphical electrostatic chuck |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114384770A (en) * | 2020-10-22 | 2022-04-22 | 中国科学院微电子研究所 | Wafer alignment method, wafer alignment device and semiconductor device |
| CN114384770B (en) * | 2020-10-22 | 2024-04-02 | 中国科学院微电子研究所 | Wafer alignment method and device and semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant after: TCL Huaxing Photoelectric Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190813 |
|
| RJ01 | Rejection of invention patent application after publication |