CN110117791B - Binding force promoter for brown oxide liquid of high-density interconnection printed circuit board - Google Patents
Binding force promoter for brown oxide liquid of high-density interconnection printed circuit board Download PDFInfo
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- CN110117791B CN110117791B CN201910433014.5A CN201910433014A CN110117791B CN 110117791 B CN110117791 B CN 110117791B CN 201910433014 A CN201910433014 A CN 201910433014A CN 110117791 B CN110117791 B CN 110117791B
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- binding force
- printed circuit
- circuit board
- browning
- tetrazole
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- 239000007788 liquid Substances 0.000 title abstract description 28
- 150000003536 tetrazoles Chemical class 0.000 claims abstract description 13
- -1 tetrazole compound Chemical class 0.000 claims abstract description 10
- 239000012530 fluid Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 230000007797 corrosion Effects 0.000 claims description 12
- 238000005260 corrosion Methods 0.000 claims description 12
- 239000003112 inhibitor Substances 0.000 claims description 12
- 239000008367 deionised water Substances 0.000 claims description 10
- 229910021641 deionized water Inorganic materials 0.000 claims description 10
- GGZHVNZHFYCSEV-UHFFFAOYSA-N 1-Phenyl-5-mercaptotetrazole Chemical compound SC1=NN=NN1C1=CC=CC=C1 GGZHVNZHFYCSEV-UHFFFAOYSA-N 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 7
- VUWHBDDOJYSXJA-UHFFFAOYSA-N 5-(4-methoxyphenyl)-2,3-diphenyl-1h-tetrazol-1-ium;chloride Chemical compound [Cl-].C1=CC(OC)=CC=C1C1=NN(C=2C=CC=CC=2)N(C=2C=CC=CC=2)[NH2+]1 VUWHBDDOJYSXJA-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 25
- 229910052802 copper Inorganic materials 0.000 abstract description 25
- 239000010949 copper Substances 0.000 abstract description 25
- 239000002253 acid Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 239000012964 benzotriazole Substances 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000002608 ionic liquid Substances 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 239000005416 organic matter Substances 0.000 abstract description 2
- 239000002244 precipitate Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 19
- 238000005406 washing Methods 0.000 description 17
- 238000003475 lamination Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 12
- 239000011229 interlayer Substances 0.000 description 5
- UFNOUKDBUJZYDE-UHFFFAOYSA-N 2-(4-chlorophenyl)-3-cyclopropyl-1-(1H-1,2,4-triazol-1-yl)butan-2-ol Chemical compound C1=NC=NN1CC(O)(C=1C=CC(Cl)=CC=1)C(C)C1CC1 UFNOUKDBUJZYDE-UHFFFAOYSA-N 0.000 description 4
- 239000005757 Cyproconazole Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000004880 explosion Methods 0.000 description 4
- FQQFBZJZDJGQPQ-UHFFFAOYSA-N 3,5-dimethyl-1h-benzimidazole-2-thione Chemical compound CC1=CC=C2NC(=S)N(C)C2=C1 FQQFBZJZDJGQPQ-UHFFFAOYSA-N 0.000 description 3
- PYNKPKDEEQKNPO-UHFFFAOYSA-N CN1C=NC2=C1C=CC=C2CCCC Chemical compound CN1C=NC2=C1C=CC=C2CCCC PYNKPKDEEQKNPO-UHFFFAOYSA-N 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- 150000003852 triazoles Chemical class 0.000 description 2
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical class Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000157 blood function Effects 0.000 description 1
- 201000011510 cancer Diseases 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000012851 eutrophication Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000007954 hypoxia Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
Abstract
The invention belongs to the field of printed circuit board manufacturing, and particularly provides a binding force promoter for a high-density interconnection printed circuit board browning liquid and a browning treatment liquid containing the binding force promoter, which are used for overcoming the defect that benzotriazole and derivatives thereof exist as a browning liquid component. The invention adopts tetrazole compound as binding force promoter, and the prepared browning treatment fluid has the following advantages: 1) The copper carrying quantity is high and can reach 60g/L; 2) Environmental friendliness, such as tetrazole violet can be used as a medical intermediate; 3) The stability is good, no pungent smell exists, and the ionic liquid is not easy to volatilize; taking tetrazole violet as an example, the melting point of the tetrazole violet is 247-249 ℃ which is far higher than 98.5 ℃ of BTA, and the solution is not easy to produce precipitate residues after the browning treatment; 4) The organic matter dosage is small, the reaction condition is mild, and the temperature operation window is wide; 5) The prepared printed circuit board has good tearing strength, good moisture resistance and acid resistance, and no pink ring.
Description
Technical Field
The invention belongs to the field of printed circuit board manufacturing, relates to a pretreatment liquid for lamination between printed circuit board layers, and particularly relates to a binding force promoter for a browning liquid of a high-density interconnection printed circuit board and a browning treatment liquid containing the binding force promoter.
Background
The printed circuit board is an important electronic component, which provides support for the installation and fixation of various electronic components, and also takes over the weight of the circuit intercommunication between the components. With the development of the printed circuit board towards the light, thin and high density, higher requirements are brought to equipment and production processes, and particularly, the electric interconnection between any two or more layers on the Printed Circuit Board (PCB) is realized by adopting the electroplating hole filling and blind hole stacking technology, so that the printed circuit board becomes a high-density interconnection board (High Density Interconnect, HDI) manufacturing technology which is more and more important to the market. The printed circuit industry has entered the era of high frequency and high speed interconnection and has paid more and more attention to the surface roughness of electronic circuits and the interlayer bonding force thereof. Any layer of high-density connecting plate (Any-layer HDI) is an HDI technology manufactured by adopting a successive lamination and layer-adding (Sequential Buildup) method, the manufacturing process is relatively complicated, particularly, the lamination process has very strict quality control indexes, such as higher hole distribution density on Any-layer, and the lamination times of high temperature (> 200 ℃) in the manufacturing process are more than 5 times, so that a brown film which can withstand repeated and long-time hot-pressing impact and acid leaching resistance is a key factor for ensuring the lamination performance, otherwise, interlayer interconnection failure can be caused. Therefore, the interlayer lamination process directly relates to the reliability of any layer of high-density connecting plate, and the copper surface roughening treatment process before interlayer lamination directly determines the reliability of the printed circuit board after lamination.
The method for improving the bonding force between layers (comprising copper and resin) mainly comprises a Black oxidation method (Black oxide), a microetching method (Brown oxide) and the like, wherein the prior HDI lamination pretreatment process adopts an acid/hydrogen peroxide-based copper surface microetching chemical inner layer browning treatment process, and the adopted browning treatment process has the characteristics of simplicity in operation, high efficiency, low cost, mild process conditions, strong oxidation resistance of the plate surface after the browning treatment, capability of effectively inhibiting Pink ring (Pink ring) and the like, and the prior browning process has become the main process for manufacturing the inner layer of the printed circuit board. The brown oxide liquid mainly contains main components such as acid corrosive liquid, binding force promoter, oxidant and the like, an organic copper oxide film layer is formed on the surface of the inner layer copper circuit of the printed circuit board in the brown oxide process, and the organic copper oxide film layer and resin undergo curing and crosslinking reaction during lamination, so that better interface binding force of interlayer lamination can be provided.
At present, the brown oxide liquid generally contains a large amount of substances such as triazole and derivatives thereof, copper ions, pyrrole and the like, and the wastewater treatment of the brown oxide liquid is slightly careless, so that great harm is brought to the ecological environment; wherein, the triazole and the derivatives thereof are easy to cause hypoxia and eutrophication of water environment, and the human body is easy to cause cancer and destroy the blood function system after contacting; therefore, the development of the novel, efficient and environment-friendly brown oxide liquid has wide market prospect.
Disclosure of Invention
Aiming at the defect that benzotriazole and derivatives thereof exist as brown liquid components, the invention provides a binding force promoter for high-density interconnection printed circuit board brown liquid and brown treatment liquid containing the binding force promoter, which are used for improving the binding force between the inner copper surface and prepreg and obtaining the printed circuit board with excellent comprehensive performance.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the binding force promoter for the brown oxide liquid of the high-density interconnection printed circuit board is characterized by being a tetrazole compound, and the molecular structure of the binding force promoter is as follows:
wherein X is 1 、X 2 、X 3 、X 4 Are all substituent groups, in particular mercapto-SH, carboxyl-COOH, sulfo-SO 3H, amino-NH, phenyl or naphthyl.
Further, the binding force promoter is a phenyl tetrazole compound, and the molecular structure of the binding force promoter is as follows:
wherein X is 1 、X 2 、X 3 、X 4 Are all substituent groups, in particular mercapto-SH, carboxyl-COOH, sulfo-SO 3H, amino-NH, phenyl or naphthyl.
Further, the binding force promoter is tetrazole violet, and the molecular structure of the binding force promoter is as follows:
further, the binding force promoter is 2,5 diphenyl-3- (4 styrylphenyl) tetrazole chloride, and the molecular structure is as follows:
further, the binding force promoter is 2,3 diphenyl-5- (4 methoxyphenyl) tetrazolium chloride, and the molecular structure is as follows:
further, the binding force promoter is 1-phenyl-5-mercapto-1H-tetrazole, and the molecular structure is as follows:
a browning treatment fluid comprising the above-described cohesion accelerator, comprising: h 2 SO 4 ：50～120g/L，H 2 O 2 ：5～50g/L，HCl：0～80mg/L，CuSO 4 ·5H 2 O: 0-60 g/L, corrosion inhibitor: 1-20 g/L, binding force promoter: 1-10 g/L, and deionized water.
Further, the binding force promoter is one or more of tetrazole violet, 1-phenyl-5-mercapto-1H-tetrazole, 2,5 diphenyl-3- (4 styrylphenyl) tetrazole chloride and 2,3 diphenyl-5- (4 methoxyphenyl) tetrazole chloride.
Further, the H 2 SO 4 The concentration of (2) is: 80-110g/L%, H 2 O 2 The concentration of the corrosion inhibitor is 10-20 g/L, and the concentration of the corrosion inhibitor is as follows: 5-15g/L, wherein the concentration of the binding force promoter is 3-6g/L.
The invention has the beneficial effects that:
the invention provides a binding force promoter for a brown oxide liquid of a high-density interconnection printed circuit board and a brown oxide treatment liquid containing the binding force promoter; tetrazole compounds are used as binding force promoters, and the prepared brown treatment liquid has the following advantages:
1) The copper carrying quantity is high and can reach 60g/L;
2) Environmental friendliness, such as tetrazole violet can be used as a medical intermediate;
3) The stability is good, no pungent smell exists, and the ionic liquid is not easy to volatilize; taking tetrazole violet as an example, the melting point of the tetrazole violet is 247-249 ℃ which is far higher than 98.5 ℃ of BTA, and the solution is not easy to produce precipitate residues after the browning treatment;
4) The organic matter dosage is small, the reaction condition is mild, and the temperature operation window is wide (the use can be carried out at high and low temperatures);
5) The prepared printed circuit board has good tearing strength, good moisture resistance and acid resistance, and no pink ring; the heat shock resistance is qualified, the peeling strength is good, and the copper brown surface is observed by an electron microscope to show a uniform microetching structure.
Detailed Description
The technical scheme of the invention is further described below by combining examples:
in the invention, the technical route of the browning process is as follows:
acid washing, water washing, alkaline degreasing, water washing, presoaking, browning, pure water washing, drying and pressing.
(1) Acid washing: adopting 3% -5% dilute sulfuric acid as a cleaning agent, and washing off metal oxide loaded on the copper surface at 25-40 ℃;
(2) Washing: washing with tap water, and repeatedly washing with deionized water at room temperature until the washing liquid is basically neutral;
(3) Alkaline degreasing: and washing the washed PCB by adopting an alkaline degreasing agent at the temperature of 40-60 ℃. The method aims at effectively removing pollutants such as grease on the surface of copper and preparing for later browning;
(4) Washing: washing with tap water, and repeatedly washing with deionized water at room temperature to remove alkaline washing liquid;
(5) Presoaking: placing the washed clean PCB into a presoaking groove (the temperature is 30 ℃ and the time is 30 seconds), so that a brown film can be formed rapidly after the PCB enters the brown groove, and other metal ion pollutants are prevented from being brought into the brown groove;
(6) Brown chemical: the core of the process is that the pre-soaked PCB is browned in a PVC browning tank by adopting a horizontal spraying method, the browning temperature is 30-40 ℃, and the browning time is 30-50s;
(7) Washing with pure water: repeatedly washing with deionized water at room temperature until no residual brown liquid exists on the PCB;
(8) And (3) drying: placing the mixture into an oven and controlling the temperature to be 100 ℃ for drying;
(9) Pressing: and pressing the browned copper-clad plate and the prepreg, and detecting the peeling strength of the copper-clad plate.
The preparation method of the brown oxide liquid comprises the following steps:
(1) Adding deionized water, HCl and H into a reactor in sequence 2 SO 4 、CuSO 4 5H2O and stirring uniformly until the copper sulfate is completely dissolved;
(2) Continuously adding a corrosion inhibitor, a binding force promoter and H into the reactor in required quantity 2 O 2 Stirring uniformly.
Example 1
The brown treatment liquid for the printed circuit board comprises the following components: h 2 SO 4 ：80g/L，H 2 O 2 ：10g/L，HCl：10mg/L，CuSO 4 ·5H 2 O:25mg/L, binding force promoter: tetrazole violet 2g/L, 1-phenyl-5-mercapto-1H-tetrazole 1g/L, corrosion inhibitor: 5g/L cyproconazole, deionized water is added to 1L; in this example, the browning temperature was 35℃and the browning time was 45s, and the peel strength measurement was obtained by referring to the IPC-TM-650 standard method.
Through detection, the brown copper-carrying amount can reach 55g/L, the surface of copper can be uniformly roughened after brown treatment, stable binding force and excellent heat resistance are realized between the copper and the prepreg, and the copper does not have layering and board explosion phenomenon after 6 times of impact under the condition of 1 < 0 > s at 288 ℃; the peel strength between the copper surface and the prepreg after lamination is 5.1b/in.
Example 2
The brown treatment liquid for the printed circuit board comprises the following components: h 2 SO 4 ：100g/L，H 2 O 2 ：16g/L，HCl：80mg/L，CuSO 4 ·5H 2 O:200mg/L, binding force promoter: tetrazole violet 1.5g/L, 1-phenyl-5-mercapto-1H-tetrazole 1g/L,2,3 diphenyl-5- (4 methoxyphenyl) tetrazole chloride 0.5g/L, corrosion inhibitor: 1g/L of cyproconazole, 2g/L of 1-methyl-4-butylbenzimidazole and 2g/L of 3, 5-dimethyl-2-mercaptobenzimidazole, deionized water is added to 1L; in this example, the browning temperature was 40℃and the browning time was 30s.
Through detection, the brown copper-carrying amount can reach 59g/L, the surface of copper can be uniformly roughened after brown treatment, stable binding force and excellent heat resistance are realized between the copper and the prepreg, and the copper does not have layering and board explosion phenomenon after 6 times of impact under the condition of 1 < 0 > s at 288 ℃; the peel strength between the copper surface and the prepreg after lamination is 4.9b/in.
Example 3
The brown treatment liquid for the printed circuit board comprises the following components: h 2 SO 4 ：110g/L，H 2 O 2 ：25g/L，HCl：30mg/L，CuSO 4 ·5H 2 O:60mg/L, binding force promoter: tetrazole violet 1.5g/L, 1-phenyl-5-mercapto-1H-tetrazole 1g/L,2,3 diphenyl-5- (4 methoxyphenyl) tetrazole chloride 1g/L, corrosion inhibitor: 1g/L of cyproconazole, 2g/L of 1-methyl-4-butylbenzimidazole and 1g/L of 3, 5-dimethyl-2-mercaptobenzimidazole, wherein a corrosion inhibitor deionized water is added to 1L; in this example, the browning temperature was 35℃and the browning time was 35s.
Through detection, the brown copper-carrying amount can reach 60g/L, the surface of copper can be uniformly roughened after brown treatment, stable binding force and excellent heat resistance are realized between the copper and the prepreg, and the copper does not have layering and board explosion phenomenon after 6 times of impact under the condition of 1 < 0 > s at 288 ℃; the peel strength between the copper surface and the prepreg after lamination is 5.4b/in.
Example 4
The brown treatment liquid for the printed circuit board comprises the following components: h 2 SO 4 ：100g/L，H 2 O 2 ：15g/L，HCl：25mg/L，CuSO 4 ·5H 2 O:60mg/L, binding force promoter: 1g/L of 1-phenyl-5-mercapto-1H-tetrazole, 0.1g/L of 2,5 diphenyl-3- (4 styrylphenyl) tetrazole chloride, 0.5g/L of tetrazole violet, 0.5g/L of 2,3 diphenyl-5- (4 methoxyphenyl) tetrazole chloride, and corrosion inhibitor: 1.5g/L of 1-methyl-4-butylbenzimidazole, 1.5g/L of 3, 5-dimethyl-2-mercaptobenzimidazole, 2g/L of cyproconazole and deionized water are added to 1L; in this example, the browning temperature was 35℃and the browning time was 40s.
Through detection, the brown copper-carrying amount can reach 54g/L, the surface of copper can be uniformly roughened after brown treatment, stable binding force and excellent heat resistance are realized between the copper and the prepreg, and the copper does not have layering and board explosion phenomenon after 6 times of impact under the condition of 1 < 0 > s at 288 ℃; the peel strength between the copper surface and the prepreg after lamination is 5.4b/in.
While the invention has been described in terms of specific embodiments, any feature disclosed in this specification may be replaced by alternative features serving the equivalent or similar purpose, unless expressly stated otherwise; all of the features disclosed, or all of the steps in a method or process, except for mutually exclusive features and/or steps, may be combined in any manner.
Claims (2)
1. The high-density interconnection printed circuit board browning treatment fluid is characterized by comprising the following components: h 2 SO 4 ：50～120g/L，H 2 O 2 ：5～50g/L，HCl：0～80mg/L，CuSO 4 ·5H 2 O: 0-60 g/L, corrosion inhibitor: 1-20 g/L, binding force promoter: 1-10 g/L and deionized water;
the binding force promoter is tetrazole violet, or 2,5 diphenyl-3- (4 styrylphenyl) tetrazole chloride, or 2,3 diphenyl-5- (4 methoxyphenyl) tetrazole chloride, or 1-phenyl-5-mercapto-1H-tetrazole.
2. The high-density interconnect printed circuit board browning treatment fluid of claim 1, wherein said H 2 SO 4 The concentration of (2) is: 80-110g/L, H 2 O 2 The concentration of the corrosion inhibitor is 10-20 g/L, and the concentration of the corrosion inhibitor is as follows: 5-15g/L, wherein the concentration of the binding force promoter is 3-6g/L.
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| CN201910433014.5A CN110117791B (en) | 2019-05-23 | 2019-05-23 | Binding force promoter for brown oxide liquid of high-density interconnection printed circuit board |
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| CN201910433014.5A CN110117791B (en) | 2019-05-23 | 2019-05-23 | Binding force promoter for brown oxide liquid of high-density interconnection printed circuit board |
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| CN110117791B true CN110117791B (en) | 2023-11-10 |
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