CN110112722A - Surge suppression modules and preparation method thereof - Google Patents
Surge suppression modules and preparation method thereof Download PDFInfo
- Publication number
- CN110112722A CN110112722A CN201910482810.8A CN201910482810A CN110112722A CN 110112722 A CN110112722 A CN 110112722A CN 201910482810 A CN201910482810 A CN 201910482810A CN 110112722 A CN110112722 A CN 110112722A
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- China
- Prior art keywords
- copper base
- circuit board
- base plate
- metal
- chip
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
- H02H9/044—Physical layout, materials not provided for elsewhere
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
Abstract
Present invention discloses a kind of surge suppression modules, Can both ends pass through metal base plate and copper base sealing respectively, FR-4 circuit board is equipped between the metal base plate and copper base, the FR-4 circuit board passes through connecting column on one side and is fixed on copper base, the other half is electrically connected with pin column, the pin column stretches out outside the metal base plate, component is fixed on the medial surface and FR-4 circuit board of copper base, by filling full silicone rubber compound in the copper base and the direct Can cavity of metal base plate.The present invention surge suppression modules have the characteristics that small in size, high reliablity, bear high current, perfect heat-dissipating with counnter attack connection function, surge voltage when power switch can effectively be inhibited, and voltage output is not influenced in power good work, unnecessary power loss is reduced, can be used for high-power circuit, continuous impulse impact can be born.
Description
Technical field
The present invention relates to the power protecting circuit fields of avionic device, are controlled more particularly to one kind based on MOSFET
Input voltage surge restraint circuit.
Background technique
There are two types of sources for direct current supply on air equipment, first is that aero-engine driving dc generator is powered, two
It is battery backup power source.But it since the direct current supply that aero-engine driving dc generator generates is highly unstable, produces
Raw DC power supply is easy to that there is a phenomenon where power surges.And in the avionic device of high reliability power supply, generally want
Secondary power supply input terminal is asked to have the function of inhibiting aircraft power supply normal voltage surge.Normal voltage surge refers to from controlled
The voltage change of steady-state value, the variation are as caused by the intrinsic adjusting of electric supply system, such as by load transfer, adjuster school
It disturbs and generates caused by the system worked wells such as direct action.
Have the function of that transient state inhibits surge voltage to meet, existing avionic device secondary power supply generally uses
Input terminal level-one or multistage LC filtering realize and inhibit surge peak voltage, defect is the voltage spikes range inhibited
Relatively narrow, input pressure voltage is lower, needs additional input front end overvoltage crowbar.In addition, input voltage fluctuation can be to rear end DC-
DC module generates impact, influences the reliability of DC-DC module, increases maintenance cost.But in practical applications, in order to ensure
The various functions of electronic equipment keep normal, it is necessary to assure when the fluctuation of normal voltage surge occurs for aircraft DC power supply, two
Secondary source is without damage and can continually and steadily power.
Summary of the invention
The technical problem to be solved by the present invention is to realize the big Surge suppression mould of one kind small in size, high reliablity, electric current
Block and preparation method thereof.
To achieve the goals above, the technical solution adopted by the present invention are as follows: surge suppression modules, Can both ends difference
It is sealed by metal base plate and copper base, FR-4 circuit board, the FR-4 circuit is equipped between the metal base plate and copper base
Plate passes through connecting column on one side and is fixed on copper base, the other half is electrically connected with pin column, and the pin column stretches out the metal bottom
Outside plate, component is fixed on the medial surface and FR-4 circuit board of copper base, directly golden by the copper base and metal base plate
Belong to and fills full silicone rubber compound in shell cavity.
The pin column includes VIN+, VIN-, VOUT+ and VOUT-, the negative terminal of the VIN+ connection TVS pipe, resistance R1
The drain electrode of one end, one end of resistance R2 and metal-oxide-semiconductor, the anode of the VIN- connection TVS pipe D1, voltage stabilizing chip M1 third end,
The anode of diode D3, one end of capacitor C1, one end of capacitor C2, chip U1 1 foot capacitor C4 one end and VOUT-, institute
State one end of the source level of VOUT+ connection metal-oxide-semiconductor, the anode of diode D5 and capacitor C4；The negative terminal and two of the diode D5
The anode of pole pipe D4, one end of capacitor C3 are connected, the other end of the capacitor C3 is connected with one end of resistance R5, the chip U1
3 feet be connected with the other end of resistance R5,8 feet of the chip U1 and 4 feet of chip U1, one end of resistance R3, voltage stabilizing chip
The second end of M1 is connected, and 7 feet of the chip U1 are connected with one end of resistance R4, and 6 feet of the chip U1 are another with resistance R4's
One end, 2 feet of chip U1, the other end of resistance R3, the other end of capacitor C1 are connected, and 5 feet of the chip U1 are with capacitor C2's
The other end is connected, the negative terminal phase of the grid and the other end of resistance R2, the negative terminal of diode D4, diode D3 of the metal-oxide-semiconductor Q1
Even.
The lateral surface of the copper base is equipped with nickel coating, and the joint of the copper base, metal base plate and Can is equal
Equipped with one layer of tin film, the component on the copper base is adhered on copper base by conductive silver glue, the FR-4 circuit board
Component is welded on FR-4 circuit board, and the connecting column and pin column are fixed by welding on the circuit board 2 of FR-4, institute
It states connecting column to be weldingly fixed on copper base, the joint of the copper base and Can is by being welded and fixed, the metal
The joint of bottom plate and Can is by being welded and fixed.
The method for making the surge suppression modules:
After step 1, cleaning Can, copper base, FR-4 circuit board and metal base plate, by Can and metal base plate
Copper base and FR- circuit board are dried in drying；
Step 2, copper base lateral surface nickel plating are rinsed later, are dried；
Step 3, copper base, Can and metal base plate are placed into together heating platform preheating, later to copper base,
Tin is uniformly covered in Can and metal base plate junction；
Metal-oxide-semiconductor, resistance and capacitor are adhered on copper base according to installation diagram with conductive silver glue by step 4；
Driving chip, resistance, capacitor, diode are welded on FR-4 circuit board by step 5 according to installation diagram；
Step 6 cleans the FR-4 circuit board, copper base and the Can that process before, carries out again after cleaning
Drying；
FR-4 circuit board, copper base and Can are placed into heating platform preheating by step 7 together, utilize connecting column
FR-4 circuit board is connected with copper base, surge suppression modules semi-finished product are made；
Can and surge suppression modules semi-finished product are placed on heating platform and preheat by step 8, later will be copper-based
Plate and Can weld；
Part is made in step 9, cleaning, is dried later；
Step 10 pours into silicone rubber compound in Can, until silicone rubber compound covers all first devices completely
Part, then curing process；
Step 11 welds metal base plate and Can.
In the step 1, copper base, Can and metal base plate are placed glassware soaked in absolute ethyl alcohol respectively
5min~10min, then gently brushing surface is cleaned with hairbrush, Can and metal base plate are with being dried with nitrogen later, copper
Substrate and FR-4 circuit board are placed into baking oven drying, and the steps 1 and 2,6,9 drying are all made of baking oven and dry, the steps 1 and 2,
In 6, oven temperature is 45 DEG C~55 DEG C, drying time 15min~20min；
In the step 2, there is the one side of circuit to be protected with paper self-adhesive tape copper base, then bundlees copper base for copper with wire rod
Substrate is put into electroplating solution, and standing time is 45min~55min, takes out after copper base removes paper self-adhesive tape and wire rod and is used clearly later
Water rinses, and places into baking oven drying；
The step 3, in 7, preheating time is 20min~30min, the preheating temperature of heating platform setting is 100 DEG C~
110 DEG C, in the step 3, it is described uniformly cover tin during, select the temperature of solder stick for 110 DEG C~130 DEG C；
In the step 4, conductive silver glue solidification temperature is curing time 1~3 hour between 170 DEG C~190 DEG C；
In the step 5, it is 170 DEG C~190 DEG C that the temperature of solder stick is selected in welding.
In the step 7, surge suppression modules semi-finished product after the assembly is completed are subjected to electric performance test, filters out and does not conform to
Lattice product, substandard product carry out maintenance of doing over again, and the surge suppression modules semi-finished product for filtering out electrical property qualification are carried out next
Step operation；
In the step 8, heating platform preheats 20min~30min, and heating platform temperature setting is 90 DEG C~110 DEG C, weldering
It connects using scolding tin, solder stick temperature is 110 DEG C~130 DEG C；
In the step 9, the cleaning agent of cleaning is alcohol, and cleaning heating temperature is 90 DEG C~110 DEG C, and scavenging period is
10-20min；
In the step 11, using soldering, solder stick temperature is 110 DEG C~130 DEG C for welding.
In the step 10, silicone rubber compound uses the silicon rubber and trade mark GMX-8152/ of trade mark GMX-8152/04H
04H silastic mixture, weight ratio 1:1.
The present invention surge suppression modules have counnter attack with small in size, high reliablity, receiving high current, perfect heat-dissipating
The features such as connection function, it can effectively inhibit surge voltage when power switch, and it is defeated in power good work not influence voltage
Out, unnecessary power loss is reduced, can be used for high-power circuit, continuous impulse impact can be born.
Detailed description of the invention
Below to width attached drawing every in description of the invention expression content and figure in label be briefly described:
Fig. 1 is surge suppression modules structure schematic diagram；
Fig. 2 is surge suppression module circuit schematic diagram；
Fig. 3,4 be FR-4 circuit board in surge suppression modules front and back sides layout；
Fig. 5,6 be copper base in surge suppression modules front and back sides layout and module id figure；
Fig. 7 is the pin schematic diagram of surge suppression modules；
Fig. 8,9 be metal base plate in surge suppression modules outline drawing；
Figure 10,11 be Can in surge suppression modules outline drawing；
Figure 12,13 be copper base in surge suppression modules outline drawing；
Label in above-mentioned figure is equal are as follows: 1, Can；2, FR-4 circuit board；3, copper base；4, connecting column；5, pin
Column；6, metal base plate.
Specific embodiment
Below against attached drawing, by the description of the embodiment, for example related each component of a specific embodiment of the invention
Shape, construction, the mutual alignment between each section and connection relationship, the effect of each section and working principle, manufacturing process and
Operate with method etc., is described in further detail, to help those skilled in the art to inventive concept of the invention, technology
Scheme has more complete, accurate and deep understanding.
Surge suppression modules and preparation method thereof the following steps are included:
1) by Can 1, FR-4 circuit board 2, copper base 3, connecting column 4, pin column 5 and bottom plate 6 respectively according to former material
Material inspection specification is tested the outer dimension of Can 1, copper base 3, connecting column 4, pin column 5 and metal base plate 6 and outer
It sees and checks；Test and process certification are carried out to FR-4 circuit board 2 and copper base 3.
2) Can 1, copper base 3, FR-4 circuit board 2 and metal base plate 6 are subjected to surface clean, when cleaning, by copper
Substrate 3, Can 1 and metal base plate 6 place glassware soaked in absolute ethyl alcohol 5min~10min respectively, need simultaneously
Hairbrush gently brushing surface；Can and metal base plate are with being dried with nitrogen after cleaning, copper base 3 and FR-4 circuit board 2
Need to place baking oven drying, oven temperature is 45 DEG C~55 DEG C, and drying time 15min~20min, preferably oven temperature are 50
DEG C, drying time 15min.
3) there is circuit one side to be protected with paper self-adhesive tape copper base 3, then copper base 3 is tied up with copper wire, is put into plating
Solution, and time 45min~55min is set, it is rinsed after the completion of plating with clear water, places baking oven drying, oven temperature 45
DEG C~55 DEG C, drying time 15min~20min, preferably oven temperature are 50 DEG C, drying time 15min.
4) by copper base 3, Can 1 and the metal base plate 6 after nickel plating be placed into together heating platform preheating 20min~
30min, setting heating platform temperature are 100 DEG C~110 DEG C；Then respectively to copper base 3, metal base plate 6 and Can 1
Tin processing is uniformly covered at step, conductive silver glue by high temperature melt is led to component obscission on copper base in order to prevent, covers
It is 110 DEG C~130 DEG C that tin solder stick, which selects temperature, preferential to select 120 DEG C.
5) metal-oxide-semiconductor, resistance and capacitor are adhered on copper base 3 according to installation diagram with conductive silver glue, conductive silver glue solidification
Temperature is curing time 1~3 hour between 170 DEG C~190 DEG C, and preferred consolidation temperature is 180 DEG C, curing time 2h.
6) components such as driving chip, resistance, capacitor, diode are welded on FR-4 circuit board 2 according to installation diagram, institute
The temperature for selecting solder stick is between 170 DEG C~190 DEG C, and preferred consolidation temperature is 180 DEG C.
7) by the FR-4 circuit board 2 after welding, copper base 3 after bonding, cover the Can 1 after tin and metal base plate 6 into
Row cleaning, cleaning agent is alcohol, and cleaning heating temperature is 90 DEG C~110 DEG C, scavenging period 10-20min.It is preferred that cleaning heating
Temperature is 100 DEG C, heating time 15min；Baking oven drying is placed after cleaning, oven temperature is 45 DEG C~55 DEG C, drying time
15min~20min, preferably oven temperature are 50 DEG C, drying time 15min.
8) frock clamp is utilized, connecting column 4 and pin column 5 are welded on the circuit board 2 of FR-4；Bonding component
Copper base 3 is placed to be preheated on heating platform, and it is between 90 DEG C~110 DEG C that heating platform temperature, which is arranged,；By connecting column weldering
The copper base 3 after FR-4 circuit board 2 and bonding after connecing connects, in this way completion surge suppression modules semi-finished product.
9) module semi-finished product after the assembly is completed are subjected to electric performance test according to detail specification, filter out unqualified production
Product, substandard product can carry out maintenance of doing over again；Electrical property qualified component will be filtered out to be packaged using soldering tech；By metal
Shell 1 and module semi-finished product are placed on heating platform, and heating platform preheats 20min~30min, and heating platform temperature setting is
90 DEG C~110 DEG C weld copper base step surface and Can, and the solder stick temperature of selection is 110 DEG C~130 DEG C.
10) the surge suppression modules surface clean that will be welded, after cleaning place baking oven drying, oven temperature be 45 DEG C~
55 DEG C, drying time 15min~20min, preferably oven temperature are 50 DEG C, drying time 15min.
11) four side of module is protected with paper self-adhesive tape respectively, silicone rubber compound is entered from module bottom surface perfusion, is filled
Note silicone rubber compound covers all components completely, then curing process；Silicone rubber compound contains trade mark GMX-
The silicon rubber and trade mark GMX-8152/04H (B) silicon rubber (weight ratio 1:1) of 8152/04H (A).
12) module after metal base plate 6 and encapsulating is subjected to soldering processing after curing process, is brazed selected solder stick
Temperature is 110 DEG C~130 DEG C, selects suitable parameters laser to beat according to the thickness and material of metal base plate 6 and copper base 3 after encapsulation
Mark；Then module carries out screening test and check test according to detail specification, can be put in storage after pass the test；Surge suppression modules
It completes
Surge suppression modules are by the discrete devices built-up circuit such as driving chip and metal-oxide-semiconductor, diode, TVS pipe.Surge suppression
Modular circuit, its working principles are as follows: in normal operation, input voltage is 18VDC~36VDC, metal-oxide-semiconductor Q1 in circuit
It is fully on, the internal resistance that pressure drop essentially consists in metal-oxide-semiconductor is generated, metal-oxide-semiconductor internal resistance is selected there was only tens milliohms, all output voltages
Pressure drop very little, it is 0.3V that pressure drop is exported when operating current reaches 10A, and the circuit metal-oxide-semiconductor is in not when input voltage is more than 36V
Complete opening state, metal-oxide-semiconductor is output voltage clamper to 39V.When input voltage restores normal input, output can restore in time
Normal output.There are three features for surge suppression modules tool: (1) maximum operating currenbt can reach 10A；(2) output voltage pressure drop is very
It is small to be no more than 0.3；(3) 80V in aircraft electrical power supply system, the surge voltage of 50ms be can inhibit.
As shown in fig. 6, each pin schematic diagram of module, each exit function of module is defined as follows table:
| Pin numbering | Title | Definition |
| 1st exit | VIN+ | Power input anode |
| 2nd exit | VIN- | Power input negative terminal |
| 3rd exit | VOUT+ | Output plus terminal |
| 4th exit | VOUT- | Export negative terminal |
As shown in Fig. 2, in modular circuit, VIN+ input terminal connects the negative terminal of TVS pipe, one end of resistance R1, resistance R2
One end is connected with the drain electrode of metal-oxide-semiconductor, and VIN- input negative terminal and the anode of TVS pipe D1, the third end of chip M1, diode D3 are just
End, one end of capacitor C1, one end of capacitor C2, chip U1 1 foot capacitor C4 one end with output negative terminal VOUT- be connected；Output
The source level of anode VOUT+ connection metal-oxide-semiconductor, the anode of diode D5 are connected with one end of capacitor C4；The negative terminal of diode D5 and two
The anode of pole pipe D4, one end of capacitor C3 are connected, the other end of capacitor C3 is connected with one end of resistance R5；3 feet of chip U1 with
The other end of resistance R5 is connected；8 feet of chip U1 and 4 feet of chip U1, one end of resistance R3, voltage stabilizing chip M1 second end phase
Even；7 feet of chip U1 are connected with one end of resistance R4；6 feet of chip U1 and the other end of resistance R4,2 feet, the resistance of chip U1
The other end of R3, the other end of capacitor C1 are connected；5 feet of chip U1 are connected with the other end of capacitor C2；The grid of metal-oxide-semiconductor Q1 with
The other end of resistance R2, the negative terminal of diode D4, the negative terminal of diode D3 are connected.Chip U1 model: SE555, voltage stabilizing chip M1
Model: 78M15.
The present invention is exemplarily described above in conjunction with attached drawing, it is clear that the present invention implements not by aforesaid way
Limitation, as long as the improvement for the various unsubstantialities that the inventive concept and technical scheme of the present invention carry out is used, or without changing
It is within the scope of the present invention into the conception and technical scheme of the invention are directly applied to other occasions.
Claims (10)
1. surge suppression modules, it is characterised in that: Can both ends pass through metal base plate and copper base sealing, the gold respectively
Belonging to and is equipped with FR-4 circuit board between bottom plate and copper base, the FR-4 circuit board passes through connecting column on one side and is fixed on copper base,
The other half is electrically connected with pin column, and the pin column stretches out outside the metal base plate, and component is fixed on the medial surface of copper base
On FR-4 circuit board, by filling full silicone rubber compound in the copper base and the direct Can cavity of metal base plate.
2. surge suppression modules according to claim 1, it is characterised in that: the pin column includes VIN+, VIN-, VOUT
+ and VOUT-, one end, one end of resistance R2 and the drain electrode of metal-oxide-semiconductor of the negative terminal, resistance R1 of the VIN+ connection TVS pipe are described
The anode of VIN- connection TVS pipe D1, the third end of voltage stabilizing chip M1, the anode of diode D3, one end of capacitor C1, capacitor C2
One end, chip U1 1 foot capacitor C4 one end and VOUT-, the anode of the source level of the VOUT+ connection metal-oxide-semiconductor, diode D5
And one end of capacitor C4；The negative terminal of the diode D5 is connected with one end of the anode of diode D4, capacitor C3, the capacitor
The other end of C3 is connected with one end of resistance R5, and 3 feet of the chip U1 are connected with the other end of resistance R5, the chip U1's
8 feet are connected with the second end of 4 feet of chip U1, one end of resistance R3, voltage stabilizing chip M1,7 feet and resistance R4 of the chip U1
One end be connected, the other end, 2 feet of chip U1, the other end of resistance R3, the capacitor C1 of 6 feet of the chip U1 and resistance R4
The other end be connected, 5 feet of the chip U1 are connected with the other end of capacitor C2, and the grid of the metal-oxide-semiconductor Q1 is with resistance R2's
The other end, the negative terminal of diode D4, the negative terminal of diode D3 are connected.
3. surge suppression modules according to claim 1 or 2, it is characterised in that: the lateral surface of the copper base is equipped with plating
Nickel layer, the joint of the copper base, metal base plate and Can are equipped with one layer of tin film, the component on the copper base
It is adhered on copper base by conductive silver glue, the component of the FR-4 circuit board is welded on FR-4 circuit board, the connection
Column and pin column are fixed by welding on the circuit board 2 of FR-4, and the connecting column is weldingly fixed on copper base, the copper
By being welded and fixed, the joint of the metal base plate and Can is solid by welding for the joint of substrate and Can
It is fixed.
4. the method for making the surge suppression modules as described in any in claim 1-3, it is characterised in that:
After step 1, cleaning Can, copper base, FR-4 circuit board and metal base plate, Can and metal base plate are blown
It is dry, copper base and FR- circuit board are dried；
Step 2, copper base lateral surface nickel plating are rinsed later, are dried；
Copper base, Can and metal base plate are placed into heating platform preheating by step 3 together, later to copper base, metal
Tin is uniformly covered in shell and metal base plate junction；
Metal-oxide-semiconductor, resistance and capacitor are adhered on copper base according to installation diagram with conductive silver glue by step 4；
Driving chip, resistance, capacitor, diode are welded on FR-4 circuit board by step 5 according to installation diagram；
Step 6 cleans the FR-4 circuit board, copper base and the Can that process before, is dried again after cleaning；
FR-4 circuit board, copper base and Can are placed into heating platform preheating by step 7 together, using connecting column by FR-
4 circuit boards are connected with copper base is made surge suppression modules semi-finished product；
Can and surge suppression modules semi-finished product are placed on heating platform and preheat by step 8, later will by copper base and
Can welds；
Part is made in step 9, cleaning, is dried later；
Step 10 pours into silicone rubber compound in Can, until silicone rubber compound covers all components completely, so
Curing process afterwards；
Step 11 welds metal base plate and Can.
5. production method according to claim 4, it is characterised in that: in the step 1, copper base, Can and
Metal base plate places glassware soaked in absolute ethyl alcohol 5min~10min respectively, then gently brushing surface carries out clearly with hairbrush
It washes, with being dried with nitrogen, copper base and FR-4 circuit board are placed into baking oven drying, the step for Can and metal base plate later
1,2,6,9 drying are all made of baking oven drying, steps 1 and 2, in 6, and oven temperature is 45 DEG C~55 DEG C, drying time 15min
~20min.
6. production method according to claim 4, it is characterised in that: in the step 2, copper base is had to the one side of circuit
It is protected with paper self-adhesive tape, copper base is then put into electroplating solution with wire rod binding copper base, standing time is 45min~55min,
It takes out after copper base removes paper self-adhesive tape and wire rod and is rinsed with clear water later, place into baking oven drying.
7. production method according to claim 4, it is characterised in that: the step 3, in 7, preheating time be 20min~
30min, the preheating temperature of heating platform setting are 100 DEG C~110 DEG C, in the step 3, it is described uniformly cover tin during, choosing
The temperature for selecting solder stick is 110 DEG C~130 DEG C；
In the step 4, conductive silver glue solidification temperature is curing time 1~3 hour between 170 DEG C~190 DEG C；
In the step 5, it is 170 DEG C~190 DEG C that the temperature of solder stick is selected in welding.
8. production method according to claim 4, it is characterised in that: in the step 7, surge after the assembly is completed is pressed down
Molding block semi-finished product carry out electric performance test, filter out substandard product, substandard product carries out maintenance of doing over again, and will filter out electricity
The surge suppression modules semi-finished product of performance qualification carry out next step operation.
9. production method according to claim 4, it is characterised in that: in the step 8, heating platform preheating 20min~
30min, heating platform temperature setting are 90 DEG C~110 DEG C, and welding uses scolding tin, and solder stick temperature is 110 DEG C~130 DEG C；
In the step 9, the cleaning agent of cleaning is alcohol, and cleaning heating temperature is 90 DEG C~110 DEG C, scavenging period 10-
20min；
In the step 11, using soldering, solder stick temperature is 110 DEG C~130 DEG C for welding.
10. production method according to claim 4, it is characterised in that: in the step 10, silicone rubber compound uses board
The silicon rubber and trade mark GMX-8152/04H silastic mixture of number GMX-8152/04H, weight ratio 1:1.
Priority Applications (1)
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| CN201910482810.8A CN110112722B (en) | 2019-06-04 | 2019-06-04 | Surge suppression module and manufacturing method thereof |
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|---|---|---|---|
| CN201910482810.8A CN110112722B (en) | 2019-06-04 | 2019-06-04 | Surge suppression module and manufacturing method thereof |
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| CN110112722A true CN110112722A (en) | 2019-08-09 |
| CN110112722B CN110112722B (en) | 2021-07-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110855135A (en) * | 2019-11-21 | 2020-02-28 | 四川富肯斯科技有限公司 | Input surge suppression control circuit based on digital chip control |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201048275Y (en) * | 2007-04-29 | 2008-04-16 | 杨从敬 | Household electrical appliance protector for preventing lighting strike and overvoltage |
| CN201466707U (en) * | 2009-07-31 | 2010-05-12 | 上海联电实业有限公司 | Signal surge protector |
| CN103384063A (en) * | 2013-07-08 | 2013-11-06 | 电子科技大学 | Surge protection circuit and production method thereof |
| CN203312802U (en) * | 2013-06-05 | 2013-11-27 | 重庆正博仪器工业有限公司 | Three-wire system screw-in type surge protection device |
| CN103441125A (en) * | 2013-07-08 | 2013-12-11 | 电子科技大学 | Surge protection circuit based on bidirectional thyristor and method for manufacturing same |
| CN104377641A (en) * | 2014-11-24 | 2015-02-25 | 程信羲 | Thick-film active surge suppression module |
| US20170366001A1 (en) * | 2016-06-15 | 2017-12-21 | Infineon Technologies Ag | Transient Voltage Protection Circuits, Devices, and Methods |
| CN109149545A (en) * | 2018-11-15 | 2019-01-04 | 电安科技（嘉兴）有限公司 | Surge protector |
-
2019
- 2019-06-04 CN CN201910482810.8A patent/CN110112722B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201048275Y (en) * | 2007-04-29 | 2008-04-16 | 杨从敬 | Household electrical appliance protector for preventing lighting strike and overvoltage |
| CN201466707U (en) * | 2009-07-31 | 2010-05-12 | 上海联电实业有限公司 | Signal surge protector |
| CN203312802U (en) * | 2013-06-05 | 2013-11-27 | 重庆正博仪器工业有限公司 | Three-wire system screw-in type surge protection device |
| CN103384063A (en) * | 2013-07-08 | 2013-11-06 | 电子科技大学 | Surge protection circuit and production method thereof |
| CN103441125A (en) * | 2013-07-08 | 2013-12-11 | 电子科技大学 | Surge protection circuit based on bidirectional thyristor and method for manufacturing same |
| CN104377641A (en) * | 2014-11-24 | 2015-02-25 | 程信羲 | Thick-film active surge suppression module |
| US20170366001A1 (en) * | 2016-06-15 | 2017-12-21 | Infineon Technologies Ag | Transient Voltage Protection Circuits, Devices, and Methods |
| CN109149545A (en) * | 2018-11-15 | 2019-01-04 | 电安科技（嘉兴）有限公司 | Surge protector |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110855135A (en) * | 2019-11-21 | 2020-02-28 | 四川富肯斯科技有限公司 | Input surge suppression control circuit based on digital chip control |
| CN110855135B (en) * | 2019-11-21 | 2020-10-09 | 四川富肯斯科技有限公司 | Input surge suppression control circuit based on digital chip control |
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