CN110112149A - Array substrate detects key and display panel - Google Patents

Array substrate detects key and display panel Download PDF

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Publication number
CN110112149A
CN110112149A CN201910432885.5A CN201910432885A CN110112149A CN 110112149 A CN110112149 A CN 110112149A CN 201910432885 A CN201910432885 A CN 201910432885A CN 110112149 A CN110112149 A CN 110112149A
Authority
CN
China
Prior art keywords
layer
array substrate
semiconductor layer
key
substrate according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910432885.5A
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Chinese (zh)
Inventor
谭刚
贺超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to CN201910432885.5A priority Critical patent/CN110112149A/en
Priority to PCT/CN2019/092907 priority patent/WO2020232795A1/en
Publication of CN110112149A publication Critical patent/CN110112149A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs

Abstract

The present invention provides a kind of array substrate detection key and its display panel.It successively includes glass substrate, more buffer layers, gate insulating layer, grid layer, source-drain electrode layer, indium tin oxide layer and flat organic layer that array substrate detects key from the bottom to top;It wherein, further include semiconductor layer, the semiconductor layer is set between more buffer layers and gate insulating layer, and can absorb partial electrostatic prevents the array substrate detection key from wound power consumption.Display panel includes above-mentioned array substrate detection key.The present invention is by increasing the semiconductor layer, the resistance value of the array substrate detection key can be increased, the influence of slight static discharge (ESD) is prevented in time, and the semiconductor layer can carry out absorption and power consumption to slight static discharge (ESD) in the processing procedure of array substrate, the i.e. described semiconductor layer reduces potential difference as resistance, to reduce the probability of damage by static electricity, to reduce the risk that the array substrate detection key be wound.

Description

Array substrate detects key and display panel
Technical field
The present invention relates to display field more particularly to a kind of array substrate detection keys and display panel.
Background technique
The existing method electrically monitored for array substrate is on its periphery while to make while array substrate production Testing element combines the detection key (Test Key) in (Test Element Group, TEG), by applying electricity to array substrate Pressure, and square resistance is measured at detection key, current value can be obtained divided by resistance value with voltage value, can be detected array substrate Current value change curve can obtain the characteristics such as the uniformity of array substrate by comparative analysis, and then can be appreciated that array substrate Quality.
Refering to Figure 1, detecting the plan view of key for existing array substrate, the array substrate detection key 200 is at it Middle part offers the test trough 210 for from top to bottom penetrating through the array substrate detection key 200, by the test trough 210 Linking probe measures resistance value.
It please refers to shown in Fig. 2, is that array substrate shown in Fig. 1 detects partial structurtes sectional view of the key along the direction A-A, the survey Examination area 210 includes glass substrate 211, more buffer layers 212, the gate insulating layer 213, grid layer being cascading from the bottom to top 214, source-drain electrode layer 215, indium tin oxide layer 216 and flat organic layer 217;The test trough 210 is through described flat organic Layer 217 simultaneously keeps the indium tin oxide layer 216 exposed in test trough 210, realizes that probe is electrically connected with the indium tin oxide layer 216 It connects, the indium tin oxide layer 216 is electrically connected with the source-drain electrode layer 215, the grid layer 214, so that circuit can be realized Conducting.
But with gradually popularizing for low temperature polycrystalline silicon (LTPS) panel, the circuit design of array substrate is also increasingly finer Change, array substrate needs to carry out 9 to 14 road processing procedures, and inevitably occurring slight static discharge (ESD) under complex process can be to inspection The phenomenon that key be wound is surveyed, especially the gate insulating layer 213 of array substrate detection key be wound and protruded the most, caused in electrical prison Generate that measured value is abnormal in control, cannot correct feed array substrate characteristic.
Summary of the invention
The object of the present invention is to provide a kind of array substrate detection key and display panels, solve detection key antistatic Weak the technical issues of wound so as to cause array substrate detection key and be not used to monitoring, guarantee the array substrate detection Key proper testing.
To solve the above-mentioned problems, a kind of array substrate detection key is provided in the present invention, from the bottom to top successively includes glass Substrate, more buffer layers, gate insulating layer, grid layer, source-drain electrode layer, indium tin oxide layer and flat organic layer;Wherein, it also wraps Semiconductor layer is included, the semiconductor layer is set between more buffer layers and gate insulating layer, can absorb partial electrostatic to electricity Can consume prevents the array substrate detection key from wound;The flat organic layer offers a groove, and the groove runs through institute It states flat organic layer and is exposed to the indium tin oxide layer in groove;The indium tin oxide layer, the source-drain electrode layer and institute State grid layer electric connection.
Further, the thickness of the semiconductor layer is less than
Further, the material of the semiconductor layer includes polysilicon.
Further, the polysilicon is doped processing through injecting phosphonium ion.
Further, the polysilicon is doped processing through injecting boron ion.
Further, the polysilicon is doped processing through injecting chromium ion.
Further, the resistance value range of the semiconductor layer is 108Ω-1012Ω。
Further, more buffer layers include the light shield layer being stacked, first buffer layer and second buffer layer.Specifically , the first buffer layer is located on the light shield layer;The second buffer layer is located at the first buffer layer away from the screening On photosphere.
Further, the material of the first buffer layer or the second buffer layer includes SiNx or SiOx.
The present invention also provides a kind of display panels, including the array substrate to detect key.
The beneficial effects of the present invention are: providing a kind of array substrate detection key and its display panel, the present invention pass through in institute It states and increases semiconductor layer between more buffer layers and gate insulating layer, increase the resistance value of the array substrate detection key, it is anti-in time The only influence of slight static discharge (ESD), and the semiconductor layer can be in the processing procedure of array substrate to slight electrostatic Electric discharge (ESD) carries out absorption and power consumption, i.e., the described semiconductor layer reduces potential difference as resistance, to reduce static shock The probability of wound, to reduce the risk that the array substrate detection key be wound.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment Attached drawing is briefly described.It should be evident that the drawings in the following description are only some examples of the present application, for For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached Figure.
Fig. 1 is the plan view that existing array substrate detects key;
Fig. 2 is the sectional view in Fig. 1 along the direction A-A;
Fig. 3 is a kind of plan view of array substrate detection key in the embodiment of the present invention;
Fig. 4 is the sectional view in Fig. 3 along the direction B-B;
Fig. 5 is the structural schematic diagram of more buffer layers described in the embodiment of the present invention.
Component mark is as follows in figure:
100, array substrate detection key, 10, groove,
11, glass substrate, 12, more buffer layers, 13, semiconductor layer, 14, gate insulating layer,
15, grid layer, 16, source-drain electrode layer, 17, indium tin oxide layer, 18, flat organic layer,
121, light shield layer, 122, first buffer layer, 123, second buffer layer.
Specific embodiment
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic. " first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.? In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
It please refers to shown in Fig. 3, Fig. 4, in one embodiment of the invention, a kind of array substrate detection key 100 is provided in the present invention For the resistance value of hot-wire array substrate, the array substrate detection key 100 successively includes the glass being stacked from the bottom to top Substrate 11, more buffer layers 12, semiconductor layer 13, gate insulating layer 14, grid layer 15, source-drain electrode layer 16, indium tin oxide layer 17 With flat organic layer 18.Specifically, more buffer layers 12 are set on the glass substrate 11;The semiconductor layer 13 is set to institute It states on more buffer layers 12;The gate insulating layer 14 is set on semiconductor layer 13;The grid layer 15 is set to the gate insulator On layer 14;The source-drain electrode layer 16 is set on the grid layer 15;The indium tin oxide layer 17 is set to the source-drain electrode layer On 16;The flat organic layer 18 is set on the indium tin oxide layer 17.The semiconductor layer 13 can absorb array substrate and exist The partial electrostatic generated in manufacturing process, the semiconductor layer 13 resistance value with higher, the resistance of the semiconductor layer 13 Being worth range is 108Ω-1012Ω can prevent the array substrate detection key 100 from wound to power consumption.The semiconductor layer 13 can increase the resistance value of the array substrate detection key 100, prevent the influence of slight static discharge (ESD), and institute in time Absorption and power consumption, i.e. institute can be carried out to slight static discharge (ESD) in the processing procedure of array substrate by stating semiconductor layer 13 Semiconductor layer 13 is stated as resistance to reduce potential difference, so that the probability of damage by static electricity is reduced, to reduce the array substrate The risk that detection key 100 be wound.
Wherein, the flat organic layer 18 offers a groove 10, and the groove is through the flat organic layer 18 and makes The indium tin oxide layer 17 is exposed in groove 10.By in the groove 10 linking probe measure resistance value, probe can It is electrically connected the indium tin oxide layer 17, the indium tin oxide layer 17 electrically connects with the source-drain electrode layer 16 and the grid layer 15 It connects.Specifically, by applying voltage to array substrate, and in the groove measurement side of array substrate detection key 100 Current value can be obtained divided by resistance value with voltage value in block resistance, can be detected the current value change curve of array substrate, by right The characteristics such as uniformity of array substrate can be obtained than analyzing, and then can be appreciated that the quality of array substrate.
The present invention increases the resistance value of the array substrate detection key 100, prevents in time by increasing the semiconductor layer 13 The only influence of slight static discharge (ESD), and the semiconductor layer 13 can be in the processing procedure of array substrate to slight quiet Discharge of electricity (ESD) carries out absorption and power consumption, i.e., the described semiconductor layer 13 reduces potential difference as resistance, to reduce quiet The probability of electric injury, to reduce the risk that the array substrate detection key 100 be wound.
In the present embodiment, the thickness of the semiconductor layer 13 is less than
In the present embodiment, the material of the semiconductor layer 13 is semiconductor, and the semiconductor layer 13 passes through chemical gaseous phase Depositional mode production, the material of the semiconductor layer 13 includes polysilicon.
Preferably, the polysilicon is doped processing through injecting phosphonium ion, forms p-type polysilicon.
Preferably, the polysilicon is doped processing through injecting boron ion, forms N-type polycrystalline silicon.
Preferably, the polysilicon is doped processing through injecting chromium ion.
It please refers to shown in Fig. 5, in the present embodiment, more buffer layers 12 include the light shield layer 121, first being stacked Buffer layer 122 and second buffer layer 123.Specifically, the first buffer layer 122 is located on the light shield layer 121;Described second Buffer layer 123 is located at the first buffer layer 122 on the light shield layer 121.
In the present embodiment, the material of the first buffer layer or the second buffer layer includes SiNx or SiOx.It is preferred that , the material of the first buffer layer is SiNx, and the material of the second buffer layer is SiOx.
In the present embodiment, the material of the gate insulating layer 14 includes SiOx.
The present invention also provides a kind of display panels, including the array substrate to detect key 100.
When in use, can by applying a voltage U on the display panel where detecting key 100 in the array substrate, The exposed indium tin oxide layer 17 is separately connected probe to measure the resistance value R of array substrate in the groove, passes through meter The electric current I for detecting key 100 known to U/R by the array substrate is calculated, 100 place of key is as detected by the array substrate The electric current I of display panel.The curve changed over time by counting the electric current I, and institute is known with standard variation curve comparison It whether normal states the electric current I variation that display panel passes through, especially by the maximum trend value for comparing the electric current I, can push away Know whether the uniformity of the array substrate part of the display panel is good, to can determine whether the service life of the display panel Length.In addition, the resistance value R is square resistance, measurement method is the prior art, and this will not be repeated here.Pass through the electricity Resistance value R can also calculate the thickness range for learning the panel, also be the prior art, this will not be repeated here.
The beneficial effects of the present invention are: providing a kind of array substrate detection key and its display panel, the present invention pass through increase The semiconductor layer, it is possible to increase the resistance value of the array substrate detection key prevents the shadow of slight static discharge (ESD) in time It rings, and the semiconductor layer can absorb to slight static discharge (ESD) in the processing procedure of array substrate and electric energy disappears Consumption, i.e., the described semiconductor layer reduces potential difference as resistance, so that the probability of damage by static electricity is reduced, to reduce the array The risk that substrate detection key be wound.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as Protection scope of the present invention.

Claims (10)

1. a kind of array substrate detects key, successively include from the bottom to top glass substrate, more buffer layers, gate insulating layer, grid layer, Source-drain electrode layer, indium tin oxide layer and flat organic layer;
It is characterized in that, further including semiconductor layer, the semiconductor layer is set between more buffer layers and gate insulating layer, Partial electrostatic, which can be absorbed, prevents the array substrate detection key from wound power consumption;
Wherein, the flat organic layer offers a groove, and the groove is through the flat organic layer and makes the indium oxide Tin layers are exposed in groove;The indium tin oxide layer, the source-drain electrode layer and the grid layer are electrically connected.
2. array substrate according to claim 1 detects key, which is characterized in that the thickness of the semiconductor layer is less than
3. array substrate according to claim 1 detects key, which is characterized in that the material of the semiconductor layer includes polycrystalline Silicon.
4. array substrate according to claim 3 detects key, which is characterized in that the polysilicon is carried out through injection phosphonium ion Doping treatment.
5. array substrate according to claim 3 detects key, which is characterized in that the polysilicon is carried out through injection boron ion Doping treatment.
6. array substrate according to claim 3 detects key, which is characterized in that the polysilicon is carried out through injection chromium ion Doping treatment.
7. array substrate according to claim 1 detects key, which is characterized in that the resistance value range of the semiconductor layer is 108Ω-1012Ω。
8. array substrate according to claim 1 detects key, which is characterized in that
More buffer layers include:
Light shield layer;
First buffer layer is located on the light shield layer;And
Second buffer layer is located at the first buffer layer on the light shield layer.
9. array substrate according to claim 7 detects key, which is characterized in that the first buffer layer is described second slow The material for rushing layer includes SiNx or SiOx.
10. a kind of display panel, including the described in any item array substrates of an at least claim 1-9 detect key.
CN201910432885.5A 2019-05-23 2019-05-23 Array substrate detects key and display panel Pending CN110112149A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201910432885.5A CN110112149A (en) 2019-05-23 2019-05-23 Array substrate detects key and display panel
PCT/CN2019/092907 WO2020232795A1 (en) 2019-05-23 2019-06-26 Array substrate test key and display panel

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Application Number Priority Date Filing Date Title
CN201910432885.5A CN110112149A (en) 2019-05-23 2019-05-23 Array substrate detects key and display panel

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Publication Number Publication Date
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WO (1) WO2020232795A1 (en)

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CN111354744A (en) * 2020-04-03 2020-06-30 武汉华星光电技术有限公司 Array substrate detection key and display panel

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