CN110098485B - Small-spacing microstrip antenna array - Google Patents
Small-spacing microstrip antenna array Download PDFInfo
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- CN110098485B CN110098485B CN201910373813.8A CN201910373813A CN110098485B CN 110098485 B CN110098485 B CN 110098485B CN 201910373813 A CN201910373813 A CN 201910373813A CN 110098485 B CN110098485 B CN 110098485B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
- H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
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Abstract
The invention discloses a small-spacing microstrip antenna array, wherein the small-spacing microstrip antenna array comprises: a dielectric substrate; the first microstrip antenna and the second microstrip antenna are arranged on the upper surface of the dielectric substrate at intervals along the length direction of the dielectric substrate; the electromagnetic band gap decoupling unit comprises a first microstrip line and a second microstrip line which are arranged on the upper surface of a dielectric substrate, the first microstrip line is positioned between the first microstrip antenna and the second microstrip antenna, the second microstrip line and the first microstrip line are arranged in a cross mode and form two groups of open resonant ring groups, each open resonant ring group comprises a plurality of open resonant rings which are arranged in the width direction of the dielectric substrate, the open resonant rings of the two groups of open resonant ring groups are arranged in one-to-one correspondence in the length direction of the dielectric substrate, and the opening directions of the two corresponding open resonant rings are opposite. The technical scheme of the invention improves the isolation of the small-spacing microstrip antenna.
Description
Technical Field
The invention relates to the technical field of antenna design, in particular to a small-spacing microstrip antenna array.
Background
Antennas have become an indispensable component of wireless systems as a transceiver for radio signals, and are used in various fields such as mobile communications, broadcast television, radar detection, satellite navigation, and deep space exploration. In many practical applications, antennas are usually present in pairs in a transceiver wireless system (e.g., radio frequency identification system, continuous wave detection system, etc.), or as array elements in a multi-element antenna array (e.g., adaptive antenna array, mimo antenna array, phased array, etc.), or as functional units in a multifunctional wireless terminal device (e.g., notebook computer, mobile phone, etc.). In these cases, coupling inevitably occurs between adjacent antenna elements, and the coupling is mutual.
Mutual coupling of antennas affects various wireless communication and detection systems by a non-trivial amount, which degrades transmit and receive isolation, reduces system capacity, introduces scanning blind spots, and affects system design accuracy. In a continuous wave detection system, the deterioration of the inter-channel isolation caused by mutual coupling between transmitting and receiving antennas causes the reduction of the signal-to-noise ratio, and directly affects the detection distance, the increase of the spacing of the antenna units in the existing decoupling method causes the oversize of an antenna platform, the complex geometric shape and the possible reduction of the overall performance of an array, and some antennas also need complex feed network design, thus increasing the difficulty of the design.
Disclosure of Invention
The invention mainly aims to provide a small-spacing microstrip antenna array, aiming at improving the isolation of the small-spacing microstrip antenna.
In order to achieve the above object, the present invention provides a small-pitch microstrip antenna array, which includes:
a dielectric substrate;
the first microstrip antenna and the second microstrip antenna are arranged on the upper surface of the dielectric substrate at intervals along the length direction of the dielectric substrate;
the electromagnetic band gap decoupling unit comprises a first microstrip line and a second microstrip line which are arranged on the upper surface of the dielectric substrate, the first microstrip line is positioned between the first microstrip antenna and the second microstrip antenna, the second microstrip line and the first microstrip line are arranged in a cross mode and form two groups of open resonant ring groups, each open resonant ring group comprises a plurality of open resonant rings which are arranged in the width direction of the dielectric substrate, the open resonant rings of the two groups of open resonant ring groups are arranged in one-to-one correspondence in the length direction of the dielectric substrate, and the opening directions of the two corresponding open resonant rings are opposite.
Optionally, the first microstrip line includes a first straight line segment and two second straight line segments symmetrically disposed at two ends of the first straight line segment, and the two second straight line segments and the first straight line segment are in an "i" shape.
Optionally, the second microstrip line includes a third straight line segment and two fourth straight line segments symmetrically disposed at two ends of the third straight line segment, and the two fourth straight line segments and the third straight line segment are in an "H" shape.
Optionally, the first microstrip antenna and the second microstrip antenna are symmetrically arranged with the first microstrip line as a center line.
Optionally, a distance between a center point of the first microstrip antenna and a center point of the second microstrip antenna is less than 0.5 free space wavelength.
Optionally, the lower surface of the dielectric substrate is a common ground plate.
Optionally, the dielectric substrate has a thickness in a range of 0.1mm to 3 mm.
Optionally, the small-pitch microstrip antenna array further includes:
the first feed point and the second feed point are respectively arranged on the first microstrip antenna and the second microstrip antenna and are symmetrically arranged by taking the first microstrip line as a central line, and the first feed point and the second feed point are metalized through holes.
Optionally, the small-pitch microstrip antenna array further includes four metallized half holes, and the four metallized half holes are respectively disposed on the side edges of the dielectric substrate in the length direction in pairs.
The technical scheme of the invention is that a small-spacing microstrip antenna array comprises a dielectric substrate, a first microstrip antenna, a second microstrip antenna and an electromagnetic band gap decoupling unit, wherein the first microstrip antenna and the second microstrip antenna are arranged on the upper surface of the dielectric substrate at intervals along the length direction of the dielectric substrate, the electromagnetic band gap decoupling unit comprises a first microstrip line and a second microstrip line which are both arranged on the upper surface of the dielectric substrate, the first microstrip line is positioned between the first microstrip antenna and the second microstrip antenna, the second microstrip line and the first microstrip line are arranged in a crossed manner to form two groups of open resonant ring groups, each group of open resonant ring comprises a plurality of open resonant rings arranged along the width direction of the dielectric substrate, and the open resonant rings of the two groups of open resonant ring groups are arranged in a one-to-one correspondence manner in the length direction of the dielectric substrate, and the opening directions of the two correspondingly arranged split resonant rings are opposite. The electromagnetic band gap decoupling unit can form a plurality of opening resonance rings which are reversely arranged between the first microstrip antenna and the second microstrip antenna, the resonance rings of the first microstrip antenna and the second microstrip antenna are equivalent to an inductor, and the opening of the resonance ring is equivalent to a capacitor, so that an LC filter can be formed through the plurality of opening resonance rings to form an electromagnetic structure with band elimination filtering and decoupling, the fluctuation of impedance causes that electromagnetic waves are forbidden to be transmitted in a forbidden band, a transmission stop band is formed on a coupling path between the microstrip antennas, namely the transmission stop band is formed on the paths of the first microstrip antenna and the second microstrip antenna, and when the electromagnetic waves are transmitted, the electromagnetic waves are reflected, so that the mutual coupling between the microstrip antennas is filtered, and the isolation degree of the microstrip antennas is improved; because the electromagnetic band gap decoupling unit is arranged into a cross structure of the reverse open resonant ring, the first microstrip line and the second microstrip line have a common microstrip line, so that the microstrip antenna array structure is compact while the mutual coupling of the antennas is filtered. The scheme solves the problems of mutual coupling between small-spacing microstrip antenna arrays, complex structural shape and large occupied space. The technical scheme of the invention improves the isolation of the small-spacing microstrip antenna.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a small-pitch microstrip antenna array according to an embodiment of the present invention;
fig. 2 is a schematic side view of a small-pitch microstrip antenna array according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating an embodiment of an electric field vector direction and a maximum propagation direction in a small-pitch microstrip antenna array according to the present invention;
fig. 4 is a schematic diagram of the S21 parameter curve before and after the addition of the electromagnetic band gap decoupling unit in the small-pitch microstrip antenna array according to the present invention.
The reference numbers illustrate:
the implementation, functional features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a small-spacing microstrip antenna array which is applied to various fields of mobile communication, broadcast television, radar detection, satellite navigation, deep space detection and the like. In practical applications, antennas are usually present in pairs in a transceiver wireless system (e.g., a radio frequency identification system, a continuous wave detection system, etc.), or as array elements in a multi-element antenna array (e.g., an adaptive antenna array, a multiple-input multiple-output antenna array, a phased array, etc.), or as functional units in a multifunctional wireless terminal device (e.g., a notebook computer, a mobile phone, etc.). In the above-described transceiving wireless system, the multiple antenna array, or the wireless terminal device, coupling inevitably occurs between antenna elements close to each other, and the coupling is mutual.
Mutual coupling can degrade the transmit-receive isolation of the antennas, reduce system capacity, introduce scanning blind spots, and affect the design accuracy of the system. In a continuous wave detection system, the deterioration of the inter-channel isolation caused by mutual coupling between the transmitting and receiving antennas causes the reduction of the signal-to-noise ratio, which directly affects the detection distance. The most common decoupling method is to increase the spacing between antenna elements, but this method results in an oversized antenna array and degrades the overall performance of the antenna array, such as introducing grating lobes. Other decoupling methods include adding a coupling prevention structure between antennas or adding a feed network, but these methods have the disadvantages of complex structure shape, large size space requirement, limited use conditions of the antenna array, and complicated feed network design required for some of them, which increases the difficulty of design.
In order to solve the above problem, in an embodiment of the present invention, as shown in fig. 1, the small-pitch microstrip antenna array includes:
a dielectric substrate 10;
the antenna comprises a first microstrip antenna 20 and a second microstrip antenna 21, wherein the first microstrip antenna 20 and the second microstrip antenna 21 are arranged on the upper surface of the dielectric substrate 10 at intervals along the length direction of the dielectric substrate 10;
the electromagnetic band gap decoupling unit 30 comprises a first microstrip line 35 and a second microstrip line 36 which are arranged on the upper surface of the dielectric substrate 10, the first microstrip line 35 is located between the first microstrip antenna 20 and the second microstrip antenna 21, the second microstrip line 36 and the first microstrip line 35 are arranged in a cross mode to form two groups of open resonant ring groups, each open resonant ring group comprises a plurality of open resonant rings arranged in the width direction of the dielectric substrate 10, the open resonant rings of the two groups of open resonant ring groups are arranged in the length direction of the dielectric substrate 10 in a one-to-one correspondence mode, and the opening directions of the two correspondingly arranged open resonant rings are opposite.
In this embodiment, the dielectric substrate 10 is a carrier of the first microstrip antenna 20, the second microstrip antenna 21 and the electromagnetic band gap decoupling unit 30, the material of the dielectric substrate 10 may be formed by high-pressure molding, high-temperature firing, cutting and polishing using high-purity alumina (alumina) as a main raw material, and the ceramic substrate is a basic material for manufacturing thick-film and thin-film circuits. A copper clad laminate (hereinafter referred to as a "clad laminate") is a substrate material for manufacturing a printed circuit board, and serves to support various components and to realize electrical connection or electrical insulation therebetween.
The dielectric substrate 10 may also be a metal substrate, which refers to a metal-based copper-clad plate made by compounding a metal thin plate, an insulating dielectric layer and a copper foil. The material is applied to the aspects of electronic components, integrated circuit supporting materials, heat sinks and the like, and plays an important role in the fields of microwave communication, automatic control, power supply conversion, aerospace and the like in power electronic devices (such as rectifier tubes, thyristors, power modules, laser diodes, microwave tubes and the like) and microelectronic devices (such as computer CPUs and DSP chips).
The microstrip antenna is a rectangular area unit, a metal thin layer is attached to the lower surface of the microstrip antenna to serve as a grounding plate, the upper surface of the microstrip antenna is a metal patch with a certain shape, the antenna is formed by feeding the patch by utilizing a microstrip line or a coaxial probe, and the microstrip antenna is integrally arranged on the upper surface of the dielectric substrate 10, namely the lower surface of the microstrip antenna is in contact with the upper surface of the dielectric substrate 10. It should be noted that, in this embodiment, the microstrip antenna includes a first microstrip antenna 20 and a second microstrip antenna 21, and the first microstrip antenna 20 and the second microstrip antenna 21 are disposed on the upper surface of the dielectric substrate 10 at intervals along the length direction of the dielectric substrate 10, so as to improve the performance of the microstrip antenna array.
The first microstrip antenna 20 and the second microstrip antenna 21 are arranged along the length direction of the dielectric substrate 10; it can be understood that the first microstrip antenna 20 and the second microstrip antenna 21 are disposed along the plane E of the dielectric substrate 10, where the plane E is a plane in which the electric field vector direction and the maximum propagation direction are located, as shown in fig. 3, the electric field vector direction is the X-axis direction in fig. 3, the maximum propagation direction is the Z-axis direction in fig. 3, and the plane E is a plane formed by the X-axis and the Z-axis.
In the above embodiment, as for the electromagnetic bandgap decoupling unit 30, it can be understood that the electromagnetic bandgap decoupling unit 30 includes a first microstrip line 35 and a second microstrip line 36 which are arranged in a crossed manner to form two groups of open-ended resonant rings, each group of open-ended resonant rings includes a plurality of open-ended resonant rings arranged in a width direction of the dielectric substrate 10, the plurality of open-ended resonant rings are arranged in a one-to-one correspondence in a length direction of the dielectric substrate 10, and opening directions of the open-ended resonant rings arranged in a one-to-one correspondence are opposite. Therefore, an electromagnetic band gap structure is formed, coupling between the microstrip antennas is filtered, and the isolation of the microstrip antenna array is improved.
The Split-ring resonator (Split-ring resonator) mentioned above is a magnetic metamaterial. A pair of concentric sub-wavelength sized split resonant rings can effectively change permeability. Specifically, a metal ring generates an induced electromagnetic field in a varying magnetic field perpendicular to the ring, but is not a resonant system. To produce a resonance enhanced magnetic response, we need to introduce a capacitance. Because the inductor and the capacitor together form a resonant circuit (the metal ring can be regarded as an inductor). Therefore, a gap is added on each metal ring, the formed open metal ring forms a capacitor, and charges can be accumulated at two ends. This split ring thus resembles a resonant circuit with two capacitors. Two split ring resonators are used because the charges accumulated in a single split ring resonator can generate electric dipole moments to weaken the electromagnetic dipole moment that we want, and the electric dipole moments generated by the split ring resonators with two opposite split rings can cancel each other out, so that a dual split ring resonator structure is often used in metamaterial design.
In this embodiment, the electromagnetic band gap decoupling unit 30 is configured by taking the length direction of the dielectric substrate 10 as a baseline and by cross-setting the first microstrip line 35 and the second microstrip line 36, two groups of open resonator ring groups are formed, each group of open resonator ring group includes a plurality of open resonator rings, the width direction of the dielectric substrate 10 is taken as a baseline, the plurality of open resonator rings of each group of open resonator ring groups are arranged, and the plurality of open resonator rings are arranged in one-to-one correspondence along the width direction of the dielectric substrate 10, that is, the open resonator rings of one group of open resonator ring groups are arranged in correspondence with the open resonator rings of the other group of open resonator ring groups; the split resonant rings arranged in one-to-one correspondence have opposite opening directions, that is, the opening directions of the split resonant rings of one split resonant ring group face one end of the length direction of the dielectric substrate 10, and the opening directions of the split resonant rings of the other split resonant ring group face the other end of the length direction of the dielectric substrate 10.
In this embodiment, as shown in fig. 1, each split ring set includes two split rings, that is, the first split ring 31 and the third split ring 33 are disposed correspondingly, and the split direction of the first split ring 31 and the split direction of the third split ring 33 are disposed oppositely; the second split resonant ring 32 and the fourth split resonant ring are arranged correspondingly, and the opening direction of the second split resonant ring 32 and the opening direction of the fourth split resonant ring 34 are arranged oppositely; the resonance ring is equivalent to an inductor, the opening of the resonance ring is equivalent to a capacitor, an LC filter can be formed by a plurality of opening resonance rings, an electromagnetic structure with filtering and decoupling resistance is formed, the electromagnetic wave is prohibited from being transmitted in a forbidden band due to the fluctuation of impedance, a transmission stop band is formed on a coupling path between the microstrip antennas, namely, a transmission stop band is formed on the paths of the first microstrip antenna 20 and the second microstrip antenna 21, and the electromagnetic wave is reflected when being transmitted; therefore, the coupling between the first microstrip antenna 20 and the second microstrip antenna 21 is filtered through the one-to-one corresponding open resonant ring with opposite opening directions, and the isolation between the first microstrip antenna 20 and the second microstrip antenna 21 is improved.
The above mentioned forbidden band specifically refers to the photon forbidden band material of the electromagnetic band gap decoupling unit 30, and from the material structure, the photonic crystal is a kind of artificially designed and manufactured crystal having a periodic dielectric structure on the optical scale. Similar to the modulation of an electronic wave function by a semiconductor lattice, photonic band gap materials are capable of modulating electromagnetic waves having a corresponding wavelength, which are modulated due to the presence of bragg scattering as they propagate in the photonic band gap material, the electromagnetic wave energy forming a band structure. A band gap, i.e., a photonic band gap, occurs between the energy bands. Photons with energies within the photonic bandgap cannot enter the crystal.
In this embodiment, after the electromagnetic bandgap decoupling unit 30 is disposed, the isolation between the microstrip antenna arrays is improved, and a specific microstrip antenna array isolation S21 parameter curve is shown in fig. 4.
The technical scheme of the invention is that a small-spacing microstrip antenna array comprises a dielectric substrate 10, a first microstrip antenna 20, a second microstrip antenna 21 and an electromagnetic band gap decoupling unit 30, wherein the first microstrip antenna 20 and the second microstrip antenna 21 are arranged on the upper surface of the dielectric substrate 10 at intervals along the length direction of the dielectric substrate 10, the electromagnetic band gap decoupling unit 30 comprises a first microstrip line 35 and a second microstrip line 36 which are both arranged on the upper surface of the dielectric substrate 10, the first microstrip line 35 is positioned between the first microstrip antenna 20 and the second microstrip antenna 21, the second microstrip line 36 is crossed with the first microstrip line 35 to form two groups of open resonant ring groups, each group of open resonant ring comprises a plurality of open resonant rings arranged along the width direction of the dielectric substrate 10, the open resonant rings of the two groups of open resonant ring groups are arranged in a one-to-one correspondence manner along the length direction of the dielectric substrate 10, and the opening directions of the two correspondingly arranged split resonant rings are opposite. The electromagnetic band gap decoupling unit 30 can form a plurality of reversely arranged open-ended resonance rings between the first microstrip antenna 20 and the second microstrip antenna 21, the resonance rings included by the first microstrip line 35 and the second microstrip line 36 are equivalent to an inductor, and the opening of the resonance ring is equivalent to a capacitor, so that an LC filter can be formed through the open-ended resonance rings to form an electromagnetic structure with band-stop filtering and decoupling, and the fluctuation of impedance can cause electromagnetic waves to forbid propagation of forbidden bands and form a transmission stop band on a coupling path between the microstrip antennas, namely, a transmission stop band is formed on the paths of the first microstrip antenna 20 and the second microstrip antenna 21, and when the electromagnetic waves are propagated, the electromagnetic waves are reflected to filter mutual coupling between the microstrip antennas, thereby improving the isolation of the microstrip antennas; because the electromagnetic band gap decoupling unit 30 is arranged in a cross structure of the inverted open-ended resonant ring, the first microstrip line 35 and the second microstrip line 36 have a common microstrip line, so that the microstrip antenna array structure is compact while the mutual coupling of the antennas is filtered out. The scheme solves the problems of mutual coupling between small-spacing microstrip antenna arrays, complex structural shape and large occupied space. The technical scheme of the invention improves the isolation of the small-spacing microstrip antenna.
In an embodiment, the first microstrip line 35 includes a first straight line segment and two second straight line segments symmetrically disposed at two ends of the first straight line segment, and the two second straight line segments and the first straight line segment are in an "i" shape.
The second microstrip line 36 includes a third straight line segment and two fourth straight line segments symmetrically disposed at two ends of the third straight line segment, and the two fourth straight line segments and the third straight line segment are in an "H" shape.
In this embodiment, 4 open-ended resonant rings are formed by the first straight line segment and the two second straight line segments included in the first microstrip line 35 and the third straight line segment and the two fourth straight line segments included in the second microstrip line 36, that is, the first open-ended resonant ring 31 and the third open-ended resonant ring 33 are correspondingly arranged, and the opening direction of the first open-ended resonant ring 31 and the opening direction of the third open-ended resonant ring 33 are oppositely arranged back to back; the second split resonant ring 32 and the fourth split resonant ring 34 are correspondingly arranged, and the opening direction of the second split resonant ring 32 and the opening direction of the fourth split resonant ring 34 are oppositely arranged; that is, the first microstrip line 35 is in an "i" shape and the second microstrip line 36 is in an "H" shape, and the two microstrip lines are arranged in a crossed manner to form 4 open-ended resonant rings, so that the coupling between the first microstrip antenna 20 and the second microstrip antenna 21 is filtered, and the isolation between the first microstrip antenna 20 and the second microstrip antenna 21 is improved.
In the above embodiment, the first microstrip antenna 20 and the second microstrip antenna 21 are symmetrically disposed with the first microstrip line 35 as a center line.
In the above embodiment, the electromagnetic bandgap decoupling unit 30 has a length of 0.5 guided wavelengths and a width of 0.125 guided wavelengths.
In this embodiment, the length of the electromagnetic bandgap decoupling element 30 means the longest length of the electromagnetic bandgap decoupling element 30 is 0.5 guided wave wavelength, and the width means the longest width of the electromagnetic bandgap decoupling element 30 is 0.125 guided wave wavelength.
The guided wave wavelength in the above embodiment is also referred to as guided inner wave wavelength, and is a periodic distribution of the electromagnetic field intensity along the waveguide propagation direction formed by the back and forth reflection of the working electromagnetic wave on the two side walls of the waveguide, and the specific calculation method of the guided wave wavelength is as follows:
guided wave wavelength
Wherein epsiloneIs the equivalent dielectric constant, λ, of the dielectric substrate 100Is a free space wavelength;
equivalent dielectric constant of the dielectric substrate 10
Wherein epsilonrIs the relative dielectric constant of the dielectric substrate 10, h is the thickness of the dielectric substrate 10, w is the width of the electromagnetic bandgap decoupling cell 30The thickness h of the substrate 10 and the width w of the electromagnetic bandgap decoupling cell 30 are shown in fig. 2.
Free space wavelength
Wherein C is the speed of light, f0Is the working frequency;
in the above embodiments, the distance from the center point of the first microstrip antenna 20 to the center point of the second microstrip antenna 21 is less than 0.5 free space wavelength.
It can be understood that, the central point of the first microstrip antenna 20 or the central point of the second microstrip antenna 21 is not limited herein, because the microstrip antenna is rectangular, that is, the intersection point of the diagonals of the first microstrip antenna 20 or the second microstrip antenna 21, and the distance between the central points of the two microstrip antennas can be 0.2 free space wavelength, 0.3 free space wavelength, or the like.
In the above embodiments, the free space refers to a propagation space without any attenuation, without any blocking, and without any multipath. Ideal radio propagation conditions do not exist, and it is generally considered that as long as the atmosphere above the ground is an isotropic homogeneous medium, the relative permittivity ∈ and the relative permeability μ of which are both equal to 1, and no obstacles are present in the propagation path, the field strength of the ground-reflected signal reaching the receiving antenna can be ignored, and in such a case, the propagation mode of the electric wave is considered to be propagation in free space. Both satellite communication and microwave communication are generally considered to be communication in an ideal channel. I.e., free space wavelength refers to a wavelength that propagates in free space.
In the above embodiment, the first microstrip antenna 20 and the second microstrip antenna 21 are symmetrically disposed with the second microstrip strip as a central line, and the distance between the central points of the two microstrip antennas is 0.3 free space wavelengths, it can be understood that, due to the symmetric disposition of the first microstrip antenna 20 and the second microstrip antenna 21, the electromagnetic band gap decoupling unit 30 between the first microstrip antenna 20 and the second microstrip antenna 21 can be disposed between smaller spaces, and the first microstrip line 35 and the second microstrip line 36 in the electromagnetic band gap decoupling unit 30 have a commonly used microstrip line, so that the distance between the microstrip antennas in the microstrip antenna array is reduced while the coupling between the microstrip antenna arrays is filtered, so as to achieve a compact structure of the microstrip antenna array.
In one embodiment, the lower surface of the dielectric substrate 10 is a common ground plate. It can be understood that the common ground plate can be connected to the first microstrip antenna 20 and the second microstrip antenna 21, and can also be grounded to the electromagnetic band gap decoupling unit 30, so that the electromagnetic band gap decoupling unit 30 can form an open resonant loop to form a filter, so as to form a transmission stop band on a coupling path between the microstrip antennas, filter out mutual coupling between the microstrip antennas, and improve isolation of the microstrip antennas.
In the embodiment, the medium substrate 10 can adopt an FR4 double-sided copper-clad plate, the FR4 double-sided copper-clad plate refers to a glass fiber epoxy resin copper-clad plate, and the dielectric constant is generally 4.2-4.7; the dielectric substrate 10 may be other ceramic substrate, metal substrate, or the like, and is not limited thereto. For example, by using an FR4 double-sided copper-clad plate with a dielectric constant of 4.4, the first microstrip antenna 20, the second microstrip antenna 21, and the electromagnetic band gap decoupling unit 30 can have better connection performance with the dielectric substrate 10, and meanwhile, the cost of the microstrip antenna array is reduced because the FR4 double-sided copper-clad plate has lower cost.
In this embodiment, the thickness of the dielectric substrate ranges from 0.1mm to 3mm, that is, the thickness of the dielectric substrate may be 0.5mm, 1mm, 1.5mm, and the like, which is not limited herein. The length of the dielectric substrate may be specifically set according to an application scenario, for example, the length of the dielectric substrate is 0.6 free space wavelengths, and the width of the dielectric substrate is 0.3 free space wavelengths, which is not limited herein.
In an embodiment, the small-pitch microstrip antenna array further comprises:
a first feed point 40 and a second feed point 41, where the first feed point 40 and the second feed point 41 are respectively disposed on the first microstrip antenna 20 and the second microstrip antenna 21, and are symmetrically disposed with the second microstrip line 36 as a central line.
In this embodiment, the two feed points are metalized vias.
In the above embodiment, the feeding mode of the microstrip antenna array is coaxial feeding, where feeding is to add an electromagnetic wave signal with a certain frequency to the microstrip antenna, and here is a frequency band in which the microstrip antenna needs to operate, and what frequency band the microstrip antenna is designed to, and it can be understood that the microstrip antenna array operates in an ISM frequency band of 5.8GHz, that is, an electromagnetic wave signal with 5.8GHz needs to be added to the microstrip antenna, and this is not limited here.
In the coaxial feeding, the coaxial probe is connected to the radiator portion of the microstrip antenna, the coaxial outer conductor is generally grounded, and since the first microstrip antenna 20 and the second microstrip antenna 21 are disposed on the upper surface of the dielectric substrate 10, the coaxial probe is connected to the first microstrip antenna 20 and the second microstrip antenna 21, and the coaxial outer conductor is connected to the lower surface of the dielectric substrate 10. Therefore, the complex feed network design is reduced, and the design difficulty is reduced.
In the above embodiment, the small-pitch microstrip antenna array further includes four metallized half holes 50, and the four metallized half holes 50 are respectively disposed on the side edges of the dielectric substrate 10 in the length direction two by two.
It will be appreciated that two metallized half holes 50 are provided on a first side edge of the dielectric substrate 10 in the longitudinal direction, and two metallized half holes 50 are provided on a second side edge of the dielectric substrate 10 in the longitudinal direction, which allows more space for components to be provided in a limited area when connecting with other printed circuit board modules.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (7)
1. A small-pitch microstrip antenna array, comprising:
a dielectric substrate;
the first microstrip antenna and the second microstrip antenna are arranged on the upper surface of the dielectric substrate at intervals along the length direction of the dielectric substrate;
the electromagnetic band gap decoupling unit comprises a first microstrip line and a second microstrip line which are arranged on the upper surface of the dielectric substrate, the first microstrip line is positioned between the first microstrip antenna and the second microstrip antenna, the second microstrip line and the first microstrip line are arranged in a crossed mode and form two groups of open resonant ring groups, each open resonant ring group comprises a plurality of open resonant rings which are arranged in the width direction of the dielectric substrate, the open resonant rings of the two groups of open resonant ring groups are arranged in the length direction of the dielectric substrate in a one-to-one correspondence mode, and the opening directions of the two correspondingly arranged open resonant rings are opposite; the opening directions of the two groups of opening resonance rings respectively face to two ends of the length direction of the medium substrate; the first microstrip line comprises a first straight line section and two second straight line sections symmetrically arranged at two ends of the first straight line section, and the two second straight line sections and the first straight line section are in an I shape; the second microstrip line comprises a third straight line section and two fourth straight line sections symmetrically arranged at two ends of the third straight line section, and the two fourth straight line sections and the third straight line section are H-shaped.
2. The small-pitch microstrip antenna array of claim 1, wherein the first microstrip antenna and the second microstrip antenna are symmetrically disposed with the first microstrip line as a center line.
3. The small-pitch microstrip antenna array of claim 2, wherein the distance from the center point of the first microstrip antenna to the center point of the second microstrip antenna is less than 0.5 free-space wavelengths.
4. The small-pitch microstrip antenna array of claim 1, wherein the lower dielectric substrate surface is a commoned ground plate.
5. The small-pitch microstrip antenna array of claim 4, wherein the dielectric substrate has a thickness in the range of 0.1mm to 3 mm.
6. The small-pitch microstrip antenna array of claim 1, further comprising:
the first feed point and the second feed point are respectively arranged on the first microstrip antenna and the second microstrip antenna and are symmetrically arranged by taking the first microstrip line as a central line, and the first feed point and the second feed point are metalized through holes.
7. The small-pitch microstrip antenna array of claim 1, further comprising four metallized half holes, wherein the four metallized half holes are disposed two by two on the side edges of the dielectric substrate in the length direction.
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| KR20210061577A (en) * | 2019-11-20 | 2021-05-28 | 삼성전기주식회사 | Antenna apparatus |
| CN111697340B (en) * | 2020-07-20 | 2021-08-24 | 华南理工大学 | Dual-polarized array antenna and decoupling structure |
| CN112510367B (en) * | 2020-10-19 | 2023-05-30 | 西安朗普达通信科技有限公司 | Resonant decoupling chip |
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| CN113270719B (en) * | 2021-04-01 | 2023-04-11 | 中信科移动通信技术股份有限公司 | Antenna isolation device, array antenna and base station antenna |
| CN114234934B (en) * | 2021-12-16 | 2024-01-09 | 中国人民解放军国防科技大学 | Ocean internal wave monitoring method and system of non-uniform spatial resolution satellite-borne low-light-level imager |
| CN115173062B (en) * | 2022-09-08 | 2022-11-15 | 北京信诺飞图科技有限公司 | High-gain high-isolation miniaturized airborne Beidou anti-interference array antenna |
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