CN110095638A - A kind of PCB electronic component test method and system based on oscillograph probe - Google Patents
A kind of PCB electronic component test method and system based on oscillograph probe Download PDFInfo
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- CN110095638A CN110095638A CN201910451682.0A CN201910451682A CN110095638A CN 110095638 A CN110095638 A CN 110095638A CN 201910451682 A CN201910451682 A CN 201910451682A CN 110095638 A CN110095638 A CN 110095638A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention discloses a kind of PCB electronic component test method based on oscillograph probe, comprising: driving probe is moved to the top of electronic component to be measured in space；Driving probe is down to electronic component surface to be measured with pre-set velocity and is in contact with it, and real-time detection external force suffered by it when probe starts to contact with electronic component surface to be measured；The rate of straining of probe is calculated according to the external force of probe and system inertia, system damping parameter, and probe is made to keep rate of straining to keep constant-force contact preset time to completing to test with electronic component surface to be measured.The present invention can make probe and electronic component that constant force be kept to be steadily contacted, avoid damage PCB or probe, while improving testing efficiency in the test process for carrying out oscillograph probe to the electronic component on PCB.The PCB electronic component test macro based on oscillograph probe that invention additionally discloses a kind of, its advantages are as described above.
Description
Technical field
The present invention relates to PCB the field of test technology, in particular to a kind of PCB electronic component based on oscillograph probe is surveyed
Method for testing.The PCB electronic component test macro based on oscillograph probe that the invention further relates to a kind of.
Background technique
With the development of electronics assembly technology, the spacing of electronic component is smaller and smaller on pcb board, needs to be surveyed with oscillograph
The quantity of the point of examination is more and more, and the method that traditional manual clamping oscillograph is tested is time-consuming and laborious, and effect is unstable, institute
With a large amount of equipment application in the automatic test course of oscillograph.Oscillograph automated test device used is multifarious,
But hardware configuration used is reached by certain mechanical structure clamping oscillograph probe and the test point contact of surveyed object
To test purpose.However a current important difficult point is exactly that the oscillography clamped by mechanical structure how is realized in automatic test course
Device probe probe contacts safely and effectively and steadily with server master board test point, reaches test purpose.
It is main at present to allow probe probe and surveyed pcb board to test point contact by two ways, first is that by clamping manually
The mode of probe, second is that clamping probe by certain automation equipment realizes test process, these equipment often use position
Mode is controlled, that is to say, judging whether equipment contacts with mainboard according to the feedback of position (height).
Wherein, the mode that clamping probe is tested manually, needs that difference probe is placed in fixed position with hand on one side,
It also needs to operate oscillograph on one side to observe and record waveform.Posture in the lesser position of some measuring point spacings, hand-held probe is wanted
It asks higher, and needs to keep certain time to keep waveform, some test points even need two people's cooperations that can just fulfil assignment,
More manpower is occupied, wastes the more time, and effect is undesirable.And the scheme for replacing hand to survey with mechanical grip, contact
Process use position control, i.e., according to the feedback of probe present position determine mechanical structure whether the drive probe advance or after
It moves back.Using mode position, the power at contact point is often uncontrollable, and mainboard or probe can be damaged when serious.Which needs pair
Contact environment absolute such as the stress deformation or probe deformations of mainboard, is asked above it is known that be secondly difficult to ignore the deformation of environment
Deviation caused by topic often leads to that measurement accuracy is not high, can not keep stable pressure in test process with contact point, lead to wave
Shape distortion, test effect are unstable.
Therefore, how in the test process for carrying out oscillograph probe to the electronic component on PCB, make probe and electronics
Component keeps constant force to be steadily contacted, and avoids damage PCB or probe, while improving testing efficiency, is those skilled in the art institute
The technical issues of facing.
Summary of the invention
The PCB electronic component test method based on oscillograph probe that the object of the present invention is to provide a kind of, can be right
Electronic component on PCB carries out in the test process of oscillograph probe, and probe is made to keep constant force stabilization to connect with electronic component
Touching avoids damage PCB or probe, while improving testing efficiency.It is a further object of the present invention to provide one kind to be visited based on oscillograph
The PCB electronic component test macro of stick.
In order to solve the above technical problems, the present invention provides a kind of PCB electronic component test side based on oscillograph probe
Method, comprising:
Driving probe is moved to the top of electronic component to be measured in space；
Drive the probe to be down to electronic component surface to be measured with pre-set velocity and be in contact with it, and the probe with to
It surveys electronic component surface and starts its suffered external force of real-time detection when contact；
The rate of straining of the probe is calculated according to the external force of the probe and system inertia, system damping parameter, and
The probe is set to keep the rate of straining to keep constant-force contact preset time to completing to survey with electronic component surface to be measured
Examination.
Preferably, described pop one's head in is driven to be moved to the top of electronic component to be measured in space, comprising:
The probe is driven to move to the upper of electronic component to be measured in space by the output end of Three-axis drive mechanism
Side, and the posture of probe described in the rotation axial adjustment by being arranged on the output end of the Three-axis drive mechanism.
Preferably, when driving the probe downlink probe described in real-time detection height and position, and adjusted with this described
The downstream rate of probe.
Preferably, during driving the probe to be down to electronic component surface to be measured with pre-set velocity, make described
Probe is maintained in 0.1~0.5mm/s of velocity interval.
Preferably, by the way that force snesor real-time detection external force suffered by it of the probe tip is arranged in, and with its detection
It is worth the external force as the probe.
Preferably, after the rate of straining for calculating the probe, make the probe keep the rate of straining with it is to be measured
Electronic component surface keeps 10~15s.
Preferably, the strain of the probe is calculated according to the external force of the probe and system inertia, system damping parameter
Speed specifically includes:
Pass through formula:
Calculate the rate of straining of the probe；
Wherein, M is system inertia parameter, and B is system damping parameter, and x is the physical location of the probe, and f is the spy
The external force of head,For the rate of straining of probe,It is f to the first derivative of t.
The PCB electronic component test macro based on oscillograph probe that the present invention also provides a kind of, comprising:
First drive module is moved to the top of electronic component to be measured for driving to pop one's head in space；
Second drive module connects for driving the probe to be down to electronic component surface to be measured with pre-set velocity with it
Touching；
External force detection module, for its institute of real-time detection when the probe starts to contact with electronic component surface to be measured
By external force；
Constant force control module, for according to the external force of the probe and system inertia, the calculating of system damping parameter
The rate of straining of probe, and the probe is made to keep the rate of straining to keep constant-force contact with electronic component surface to be measured
Preset time is to completing to test.
Preferably, further include height detection module, be used for its height and position of real-time detection when the probe starts downlink,
And the downstream rate of the probe is adjusted with this.
Preferably, first drive module includes for driving the Three-axis drive mechanism popped one's head in and moved in space
Be set to the Three-axis drive mechanism output end on, the rotary shaft for adjusting the probe posture.
PCB electronic component test method provided by the present invention based on oscillograph probe mainly includes three steps,
In the first step, driving probe first is moved in space with fast speed, by the electronics to be measured in probe movement to PCB surface
The top of component, it is aligned with it, complete assignment test preparation.Then, in second step, continue driving probe with relatively slow
Speed carries out vertical elevating movement, so that probe is gradually reduced, until being in contact with the surface of electronic component to be measured.Work as probe
After falling into place, the bottom surface of probe starts to contact with the surface of electronic component to be measured, and come into existence mutual masterpiece between the two
With, and the external force (predominantly pressing reaction force) that detection probe is subject to from now on.Finally, in the third step, according to
The relevant system inertia of probe overall structure, system damping parameter and detect that the outer force parameter of probe calculates answering for probe
Speed change degree, the rate of straining is more small, and can make to pop one's head in carries out reciprocal lifting fortune by a small margin on the surface of electronic component to be measured
It is dynamic, to adapt to pop one's head in the two contact process miniature deformation of bottom surface, the miniature deformation and PCB on electronic component surface to be measured
The miniature deformation on surface, so that the contact popped one's head between bottom surface and electronic component surface to be measured be made to be in suitable constant force range
It is interior, the test popped one's head in electronic component to be measured can be completed after so keeping preset time.In conclusion provided by the present invention
The PCB electronic component test method based on oscillograph probe, power can be passed through in the test process to electronic component
Feedback and the mode of speed control make probe keep constant force to be steadily contacted with electronic component, avoid damage PCB or probe, simultaneously
Improve testing efficiency.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the flow chart of test method in a kind of specific embodiment provided by the present invention.
Fig. 2 is the module map of test macro in a kind of specific embodiment provided by the present invention.
Fig. 3 is the schematic diagram that electronic component is tested by oscillograph probe.
Wherein, in Fig. 2-Fig. 3:
First drive module -1, the second drive module -2, height detection module -3, external force detection module -4, constant force
Control module -5, probe -6.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1 and Fig. 3 are please referred to, Fig. 1 is the flow chart of test method in a kind of specific embodiment provided by the present invention,
Fig. 3 is the schematic diagram that electronic component is tested by oscillograph probe.
In a kind of specific embodiment provided by the present invention, the PCB electronic component test based on oscillograph probe
Method mainly includes three steps.
In the first step, driving probe first is moved in space with fast speed, will be in probe movement to PCB surface
The top of electronic component to be measured, it is aligned with it, complete assignment test preparation.In this step, since probe only relates to
Free movement in space, therefore movement velocity can be very fast, for example probe generally can be in the velocity interval of 5~10mm/s.
Certainly, to guarantee that movement position is accurate, coordinate position of the electronic component to be measured on fixture can be scanned in advance, then driving is visited
Head is moved according to the coordinate position, to guarantee position face to be measured electronic component of the probe above fixture.
In addition, needing the stabilizer blade of end two of probe being clamped in electronic component to be measured due to the working characteristics of probe
Both ends of the surface on, it is contemplated that distribution mode of the electronic component to be measured on PCB surface is varied, for example, laterally, Zong Xianghuo
It diagonally distributes, it, in this step can also rotation on the output end by the way that Three-axis drive mechanism is arranged in for convenience of probe clamping
Shaft driving probe is rotated, to adjust the spatial attitude of probe, to adapt to that electronic component to be tested is currently needed to exist
Distribution form on PCB surface.
In second step, continues driving probe with slower speed and carry out vertical elevating movement, so that probe is gradually reduced, when
After probe is fallen into place, the bottom surface of probe starts to contact with the surface of electronic component to be measured, comes into existence between the two mutually
Power effect, and the external force (predominantly pressing reaction force) that detection probe is subject to from now on.In this step, due to this hair
Bright core is the constant-force contact of probe with electronic component to be realized by the mode of force feedback and speed control, therefore work as probe
When contacting with each other with electronic component to be measured generation, the interaction of the two must be just monitored.Specifically, can visited by setting
The force snesor at the crown end power suffered to probe detects.
Meanwhile in the process can also real-time detection probe height and position, so as to judge probe with electronics member device to be measured
The distance of part.Contacted due to needing that probe is driven to generate with the surface of electronic component to be measured, be avoid excessive velocities and
Cause to generate shock when contact, probe can with downlink between slower speed, in general, the speed of probe be positively retained at 0.1~
In 0.5mm/s.Specifically, laser sensor can be set on the side wall of probe to improve the height and position detection accuracy of probe,
To by way of laser ranging the bottom surface Yu electronic component surface to be measured of detection probe (or the bottom surface of itself) away from
From finally again converting this to apart from detected value the height and position (generally by 0 altitude datum of PCB surface) of probe.
In the third step, according to system inertia relevant to probe overall structure, system damping, (probe system has certain
Elasticity), the outer force parameter of system rigidity parameter and the probe detected calculate the rate of straining of probe, the rate of straining compared with
Small, can make to pop one's head in carries out reciprocal elevating movement by a small margin on the surface of electronic component to be measured, to adapt to the two contact process
Miniature deformation, the miniature deformation on electronic component surface to be measured and the miniature deformation of PCB surface of middle probe bottom surface, to make
Contact between probe bottom surface and electronic component surface to be measured is within the scope of suitable constant force, after so keeping preset time
The test popped one's head in electronic component to be measured can be completed.In this step, probe can be first with electronics to be measured under constant force effect
The surface of device keeps 10~15s, i.e., carries out complete signal testing using oscillograph.
In conclusion the PCB electronic component test method based on oscillograph probe provided by the present embodiment, Neng Gou
To in the test process of electronic component, probe is set to keep constant force with electronic component by the mode of force feedback and speed control
It is steadily contacted, avoids damage PCB or probe, improve testing efficiency.
In addition, in the third step, it is as follows for the rate of straining calculation method of probe.
Firstly, a zero uniaxial input mechanical system can be regarded as simplified second order mass-damping linear system, express
Formula is as follows:
Wherein, M, B, K are respectively system inertia parameter, system damping parameter and system rigidity parameter, which is system
Intrinsic parameter, it is related to structure, it can measure in advance, x is the physical location (respective heights position) of probe.
When there is external force input:
Wherein, f is the external force of probe；
Regard f as f=-Kvx-Kp, state equation newly can be obtained:
Deformation is arranged to obtain:
It is obtained after above formula is carried out Laplace transform:
In turn, rightLaplace transform is carried out to obtain:
Reverse drawing Laplace transform is carried out to above formula to obtain:
Wherein, since there are apparent saturated hysteresis phenomenons for integral term, for the contact process popped one's head in electronic component
For speed adjust and there is lag, inaccurate influence, therefore this usually ignores, and obtains:
Wherein,It is x to the first derivative of t (time), the rate of straining as popped one's head in,It is f to the single order of t (time)
Derivative；For convenience of calculating, B and M can also carry out parameter tuning.
The present embodiment also provides a kind of PCB electronic component test macro based on oscillograph probe, mainly includes first
Drive module 1, the second drive module 2, height detection module 3, external force detection module 4 and constant force control module 5.Wherein, first
Drive module 1 is mainly used for the top that driving probe 6 is moved to electronic component to be measured in space, and the second drive module 2 is main
It is used to that probe 6 to be driven to be down to electronic component surface to be measured with pre-set velocity and be in contact with it.Height detection module 3 is mainly used
In its height and position of real-time detection when probe 6 starts downlink, external force detection module 4 is mainly used in probe 6 and electronics to be measured
Component surface starts its suffered external force of real-time detection when contact.Constant force control module 5 be mainly used for according to probe 6 external force with
And system inertia, system damping parameter calculate probe 6 rate of straining, and make probe 6 keep rate of straining with electronics to be measured
Component surface keeps constant-force contact preset time to completing to test.
In a kind of preferred embodiment about the first drive module 1, which mainly includes that three axis drive
Motivation structure and rotary shaft.Wherein, Three-axis drive mechanism concretely x-y-z Three Degree Of Freedom driving mechanism is mainly used for driving and visits
First 6 carry out free movement in space.Rotary shaft is arranged on the output end of Three-axis drive mechanism, for example in z-axis, is mainly used for
Driving probe 6 is rotated, so as to adjust the spatial attitude (yaw angle, pitch angle and roll angle) of probe 6.
Wherein, height detection module 3 can specifically use laser sensor, and may be provided on the side wall of probe 6, and
External force detection module 4 can specifically use force snesor, and may be provided on the top of probe 6.The top of probe 6 passes through again
The components such as connecting shaft are connected with the first drive module 1, and can also add vertically flexible spring therebetween and make and be
System forms apparent damping system, while can also prevent probe 6 in test process from generating overshoot.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (10)
1. a kind of PCB electronic component test method based on oscillograph probe characterized by comprising
Driving probe is moved to the top of electronic component to be measured in space；
It drives the probe to be down to electronic component surface to be measured with pre-set velocity to be in contact with it, and in the probe and electricity to be measured
Sub- component surface starts its suffered external force of real-time detection when contact；
The rate of straining of the probe is calculated according to the external force of the probe and system inertia, system damping parameter, and makes institute
It states probe and keeps the rate of straining to keep constant-force contact preset time to completing to test with electronic component surface to be measured.
2. the PCB electronic component test method according to claim 1 based on oscillograph probe, which is characterized in that drive
It moves described pop one's head in and is moved to the top of electronic component to be measured in space, comprising:
Described pop one's head in is driven to move to the top of electronic component to be measured in space by the output end of Three-axis drive mechanism, and
The posture of probe described in the rotation axial adjustment being arranged on output end by the Three-axis drive mechanism.
3. the PCB electronic component test method according to claim 2 based on oscillograph probe, which is characterized in that
The height and position of probe described in real-time detection when driving the probe downlink, and adjust with this downstream rate of probe.
4. the PCB electronic component test method according to claim 3 based on oscillograph probe, which is characterized in that
During driving the probe to be down to electronic component surface to be measured with pre-set velocity, the probe is made to be maintained at velocity interval
In 0.1~0.5mm/s.
5. the PCB electronic component test method according to claim 4 based on oscillograph probe, which is characterized in that logical
The force snesor real-time detection that the probe tip is set external force suffered by it is crossed, and outer using its detected value as the probe
Power.
6. the PCB electronic component test method according to claim 5 based on oscillograph probe, which is characterized in that meter
After the rate of straining for calculating the probe, the probe is made to keep the rate of straining to keep with electronic component surface to be measured
10~15s.
7. the PCB electronic component test method according to claim 1-6 based on oscillograph probe, feature
It is, the rate of straining of the probe is calculated according to the external force of the probe and system inertia, system damping parameter, it is specific to wrap
It includes:
Pass through formula:
Calculate the rate of straining of the probe；
Wherein, M is system inertia parameter, and B is system damping parameter, and x is the physical location of the probe, and f is the probe
External force,For the rate of straining of probe,It is f to the first derivative of t.
8. a kind of PCB electronic component test macro based on oscillograph probe characterized by comprising
First drive module is moved to the top of electronic component to be measured for driving to pop one's head in space；
Second drive module is in contact with it for driving the probe to be down to electronic component surface to be measured with pre-set velocity；
External force detection module, for when the probe starts to contact with electronic component surface to be measured real-time detection it is outer suffered by it
Power；
Constant force control module, for calculating the probe according to external force and system inertia, the system damping parameter of the probe
Rate of straining, and the probe is made to keep the rate of straining to keep constant-force contact default with electronic component surface to be measured
Time is to completing to test.
9. the PCB electronic component test macro according to claim 8 based on oscillograph probe, which is characterized in that also
Include:
Height detection module for its height and position of real-time detection when the probe starts downlink, and adjusts the spy with this
The downstream rate of head.
10. the PCB electronic component test macro according to claim 9 based on oscillograph probe, which is characterized in that institute
State the first drive module include for drive it is described pop one's head in the Three-axis drive mechanism that move in space be set to three axis
Rotary shaft on the output end of driving mechanism, for adjusting the probe posture.
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Application publication date: 20190806 |