CN110083016A - Photoresist liquid supply device and photoresist liquid replenishing method - Google Patents
Photoresist liquid supply device and photoresist liquid replenishing method Download PDFInfo
- Publication number
- CN110083016A CN110083016A CN201910303493.9A CN201910303493A CN110083016A CN 110083016 A CN110083016 A CN 110083016A CN 201910303493 A CN201910303493 A CN 201910303493A CN 110083016 A CN110083016 A CN 110083016A
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- Prior art keywords
- photoresist
- vacuum pump
- circulation loop
- bubble
- replenishing
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 240
- 239000007788 liquid Substances 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000001914 filtration Methods 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 8
- 239000010703 silicon Substances 0.000 claims abstract description 8
- 239000007921 spray Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 42
- 239000006260 foam Substances 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 7
- 238000002360 preparation method Methods 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 37
- 238000010586 diagram Methods 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000004090 dissolution Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 238000004064 recycling Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001311 chemical methods and process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000001802 infusion Methods 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000009469 supplementation Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002101 nanobubble Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
Abstract
The invention is related to a kind of photoresist liquid supply device and photoresist liquid replenishing method, wherein the photoresist liquid supply device includes: replenishing line, is used for transmission photoresist to nozzle, sprays for the nozzle；Vacuum pump, input terminal and output end pass through two sections of connecting lines respectively and are connected to the replenishing line, replenishing line between the vacuum pump, two sections of connecting lines and two sections of connecting lines constitutes a circulation loop, and the vacuum pump is for making photoresist in the circulation loop internal circulation flow；Temperature controller is arranged on the circulation loop, for controlling the temperature for flowing through the photoresist of the circulation loop；Filter is installed to the vacuum pump, for filtering out the bubble in the photoresist for flowing through the vacuum pump.The photoresist liquid supply device and photoresist liquid replenishing method can reduce the bubble in photoresist, and the uniform film thickness of the photoresist film formed when photoresist being made to be sprayed onto silicon polished surface can greatly reduce the defects of wafer preparation process.
Description
Technical field
The present invention relates to wafer production fields, and in particular to a kind of photoresist liquid supply device and photoresist liquid replenishing method.
Background technique
In semicon industry lithographic process technique, it is very crucial that the photoresist film of uniform thickness is applied out on wafer
A technology.
In the prior art, when carrying out jet-coating photoresit, the thickness degree that always will appear photoresist film is different, uneven
It is even, cause final wafer processing procedure defect occur, leverages the yield of the wafer of final output.
Summary of the invention
The purpose of the present invention is to provide a kind of photoresist liquid supply device and photoresist liquid replenishing methods, can be in fluid infusion process
Bubble in middle removal photoresist reduces the generation of processing procedure defect, improves the good of wafer photolithography to improve the uniformity of film thickness
Rate.
In order to solve the above-mentioned technical problems, the present invention provides a kind of photoresist liquid supply devices, comprising: replenishing line is used
In transmission photoresist to nozzle, sprayed for the nozzle；Vacuum pump, input terminal and output end pass through two sections of connecting lines respectively and connect
The replenishing line is passed to, the replenishing line between the vacuum pump, two sections of connecting lines and two sections of connecting lines constitutes one
Circulation loop, the vacuum pump is for making photoresist in the circulation loop internal circulation flow；Temperature controller is arranged in the circulation
On circuit, for controlling the temperature for flowing through the photoresist of the circulation loop；Filter is installed to the vacuum pump, for filtering
Except the bubble in the photoresist for flowing through the vacuum pump.
Optionally, the temperature controller includes: header tank, for holding water for heating；Heater strip, installation are catchmented to described
Case, for heating the water for heating held in the header tank；The circulation loop passes through the header tank.
Optionally, the temperature controller control flows through the temperature of the photoresist of the circulation loop are as follows: heating flows through described follow
The photoresist of loop back path.
Optionally, further includes: air-foam detector is installed to the vacuum pump, for detecting whether there is the bubble being filtered out.
Optionally, further includes: controller is connected to the vacuum pump, temperature controller and air-foam detector, for obtaining bubble
Testing result controls the working condition of the temperature controller and the working condition of the control vacuum pump.
Optionally, further includes: gas exhaust piping is connected to the vacuum pump, and is connected to the controller, for described
Under the control of controller, when the air-foam detector, which detects, has the bubble being filtered out in the vacuum pump, the mistake is discharged
The bubble that filter filters out.
Optionally, further includes: temperature sensor is connected to the controller, and is set in the circulation loop, is used for
Detect the temperature of the photoresist flowed in the circulation loop, and the temperature that the controller is detected according to the temperature sensor
Degree controls the working condition of the temperature controller.
In order to solve the above-mentioned technical problem, the present invention also provides a kind of photoresist liquid replenishing methods, comprising the following steps: will
Photoresist is pumped into the replenishing line；Photoresist is filtered and is heated；Photoresist after filtering and heating is delivered to
Nozzle is sprayed for the nozzle.
Optionally, further comprising the steps of before photoresist being pumped into the replenishing line: to evacuate transmission photoresist
Gas in replenishing line.
Optionally, the input terminal of a vacuum pump and output end pass through two sections of connecting lines respectively and are connected to the liquid supplementation pipe
Road, the replenishing line between the vacuum pump, two sections of connecting lines and two sections of connecting lines constitutes a circulation loop, to light
When photoresist is filtered and heats, make photoresist in the circulation loop internal circulation flow using the vacuum pump, with realization pair
The circulating filtration of photoresist and heating.
Optionally, a temperature controller is arranged on the circulation loop, heats to photoresist.
Optionally, a filter is installed to the vacuum pump, is filtered to photoresist.
Optionally, an air-foam detector installs the bubble for detecting whether to be filtered out to the vacuum pump, and is detecting
When having the bubble being filtered out, the bubble being filtered out is discharged.
Optionally, photoresist is measured in the number of the circulation loop internal circulation flow, until the number is greater than one in advance
If threshold value.
Optionally, the photoresist after filtering and heating is delivered to nozzle, further includes following step after being sprayed for the nozzle
Rapid: detect the spraying of nozzle as a result, check the film thickness for the photoresist film that the silicon polished surface being sprayed-on is formed, in the light
When the difference of height of photoresist film is greater than a preset value, continue to carry out circulating filtration and heating to photoresist.
Photoresist liquid supply device and photoresist liquid replenishing method of the invention is pumped photoresist to nozzle, photoetching using vacuum pump
Glue flows into the replenishing line under the action of negative-pressure adsorption, reduces the dissolution rate of gas in photoresist, is fundamentally subtracting
Bubble formation in few photoresist.
It, can also be by heating photoresist also, due to being provided with temperature controller and filter on circulation loop
It reduces gas dissolution rate in the photoresist and filters out the method for bubble to reduce the generation of bubble, and heat energy after photoresist
The viscosity number of the photoresist is enough reduced, is floated convenient for bubbling polymerization, moreover it is possible to increase the movement velocity of molecule in photoresist, molecule
Between slide over each other and be easier, and increase intermolecular spacing, make intermolecular mutual reduced gravity, reach and more multi-solvent is precipitated
In gas molecule purpose.
And it is possible to by recycling the photoresist in the circulation loop repeatedly, to guarantee bubble in photoresist
Amount reduce to meeting the requirements, in this way, the bubble in the photoresist being ejected greatly reduces, when being sprayed onto silicon polished surface
The uniform film thickness of the photoresist film of formation can greatly reduce the defects of wafer preparation process.Use the photoresist fluid infusion
Device and photoresist liquid replenishing method can also save human cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of photoresist liquid supply device in a kind of specific embodiment of the invention.
Fig. 2 is the structural schematic diagram of temperature controller in a kind of specific embodiment of the invention.
Fig. 3 is the connection relationship diagram of controller in a kind of specific embodiment of the invention.
Fig. 4 is the flow diagram of photoresist liquid replenishing method in a kind of specific embodiment of the invention.
Specific embodiment
A kind of photoresist liquid supply device proposed by the present invention and photoresist are mended below in conjunction with the drawings and specific embodiments
Liquid method is described in further detail.
The study found that during coating photoresist film, if inhibiting, reducing or removing the bubble in photoresist, packet
Micro-nano bubble is included, then can substantially improve the uniformity of the photoresist film film thickness eventually formed, reduce the generation of processing procedure defect, mention
The yield of the wafer of high final output.
Referring to Fig. 1, for the structural schematic diagram of photoresist liquid supply device in a kind of specific embodiment of the invention.
In this specific embodiment, a kind of photoresist liquid supply device is provided, comprising: replenishing line 100 is used for transmission
Photoresist is sprayed to nozzle 105 for the nozzle 105；Vacuum pump 101, input terminal 1011 and output end 1012 pass through two respectively
Section connecting line 103 is connected to the replenishing line 100,101, two sections of connecting lines 103 of the vacuum pump and two sections of connections
Replenishing line 100 between pipeline constitutes a circulation loop 109, and the vacuum pump 101 is for being recycled back to photoresist described
109 internal circulation flow of road；Temperature controller 102 is arranged on the circulation loop 109, flows through the circulation loop 109 for controlling
Photoresist temperature；Filter 104 is installed to the vacuum pump 101, for filtering out the photoetching for flowing through the vacuum pump 101
Bubble in glue.
The replenishing line 100 is connected to photoresist source 108.Due to using vacuum pump 101 that photoresist is pumped into the benefit
Liquid pipeline 100, therefore photoresist is that the replenishing line 100 is flowed under the action of negative-pressure adsorption, be can reduce in this way
The dissolution rate of gas in photoresist is fundamentally reducing the bubble in photoresist.And due to being provided with temperature on circulation loop 109
Device 102 and filter 104 are controlled, therefore the dissolution rate of heating photoresist reduction gas in the photoresist and filter can also be passed through
The method of bubble removing reduces the generation of bubble, and can be by recycling the photoresist in the circulation loop 109
Repeatedly, guarantee that the amount of bubble in photoresist is reduced to meeting the requirements, in this way, the bubble in the photoresist being ejected subtracts significantly
Few, the uniform film thickness of the photoresist film formed when being sprayed onto silicon polished surface can greatly be reduced in wafer preparation process
Defect.
In a specific embodiment, the replenishing line 100 is preferably the corrosion resistant replenishing line 100 of inner wall, institute
The material for stating connecting line 103 should be identical as the material of the replenishing line 100, and the inner wall of the connecting line 103
It is corrosion-resistant.In fact, the material for preparing of the replenishing line 100 and connecting line 103 can not also be identical.By being applied in inner wall
When covering corrosion resistance of the etch-proof material to realize inner wall, the replenishing line 100 and the selected painting of connecting line 103
Material can also be different.
In a specific embodiment, replenishing line 100 and connecting line 103 are prepared using corrosion-resistant material, such as
Using glass reinforced plastic, stainless steel etc., corrosion resistant coating can also be used, the replenishing line 100 and connecting line 103 are coated to
Inner wall, guarantee that the inner wall of the replenishing line 100 and connecting line 103 is corrosion-resistant.
In a specific embodiment, corrosion resistant coating include epoxy anticorrosion coating, grease paint, raw lacquer and
Modified raw lacquer emulsion paint etc..Indeed, it is possible to as needed the material to replenishing line 100 and connecting line 103 or coating into
Row selection.
In a specific embodiment, the vacuum pump 101 refer to using machinery, physics, chemically or physically chemistry
Method is to the device or equipment for being evacuated and being obtained vacuum by pumping container.For popular, vacuum pump 101 is existed with various methods
Improve in a certain enclosure space, the device of generation and maintenance vacuum.When vacuum pump 101 is in running order, the replenishing line
100 and connecting line 103 in air pressure be less than the atmospheric pressure of external environment, in this way, photoresist is pressed into the liquid supplementation pipe
Road 100 can also be pressed into the connecting line 103.
In a specific embodiment, the vacuum pump 101 is at least one in gas trapping pump and gas transmission pump
Kind.In fact, the specific structure of the vacuum pump 101 can be set as needed.
Referring to Fig. 2, for the structural schematic diagram of temperature controller 102 in a kind of specific embodiment of the invention.It is specific at this
In embodiment, the temperature controller 102 includes: header tank 1021, for holding water for heating；Heater strip 1022, installation to institute
Header tank 1021 is stated, for heating the water for heating held in the header tank 1021；The circulation loop 109 passes through the collection
Water tank 1021.When the temperature controller 102 controls the temperature of the photoresist flowed in circulation loop 109, actually heat
The photoresist flowed in circulation loop 109.
By heating photoresist, so that the meltage of gas is reduced in photoresist, the Bubble in photoresist.This be because
For, as the temperature rises, the solubility of gas gradually decreases in photoresist, therefore before low temperature when photoresist in the gas that dissolves
Know from experience as temperature is to increase and be precipitated.Also, the viscosity number that can reduce the photoresist after heating photoresist, is convenient for bubble
Polymerization is floated, moreover it is possible to increase the movement velocity of molecule in photoresist, intermolecular slide over each other is easier, and increases intermolecular
Away from, make intermolecular mutual reduced gravity, achieve the purpose that be precipitated more multi-solvent in gas molecule.
In fact, the specific structure of the temperature controller 102 can be set as needed, it such as can be directly by the heater strip 1022
Twine the outer surface for the either segment pipeline being tied in circulation loop 109, and using the heater strip 1022 to flowing through described be recycled back to
The photoresist on road 109 is heated.
In a specific embodiment, it before photoresist to be pumped into the replenishing line 100, begins to using described
Temperature controller 102 heats the replenishing line 100.
In a specific embodiment, it is provided with valve on the replenishing line 100, to control in circulation loop
The photoresist flowed in 109 will not flow out the circulation loop 109, consequently facilitating realizing the circulating filtration to photoresist and adding
Heat.
Specifically, two positions that the connecting line is connected to replenishing line 100 are arranged in the valve, prevent from recycling
In photoresist be detached from the circulation loop 109.
Since the vacuum pump 101 is on the circulation loop 109, the photoresist can be in the circulation loop
109 internal circulation flows.More since the filter 104 is also installed on the vacuum pump 101, followed in the vacuum pump 101 extraction
When photoresist in loop back path 109, the photoresist for flowing through the vacuum pump 101 also passes through the filter 104, is the filtering
Device 104 is filtered, to filter out the bubble in the photoresist.
In a specific embodiment, can be come by the way that sufficiently large cycle-index is arranged so that being recycled back to described in
Road 109 flows out in the photoresist of nozzle 105 almost without bubble.In such manner, it is possible to guarantee the photoetching sprayed from the nozzle 105
The quality of glue prevents the photoresist for causing to spray because of the bubble in photoresist uneven in silicon polished upper film forming, influences subsequent
Technique.
In a specific embodiment, cycle-index of the photoresist in the circulation loop 109 is greater than 100
It is secondary.The number of circulation is more, and the amount of the bubble in photoresist is fewer, but the number recycled is more, time-consuming also longer, therefore is setting
When setting the number of circulation, need to determine according to actual needs.
In a specific embodiment, light is filled up in the vacuum pump 101, filter 104 and replenishing line 100
When photoresist, just start the cycle over.
In a specific embodiment, the photoresist liquid supply device further include: controller 301 is connected to described true
Sky pump 101, for controlling the working condition of the vacuum pump 101.Exist in fact, the controller 301 is also used to control setting
The working condition of valve on the replenishing line 100.In use, the controller 301 controls the light valve door shutdown, protects
It demonstrate,proves the photoresist only to flow in the circulation loop 109, photoresist is just via the nozzle 105 when preventing from not completing circulation
It sprays.The controller 301 is also used to control the working condition of the vacuum pump 101, so that photoresist is in the circulation loop
109 internal circulation flows.
In a specific embodiment, the controller 301 includes microcontroller 301, single-chip microcontroller and Programmadle logic
At least one of device.In fact, the specific structure of the controller 301 can be arranged as needed.
In a specific embodiment, the controller 301 is additionally coupled to the temperature controller 102, described for controlling
The working condition of temperature controller 102, including the control temperature controller 102 are heated or not heated.
In a specific embodiment, the photoresist liquid supply device further includes a temperature sensor 302, is connected to institute
Controller 301 is stated, and is set in the circulation loop 109, for detecting the photoresist flowed in the circulation loop 109
Temperature, and the controller 301 controls the work of the temperature controller 102 according to the temperature that the temperature sensor 302 detects
State is maintained at the temperature of photoresist in one preset range consequently facilitating the temperature to photoresist controls.
In a specific embodiment, the photoresist is being controlled in 109 internal circulation flow of circulation loop, the control
Device 301 processed controls the temperature controller 102 and the temperature of the photoresist is heated to 25 DEG C to 30 DEG C.In the temperature sensor
302 when detecting that the temperature of photoresist is higher than 30 DEG C, and the controller 301, which controls the temperature controller 102, to be stopped to photoresist
Heating, to realize temperature control.
Referring to Fig. 3, for the connection relationship diagram of controller 301 in a kind of specific embodiment of the invention.At this
In specific embodiment, the photoresist liquid supply device further include: air-foam detector 303, installation to the vacuum pump 101 are used
In the bubble for detecting whether to be filtered out.In a specific embodiment, the air-foam detector 303 is ultrasonic bubble inspection
Device 303 is surveyed, whether can measure in the vacuum pump 101 has the bubble being filtered out.Indeed, it is possible to be set as needed described
The specific structure of air-foam detector 303.
In a specific embodiment, it is provided with a catch basin 106 before the entrance of the vacuum pump 101, and it is described true
101 connection of sky pump, for placing the photoresist flowed through to the vacuum pump 101, to be filtered to the photoresist.It is described
Filter 104 is set to the catch basin 106 with before the entrance of the vacuum pump 101, flow to the vacuum pump 101 for making
Bubble in photoresist can be filtered out.
At this point, the air-foam detector 303 is also disposed in the catch basin 106.In a specific embodiment, institute
State controller 301 and be connected to the air-foam detector 303, obtain bubble testing result, and according to the bubble testing result into
The corresponding control of row.
In fact, the filter 104 can also be arranged in as needed in the pump housing of the vacuum pump 101.Due to pump
Body can be used filter 104 that the pump housing is separated into two sections with a constant volume, make to be pumped dynamic light by the vacuum pump 101
Photoresist has to also achieve the purpose that filtering in this way by the filter 104.
In a specific embodiment, the photoresist liquid supply device further include: gas exhaust piping 107 is connected to described
Vacuum pump 101 specifically, being connected to the catch basin 106, and is connected to the controller 301.The gas exhaust piping 107 is used
Under the control in the controller 301, detects to have in the catch basin 106 in the air-foam detector 303 and be filtered out
When bubble, the bubble that the filter 104 filters out is discharged.
In a specific embodiment, the gas exhaust piping 107 is also connected to a negative pressure adsorption equipment, by the negative pressure
Adsorbent equipment is that the gas exhaust piping 107 provides negative pressure, enables the gas exhaust piping 107 by the gas in the catch basin 106
Bubble is sucked out.The controller 301 is to the control that the control of the gas exhaust piping 107 is to the negative pressure adsorption equipment.
In a specific embodiment, the negative pressure adsorption equipment is also a vacuum pump.
Referring to FIG. 1 to FIG. 4, wherein Fig. 4 be a kind of specific embodiment of the invention in photoresist liquid replenishing method stream
Journey schematic diagram.In this specific embodiment, a kind of photoresist liquid replenishing method is provided, comprising the following steps: S41 is by photoresist
It is pumped into the replenishing line 100；S42 is filtered and heats to photoresist；S43 conveys the photoresist after filtering and heating
To nozzle 105, sprayed for the nozzle 105.
Since photoresist is to be drawn into the replenishing line 100, the dissolution rate of gas in photoresist can reduce,
Fundamentally reduce the bubble in photoresist.And due to being heated and having been filtered to photoresist, gas in photoresist can be reduced
Meltage, part bubble is precipitated, and filters out the bubble in photoresist.In this way, the bubble in the photoresist being ejected subtracts significantly
Few, the uniform film thickness of the photoresist film formed when being sprayed onto silicon polished surface can greatly be reduced in wafer preparation process
Defect.
It in a specific embodiment, further include following step before photoresist being pumped into the replenishing line 100
It is rapid: to evacuate the gas in the replenishing line 100 of transmission photoresist.It can prevent from transmitting light in the replenishing line 100 in this way
There are also gases to circulate in photoresist during photoresist, leads to the generation of bubble.
In a specific embodiment, photoresist is pumped into the replenishing line 100 and is evacuated transmission photoresist
Replenishing line 100 in gas be all to be carried out by vacuum pump 101.
In a specific embodiment, the vacuum pump 101 refer to using machinery, physics, chemically or physically chemistry
Method is to the device or equipment for being evacuated and being obtained vacuum by pumping container.For popular, vacuum pump 101 is existed with various methods
Improve in a certain enclosure space, the device of generation and maintenance vacuum.When vacuum pump 101 is in running order, the replenishing line
100 and connecting line 103 in air pressure be lower than the atmospheric pressure of external environment, photoresist can be pressed into described by extraneous atmospheric pressure
Replenishing line 100.
In a specific embodiment, the vacuum pump 101 is at least one in gas trapping pump and gas transmission pump
Kind.In fact, the specific structure of the vacuum pump 101 can be set as needed.
In a specific embodiment, the input terminal 1011 of a vacuum pump 101 and output end 1012 pass through two sections respectively
Connecting line 103 is connected to the replenishing line 100,101, two sections of connecting lines 103 of the vacuum pump and two sections of connecting tubes
Replenishing line 100 between road 103 constitutes a circulation loop 109, when being filtered and heating to photoresist, using described true
Sky pump 101 makes photoresist in 109 internal circulation flow of circulation loop, to realize circulating filtration and the heating to photoresist.
By recycling photoresist in the circulation loop 109 repeatedly, come guarantee the amount of bubble in photoresist reduce to
It meets the requirements.In a specific embodiment, cycle-index of the photoresist in the circulation loop 109 is greater than 100
It is secondary.The number of circulation is more, and the amount of the bubble in photoresist is fewer, but the number recycled is more, time-consuming also longer, therefore is setting
When setting the number of circulation, need to determine according to actual needs.
In a specific embodiment, a temperature controller 102 is arranged on the circulation loop 109, carries out to photoresist
Heating.By heating photoresist, so that the meltage of gas is reduced in photoresist, the Bubble in photoresist.This is because
As the temperature rises, the solubility of gas gradually decreases in photoresist, thus before low temperature when photoresist in the gas that dissolves
It can be to increase and be precipitated with temperature.
In a specific embodiment, the temperature controller 102 includes header tank 1021, for holding water for heating, institute
Stating photoresist liquid supply device further includes heater strip 1022, is installed to the header tank 1021, for heating the header tank 1021
The water for heating inside held.
By heating photoresist, so that the meltage of gas is reduced in photoresist, the Bubble in photoresist.This be because
For, as the temperature rises, the solubility of gas gradually decreases in photoresist, therefore before low temperature when photoresist in the gas that dissolves
Know from experience as temperature is to increase and be precipitated.Also, the viscosity number that can reduce the photoresist after heating photoresist, is convenient for bubble
Polymerization is floated, moreover it is possible to increase the movement velocity of molecule in photoresist, intermolecular slide over each other is easier, and increases intermolecular
Away from, make intermolecular mutual reduced gravity, achieve the purpose that be precipitated more multi-solvent in gas molecule.
In fact, the specific structure of the temperature controller 102 can be set as needed, it such as can be directly by the heater strip 1022
The outer surface for the either segment pipeline being tied in the circulation loop 109 is twined, and using the heater strip 1022 to circulation loop 109
Interior photoresist is heated.
In a specific embodiment, the photoresist is heated to 25 DEG C to 30 DEG C by the temperature controller 102, so that
Bubble can be parsed from photoresist.When the temperature sensor 302 detects the temperature of photoresist higher than 30 DEG C, control
The temperature controller 102 stops the heating to photoresist, to realize temperature control.
In a specific embodiment, as the temperature rises, the solubility of gas in the photoresist gradually decreases.It can
Determining that gas after temperature corresponding to the minimum point of solubility, determines the temperature controller 102 by the photoetching in the photoresist
The temperature that glue is heated to.
In a specific embodiment, it is provided with temperature sensor 302 in the circulation loop 109, for detecting
State the temperature of the photoresist flowed in circulation loop 109.The temperature for the photoresist that can be detected according to the temperature sensor 302
Degree, to control heating of the temperature controller 102 to the photoresist.
In a specific embodiment, a filter 104 installation is filtered photoresist to the vacuum pump 101.
In a specific embodiment, an air-foam detector 303 installation is to the vacuum pump 101, detected whether by
The bubble filtered out, and when detecting the bubble being filtered out, the bubble being filtered out is discharged.Specifically, using gas exhaust piping 107
The bubble being filtered out is discharged.
In a specific embodiment, it is provided with a catch basin 106 before the entrance of the vacuum pump 101, and it is described true
101 connection of sky pump, for placing the photoresist flowed through to the vacuum pump 101, to be filtered to the photoresist.It is described
Filter 104 is set to the catch basin 106 with before the entrance of the vacuum pump 101, flow to the vacuum pump 101 for making
Photoresist all has to pass through the filter 104, to guarantee the filter effect to the bubble in photoresist.
In this specific embodiment, the air-foam detector 303 is set in the catch basin 106, monitors catch basin
Whether there is bubble in 106, to accordingly be controlled according to bubble testing result, that is, the bubble being filtered out is discharged.
In a specific embodiment, photoresist is measured in the number of 109 internal circulation flow of circulation loop, until
The number is greater than a preset threshold.Specifically, controlling the photoresist in the circulation loop 109 by a controller 301
Interior cycle-index, so as to control the photoresist by the number of circulating filtration and heating, to guarantee the number foot of filtering
Enough, the temperature of heating is also enough, guarantees that bubble is filtered out by filter 104, is heated to the effect being precipitated by temperature controller 102.
In a specific embodiment, it is provided with valve on the replenishing line 100, for making the photoresist exist
It is constantly circulated in circulation loop 109, without being flowed out via the nozzle 105, to realize the circulating-heating to photoresist.
Specifically, two positions that the connecting line is connected to replenishing line 100 are arranged in the valve, prevent from recycling
In photoresist be detached from the circulation loop 109.
In this specific embodiment, the controller 301 is also used to control the valve being arranged on the replenishing line 100
The working condition of door.In use, the controller 301 controls the valve shutdown, guarantees that the photoresist is only followed described
Flowing in loop back path 109, photoresist is just sprayed via the nozzle 105 when preventing from not completing circulation.The controller 301 is also used
In the working condition for controlling the vacuum pump 101, so that photoresist is in 109 internal circulation flow of circulation loop.
In a specific embodiment, the photoresist after filtering and heating is delivered to nozzle 105, for the nozzle
105 spray after, it is further comprising the steps of: detection nozzle 105 spraying as a result, checking that the silicon polished surface being sprayed-on is formed
Photoresist film film thickness, the photoresist film difference of height be greater than a preset value when, continue to be circulated throughout photoresist
Filter and heating.The step of subsequent survey is arranged, when guaranteeing finally to spray to crystal column surface to be processed, photoresist is formed by
Non-uniform state will not be presented due to the bubble in photoresist in photoresist film.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (15)
1. a kind of photoresist liquid supply device characterized by comprising
Replenishing line is used for transmission photoresist to nozzle, sprays for the nozzle；
Vacuum pump, input terminal and output end pass through two sections of connecting lines respectively and are connected to the replenishing line, the vacuum pump, two
Replenishing line between section connecting line and two sections of connecting lines constitutes a circulation loop, and the vacuum pump is for making photoresist
In the circulation loop internal circulation flow；
Temperature controller is arranged on the circulation loop, for controlling the temperature for flowing through the photoresist of the circulation loop；
Filter is installed to the vacuum pump, for filtering out the bubble in the photoresist for flowing through the vacuum pump.
2. photoresist liquid supply device according to claim 1, which is characterized in that the temperature controller includes: header tank, is used for
Hold water for heating；
Heater strip is installed to the header tank, for heating the water for heating held in the header tank；
The circulation loop passes through the header tank.
3. photoresist liquid supply device according to claim 1, which is characterized in that the temperature controller control flows through the circulation
The temperature of the photoresist in circuit are as follows:
Heating flows through the photoresist of the circulation loop.
4. photoresist liquid supply device according to claim 1, which is characterized in that further include:
Air-foam detector is installed to the vacuum pump, for detecting whether there is the bubble being filtered out.
5. photoresist liquid supply device according to claim 4, which is characterized in that further include:
Controller is connected to the vacuum pump, temperature controller and air-foam detector, for obtaining bubble testing result, described in control
The working condition of temperature controller and the working condition of the control vacuum pump.
6. photoresist liquid supply device according to claim 5, which is characterized in that further include:
Gas exhaust piping is connected to the vacuum pump, and is connected to the controller, under the control of the controller,
The air-foam detector detects when having the bubble being filtered out in the vacuum pump, and the bubble that the filter filters out is discharged.
7. photoresist liquid supply device according to claim 5, which is characterized in that further include:
Temperature sensor is connected to the controller, and is set in the circulation loop, for detecting in the circulation loop
The temperature of the photoresist of flowing, and the controller controls the temperature controller according to the temperature that the temperature sensor detects
Working condition.
8. a kind of photoresist liquid replenishing method, which comprises the following steps:
Photoresist is pumped into the replenishing line；
Photoresist is filtered and is heated；
Photoresist after filtering and heating is delivered to nozzle, is sprayed for the nozzle.
9. photoresist liquid replenishing method according to claim 8, which is characterized in that photoresist to be pumped into the replenishing line
Before, further comprising the steps of:
Evacuate the gas in the replenishing line of transmission photoresist.
10. photoresist liquid replenishing method according to claim 8, which is characterized in that the input terminal and output end of a vacuum pump
The replenishing line, the vacuum pump, two sections of connecting lines and two sections of connecting tubes are connected to by two sections of connecting lines respectively
Replenishing line between road, which constitutes a circulation loop, makes light using the vacuum pump when being filtered and heating to photoresist
Photoresist is in the circulation loop internal circulation flow, to realize circulating filtration and the heating to photoresist.
11. photoresist liquid replenishing method according to claim 10, which is characterized in that temperature controller setting is recycled back to described
On the road, photoresist is heated.
12. photoresist liquid replenishing method according to claim 10, which is characterized in that a filter is installed to the vacuum
Pump, is filtered photoresist.
13. photoresist liquid replenishing method according to claim 10, which is characterized in that an air-foam detector is installed to described true
Sky pump, detects whether the bubble being filtered out, and when detecting the bubble being filtered out, the bubble being filtered out is discharged.
14. photoresist liquid replenishing method according to claim 10, which is characterized in that metering photoresist is in the circulation loop
The number of internal circulation flow, until the number is greater than a preset threshold.
15. photoresist liquid replenishing method according to claim 8, which is characterized in that the photoresist after filtering and heating is defeated
It send to nozzle, further comprising the steps of after being sprayed for the nozzle:
Detect the spraying of nozzle as a result, the film thickness for the photoresist film that the silicon polished surface that is sprayed-on is formed is checked, described
When the difference of height of photoresist film is greater than a preset value, continue to carry out circulating filtration and heating to photoresist.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910303493.9A CN110083016A (en) | 2019-04-16 | 2019-04-16 | Photoresist liquid supply device and photoresist liquid replenishing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910303493.9A CN110083016A (en) | 2019-04-16 | 2019-04-16 | Photoresist liquid supply device and photoresist liquid replenishing method |
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| CN201910303493.9A Pending CN110083016A (en) | 2019-04-16 | 2019-04-16 | Photoresist liquid supply device and photoresist liquid replenishing method |
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| CN112454173A (en) * | 2020-11-02 | 2021-03-09 | 杭州白绝科技有限公司 | Semiconductor substrate polishing solution compensation device for high-end manufacturing |
| WO2021162869A1 (en) * | 2020-02-12 | 2021-08-19 | Tokyo Electron Limited | Vacuum assisted filtration |
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Effective date of registration: 20230720 Address after: 223001 Room 318, Building 6, east of Zhenda Steel Pipe Company, south of Qianjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Applicant after: Huaian Xide Industrial Design Co.,Ltd. Address before: 223300 no.599, East Changjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Applicant before: HUAIAN IMAGING DEVICE MANUFACTURER Corp. |
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