CN110081915A - Magnetic-type linear encoder - Google Patents
Magnetic-type linear encoder Download PDFInfo
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- CN110081915A CN110081915A CN201910031299.XA CN201910031299A CN110081915A CN 110081915 A CN110081915 A CN 110081915A CN 201910031299 A CN201910031299 A CN 201910031299A CN 110081915 A CN110081915 A CN 110081915A
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- circuit board
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- base plate
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/244—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains
- G01D5/245—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains using a variable number of pulses in a train
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Abstract
A kind of magnetic-type linear encoder, is able to achieve the slimming of head.In magnetic-type linear encoder, since the circuit board (60) in from the beginning (11) guides to external distribution component (12) as flexible wiring substrate (40), it is able to achieve the slimming of head (11).Due to being equipped with amplifying circuit (69) in circuit board, even if being output to the outside signal by flexible wiring substrate (40), it is also not easy the problems such as forming signal decaying.In head (11), the wiring from sensor base plate (30) to circuit board (60) is implemented by flexible wiring substrate.It is consequently adapted to for head (11) being further thinned.In addition, by in Part III (48) folded flexible wiring substrate, it can be used single substrate as flexible wiring substrate, the single substrate is the single substrate that first electrode (49), second electrode (44) and the third electrode (45) connecting with the first terminal (36) of sensor base plate are arranged at single-face side.
Description
Technical field
The present invention relates to the magnetic-type linear encoders for drawing distribution component from the head with Magnetosensing element flexiblely.
Background technique
Configured with the magnet sensor arrangement with Magnetosensing element, magnet sensor arrangement and direction in magnetic-type linear encoder
The magnetic scale that one direction extends is opposite.Magnet sensor arrangement includes: the head with Magnetosensing element；And from the beginning match to what outside was drawn
Line component, distribution component are formed (referring to patent document 1) by the cable to extend out from circuit board of the configuration in head.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2006-84410 bulletin
Summary of the invention
The technical problems to be solved by the invention
Although it is required that the magnet sensor arrangement recorded in patent document 1 etc. is thinned, in structure described in Patent Document 1
In, due to needing the Inside To Outside outgoing cable from retainer, the slimming of head is difficult.
In view of the above problems, technical problem of the invention is that the magnetic-type for providing a kind of slimming that can be realized head is linear
Encoder.
For solving the technical solution of technical problem
In order to solve the above-mentioned technical problem, magnetic-type linear encoder of the invention includes: magnetic scale, the magnetic scale direction first
Direction extends；And magnet sensor arrangement, the magnet sensor arrangement have a head and flexible distribution component, the head have with
The opposite Magnetosensing element of the magnetic scale, the distribution component is from the head output signal, the feature of the magnetic-type linear encoder
It is, the head includes sensor base plate, and the sensor base plate is equipped with the Magnetosensing element and first terminal；Rigidity
Circuit board, the circuit board are equipped with amplifying circuit, Second terminal and the third end for amplifying the output signal of the Magnetosensing element
Son；And the first flexible wiring substrate, the described first flexible wiring substrate are connect with the third terminal, and as the wiring
Component is drawn out to the outside of the head.
In the present invention, from the beginning in circuit board to be drawn out to external distribution component be the first flexible wiring substrate, therefore
It can be realized the slimming of head.Also, due to being equipped with amplifying circuit in circuit board, even if passing through the first flexible wiring substrate
The problems such as being output to the outside signal, being not easy to produce signal decaying.It therefore, also can be suitably even if realizing the slimming of head
Enforcing location detection etc..
In the present invention, such embodiment can be used: the head is described with extending to from the sensor base plate
Circuit board and the second flexible wiring substrate being connect with the first terminal and the Second terminal.According to the embodiment, fit
In head is further thinned.
In the present invention, such embodiment can be used: the described first flexible wiring substrate and second flexibility are matched
Line substrate is by one piece of flexible wiring base extending from the sensor base plate via the outside that the circuit board is re-directed towards the head
Plate is formed.According to the embodiment, the cost of magnetic-type linear encoder can reduce.
In the present invention, such embodiment can be used: the sensor base plate and the circuit board are in the head
It is configured opposite to each other in short transverse, is equipped with the second end in the circuit board and the face of the sensor base plate opposite side
The sub and described third terminal, the flexibility wiring substrate include first part, the first part from the sensor base plate
One end of connection extends to the first direction；Second part, the second part is relative to the circuit board and the biography
The opposite side of sensor substrate and the circuit board are opposite, and extend to the first direction；And Part III, the third
Part folds deviously, and the first part is connect with the second part, in the single-face side of the flexible wiring substrate
Equipped with being connected with the first electrode of the first terminal, be connected with the second electrode of the Second terminal and be connected with described
The third electrode of three terminals.According to the embodiment, first electrode, second electrode and third electrode can be used to be arranged on single side
The single substrate of side is as flexible wiring substrate.Also, due to being the structure of folded flexible wiring substrate in a thickness direction, because
This is capable of the width of constriction head.
In the present invention, such embodiment can be used: the circuit board is that circuit element is assembled in by the biography
The double-sided substrate in the face of the side of sensor substrate.
In the present invention, such embodiment can be used: the magnetic-type linear encoder, which has, supports the sensor
The retainer of substrate and the circuit board, the retainer have configuration between the sensor base plate and the circuit board
Supporting board, the sensor base plate is fixed on the retainer with the state Chong Die with the one side of the supporting board, described
Circuit board is fixed on the retainer with the state Chong Die with the another side of the supporting board.According to the embodiment, due to
It is in a thickness direction that sensor base plate is Chong Die with circuit board, therefore it is capable of the floor space of constriction head, so as to realize head
Miniaturization.
In the present invention, such embodiment can be used: Chong Die with the supporting board not on the circuit board
Part assemble the circuit element.According to the embodiment, circuit board can not suitably be matched with being influenced by circuit element
It is set to Chong Die with supporting board.
In the present invention, such embodiment can be used: the face where the supporting board on the circuit board
It is equipped with the circuit element, does not assemble the circuit element in Chong Die with the Second terminal 50% or more region, and not
The circuit element is assembled in Chong Die with the third terminal 50% or more region.According to the embodiment, electricity can be utilized
The nonoverlapping part of circuit element in the terminal (Second terminal and third terminal) of road plate is implemented between flexible wiring substrate
Connection.It therefore, can be real from two surface sides of circuit board and flexible wiring substrate when circuit board to be connect with flexible wiring substrate
Apply heat, pressurization, therefore can reliably and efficiently connect circuit board with flexible wiring substrate.
In the present invention, such embodiment can be used: the retainer have with the short transverse and described
Opposite two side walls, the supporting board are connected with described two side walls in the orthogonal second direction of first direction.According to this
Embodiment can be reinforced retainer by supporting board, therefore can be done side wall thin.Thereby, it is possible to realize the small of head
Type.
In the present invention, such embodiment can be used: the retainer is equipped in the side of the short transverse
The opening portion Chong Die with the Magnetosensing element, in the outer surface side of the retainer, the opening portion is surrounded by recess portion, described
Shield member in recess portion equipped with plate or sheet.According to the embodiment, noise bring can be reduced by shield member
It influences.Further, it is possible to prevent shield member from substantially protruding in a thickness direction, it is consequently adapted to the slimming of head.
In the present invention, such embodiment can be used: being equipped with the first positioning reference plane and second in the retainer
Positioning reference plane, first positioning reference plane limit the position when head is fixed, second positioning reference plane
It is set in parallel with first positioning reference plane, and is limited to the position when sensor base plate to be fixed on to the retainer
It sets.According to the embodiment, sensor base plate can be configured to when retainer is fixed on equipment parallel with magnetic scale.
In the present invention, such embodiment can be used: the first terminal, the Second terminal and the third end
Son is connect by anisotropic conductive material with the flexible wiring substrate.According to the embodiment, even if small for head
Type and in the case where constriction terminal spacing, can also be appropriately carried out electrical connection.
In the present invention, such embodiment can be used: the magnetic scale has rigid substrates and magnetic coating film, the magnetic
Property film is the layer that magnetic powder is mixed in resin, and is formed in the one side of the rigid substrates, by the magnetic coating film structure
The permanent magnet being alternately arranged at the pole S and the pole N.It can be improved compared with the situation for using ferro-gum etc. according to the embodiment
The flatness of permanent magnet.
In the present invention, such embodiment can be used: in the magnetic scale, the pole S and the pole N are in said first direction
The magnetic track being alternately arranged two column arranged side by side it is arranged, the Magnetosensing element is the magnetic resistance member that magnetic resistance pattern is laminated in a thickness direction
Part.According to the embodiment, it is capable of the width of constriction magnetic scale and head.Also, even if also can in the case where the width of constriction head
Enough ensure to be arranged the space of the Z phase magnetic resistance pattern of origin position detection.
(invention effect)
In the present invention, from the beginning in circuit board to guide to external distribution component be the first flexible wiring substrate, therefore energy
Enough slimmings for realizing head.Also, due to being equipped with amplifying circuit on circuit boards, even if passing through the first flexible wiring substrate
The problems such as implementing to export to external signal, also not easily leading to signal decaying.Therefore, even if realizing the slimming of head, also can
It is appropriately carried out position detection etc..
Detailed description of the invention
Fig. 1 is the perspective view that magnet sensor arrangement of the invention is applied from the other side of short transverse.
Fig. 2 is the perspective view from the unilateral observation magnet sensor arrangement shown in FIG. 1 of short transverse.
Fig. 3 is the cross-sectional view of magnet sensor arrangement shown in FIG. 1.
Fig. 4 is the exploded perspective view of the magnet sensor arrangement shown in FIG. 1 from the other side of short transverse.
Fig. 5 is the exploded perspective view from the unilateral observation magnet sensor arrangement shown in FIG. 1 of short transverse.
Fig. 6 is the exploded perspective view after separating flexible wiring substrate and sensor base plate etc. from state shown in Fig. 4.
Fig. 7 is the exploded perspective view after separating flexible wiring substrate and sensor base plate etc. from state shown in fig. 5.
Fig. 8 is the top view of the circuit board shown in Fig. 6 etc. from the other side of short transverse.
Fig. 9 is the explanatory diagram for showing the configuration of the bonding agent in magnet sensor arrangement shown in FIG. 1.
Figure 10 is the explanatory diagram of magnetic scale shown in FIG. 1 etc..
Figure 11 is the explanatory diagram of the magnetic resistance pattern of Magnetosensing element shown in Fig. 10.
Description of symbols
1 ... magnetic-type linear encoder, 10 ... magnet sensor arrangements, 11 ... heads, 12 ... distribution components, 20 ... retainers,
21 ... the first side walls, 22 ... second sidewalls, 23 ... third side walls, 24 ... the 4th side walls, 25 ... bottom walls, 26 ... supporting boards,
27 ... opening portions, 30 ... sensor base plates, 36 ... first terminals, 38 ... Magnetosensing elements, 40 ... flexible wiring substrates, 41 ... one
End, 42 ... the other ends, 44 ... second electrodes, 45 ... third electrodes, 46 ... first parts, 47 ... second parts, 48 ... third portions
Point, 49 ... first electrodes, 50 ... outer covers, 51 ... end plates, 52,53 ... side plates, 60 ... circuit boards, 64 ... Second terminals,
65 ... third terminals, 66 ... circuit elements, 70 ... shield members, 90 ... magnetic scales, 91 ... first bonding agents, 92 ... second bondings
Agent, 93 ... third bonding agents, 94 ... the 4th bonding agents, 95 ... the 5th bonding agents, 96 ... the 6th bonding agents, 97 ... the 7th bondings
Agent, 222 ... gaps, 280 ... second positioning reference planes, 290 ... first positioning reference planes, 380 ... magnetoresistive elements, 471,472 ...
Flexible sheets, 901 ... permanent magnets, 902 ... magnetic coating films, 903 ... rigid substrates, X ... first direction, Y ... second direction, H ... are high
Spend direction.
Specific embodiment
Referring to attached drawing, the magnet sensor arrangement for applying of the invention is illustrated.In addition, in the figure of following institute's reference
In, using the length direction of retainer 20 as first direction X, with the width direction orthogonal with length direction (first direction X) for the
Two direction Y, using the direction orthogonal with length direction (first direction X) and width direction (second direction Y) as height direction H.
(overall structure of magnet sensor arrangement 10)
Fig. 1 is the perspective view that magnet sensor arrangement 10 of the invention is applied from the other side H2 of height direction H.Figure
2 for the magnet sensor arrangement 10 shown in FIG. 1 from the side H1 of height direction H perspective view.Fig. 3 is magnetic shown in FIG. 1 biography
The cross-sectional view of sensor arrangement 10.Fig. 4 divides for magnet sensor arrangement 10 shown in FIG. 1 from the other side H2 of height direction H
Solve perspective view.Fig. 5 is the exploded perspective view of the magnet sensor arrangement 10 shown in FIG. 1 from the side H1 of height direction H.Fig. 6
For the exploded perspective view after separating flexible wiring substrate 40 and sensor base plate 30 etc. from state shown in Fig. 4.Fig. 7 is from figure
State shown in 5 flexible wiring substrate 40 and sensor base plate 30 etc. are separated after state exploded perspective view.
Magnet sensor arrangement 10 shown in FIG. 1 is used as detection lathe together with magnetic scale 90 or assembles the movable workbench of device
Distance, position magnetic-type linear encoder 1.In magnetic scale 90, the pole N is alternately arranged at a specific interval with the pole S.In the magnetic-type
In linear encoder 1, the side in magnet sensor arrangement 10 and magnetic scale 90 is installed in fixed body, and another party is installed in moving body.
Magnet sensor arrangement 10 includes the head 11 opposite with magnetic-type linear encoder 1；And from the beginning 11 interior draw and
The flexible distribution component 12 extended on first direction X.
As shown in Figures 2 to 7, magnet sensor arrangement 10 includes retainer 20；Configure the sensing in the inside of retainer 20
Device substrate 30；The outer cover 50 of retainer 20 is fixed in a manner of covering sensor base plate 30 from the other side H2 of height direction H；
It is configured at the circuit board 60 of the rigidity between outer cover 50 and sensor base plate 30；And to close the opening portion 27 of retainer 20
The fixed shield member 70 of mode.
Magnet sensor arrangement 10 includes the first flexibility wiring substrate 40a, the first flexibility wiring substrate 40a and head 11
Interior circuit board 60 connects, and the outside of retainer 20 is introduced to as distribution component 12；And the second flexible wiring substrate
40b, the second flexibility wiring substrate 40b extend to circuit board 60 from sensor base plate 30, and with sensor base plate 30 and electricity
Road plate 60 connects.In the present embodiment, the first flexibility wiring substrate 40a and the second flexibility wiring substrate 40b is by from sensor
Substrate 30 is formed via one piece of flexible wiring substrate 40 that the outside that circuit board 60 is re-directed towards first 11 extends.
Retainer 20 is formed by nonmagnetic metal parts such as aluminium, stainless steel etc., and includes the first side wall 21；Second side
Wall 22, the side X1 of X and the first side wall 21 are opposite in a first direction for the second sidewall 22；And bottom wall 25, the bottom wall 25
It is set between the first side wall 21 and second sidewall 22 in the side H1 of height direction H.On the first direction X of retainer 20
Other side X2 is formed with opening portion 27.
Retainer 20 includes third side wall 23, the third side wall 23 second direction Y side Y1 by the first side wall 21
It is connect with second sidewall 22；And the 4th side wall 24, other side Y2 and third side wall of the 4th side wall 24 in second direction Y
23 is opposite, and the first side wall 21 is connect with second sidewall 22.The size of the height direction H of third side wall 23 and the 4th side wall 24
It is shorter than the first side wall 21 and second sidewall 22.The company of general triangular is formed between third side wall 23 and the first side wall 21
Socket part 230 is formed with the interconnecting piece 240 of general triangular between the 4th side wall 24 and the first side wall 21.In second sidewall 22
Height direction H the end of other side H2 and the center portion of the extending direction of second sidewall 22 be formed with recess portion 221.
It is formed between outer cover 50 and sensor base plate 30 in the inside of retainer 20 by third side wall 23 and the 4th side
The supporting board 26 that wall 24 connects, supporting board 26 and circuit board 60 are opposite.Therefore, can reinforce keeping by supporting board 26
Frame 20 is thin so as to do side wall.It is suitable for the miniaturization of head 11 as a result,.
Bottom wall 25 is formed only in the side X1 of first direction X, the height of the first side wall 21, third side wall 23 and the 4th side wall 24
The end for spending the side H1 of direction H becomes the opening edge of opening portion 27.Being formed in the outer surface side of bottom wall 25 makes opening portion 27
Peripheral recesses recess portion 28,27 complete cycle of opening portion surrounded by recess portion 28.
In the present embodiment, it is formed with hole 291 in the end 29 of the other side X2 of the first direction X of retainer 20, it should
Hole 291 is used to be fixed on equipment for first 11 by screw etc..In end 29, the face of the other side H2 of height direction H, which becomes, to be limited
First positioning reference plane 290 of position when enemy 11 is fixed.The bottom of recess portion 28 is parallel with the first positioning reference plane 290
Ground setting, and become the second positioning reference plane 280 for limiting position when sensor base plate 30 to be fixed on to retainer 20.Cause
This can configure in parallel sensor base plate 30 and magnetic scale 90 when being fixed on equipment for first 11 by retainer 20.
The one of the sensor base plate 30 for configuring one side 31 towards opening portion 27 between opening portion 27 and supporting board 26
31 side of face, Magnetosensing element 38 and multiple first terminals 36 are arranged on second direction Y and are formed, and Magnetosensing element 38 is formed in and opens
The region that oral area 27 is overlapped.In the present embodiment, Magnetosensing element 38 be magnetoresistive element 380, as referring to Fig.1 0 it is aftermentioned, magnetic
Resistance element 380 includes the A phase magnetic resistance pattern and B phase magnetic resistance pattern of the unlike signal of output two differences, 90 ° of phases.
Circuit board 60 is configured at supporting board 26 in the opposite mode of the another side 32 of its one side 61 and sensor base plate 30
Between outer cover 50.Circuit board 60 is to be assembled with multiple circuit elements 66 in one side 61 and be formed with multiple second in another side 62
The double-sided substrate of terminal 64 and multiple third terminals 65.Multiple Second terminals 64 and multiple third terminals 65 are respective in a first direction
Two separated regions arrange on second direction Y and are formed on X.Be formed through in circuit board 60 circuit element 66 amplification from
The amplifying circuit 69 of output signal etc. that sensor base plate 30 exports.
Outer cover 50 includes end plate 51, the another side 32 and circuit board 60 of the end plate 51 and sensor base plate 30
Another side 62 it is opposite；And side plate 52,53, the both ends of second direction Y of the side plate 52,53 from end plate 51 to
The side H1 of height direction H is prominent.End plate 51 is fixed on the first side wall 21, second sidewall 22, third side wall 23 and the 4th side
The end of the other side H2 of the height direction H of wall 24.In this state, by recess portion 221 in outer cover 50 and second sidewall 22
Between formed gap 222.
Flexible wiring substrate 40 in the state in which: one end 41 is connect with sensor base plate 30, and midway portion is via electricity
Road plate 60, the other end 42 are drawn towards the outside of retainer 20.More specifically, flexible wiring substrate 40 includes first
Divide 46, other side X2 of the first part 46 from one end 41 to first direction X extends；Second part 47, the second part
47 between the end plate 51 and circuit board 60 of outer cover 50 with the another of the another side 32 and circuit board 60 with sensor base plate 30
62 opposite modes extend from the other side X2 of first direction X to side X1 on one side；And Part III 48, the Part III
48 are bent along the first side wall 21, and connect end and the second part 47 of the other side X2 of the first direction X of first part 46
The end of the other side X2 of first direction X.In the present embodiment, flexible wiring substrate 40 is by from one end 41 to the other end 42
One piece of substrate is formed.
Flexible wiring substrate 40 is single substrate, and is formed with first electrode in the face 43 for the inside for being located at Part III 48
49, second electrode 44 and third electrode 45, first terminal of the first electrode 49 in first part 46 and sensor base plate 30
36 connections, the second electrode 44 are connected with the Second terminal 64 of circuit board 60 in second part 47, and the third electrode 45 exists
Second part 47 is connected with the third terminal 65 of circuit board 60.Reinforcement is pasted in the second part 47 of flexible wiring substrate 40 to use
Flexible sheets 471,472, be located on the extending direction of second part 47 of the flexible sheets 471,472 in flexible wiring substrate 40
It is formed with the two sides of 45 this side of second electrode 44 and third electrode.Therefore, can be improved in flexible wiring substrate 40
The rigidity of linearly extended second part 47 on one direction X.
Shield member 70 is nonmagnetic plate-shaped member or the sheet components such as aluminium, copper, and configures the appearance in bottom wall 25
The recess portion 28 of surface side, thus closed peristome 27.Therefore, can reduce noise bring by shield member 70 influences.Also,
Can prevent shield member 70 from substantially protruding in thickness direction (height direction H) from retainer 20, be thereby adapted for first 11 it is thin
Type.
(connection between sensor base plate 30 and circuit board 60 and flexible wiring substrate 40)
Fig. 8 is the top view of the circuit board 60 shown in Fig. 6 etc. from the other side H2 of height direction H.In Fig. 6 and Fig. 7
In, when manufacturing magnet sensor arrangement 10, the state that flexible wiring substrate 40 is unfolded, by the first end of sensor base plate 30
The first electrode of son 36, the third terminal 65 of the Second terminal 64 of circuit board 60 and circuit board 60 and flexible wiring substrate 40
49, second electrode 44 and third electrode 45 connect.At this point, in the anisotropy that conducting particles is dispersed to thermosetting resin
Implement hot pressing in the state that conductive material configuration is between flexible wiring substrate 40 and circuit board 60, and consolidates thermosetting resin
It is cooled down after change.Also, it configures in the anisotropic conductive material that conducting particles is dispersed to thermosetting resin in flexibility
Implement hot pressing in the state of between wiring substrate 40 and sensor base plate 30, and is cooled down after solidifying thermosetting resin.
Therefore, even if can also be appropriately carried out electrical connection in the miniaturization for first 11 in the case where constriction terminal spacing.
In the present embodiment, in first electrode 49, second electrode 44, third electrode 45, first terminal 36, Second terminal
64 and the surface of third terminal 65 be formed with soldering-tin layer, conducting particles is fusing point a scolding tin particle more much lower than soldering-tin layer.Cause
This, in hot pressing, soldering-tin layer is not melted, and scolding tin pellet melting, to implement to be electrically connected.Resin material uses epoxylite
Equal heat reactive resins.Certain metals in scolding tin particle containing tin and copper, silver, bismuth, antimony, indium in these, such as existed by fusing point
The solder of 200 DEG C of low melting points below is formed.Soldering-tin layer is for example formed by tin-copper class solder, and fusing point is about 230 DEG C.Weldering
Tin layers can also be the solder of tin-silver-copper class or Sn-Bi class in addition to tin-copper class solder.
As shown in figure 8, not assembled in Chong Die with Second terminal 64 50% or more region in the one side 61 of circuit board 60
Circuit element 66, and not Chong Die with third terminal 65 50% or more region assembly circuit element 66.That is, in circuit board 60
On one side in 61, circuit element 66 is Chong Die with a part of Second terminal 64 and third terminal 65, but circuit element 66 is overlapped
Part is less than the 50% of Second terminal 64 and third terminal 65, further less than 20%.
It therefore, can be using 66 institute of circuit element in the terminal (Second terminal 64 and third terminal 65) of circuit board 60 not
Part 64a, 65a (grey parts in Second terminal 64 and third terminal 65 shown in Fig. 8) of overlapping implement flexible wiring base
The connection of plate 40 and circuit board 60.Therefore, circuit board 60 and flexible wiring substrate 40 are being connected by anisotropic conductive material
When connecing, it can heat or pressurize from two surface sides of circuit board 60 and flexible wiring substrate 40 to implement, therefore can be reliable and high
Circuit board 60 is connect by effect ground with flexible wiring substrate 40.
In 61 side of one side of circuit board 60, electricity is not assembled in the region Chong Die with the supporting board 26 of retainer 20 when looking down
Circuit component 66.Therefore, circuit board 60 can not be appropriately configured to and 26 weight of supporting board with being influenced by circuit element 66
It is folded.
(bonded structure in magnet sensor arrangement 10)
Fig. 9 is the explanatory diagram for showing the configuration of the bonding agent in magnet sensor arrangement 10 shown in FIG. 1, and is shown than
The position of three side walls 23 in the inner part carries out the appearance after cutting.
In the process of manufacture magnet sensor arrangement 10, sensor base plate 30 and circuit board 60 are being connected to flexible wiring
After substrate 40, flexible wiring substrate 40 is bent on one side, on one side as shown in Figure 9 configures flexible wiring substrate 40 in retainer 20
Inside.In the outer surface side of bottom wall 25, in a manner of closed peristome 27, shield member 70 is configured in the inside of recess portion 28.
In this state, by first bonding agents 91, by flexible wiring substrate 40 first part 46 and Part III
The first side wall 21 of retainer 20 is fixed in part between 48.Therefore, even if vibration is passed to magnet sensor arrangement 10, also not
Be also easy to produce flexible wiring substrate 40 leads to the situation of broken string in the movement of the inside of retainer 20 with the friction of retainer 20.Even if making
The slimming that magnet sensor arrangement 10 is realized with flexible wiring substrate 40, can also ensure that higher reliability.
In the inside of retainer 20, using the second bonding agents 92 being made of material identical with first bonding agents 91,
The edge fixed mask component 70 of the opening portion 27 of retainer 20.Therefore, even if the spare space in retainer 20 is narrow, also without
It need to be distinguished in first bonding agents 91 and second bonding agents 92 and use bonding agent.In the present embodiment, second bonding agents are utilized
92 fix shield member complete cycle.Therefore, it is not easy to generate gap between shield member 70 and retainer 20, so that dust etc. is no
The inside of retainer 20 is easily entered from opening portion 27.
Here, first bonding agents 91 and second bonding agents 92 are the soft bonding agent of rubber.Therefore, even if environment temperature
Variation, causes first bonding agents 91 to generate expansion or shrinkage, which can also be absorbed by the elasticity of first bonding agents 91.
Therefore, the stress transfer for being able to suppress the expansion or shrinkage of first bonding agents 91 leads to Magnetosensing element 38 to sensor base plate 30
Magnetic characteristic variation.First bonding agents 91 and second bonding agents 92 are heat-curable adhesive.Therefore, first bonding agents 91 and second
The viscosity of bonding agent 92 is lower, to be easy to smear first bonding agents 91 and second bonding agents 92 in narrow gap.For example,
Hardness after the solidification of first bonding agents 91 and second bonding agents 92 is for example in the range of shore D30 to shore D60.
Also, sensor base plate 30 is temporarily fixed on retainer 20 using the third bonding agent 93 of UV (ultraviolet) curability
Afterwards, then to sensor base plate 30 position adjustment is carried out, is later consolidated sensor base plate 30 using heat cured 4th bonding agent 94
Due to retainer 20.In the present embodiment, sensor base plate 30 is temporarily fixed on retainer 20 using third bonding agent 93
Supporting board 26 after, then 30 enforcing location of sensor base plate is adjusted, later using the 4th bonding agent 94 by sensor base plate
30 are fixed on the supporting board 26 of retainer 20.Hardness after the solidification of 4th bonding agent 94 is for example in shore D60 to shore D90
In the range of.
Also, circuit board 60 is fixed on retainer 20 using the 5th bonding agent 95 of rapid-drying properties.In the present embodiment,
Circuit board 60 is fixed on supporting board 26 using the 5th bonding agent 95.Therefore, flexible wiring substrate 40 is able to maintain in third
Circuit board 60 is fixed on retainer 20 by curved state at part 48.
Next, outer cover 50 is covered in retainer 20.At this point, the second part 47 of flexible wiring substrate 40 be in by from
The state that gap 222 between the second sidewall 22 and outer cover 50 of retainer 20 extracts.In the present embodiment, the 6th is utilized
Outer cover 50 is fixed on retainer 20 by bonding agent 96.Recycle the 7th soft bonding agent 97 by the second of flexible wiring substrate 40
Part 47 is fixed together with second sidewall 22.Therefore, in flexible wiring substrate 40, even if drawing from outside to from retainer 20
Part applied force out is not easy to produce the flexible scratch of wiring substrate 40 and the situation of broken string etc..6th bonding agent 96 is consolidated
Hardness after change is for example in the range of shore D60 to shore D90.7th bonding agent 97 is the soft bonding agent of rubber, firmly
Six bonding agent 96 of Du Bi is low.Hardness after the solidification of 7th bonding agent 97 is for example in the range of shore D30 to shore D60.
7th bonding agent 97 is, for example, the bonding agent of moisture through the air and cured normal temperature cured type.
(structure of magnetic scale 90 and Magnetosensing element 38)
Figure 10 is the explanatory diagram of magnetic scale 90 shown in FIG. 1 etc., shows in Figure 10: schematically illustrating saying for the section of magnetic scale 90
The explanatory diagram (b) of plan positional relationship between bright figure (a), expression magnetic scale 90 and Magnetosensing element 38.Figure 11 is sense shown in Fig. 10
The explanatory diagram of the magnetic resistance pattern of magnetic cell 38 is shown in Figure 11: schematically illustrate the section of Magnetosensing element 38 explanatory diagram (a),
Indicate the explanatory diagram (b) of the magnetic resistance pattern of Magnetosensing element 38.
As shown in (a) of Figure 10, magnetic scale 90 includes the rigid substrates such as metal plate 903；And it is formed in the one of rigid substrates
The magnetic coating film 902 in face.Magnetic coating film 902 is the layer that magnetic powder is mixed in resin, and constitutes permanent magnetism by magnetic coating film 902
Iron 901.It grinds after magnetic coating film 902 is set to rigid substrates 903, then to the surface of magnetic coating film 902, then leads to
It crosses magnetization and forms the permanent magnet 901.Therefore, compared with the situation for using ferro-gum etc., it can be improved the flatness of permanent magnet.
As shown in (b) of Figure 10, in permanent magnet 901, magnetic track that the pole S and the pole N are alternately arranged on X in a first direction
901A, 901B two column arranged side by side ground setting, and the side being formed between the Magnetosensing element 38 of sensor base plate 30 and magnetic track 901A, 901B
Boundary overlappingly configures.
As shown in (a) of Figure 11, in the present embodiment, Magnetosensing element 38 is that magnetic resistance has been laminated in sensor base plate 30
The structure of pattern 38.More specifically, in sensor base plate 30, Magnetosensing element 38 is that SIN+ has been laminated across insulating film 39
The magnetic resistance pattern 38 (+b) of magnetic resistance pattern 38 (+a) and COS+ and the magnetic resistance figure that SIN- has been laminated across insulating film 39
The structure of the magnetic resistance pattern 38 (- b) of case 38 (- a) and COS-.In the present embodiment, the magnetic resistance pattern 38 (+a) of SIN+
Same layer, the magnetic resistance pattern 38 (+b) of COS+ and the magnetic resistance pattern of SIN- are formed in the magnetic resistance pattern 38 (- b) of COS-
38 (- a) are formed in same layer.
Here, assign the A phase magnetic resistance pattern 38 (+a) of SIN has each other with the B phase magnetic resistance pattern 38 (+b) for assigning COS
90 ° of phase differences, the A phase magnetic resistance pattern 38 (- a) for assigning SIN have 90 ° of phases with the B phase magnetic resistance pattern 38 (- b) for assigning COS each other
Potential difference.A phase magnetic resistance pattern 38 (+a) and magnetic resistance pattern 38 (- a) have 180 ° of phase differences, B phase magnetic resistance pattern 38 (+b) and magnetic resistance
Pattern 38 (- b) has 180 ° of phase differences.
According to the embodiment, in magnetic scale 90 and sensor base plate 30, the broad-ruler in the region of Magnetosensing element 38 is formed
Very little (size of second direction Y) constriction.Therefore, it can be realized first 11 miniaturization.Due to the shape in sensor base plate 30
At width dimensions (size of the second direction Y) constriction in the region of Magnetosensing element 38, therefore can be in width direction (second
Direction Y) on adjacent with Magnetosensing element 38 region setting origin detection Z phase magnetic resistance pattern.
(main effect of present embodiment)
As described above, in the magnetic-type linear encoder 1 of present embodiment, from the beginning the circuit board 60 in 11 guides to outside
Distribution component 12 be flexible wiring substrate 40, therefore can be realized first 11 slimming.Due to being equipped with amplification in circuit board 60
Circuit 69, therefore even if being output to the outside signal by flexible wiring substrate 40, also it is not easy the problems such as forming signal decaying.Cause
This also can accurately enforcing location detection etc. even if realizing the slimming of head 11.From sensor base plate 30 to circuit board in first 11
By flexible wiring substrate 40 come wiring between 60.Therefore, it is suitable for first 11 further slimmings.Due to being matched by one piece of flexibility
Line substrate 40 is implemented from sensor base plate 30 to the wiring of circuit board 60 or to external wiring, therefore it is linear to can reduce magnetic-type
The cost of encoder 1.
By the way that flexible wiring substrate 40 is folded in Part III 48, be able to use first electrode 49, second electrode 44 and
Third electrode 45 is arranged on the single substrate of single-face side as flexible wiring substrate 40.Therefore, it can reduce magnetic-type linearly to compile
The cost of code device.It, being capable of constriction head 11 due to being the structure folded in a thickness direction to flexible wiring substrate 40
Width.
Sensor base plate 30 and circuit board 60 is Chong Die with the opposite side of supporting board 26 of retainer 20 respectively.Cause
This, is capable of the floor space of constriction head 11, and can be realized first 11 miniaturization.
(other embodiments)
In the above-described embodiment, one side 61 and Second terminal 64 and third terminal 65 of the circuit element 66 in circuit board 60
A part overlapping, but if using the not embodiment party Chong Die with Second terminal 64 and third terminal 65 completely of circuit element 66
Formula, then can be by the whole connection being used between flexible wiring substrate 40 of Second terminal 64 and third terminal 65.
In the above-described embodiment, the first flexibility wiring substrate 40a and the second flexibility wiring substrate 40b are matched by one piece of flexibility
The formation of line substrate 40, but the flexibility of the first flexibility wiring substrate 40a and second wiring substrate 40b can also be by the flexible wiring base that separates
Plate is constituted.In this case, third electrode 45 is configured to the first flexible wiring substrate 40a to the other end 42, and first electrode 49 arrives
Second electrode 44 is configured to the second flexible wiring substrate 40b.
Claims (16)
1. a kind of magnetic-type linear encoder, comprising:
Magnetic scale, the magnetic scale extend in a first direction；And
Magnet sensor arrangement, the magnet sensor arrangement have the distribution component of head and flexibility, and the head has and the magnetic scale
Opposite Magnetosensing element, the distribution component from the head output signal,
The magnetic-type linear encoder is characterized in that,
The head includes
Sensor base plate, the sensor base plate are equipped with the Magnetosensing element and first terminal；
The circuit board of rigidity, the circuit board are equipped with the amplifying circuit of output signal of the amplification from the Magnetosensing element, the
Two-terminal and third terminal；And
First flexible wiring substrate, the described first flexible wiring substrate are connect with the third terminal, and as the wiring part
Part is drawn out to the outside of the head.
2. magnetic-type linear encoder according to claim 1, which is characterized in that
The head has the second flexible wiring substrate, and the described second flexible wiring substrate extends to described from the sensor base plate
Circuit board, and connect with the first terminal and the Second terminal.
3. magnetic-type linear encoder according to claim 2, which is characterized in that
Described first flexible wiring substrate and the second flexible wiring substrate are formed by one piece of flexible wiring substrate,
The flexibility wiring substrate extends via the circuit board to the outside of the head from the sensor base plate.
4. magnetic-type linear encoder according to claim 3, which is characterized in that
The sensor base plate configures in the short transverse of the head opposite to each other with the circuit board,
It is equipped with the Second terminal and the third terminal in the circuit board and the face of the sensor base plate opposite side,
The flexibility wiring substrate includes
First part, the first part extend from the one end connecting with the sensor base plate to the first direction；
Second part, the second part is in the side opposite with the sensor base plate relative to the circuit board and the electricity
Road plate is opposite, and extends towards the first direction；And
Part III, the Part III are folded deviously, and the first part is connect with the second part,
It is equipped in the single-face side of the flexible wiring substrate: being connected with the first electrode of the first terminal；It is connected with described
The second electrode of two-terminal；And it is connected with the third electrode of the third terminal.
5. magnetic-type linear encoder according to claim 4, which is characterized in that
The circuit board is the double-sided substrate that circuit element is assembled in the face by the side of the sensor base plate.
6. magnetic-type linear encoder according to claim 5, which is characterized in that
The magnetic-type linear encoder has the retainer supported to the sensor base plate and the circuit board,
The retainer has supporting board of the configuration between the sensor base plate and the circuit board,
The sensor base plate is fixed in the retainer with the state Chong Die with the one side of the supporting board,
The circuit board is fixed in the retainer with the state Chong Die with the another side of the supporting board.
7. magnetic-type linear encoder according to claim 6, which is characterized in that
The circuit element is not assembled in the part Chong Die with the supporting board of the circuit board.
8. magnetic-type linear encoder according to claim 6, which is characterized in that
It is equipped with the circuit element on one side where the supporting board in the circuit board,
The circuit element is not assembled in Chong Die with the Second terminal 50% or more region,
The circuit element is not assembled in Chong Die with the third terminal 50% or more region.
9. magnetic-type linear encoder according to claim 6, which is characterized in that
The retainer has opposite two sides in the second direction orthogonal with the short transverse and the first direction
Wall,
The supporting board is connected with described two side walls.
10. magnetic-type linear encoder according to claim 6, which is characterized in that
The retainer is equipped with the opening portion Chong Die with the Magnetosensing element in the side of the short transverse,
In the outer surface side of the retainer, the opening portion is surrounded by recess portion,
It is equipped with plate or laminar shield member within the recess.
11. magnetic-type linear encoder according to claim 6, which is characterized in that
The retainer is equipped with:
First positioning reference plane, first positioning reference plane limit the position when head is fixed；And
Second positioning reference plane, second positioning reference plane are set in parallel with first positioning reference plane, and limiting will
The sensor base plate is fixed on the position when retainer.
12. according to claim 1 to magnetic-type linear encoder described in any one of 11, which is characterized in that
The first terminal, the Second terminal and the third terminal pass through anisotropic conductive material and the flexible wiring
Substrate connection.
13. magnetic-type linear encoder according to claim 12, which is characterized in that
The magnetic scale has rigid substrates and magnetic coating film,
The magnetic coating film is the layer that magnetic powder is mixed in resin, and the magnetic coating film is formed in the rigid substrates
On one side,
The permanent magnet that the pole S and the pole N are alternately arranged is made of the magnetic coating film.
14. magnetic-type linear encoder according to claim 13, which is characterized in that
In the magnetic scale, the pole S is arranged with the magnetic track that the pole N is alternately arranged in said first direction two column arranged side by side,
The Magnetosensing element is the magnetoresistive element that magnetic resistance pattern has been laminated in a thickness direction.
15. according to claim 1 to magnetic-type linear encoder described in any one of 11, which is characterized in that
The magnetic scale has rigid substrates and magnetic coating film,
The magnetic coating film is the layer of magnetic powder to be mixed in resin, and be formed in the one side of the rigid substrates,
The permanent magnet that the pole S and the pole N are alternately arranged is made of the magnetic coating film.
16. magnetic-type linear encoder according to claim 15, which is characterized in that
In the magnetic scale, the pole S is arranged with the magnetic track that the pole N is alternately arranged in said first direction two column arranged side by side,
The Magnetosensing element is the magnetoresistive element that magnetic resistance pattern has been laminated in a thickness direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018010534A JP7026517B2 (en) | 2018-01-25 | 2018-01-25 | Magnetic linear encoder |
| JP2018-010534 | 2018-01-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110081915A true CN110081915A (en) | 2019-08-02 |
| CN110081915B CN110081915B (en) | 2021-09-14 |
Family
ID=67412983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910031299.XA Active CN110081915B (en) | 2018-01-25 | 2019-01-14 | Magnetic linear encoder |
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| Country | Link |
|---|---|
| JP (1) | JP7026517B2 (en) |
| CN (1) | CN110081915B (en) |
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| US5434602A (en) * | 1992-04-23 | 1995-07-18 | Canon Kabushiki Kaisha | Recording apparatus with magnetic linear encoder |
| JP2004312910A (en) * | 2003-04-09 | 2004-11-04 | Nachi Fujikoshi Corp | Encoder |
| CN1750288A (en) * | 2004-09-17 | 2006-03-22 | 株式会社三协精机制作所 | Magnetoresistive element |
| CN101395450A (en) * | 2006-03-06 | 2009-03-25 | 日本电产三协株式会社 | Magnetic sensor device, magnetic encoder device, and magnetic scale manufacturing method |
| CN102650534A (en) * | 2011-02-22 | 2012-08-29 | 日本电产三协株式会社 | Sensor unit and composite substrate thereof |
| CN103532279A (en) * | 2012-07-06 | 2014-01-22 | 日本电产株式会社 | Base unit, motor and disk drive apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000321093A (en) | 1999-05-10 | 2000-11-24 | Denso Corp | Rotation detecting apparatus |
| US20020190710A1 (en) | 2001-02-13 | 2002-12-19 | Asm Automation Sensorik Messtechnik Gmbh | Magnetic length measuring device |
| JP2006084410A (en) | 2004-09-17 | 2006-03-30 | Nidec Sankyo Corp | Magnetometric sensor |
| JP2009121958A (en) | 2007-11-15 | 2009-06-04 | Mitsuba Corp | Rotary encoder and brushless motor |
-
2018
- 2018-01-25 JP JP2018010534A patent/JP7026517B2/en active Active
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2019
- 2019-01-14 CN CN201910031299.XA patent/CN110081915B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5434602A (en) * | 1992-04-23 | 1995-07-18 | Canon Kabushiki Kaisha | Recording apparatus with magnetic linear encoder |
| JP2004312910A (en) * | 2003-04-09 | 2004-11-04 | Nachi Fujikoshi Corp | Encoder |
| CN1750288A (en) * | 2004-09-17 | 2006-03-22 | 株式会社三协精机制作所 | Magnetoresistive element |
| CN101395450A (en) * | 2006-03-06 | 2009-03-25 | 日本电产三协株式会社 | Magnetic sensor device, magnetic encoder device, and magnetic scale manufacturing method |
| CN102650534A (en) * | 2011-02-22 | 2012-08-29 | 日本电产三协株式会社 | Sensor unit and composite substrate thereof |
| CN103532279A (en) * | 2012-07-06 | 2014-01-22 | 日本电产株式会社 | Base unit, motor and disk drive apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019128276A (en) | 2019-08-01 |
| CN110081915B (en) | 2021-09-14 |
| JP7026517B2 (en) | 2022-02-28 |
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