CN110079764A - A kind of adjustable PVD film plating process of Film color - Google Patents

A kind of adjustable PVD film plating process of Film color Download PDF

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Publication number
CN110079764A
CN110079764A CN201810072302.8A CN201810072302A CN110079764A CN 110079764 A CN110079764 A CN 110079764A CN 201810072302 A CN201810072302 A CN 201810072302A CN 110079764 A CN110079764 A CN 110079764A
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film
plating
adjustable
pvd
layer
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许志
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Fujian Province Huirui Material Science & Technology Co Ltd
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Fujian Province Huirui Material Science & Technology Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0015Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641Nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/081Oxides of aluminium, magnesium or beryllium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/083Oxides of refractory metals or yttrium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/086Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/10Glass or silica
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention discloses a kind of adjustable PVD film plating process of Film color, and described method includes following steps: Step 1: plating metal film layer;Step 2: plating low-index film;Step 3: plating high refractive index layer;Step 4: repeating step 2 and step 3 for several times, the film layer of different colours is obtained.The present invention provides the adjustable PVD film plating process of Film color, pass through different-thickness, different metallic diaphragms and different high low-index films and the plating of the high low-index film of different-thickness, it is adjustable to realize plated film Film color, meets the needs of different product is to different colours, so that PVD plated film can be applied in the field of more color decorations;This method is without using the special gas such as acetylene, and easy to operate, production process safety non-pollution, Film color is bright-coloured, reproducible.

Description

A kind of adjustable PVD film plating process of Film color
Technical field
The present invention relates to PVD coating technique field more particularly to a kind of adjustable PVD film plating process of Film color.
Background technique
PVD, that is, physical vapour deposition (PVD) is deposited using under vacuum conditions by the modes such as evaporating, sputter in product surface each Film layer is planted, in this way available very thin overlay coating, the outstanding advantages for having the fast adhesive force of speed good, PVD coating technique is a kind of coating process of environmental protection simultaneously, therefore more and more wider in the plated film fields application such as dicoration, functionality It is general.
In decorative plated film industry, Film color is a very crucial technical indicator, and PVD decoration film coating belongs to one The main reason for kind optical film, generation color is exactly the interference of light.PVD plated film needs first to select target type, material and gas (nitrogen, oxygen, acetylene, methane, argon gas etc.), determines target and gaseous species, then adjusts gas ratio, dosage, sputtering function The technological parameters such as rate, sputtering time, base material treatment temperature, sputter temperature, sputtering time, prepare color film layer.PVD plated film The gas that is reacted with target of color film layer it is directly related, such as N2、C2H2、CH4、O2, the gas for participating in target reaction is single gas When body, the film layer plated is monotone film layer;When the gas for participating in target reaction is two or more, the film layer plated For compound tone film layer.
Existing PVD coating technique is to realize that multiple color film plating layer generally all needs to use the special gas such as acetylene, methane, is produced There are certain risk in journey, while chamber and target material surface are easy residual carbonaceous gas, need to grow when plating another color film Time cleans target material surface, more troublesome;Furthermore when using two or more reaction gas, it is easy to make because gas is unevenly distributed It is had differences at each plated film color;Therefore, existing PVD plating color film layer process is more complex, produces more dangerous, plated film weight Renaturation is poor, and the prior art could be improved.
Summary of the invention
In view of the above-mentioned problems, passing through metal lining film the present invention provides a kind of adjustable PVD film plating process of Film color Layer and high low-index film, adjust thicknesses of layers, adjust high low-index film intersection construction and high low-index film The plating number of plies etc. realize that PVD plated film Film color is adjustable, meet the color plating demand on different product surface.
In order to solve the above technical problems, the technical scheme adopted by the invention is that: a kind of adjustable PVD plated film of Film color Method, described method includes following steps:
Step 1: plating metal film layer;
Step 2: plating low-index film;
Step 3: plating high refractive index layer;
Step 4: repeating step 2 and step 3 for several times, the film layer of different colours is obtained.
Further, the step 1 plating metal film layer is that will be passed to the coating chamber equipped with metal targets to plated product, It opens pumping vacuum and heating device carries out substrate heating, so that base vacuum reaches 1 × 10-3Pa and reach 80-150 DEG C of work After skill temperature, it is passed through the argon gas of 10-1000sccm to chamber, starts shielding power supply, sputtering power 1-15KW, plated film time are set 10-300S obtains the metallic diaphragm with a thickness of 1-100nm.
Further, the metallic diaphragm be copper (Cu), silver-colored (Ag), aluminium (Al), metallic diaphragms or the ambrose alloy such as chromium (Cr) (NiCu), the alloy film layers such as nickel chromium triangle (NiCr).
Further, the step 2 plating low-index film is that can form incoming be equipped with of the product for having plated metallic diaphragm The target coating chamber of low-index film, heating reach 80-150 DEG C of technological temperature, are passed through process gas to chamber, are arranged Sputtering power 1-15KW, plated film time 1-300S obtain the low-index film with a thickness of 1-100nm.
Further, the low-index film is the film layers such as silica, silicon nitride.
Further, step 3 plating high refractive index layer be will plate incoming be equipped with of product of low-index film can The target coating chamber of high refractive index layer is formed, heating reaches 80-150 DEG C of technological temperature, is passed through process gas to chamber, Sputtering power 1-15KW is set, and plated film time 1-300S obtains the high refractive index layer with a thickness of 1-100nm.
Further, the high refractive index layer be titanium oxide, titanium nitride, zirconium oxide, zirconium nitride, niobium oxide, niobium nitride, The film layers such as zinc oxide, indium oxide, aluminium oxide, iron oxide, chromium oxide, chromium nitride.
Further, the process gas of the height refracting film layer is Ar, N2、O2At least one of, wherein Ar gas stream Amount is 10-1000sccm, N2Gas flow is 10-1000sccm, O2Gas flow is 10-1000sccm.
Further, it is 1-100 times that the step 4, which repeats step 2 and the number of step 3,.
By the above-mentioned description to structure of the invention it is found that compared to the prior art, the present invention has the advantage that
The present invention provides the adjustable PVD film plating process of Film color, passes through different-thickness, different metallic diaphragms and difference High low-index film and different-thickness high low-index film plating, it is adjustable to realize plated film Film color, meets Demand of the different product to different colours, so that PVD plated film can be applied in the field of more color decorations;This method without The special gas such as acetylene need to be used, easy to operate, production process safety non-pollution, Film color is bright-coloured, reproducible.
Detailed description of the invention
The attached drawing constituted part of this application is used to provide further understanding of the present invention, schematic reality of the invention It applies example and its explanation is used to explain the present invention, do not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is a kind of process flow chart of the adjustable PVD film plating process of Film color of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and It is not used in the restriction present invention.
Referring to Fig. 1, the technical program embodiment provides a kind of adjustable PVD film plating process of Film color, the side Method includes the following steps:
S101, Step 1: plating metal film layer opens pumping for the incoming coating chamber equipped with metal targets of plated product Vacuum and heating device carry out substrate heating, so that base vacuum reaches 1 × 10-3Pa and after reaching 80-150 DEG C of technological temperature, It is passed through the argon gas of 10-1000sccm to chamber, starts shielding power supply, sputtering power 1-15KW, plated film time 10-300S are set, Obtain the metallic diaphragm with a thickness of 1-100nm, the metallic diaphragm is copper (Cu), silver-colored (Ag), aluminium (Al), the metal films such as chromium (Cr) The alloy film layers such as layer or ambrose alloy (NiCu), nickel chromium triangle (NiCr);
S102, Step 2: plating low-index film, can form low-refraction for incoming be equipped with of the product for having plated metallic diaphragm The target coating chamber of film layer, heating reach 80-150 DEG C of technological temperature, are passed through process gas to chamber, sputtering power is arranged 1-15KW, plated film time 1-300S, obtain the low-index film with a thickness of 1-100nm, and the low-index film is oxidation The film layers such as silicon, silicon nitride;
S103, Step 3: plating high refractive index layer, can form high folding for incoming be equipped with of the product for having plated low-index film The target coating chamber of rate film layer is penetrated, heating reaches 80-150 DEG C of technological temperature, is passed through process gas, setting sputtering to chamber Power 1-15KW, plated film time 1-300S, obtain the high refractive index layer with a thickness of 1-100nm, and the high refractive index layer is Titanium oxide, titanium nitride, zirconium oxide, zirconium nitride, niobium oxide, niobium nitride, zinc oxide, indium oxide, aluminium oxide, iron oxide, chromium oxide, The film layers such as chromium nitride, the process gas of the height refracting film layer are Ar, N2、O2At least one of, wherein Ar gas flow is 10-1000sccm, N2Gas flow is 10-1000sccm, O2Gas flow is 10-1000sccm;
S104 obtains the film layer of different colours Step 4: repeating step 2 and step 3 for several times, repeats step 2 and step Rapid three number is 1-100 times.
The present invention provides the adjustable PVD film plating process of Film color, passes through different-thickness, different metallic diaphragms and difference High low-index film and different-thickness high low-index film plating, it is adjustable to realize plated film Film color, meets Demand of the different product to different colours, so that PVD plated film can be applied in the field of more color decorations;This method without The special gas such as acetylene need to be used, easy to operate, production process safety non-pollution, Film color is bright-coloured, reproducible.
Embodiment 1
S101, nickel-clad copper metallic diaphragm;
By to the incoming coating chamber equipped with ambrose alloy target of plated product, opens pumping vacuum and heating device carries out substrate and adds Heat, so that base vacuum reaches 1 × 10-3After Pa and technological temperature reach 100 DEG C, it is passed through the argon gas of 500sccm to chamber, starts Shielding power supply is arranged sputtering power 7KW, plated film time 30S, obtains the ambrose alloy film layer with a thickness of 50nm;
S102 plates membranous layer of silicon oxide;
The incoming coating chamber equipped with silicon target of product that ambrose alloy film layer will have been plated, it is logical to chamber after heating reaches 100 DEG C Enter the Ar/O of 600sccm/200sccm2Process gas, is arranged sputtering power 7KW, and plated film time 60S obtains with a thickness of 10nm's Membranous layer of silicon oxide;
S103 plates titanium oxide layer:
The product for having plated membranous layer of silicon oxide is incoming equipped with titanium target material coating chamber, it is logical to chamber after heating reaches 100 DEG C Enter the Ar/O of 300sccm/500sccm2Process gas, is arranged sputtering power 7KW, and plated film time 60S obtains with a thickness of 10nm's Titanium oxide layer;
S104 repeats to plate membranous layer of silicon oxide and titanium oxide layer 2 times, obtains the film layer of blue.
Embodiment 2
S101, nickel-clad copper metallic diaphragm;
By to the incoming coating chamber equipped with ambrose alloy target of plated product, opens pumping vacuum and heating device carries out substrate and adds Heat, so that base vacuum reaches 1 × 10-3After Pa and technological temperature reach 100 DEG C, it is passed through the argon gas of 500sccm to chamber, starts Shielding power supply is arranged sputtering power 7KW, plated film time 30S, obtains the ambrose alloy film layer with a thickness of 50nm;
S102 plates membranous layer of silicon oxide;
The incoming coating chamber equipped with silicon target of product that ambrose alloy film layer will have been plated, it is logical to chamber after heating reaches 100 DEG C Enter the Ar/O of 600sccm/200sccm2Process gas, is arranged sputtering power 7KW, and plated film time 60S obtains with a thickness of 10nm's Membranous layer of silicon oxide;
S103 plates titanium oxide layer:
The product for having plated membranous layer of silicon oxide is incoming equipped with titanium target material coating chamber, it is logical to chamber after heating reaches 100 DEG C Enter the Ar/O of 300sccm/500sccm2Process gas, is arranged sputtering power 7KW, and plated film time 60S obtains with a thickness of 10nm's Titanium oxide layer;
S104 repeats to plate membranous layer of silicon oxide and titanium oxide layer 4 times, obtains the film layer of yellow.
Embodiment 3
S101, nickel-clad copper metallic diaphragm;
By to the incoming coating chamber equipped with ambrose alloy target of plated product, opens pumping vacuum and heating device carries out substrate and adds Heat, so that base vacuum reaches 1 × 10-3After Pa and technological temperature reach 100 DEG C, it is passed through the argon gas of 500sccm to chamber, starts Shielding power supply is arranged sputtering power 7KW, plated film time 30S, obtains the ambrose alloy film layer with a thickness of 50nm;
S102 plates membranous layer of silicon oxide;
The incoming coating chamber equipped with silicon target of product that ambrose alloy film layer will have been plated, it is logical to chamber after heating reaches 100 DEG C Enter the Ar/O of 600sccm/200sccm2Process gas, is arranged sputtering power 7KW, and plated film time 60S obtains with a thickness of 10nm's Membranous layer of silicon oxide;
S103 plates titanium oxide layer:
The product for having plated membranous layer of silicon oxide is incoming equipped with titanium target material coating chamber, it is logical to chamber after heating reaches 100 DEG C Enter the Ar/O of 300sccm/500sccm2Process gas, is arranged sputtering power 7KW, and plated film time 60S obtains with a thickness of 10nm's Titanium oxide layer;
S104 repeats to plate membranous layer of silicon oxide and titanium oxide layer 5 times, obtains the film layer of aubergine.
It can be seen from the above embodiments that, using the same technique, only change the plating of high low-index film Number can realize different colours film layer plating, therefore the adjustable PVD film plating process technique letter of Film color provided by the invention It is single, it is not required to logical special gas, chamber and target and safety will not be polluted, by changing different thicknesses of layers, different metal film layer and not Same height combination of refractive indices can realize all motley coating effects.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.

Claims (9)

1. a kind of adjustable PVD film plating process of Film color, it is characterised in that: described method includes following steps:
Step 1: plating metal film layer;
Step 2: plating low-index film;
Step 3: plating high refractive index layer;
Step 4: repeating step 2 and step 3 for several times, the film layer of different colours is obtained.
2. the adjustable PVD film plating process of a kind of Film color according to claim 1, it is characterised in that: the step 1 plating Metallic diaphragm is that will open pumping vacuum to the incoming coating chamber equipped with metal targets of plated product and heating device carries out substrate Heating, so that base vacuum reaches 1 × 10-3Pa and after reaching 80-150 DEG C of technological temperature, is passed through 10-1000sccm's to chamber Argon gas starts shielding power supply, and sputtering power 1-15KW is arranged, and plated film time 10-300S obtains the metal with a thickness of 1-100nm Film layer.
3. the adjustable PVD film plating process of a kind of Film color according to claim 2, it is characterised in that: the metallic diaphragm For the alloy film layers such as metallic diaphragms or ambrose alloy (NiCu), nickel chromium triangle (NiCr) such as copper (Cu), silver-colored (Ag), aluminium (Al), chromium (Cr).
4. the adjustable PVD film plating process of a kind of Film color according to claim 1, it is characterised in that: the step 2 plating Low-index film is incoming equipped with the target coating chamber that can form low-index film for the product that will have plated metallic diaphragm, adds Heat reaches 80-150 DEG C of technological temperature, is passed through process gas to chamber, sputtering power 1-15KW, plated film time 1- is arranged 300S obtains the low-index film with a thickness of 1-100nm.
5. the adjustable PVD film plating process of a kind of Film color according to claim 4, it is characterised in that: the low-refraction Film layer is the film layers such as silica, silicon nitride.
6. the adjustable PVD film plating process of a kind of Film color according to claim 1, it is characterised in that: the step 3 plating High refractive index layer is that the product for having plated low-index film is incoming equipped with the target plating membrane cavity that can form high refractive index layer Room, heating reach 80-150 DEG C of technological temperature, are passed through process gas to chamber, sputtering power 1-15KW, plated film time is arranged 1-300S obtains the high refractive index layer with a thickness of 1-100nm.
7. the adjustable PVD film plating process of a kind of Film color according to claim 6, it is characterised in that: the high refractive index Film layer be titanium oxide, titanium nitride, zirconium oxide, zirconium nitride, niobium oxide, niobium nitride, zinc oxide, indium oxide, aluminium oxide, iron oxide, The film layers such as chromium oxide, chromium nitride.
8. the adjustable PVD film plating process of a kind of Film color according to claim 6, it is characterised in that: the height refraction The process gas of film layer is Ar, N2、O2At least one of, wherein Ar gas flow is 10-1000sccm, N2Gas flow is 10-1000sccm, O2Gas flow is 10-1000sccm.
9. the adjustable PVD film plating process of a kind of Film color according to claim 1, it is characterised in that: the step quadruple The number of multiple step 2 and step 3 is 1-100 times.
CN201810072302.8A 2018-01-25 2018-01-25 A kind of adjustable PVD film plating process of Film color Pending CN110079764A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
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CN111253081A (en) * 2020-03-20 2020-06-09 山东大学 Colored glass and preparation method thereof
CN112458412A (en) * 2020-09-30 2021-03-09 昆山华冠商标印刷有限公司 Coating process of semitransparent color layer
CN112526781A (en) * 2020-12-09 2021-03-19 浙江日久新材料科技有限公司 Preparation method of light adjusting film with decorative effect
CN116381825A (en) * 2023-02-24 2023-07-04 荣耀终端有限公司 Composite structural member, processing method thereof and electronic equipment
CN117248179A (en) * 2023-09-20 2023-12-19 苏州安洁科技股份有限公司 Colorful PVD (physical vapor deposition) multi-angle color-changing coating process for metal steel sheet

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CN111253081A (en) * 2020-03-20 2020-06-09 山东大学 Colored glass and preparation method thereof
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Application publication date: 20190802