CN110065275A - A kind of closed composite plate and preparation method thereof and the closed composite plate of multilayer and application - Google Patents
A kind of closed composite plate and preparation method thereof and the closed composite plate of multilayer and application Download PDFInfo
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- CN110065275A CN110065275A CN201910338970.5A CN201910338970A CN110065275A CN 110065275 A CN110065275 A CN 110065275A CN 201910338970 A CN201910338970 A CN 201910338970A CN 110065275 A CN110065275 A CN 110065275A
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- plate
- thermal conductivity
- closed composite
- wire mesh
- composite plate
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- 239000002131 composite material Substances 0.000 title claims abstract description 104
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 148
- 239000002184 metal Substances 0.000 claims abstract description 146
- 239000007770 graphite material Substances 0.000 claims abstract description 84
- 229910000679 solder Inorganic materials 0.000 claims description 73
- 238000003466 welding Methods 0.000 claims description 17
- 238000005219 brazing Methods 0.000 claims description 11
- 238000009792 diffusion process Methods 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 25
- 238000012545 processing Methods 0.000 abstract description 7
- 229910002804 graphite Inorganic materials 0.000 description 39
- 239000010439 graphite Substances 0.000 description 39
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 38
- 239000010949 copper Substances 0.000 description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 37
- 229910052802 copper Inorganic materials 0.000 description 37
- 238000004321 preservation Methods 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 20
- 229910000838 Al alloy Inorganic materials 0.000 description 18
- 229910052782 aluminium Inorganic materials 0.000 description 15
- 239000004411 aluminium Substances 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 238000001816 cooling Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 239000000284 extract Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 238000001291 vacuum drying Methods 0.000 description 5
- 238000010792 warming Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000005097 cold rolling Methods 0.000 description 4
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 4
- 238000005098 hot rolling Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000011120 plywood Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004880 explosion Methods 0.000 description 3
- 229910021389 graphene Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910017693 AgCuTi Inorganic materials 0.000 description 1
- -1 Aluminium silicon magnesium Chemical group 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910001051 Magnalium Inorganic materials 0.000 description 1
- 229910000635 Spelter Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000010406 interfacial reaction Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- PMTRSEDNJGMXLN-UHFFFAOYSA-N titanium zirconium Chemical group [Ti].[Zr] PMTRSEDNJGMXLN-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/02—Layer formed of wires, e.g. mesh
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/08—Interconnection of layers by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a kind of closed composite plates and preparation method thereof and the closed composite plate of multilayer and application, belong to Heat Conduction Material technical field.Closed composite plate provided by the invention includes graphite material high thermal conductivity layer and the metal layer being wrapped in outside graphite material high thermal conductivity layer；Oven wire mesh blanket is provided between the upper and lower surface and metal layer of the graphite material high thermal conductivity layer.In the present invention, the thermal conductivity of closed composite plate can be greatly improved in graphite material high thermal conductivity layer, metal layer is conducive to improve the processability and structural reliability of closed composite plate, so that graphite material high thermal conductivity layer and metal layer is combined closely by oven wire mesh blanket, has obtained with compared with high bond strength, higher heat-conductivity and the excellent closed composite plate of processing performance.
Description
Technical field
The present invention relates to Heat Conduction Material technical fields, and in particular to a kind of closed composite plate and preparation method thereof and multilayer are close
Close composite plate and application.
Background technique
With the progress of science and technology, the development such as high power electronic device, new energy battery, large data center are swift and violent,
Quantity of heat production during the work time is increasing, happens occasionally to the burning phenomenon of device work or battery, therefore, thermal control
Importance highlights.At present in thermal control system, various heat exchange components emerge one after another, such as liquid cooling plate, Liquid cooling chasis, VC
Soaking plate, loop circuit heat pipe, solid-state high thermal conductivity plate etc., every kind of structure have the characteristic and application scenarios of itself.Liquid cooling plate or liquid cooling
Cabinet is suitable for high-power heat-dissipation field, but needs to be equipped with circulating pump and outer liquid cold source；VC soaking plate is not necessarily to outer liquid cold source,
Heat, but its complex manufacturing technology, reliable sexual deviation are taken away by its internal liquid evaporative condenser, and is often limited by application conditions
System, such as gravity direction, acceleration etc. are affected to VC soaking plate heat exchange property；Loop circuit heat pipe is generally used for defending
Star system, cost of manufacture are expensive；Solid-state high thermal conductivity plate (the higher material of thermal conductivity) is often limited by material itself and manufacturing process
System, haves the defects that certain.
Current solid-state high thermal conductivity plate material is usually aluminium, copper, pyrolytic graphite or diamond and graphite or diamond intensified
Strong aluminium or Cu-base composites, wherein aluminum amount is processed easily, but its thermal conductivity is relatively relatively low (~200W/mK)；Copper is easy
Processing, but quality weight, thermal conductivity are relatively low with respect to for current needs (~380W/mK)；By certain treated pyrolytic graphite,
Such as annealed state pyrolytic graphite, thermal conductivity is relatively high (1200~1800W/mK), and relative brittleness is big, and intensity is low, and is not easy to add
Work is at threaded hole or welding assembly device；Diamond thermal conductivity is higher (> 2000W/mK), but brittleness is very big and hardness pole
Height is difficult to be processed into the components such as plate；The thermal conductivity of Graphite Reinforced Aluminum or Cu-base composites is moderate (400~700W/mK), but
Itself low strength, using limited；Diamond enhances aluminium or the thermal conductivity of Cu-base composites is moderate (500~750W/mK),
But brittleness is bigger than normal, and comprehensive hardness is high, it is difficult to processing preparation.
In the prior art, the technology for making composite plate has hot and cold rolling to weld, explosion weldering, diffusion welding (DW) and soldering,
In, hot and cold rolling welding and explosion weldering not applicable processing aluminium, copper, annealed state pyrolytic graphite, diamond especially move back
Fiery state pyrolytic graphite relative brittleness is larger, is easily broken in hot and cold rolling welding and the Welding that explodes, meanwhile, hot and cold rolling
It welds and explosion weldering deflection is larger and is not easy to guarantee closed.And diffusion welding (DW) and soldering have certain process advantage, still
To make to have preferable interface cohesion between annealed state pyrolytic graphite and metal, generally requires active metallic element and participate in interface
Association reaction, such as titanium elements, and the interfacial reaction of the active metallic element and annealed state pyrolytic graphite is needed certain
At a temperature of carry out, be usually above 800 DEG C, therefore not applicable for aluminium alloy and magnesium alloy etc.；In addition for other metal materials
For material, even if being able to bear higher temperature, but for large-area welding, its thermal stress is also difficult to avoid that, is likely to result in and is moved back
Fiery state pyrolytic graphite fault rupture, it is therefore desirable to find a kind of more reliable interface connection method.
Summary of the invention
The purpose of the present invention is to provide a kind of closed composite plate and preparation method thereof and the closed composite plate of multilayer and answer
With closed composite plate provided by the invention bond strength with higher, thermal conductivity and processing performance are excellent.
In order to achieve the above-mentioned object of the invention, the present invention the following technical schemes are provided:
The present invention provides a kind of closed composite plates, comprising graphite material high thermal conductivity layer and are wrapped in graphite material high thermal conductivity
Metal layer outside layer；Oven wire mesh blanket is provided between the upper and lower surface and metal layer of the graphite material high thermal conductivity layer.
Preferably, the length of the graphite material high thermal conductivity layer is 10~200mm, and width is 5~150mm, with a thickness of 0.5
~3mm.
Preferably, the metal layer with a thickness of 0.5~2mm.
Preferably, the aperture of wire mesh is 1~10mm in the oven wire mesh blanket；The oven wire mesh blanket with a thickness of
0.03~0.5mm.
Preferably, solder layer is additionally provided between the oven wire mesh blanket and metal layer.
Preferably, the solder layer with a thickness of 0.03~0.2mm.
The present invention provides the preparation methods of closed composite plate described in above-mentioned technical proposal, comprising the following steps:
(1) according to first the-the first wire mesh of metal plate-graphite material high thermal conductivity plate the-the second metal of the-the second wire mesh
The sequence of plate assembles, and obtains the first pretreatment part；At least one in first metal plate and the second metal plate is with groove knot
Structure；
(2) the first pretreatment part in the step (1) is subjected to vacuum diffusion welding, obtains the closed composite plate.
In the present invention, when containing solder layer described in the above-mentioned technical proposal in closed composite plate, the closed composite plate
Preparation method, comprising the following steps:
(1) according to first the-the first wire mesh of the-the first solder of metal plate-the-the second wire of graphite material high thermal conductivity plate
The sequence of net the-the second metal plate of the-the second solder, or according to first the-the first wire mesh of the-the first solder of metal plate-graphite material
The sequence of matter high thermal conductivity plate the-the second metal plate of the-the second wire mesh, or according to first the-the first wire mesh of metal plate-graphite
The sequence of material high thermal conductivity plate the-the second wire mesh the-the second metal plate of the-the second solder assembles, and obtains the second pretreatment part；It is described
At least one in first metal plate and the second metal plate is with groove structure；
(2) the second pretreatment part in the step (1) is subjected to vacuum brazing, obtains the closed composite plate.
The present invention also provides a kind of closed composite plates of multilayer, with closed composite plate described in above scheme or above scheme institute
The closed composite plate that preparation method is prepared is stated to be prepared for structural unit.
It is prepared the present invention also provides preparation method described in closed composite plate described in above scheme or above scheme
Application of the closed composite plate of multilayer described in closed composite plate or above scheme in heat exchange equipment.
The present invention provides a kind of closed composite plates, comprising graphite material high thermal conductivity layer and are wrapped in graphite material high thermal conductivity
Metal layer outside layer；Oven wire mesh blanket is provided between the upper and lower surface and metal layer of the graphite material high thermal conductivity layer.?
In the present invention, the thermal conductivity of closed composite plate can be greatly improved in graphite material high thermal conductivity layer, and metal layer is conducive to improve
The processability and structural reliability of closed composite plate tie graphite material high thermal conductivity layer and metal layer closely by oven wire mesh blanket
It closes, has obtained with compared with high bond strength, higher heat-conductivity and the excellent closed composite plate of processing performance.Number is tested by embodiment
According to it is found that closed composite plate thermal conductivity provided by the invention is up to 700~980W/ (mK), metal layer and graphite material high thermal conductivity
The bond strength of layer is up to 17~25MPa, illustrates that closed composite plate provided by the invention has excellent heating conduction and processing
Performance.
In addition, can be avoided graphite plate the present invention also provides the preparation method of closed composite plate and go out in process
Now be layered or be broken, obtain better performances and complete closed composite plate, and preparation process is simple, be suitable for various metals with
The combination of graphite.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of closed composite plate prepared by the embodiment of the present invention 1；
Fig. 2 is the structural schematic diagram of closed composite plate prepared by the embodiment of the present invention 2；
Fig. 3 is the structural schematic diagram of closed composite plate prepared by the embodiment of the present invention 3；
Fig. 4 is the structural schematic diagram of closed composite plate prepared by the embodiment of the present invention 4；
In figure, 1-1 is the first metal plate, and 1-2 is the second metal plate, and 1-3 is third metal plate, and 2-1 is the first wire
Net, 2-2 are the second wire mesh, and 2-3 is third wire mesh, and 2-4 is the 4th wire mesh, and 3 be graphite material high thermal conductivity plate,
4-1 is the first solder.
Specific embodiment
The present invention provides a kind of closed composite plates, comprising graphite material high thermal conductivity layer and are wrapped in graphite material high thermal conductivity
Metal layer outside layer；Oven wire mesh blanket is provided between the upper and lower surface and metal layer of the graphite material high thermal conductivity layer.
The present invention does not have special limit to the specific size of the graphite material high thermal conductivity layer, metal layer and oven wire mesh blanket
It is fixed, it is advisable with obtaining meeting the closed composite plate of size requirement.In the present invention, the length of the graphite material high thermal conductivity layer is excellent
It is selected as 10~200mm；The width of the graphite material high thermal conductivity layer is preferably 5~150mm；The graphite material high thermal conductivity layer
Thickness is preferably 0.5~3mm, more preferably 1.5~2.5mm.
In the present invention, the graphite material high thermal conductivity layer is preferably by pyrolytic graphite, annealed state pyrolytic graphite, highly directional warm
The solution high thermal conductivity graphites material such as graphite or graphene-based composite heating panel is formed, more preferably by annealed state pyrolytic graphite or graphite
Alkenyl composite heating panel is formed.The present invention is to the pyrolytic graphite, annealed state pyrolytic graphite, highly oriented pyrolytic graphite or graphene
The specific source of base composite heating panel does not have special restriction, using the pyrolytic graphite of this field routine, annealed state pyrolytic graphite,
Highly oriented pyrolytic graphite or graphene-based composite heating panel.In the present invention, graphite material high thermal conductivity layer has excellent
Thermal conductivity can be improved the heating conduction of closed composite plate.
In the present invention, the thickness of the metal layer is preferably 0.5~2mm, more preferably 0.5~1.5mm, most preferably
0.8~1.2mm.In the present invention, the metal layer is preferably by aluminium alloy, copper, stainless steel, titanium, titanium alloy, nickel or nickel alloy shape
At.The present invention wraps up graphite material high thermal conductivity layer by metal layer, and graphite material can be processed into plate, improves closed multiple
The processability and structural reliability of plywood.
In the present invention, the aperture of wire mesh is preferably 1~10mm in the oven wire mesh blanket, more preferably 3~
8mm, most preferably 5~6mm.The aperture of wire mesh is limited to above range by the present invention, and it is strong to be conducive to raising interface cohesion
It spends while guaranteeing good interface thermal conductivity.
In the present invention, the thickness of the oven wire mesh blanket is preferably 0.03~0.5mm, more preferably 0.05~0.3mm,
Most preferably 0.1~0.15mm.In the present invention, the oven wire mesh blanket preferably by copper mesh, stainless steel cloth, nickel wire net or
Titanium wire network is formed.In the present invention, graphite is comparatively soft, by applying certain pressure in the welding process, enables to gold
Belong to inside silk screen insertion or half insertion graphite, and cooperate reasonable technique, wire mesh can form good with metal layer
Metallurgical bonding, on the one hand can increase bonding area, and the occlusal pattern interface on the other hand formed helps to improve interface cohesion
Power, and then improve the thermal conductivity of closed composite plate.
In the present invention, it is also preferable to include solder layers between the oven wire mesh blanket and metal layer.In the present invention, described
The thickness of solder layer is preferably 0.03~0.2mm, more preferably 0.05~0.1mm, most preferably 0.08~0.1mm.In this hair
In bright, the solder layer is preferably formed by aluminium base solder, silver-base solder, titanium based solder, nickel-based solder.In the present invention, solder
Layer is conducive to improve the binding force of metal plate and wire mesh, and then improves the combination of metal layer and graphite material high thermal conductivity layer
Power.
The present invention provides the preparation methods of closed composite plate described in above scheme, comprising the following steps:
(1) according to first the-the first wire mesh of metal plate-graphite material high thermal conductivity plate the-the second metal of the-the second wire mesh
The sequence of plate assembles, and obtains the first pretreatment part；At least one in first metal plate and the second metal plate is with groove knot
Structure；
(2) the first pretreatment part in the step (1) is subjected to vacuum diffusion welding, obtains the closed composite plate.
The present invention is according to first the-the first wire mesh of metal plate-the-the second wire mesh-the second of graphite material high thermal conductivity plate
The sequence of metal plate assembles, and obtains the first pretreatment part；At least one in first metal plate and the second metal plate is with recessed
Slot structure.In the present invention, the groove structure in the metal plate is for containing graphite material high thermal conductivity plate, so that graphite is complete
It is wrapped in metal, exposed graphite is not present, protection graphite is not damaged, improves the processability and thermal conductivity of closed composite plate
Rate.
In the present invention, the material of first metal plate and the second metal plate is preferably same metal or dissimilar metal；
The material of first wire mesh and the second wire mesh is preferably same metal or dissimilar metal.In the present invention, described
First metal plate and first wire mesh are preferably material of the same race；Second metal plate and the second wire network optimization
It is selected as material of the same race.
After obtaining the first pretreatment part, the first pretreatment part is carried out vacuum diffusion welding by the present invention, is obtained described close
Close composite plate.The present invention does not have special restriction to the design parameter of the vacuum diffusion welding so that metal plate, wire mesh and
Graphite material high thermal conductivity plate combines closely and is advisable.
In the present invention, the vacuum degree of the vacuum diffusion welding is preferably (3~8) × 10-3Pa, more preferably 5 × 10- 3Pa.The present invention is diffused weldering under vacuum conditions, and it is strong metallurgical interface can be improved under conditions of not introducing other middle layers
Degree, and guarantee that inside cavity is in vacuum state and guarantees the sealing performance of metal surrounding.
In the present invention, the vacuum diffusion welding preferably carries out under the conditions of gradient heat-insulation pressure keeping, and the gradient heat preservation is protected
Pressure specifically: the first step, with the heating rate of 5~8 DEG C/min, by room temperature to 400~600 DEG C, heat preservation 60min, and
The pressure for applying 5~10MPa in insulating process, stops pressurization after heat preservation；Second step, with the heating speed of 5~8 DEG C/min
Rate makes the temperature of the first pretreatment part increase 120~300 DEG C on the basis of 400~600 DEG C, keeps the temperature 60~90min, and
Apply the pressure of 4~6MPa in insulating process, after heat preservation, pressure continues to keep；Third step is cooled to 450 DEG C with furnace, protects
0~30min of temperature stops pressurization after heat preservation；4th step is cooled to 150 DEG C with furnace, obtains the closed composite plate.At this
In invention, by pressurization so that in the micro insertion graphite material high thermal conductivity plate of wire mesh, increase interfacial contact area and machinery
Bite force, and can alleviate since linear expansion coefficient mismatches bring remnants between metal plate and graphite material high thermal conductivity plate
Stress, the comprehensive binding force for improving graphite material high thermal conductivity plate and metal plate.
In the present invention, when containing solder layer described in the above-mentioned technical proposal in closed composite plate, the closed composite plate
Preparation method, comprising the following steps:
(1) according to first the-the first wire mesh of the-the first solder of metal plate-the-the second wire of graphite material high thermal conductivity plate
The sequence of net the-the second metal plate of the-the second solder, or according to first the-the first wire mesh of the-the first solder of metal plate-graphite material
The sequence of matter high thermal conductivity plate the-the second metal plate of the-the second wire mesh, or according to first the-the first wire mesh of metal plate-graphite
The sequence of material high thermal conductivity plate the-the second wire mesh the-the second metal plate of the-the second solder assembles, and obtains the second pretreatment part；It is described
At least one in first metal plate and the second metal plate is with groove structure；
(2) the second pretreatment part in the step (1) is subjected to vacuum brazing, obtains the closed composite plate.
The present invention is according to first the-the first wire mesh of the-the first solder of metal plate-the-the second metal of graphite material high thermal conductivity plate
The sequence of silk screen the-the second metal plate of the-the second solder, or according to first the-the first wire mesh of the-the first solder of metal plate-graphite
The sequence of material high thermal conductivity plate the-the second metal plate of the-the second wire mesh, or according to first the-the first wire mesh of metal plate-stone
The sequence of black the-the second wire mesh of material high thermal conductivity plate the-the second metal plate of the-the second solder assembles, and obtains the second pretreatment part；Institute
At least one in the first metal plate and the second metal plate is stated with groove structure, the present invention does not have the size of the groove structure
Special restriction, so that graphite material high thermal conductivity plate is advisable by metal plate package completely.In the present invention, in the metal plate
Groove structure is for containing graphite material high thermal conductivity plate, so that graphite is wrapped in metal completely, exposed graphite is not present, protects
It is not damaged to protect graphite, improves the processability and thermal conductivity of closed composite plate.
In the present invention, the material of first metal plate and the second metal plate is preferably same metal or dissimilar metal；
The material of first solder and the second solder is preferably same metal or dissimilar metal；First wire mesh and the second gold medal
The material for belonging to silk screen is preferably same metal or dissimilar metal.
In the present invention, the material of the solder is determined by metal plate, in particular to the liquidus temperature of solder will be lower than
Metal plate solidus temperature.In the present invention, if the material of the first solder and the second solder is different in closed composite plate, first
When the material difference of metal plate and the second metal plate, the liquidus temperature of the first solder and the second solder will be lower than any gold
The solidus temperature for belonging to plate, that is, guarantee that all metal plates will not melt.The present invention limits the material of solder and the material of metal plate
Matter matching is to after brazing filler metal melts, utilize the solder wetting metal plate of liquid, and then raising metal plate and graphite material
The binding force of matter high thermal conductivity plate.In a specific embodiment of the invention, when metal plate is aluminium alloy, the solder is preferably
Aluminium silicon magnesium solder；When metal plate is copper, the solder is preferably ag-cu solder or silver-bearing copper titanium solder；When metal plate is titanium or titanium
When alloy, the solder is preferably titanium zirconium cupro-nickel solder or silver-bearing copper titanium solder；When metal plate is stainless steel, nickel or nickel alloy,
The solder is preferably BNi-1 solder, BNi-2 solder, BNi-5 solder or silver-bearing copper titanium solder；When metal plate is magnesium alloy, institute
Stating solder is preferably magnalium spelter solder.
In the present invention, the first solder and the second solder can be set simultaneously according to actual needs, it can also only setting the
One solder is not provided with the second solder, or the second solder is only arranged and is not provided with the first solder.
After obtaining the second pretreatment part, the second pretreatment part is carried out vacuum brazing by the present invention, is obtained described closed
Composite plate.The present invention does not have special restriction to the design parameter of the vacuum brazing, so that metal plate, solder, wire mesh
Combining closely with graphite material high thermal conductivity plate is advisable.
In the present invention, the vacuum degree of the vacuum brazing is preferably (3~8) × 10-3Pa, more preferably 5 × 10-3Pa。
The present invention is brazed under vacuum conditions, is beneficial to prevent defect caused by oxidation.
In the present invention, the vacuum brazing preferably carries out under the conditions of gradient heat-insulation pressure keeping, the gradient heat-insulation pressure keeping
Specifically: the first step, by room temperature to 400~600 DEG C, keeps the temperature 60min, and protecting with the heating rate of 5~8 DEG C/min
The pressure for applying 5~10MPa during temperature, stops pressurization after heat preservation；Second step, with the heating rate of 5~8 DEG C/min,
So that the temperature of the second pretreatment part is increased 120~300 DEG C on the basis of 400~600 DEG C, keeps the temperature 60~90min, and keeping the temperature
Apply the pressure of 4~6MPa in the process, after heat preservation, pressure continues to keep；Third step is cooled to 450 DEG C with furnace, heat preservation 0
~30min stops pressurization after heat preservation；4th step is cooled to 150 DEG C with furnace, obtains the closed composite plate.In the present invention
In, it needs to pressurize before brazing filler metal melts, so that in wire mesh insertion graphite material high thermal conductivity plate.
The present invention also provides a kind of closed composite plates of multilayer, with closed composite plate described in above scheme or above scheme institute
The closed composite plate that preparation method is prepared is stated to be prepared for structural unit.It specifically refers to the closed composite plate as knot
Structure unit is overlapped preparation, obtains the closed composite plate of multilayer.It is closed multiple with the multilayer comprising two graphite material high thermal conductivity layers
For plywood, the structure of the closed composite plate of multilayer is that the-the first oven wire mesh blanket of the first metal layer the-the first graphite material height is led
The-the second oven wire mesh blanket of thermosphere-second metal layer-the-the second graphite material of third oven wire mesh blanket the-the four wire of high thermal conductivity layer
Stratum reticulare-third metal layer；Alternatively, the first metal layer the-the first solder layer the-the first oven wire mesh blanket the-the first graphite material high thermal conductivity
Layer the-the second oven wire mesh blanket-second metal layer-the-the second graphite material of third oven wire mesh blanket the-the four wire mesh of high thermal conductivity layer
Layer-third metal layer；Alternatively, the first metal layer the-the first oven wire mesh blanket the-the first graphite material the-the second wire of high thermal conductivity layer
The-the second solder layer of stratum reticulare-second metal layer-the-the second graphite material of third oven wire mesh blanket the-the four wire mesh of high thermal conductivity layer
Layer-third metal layer；Alternatively, the first metal layer the-the first oven wire mesh blanket the-the first graphite material the-the second wire of high thermal conductivity layer
Stratum reticulare-second metal layer-the-the four oven wire mesh blankets of third oven wire mesh blanket the-the second graphite material high thermal conductivity layer-third solder
Layer-third metal layer；Alternatively, the first metal layer the-the first solder layer the-the first graphite material of the-the first oven wire mesh blanket high thermal conductivity layer-
Second the-the second solder layer of oven wire mesh blanket-second metal layer-the-the second graphite material of third oven wire mesh blanket high thermal conductivity layer-the four
Oven wire mesh blanket-third solder layer-third metal layer.
In the present invention, the preparation method of the closed composite plate of the multilayer is preferred are as follows: according to first the-the first metal of metal plate
The-the second metal plate of silk screen the-the first graphite material the-the second wire mesh of high thermal conductivity plate-the-the second graphite material of third wire mesh is high
The assembling of four wire meshes of heat-conducting plate-the-third metal plate sequence obtains third pretreatment part；First metal plate, second
At least two have groove structure in metal plate and third metal plate；Third pretreatment part is subjected to vacuum diffusion welding, is obtained
To the closed composite plate of the multilayer.
Solder layer is either set between the metal plate and wire mesh of above-mentioned third pretreatment part, and assembling obtains the 4th
Part is pre-processed, the 4th pretreatment part is subjected to vacuum brazing, obtains the closed composite plate of the multilayer.
In the closed composite plate of preparation multilayer, the present invention does not have the preparation process of the vacuum diffusion welding or vacuum brazing
Special restriction, using the preparation process of this field routine.In the present invention preferably according to the system of the closed composite plate
It is prepared by standby technique.
It is prepared the present invention also provides preparation method described in closed composite plate described in above scheme or above scheme
Application of the closed composite plate of multilayer described in closed composite plate or above scheme in heat exchange equipment.In the present invention, described closed
Composite plate can be separately as heat exchange material for making heat exchange equipment, can also be with other Heat Conduction Material (such as liquid cooling plates, liquid cooling
Cabinet etc.) production heat exchange equipment is used in combination.
Below in conjunction with the embodiment in the present invention, the technical solution in the present invention is clearly and completely described.It is aobvious
So, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the reality in the present invention
Example is applied, every other embodiment obtained by those of ordinary skill in the art without making creative efforts all belongs to
In the scope of protection of the invention.
Embodiment 1
It is suitable according to the first aluminium alloy plate-red copper silk screen-graphite material high thermal conductivity plate-the-the second aluminium alloy plate of red copper silk screen
Sequence stacks, obtain pretreatment part, wherein the aluminium alloy trade mark be 6063, aluminium alloy plate with a thickness of 2mm；The aperture of red copper silk screen
For 5.35mm, red copper silk screen with a thickness of 0.2mm；Graphite material high thermal conductivity plate is made of annealed state pyrolytic graphite, graphite material
The length of high thermal conductivity plate is 100mm, width 50mm, with a thickness of 2mm；The inside grooves size of first aluminium alloy plate are as follows: long ×
Width × height=100mm × 50mm × 1mm, the inside grooves size of the second aluminium alloy plate are as follows: length × width × height=100mm × 50mm
×1mm；
The pretreatment part is placed in vacuum drying oven, extracts vacuum to 5 × 10-3Pa, according to the heating rate of 5 DEG C/min,
400 DEG C are heated to, 60min is kept the temperature, and applies the pressure that pressure is 5MPa in insulating process, stops pressurization after heat preservation, then
Continue to be warming up to 520 DEG C with the heating rate of 5 DEG C/min, keep the temperature 90min, in insulating process, applies the pressure that pressure is 4MPa
Power after heat preservation, starts to cool down with furnace, and pressure keeps to cooling temperature being 450 DEG C, then stops pressurization, continues cold with furnace
But to 150 DEG C, workpiece is taken out in deflation blow-on, obtains aluminium alloy-graphite-closed composite plate of aluminium alloy sandwich, gained is closed multiple
The structural schematic diagram of plywood is as shown in Figure 1.
Embodiment 2
It is folded according to the first copper plate-red copper silk screen-graphite material high thermal conductivity plate-the-the second copper plate of red copper silk screen sequence
Put, obtain pretreatment part, wherein red copper be T2 state fine copper, copper plate with a thickness of 2mm；The aperture of red copper silk screen is 2.7mm,
Red copper silk screen with a thickness of 0.2mm；Graphite material high thermal conductivity plate is made of annealed state pyrolytic graphite, graphite material high thermal conductivity plate
Length is 100mm, width 50mm, with a thickness of 2mm；The inside grooves size of first copper plate are as follows: length × width × height=100mm
× 50mm × 2mm, the second copper plate do not have groove structure；
The pretreatment part is placed in vacuum drying oven, extracts vacuum to 5 × 10-3Pa, according to the heating rate of 8 DEG C/min,
600 DEG C are heated to, 40min is kept the temperature, and applies the pressure that pressure is 10MPa in insulating process, stops pressurization after heat preservation, then
Continue to be warming up to 900 DEG C with the heating rate of 8 DEG C/min, keep the temperature 60min, in insulating process, applies the pressure that pressure is 6MPa
Power after heat preservation, starts to cool down with furnace, and pressure keeps to cooling temperature being 600 DEG C, in 600 DEG C of heat preservation 30min, after continuation of insurance
Pressure is held, stops pressurization after heat preservation, cools to 150 DEG C with the furnace, workpiece is taken out in deflation blow-on, obtains purple copper-graphite-red copper
The structural schematic diagram of the closed composite plate of sandwich, the closed composite plate of gained is as shown in Figure 2.
Embodiment 3
It is folded according to copper plate-red copper silk screen-graphite material high thermal conductivity plate-red copper silk screen-solder-stainless steel plate sequence
Put, obtain pretreatment part, wherein red copper be T2 state fine copper, copper plate with a thickness of 2mm；The aperture of red copper silk screen is 2.27mm,
Red copper silk screen with a thickness of 0.2mm；Graphite material high thermal conductivity plate is made of annealed state pyrolytic graphite, graphite material high thermal conductivity plate
Length is 100mm, width 50mm, with a thickness of 2mm；Solder is silver-bearing copper titanium solder (AgCuTi, ingredient: Cu 26wt.%, Ti
3wt.%), solder with a thickness of 0.1mm；The inside grooves size of copper plate are as follows: length × width × height=100mm × 50mm ×
1mm, the groove size of stainless steel plate are as follows: length × width × height=100 × 50 × 1mm；
The pretreatment part is placed in vacuum drying oven, extracts vacuum to 5 × 10-3Pa, according to the heating rate of 8 DEG C/min,
600 DEG C are heated to, 60min is kept the temperature, and applies the pressure that pressure is 10MPa in insulating process, stops pressurization after heat preservation, then
Continue to be warming up to 900 DEG C with the heating rate of 8 DEG C/min, keep the temperature 80min, in insulating process, applies the pressure that pressure is 6MPa
Power after heat preservation, starts to cool down with furnace, and pressure keeps to cooling temperature being 600 DEG C, in 600 DEG C of heat preservation 30min, after continuation of insurance
Pressure is held, stops pressurization after heat preservation, cools to 150 DEG C with the furnace, workpiece is taken out in deflation blow-on, and it is stainless to obtain purple copper-graphite-
The structural schematic diagram of the closed composite plate of steel sandwich, the closed composite plate of gained is as shown in Figure 3.
Embodiment 4
According to the first aluminium alloy plate-red copper silk screen-graphite material high thermal conductivity plate-the-the second aluminium alloy plate of red copper silk screen-red copper
Silk screen-graphite material high thermal conductivity plate-red copper silk screen-third aluminium alloy plate sequence stacks, and obtains pretreatment part, wherein aluminium closes
Gold medal number be 6063, aluminium alloy plate with a thickness of 2mm；The aperture of red copper silk screen be 3.35mm, red copper silk screen with a thickness of
0.2mm；Graphite material high thermal conductivity plate is made of annealed state pyrolytic graphite, and the length of graphite material high thermal conductivity plate is 100mm, width
For 50mm, with a thickness of 2mm；The inside grooves size of first aluminium alloy plate are as follows: length × width × height=100mm × 50mm × 2mm, the
The inside grooves size of two aluminium alloy plates are as follows: length × width × height=100mm × 50mm × 2mm, third aluminium alloy plate are 2mm flat
Plate；
The pretreatment part is placed in vacuum drying oven, extracts vacuum to 5 × 10-3Pa, according to the heating rate of 5 DEG C/min,
400 DEG C are heated to, 60min is kept the temperature, and applies the pressure that pressure is 5MPa in insulating process, stops pressurization after heat preservation, then
Continue to be warming up to 520 DEG C with the heating rate of 5 DEG C/min, keep the temperature 90min, in insulating process, applies the pressure that pressure is 4MPa
Power after heat preservation, starts to cool down with furnace, and pressure keeps to cooling temperature being 450 DEG C, continues according to cooling to 150 DEG C with the furnace,
Workpiece is taken out in deflation blow-on, obtains aluminium alloy-graphite-aluminium alloy-closed composite plate of five layers of graphite-aluminium alloy, gained is closed multiple
The structural schematic diagram of plywood is as shown in Figure 4.
Comparative example 1
It is stacked according to aluminium sheet-graphite material high thermal conductivity plate-aluminium sheet sequence, obtains pretreatment part, wherein aluminium sheet size
Are as follows: length × width × height=100mm × 50mm × 1mm；Graphite material high thermal conductivity plate is made of annealed state pyrolytic graphite, graphite material
The length of high thermal conductivity plate is 100mm, width 50mm, with a thickness of 2mm；
The pretreatment part is placed in vacuum drying oven, extracts vacuum to 5 × 10-3Pa, according to the heating rate of 5 DEG C/min,
400 DEG C are heated to, 60min is kept the temperature, and applies the pressure that pressure is 5MPa in insulating process, stops pressurization after heat preservation, then
Continue to be warming up to 520 DEG C with the heating rate of 5 DEG C/min, keep the temperature 90min, in insulating process, applies the pressure that pressure is 4MPa
Power after heat preservation, starts to cool down with furnace, and pressure keeps to cooling temperature being 450 DEG C, then stops pressurization, continues cold with furnace
But to 150 DEG C, workpiece is taken out in deflation blow-on, obtains aluminium-graphite-aluminum composite plate.
Test example
The bond strength and thermal conductivity for the composite plate that closed composite plate, the comparative example 1 of the preparation of testing example 1~4 obtain
And the thermal conductivity of metal plate, testing result are shown in Table 1:
1 the performance test results of table
As can be seen from Table 1, metal plate is firm in conjunction with graphite material high thermal conductivity plate in closed composite plate prepared by the present invention
Gu and there is excellent thermal conductivity.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (10)
1. a kind of closed composite plate, which is characterized in that comprising graphite material high thermal conductivity layer and be wrapped in graphite material high thermal conductivity layer
External metal layer；Oven wire mesh blanket is provided between the upper and lower surface and metal layer of the graphite material high thermal conductivity layer.
2. closed composite plate according to claim 1, which is characterized in that the length of the graphite material high thermal conductivity layer is 10
~200mm, width is 5~150mm, with a thickness of 0.5~3mm.
3. closed composite plate according to claim 1, which is characterized in that the metal layer with a thickness of 0.5~2mm.
4. closed composite plate according to claim 1, which is characterized in that the aperture of wire mesh in the oven wire mesh blanket
For 1~10mm；The oven wire mesh blanket with a thickness of 0.03~0.5mm.
5. closed composite plate according to claim 1, which is characterized in that also set between the oven wire mesh blanket and metal layer
It is equipped with solder layer.
6. closed composite plate according to claim 5, which is characterized in that the solder layer with a thickness of 0.03~0.2mm.
7. the preparation method of any one of Claims 1 to 4 closed composite plate, comprising the following steps:
(1) according to first the-the first wire mesh of metal plate-graphite material high thermal conductivity plate the-the second metal plate of the-the second wire mesh
Sequence assembles, and obtains the first pretreatment part；At least one in first metal plate and the second metal plate is with groove structure；
(2) the first pretreatment part in the step (1) is subjected to vacuum diffusion welding, obtains the closed composite plate.
8. the preparation method of any one of the claim 5~6 closed composite plate, comprising the following steps:
(1) according to first the-the first wire mesh of the-the first solder of metal plate-the-the second wire mesh-the of graphite material high thermal conductivity plate
The sequence of two the-the second metal plates of solder, or led according to first the-the first wire mesh of the-the first solder of metal plate-graphite material height
The sequence of hot plate the-the second metal plate of the-the second wire mesh, or it is high according to first the-the first wire mesh of metal plate-graphite material
The sequence of heat-conducting plate the-the second wire mesh the-the second metal plate of the-the second solder assembles, and obtains the second pretreatment part；First gold medal
Belong at least one in plate and the second metal plate with groove structure；
(2) the second pretreatment part in the step (1) is subjected to vacuum brazing, obtains the closed composite plate.
9. a kind of closed composite plate of multilayer, which is characterized in that with any one of the claim 1~6 closed composite plate or right
It is required that the closed composite plate that any one of 7~8 preparation methods are prepared is prepared for structural unit.
10. any one of any one of the claim 1~6 closed composite plate or claim 7~8 preparation method is prepared into
To closed composite plate or claim 9 described in application of the closed composite plate of multilayer in heat exchange equipment.
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| CN201910338970.5A CN110065275A (en) | 2019-04-25 | 2019-04-25 | A kind of closed composite plate and preparation method thereof and the closed composite plate of multilayer and application |
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| CN201910338970.5A CN110065275A (en) | 2019-04-25 | 2019-04-25 | A kind of closed composite plate and preparation method thereof and the closed composite plate of multilayer and application |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114214552A (en) * | 2021-12-02 | 2022-03-22 | 广东工业大学 | Diamond product and manufacturing method thereof |
| CN114763020A (en) * | 2021-01-11 | 2022-07-19 | 深圳市汉嵙新材料技术有限公司 | Heat conducting plate |
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| CN103231554A (en) * | 2013-04-24 | 2013-08-07 | 常州碳元科技发展有限公司 | Laminated type high heat conduction graphite film structure |
| CN104726735A (en) * | 2013-12-23 | 2015-06-24 | 北京有色金属研究总院 | Composite-structure highly-oriented heat conducting material and preparation method thereof |
| CN207432908U (en) * | 2017-09-27 | 2018-06-01 | 苏州花蝴蝶新材料科技有限公司 | A kind of conductive graphite piece |
| CN209794755U (en) * | 2019-04-25 | 2019-12-17 | 河北宇天材料科技有限公司 | Airtight composite sheet and airtight composite sheet of multilayer |
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| JP2005219478A (en) * | 2004-01-09 | 2005-08-18 | Nippon Steel Corp | Clad plate and its production method |
| CN103231554A (en) * | 2013-04-24 | 2013-08-07 | 常州碳元科技发展有限公司 | Laminated type high heat conduction graphite film structure |
| CN104726735A (en) * | 2013-12-23 | 2015-06-24 | 北京有色金属研究总院 | Composite-structure highly-oriented heat conducting material and preparation method thereof |
| CN207432908U (en) * | 2017-09-27 | 2018-06-01 | 苏州花蝴蝶新材料科技有限公司 | A kind of conductive graphite piece |
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| CN114763020A (en) * | 2021-01-11 | 2022-07-19 | 深圳市汉嵙新材料技术有限公司 | Heat conducting plate |
| CN114214552A (en) * | 2021-12-02 | 2022-03-22 | 广东工业大学 | Diamond product and manufacturing method thereof |
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