CN110064989A - A kind of Mold polishing device - Google Patents
A kind of Mold polishing device Download PDFInfo
- Publication number
- CN110064989A CN110064989A CN201810065893.6A CN201810065893A CN110064989A CN 110064989 A CN110064989 A CN 110064989A CN 201810065893 A CN201810065893 A CN 201810065893A CN 110064989 A CN110064989 A CN 110064989A
- Authority
- CN
- China
- Prior art keywords
- polishing
- semicolumn
- mold
- myt3
- limit plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/20—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/06—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by liquid or gas pressure only
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of Mold polishing devices, including firm banking, rotation controling mechanism has been bolted at the top center position of the firm banking, it is sequentially connected on the rotation controling mechanism by rotation axis and limit plate, the inside of the limit plate offers storage groove, the storage groove is internally provided with adjusting bolt, is connect by mobile lantern ring with connecting rod at the side ports for adjusting bolt, the top of the connecting rod is welded with hemisphere polishing layer.In the present invention, MYT3-23 hydraulic driver is internally provided in clamping rings, and pass through telescopic rod and semicolumn polishing stick transmission connection on MYT3-23 hydraulic driver, polishing stick by semicolumn can be for mold progress grinding process, this kind of mode can pass through the position of the mobile semicolumn polishing stick of MYT3-23 hydraulic driver, to adjust the spacing between three semicolumn polishing sticks, polishing work can be carried out for different size of mold.
Description
Technical field
The present invention relates to grinding apparatus technical field more particularly to a kind of Mold polishing devices.
Background technique
Mold, in industrial production to be molded, be blow molded, squeeze out, die casting or the methods of forging and forming, smelting, punching press obtain
The various moulds and tool of required product, in brief, mold are the tools for making formed article, and this tool is by various
Part is constituted, and different molds is made of different parts, it is mainly realized by the change of physical state of the formed material
The processing of article shape.So that blank is become the tool for having the product of specific shape and size under external force, is widely used in punching
The compression moulding of the products such as sanction, die forging, cold-heading, extruding, metallic sintered products compacting, compression casting and engineering plastics, rubber, ceramics
Or in the forming of injection molding, mold has specific profile or cavity shape, can make using the chamfered shape with cutting edge
By profile wire shaped separation (punching) occurs for blank.
However existing Mold polishing device is in use there is some shortcomings, it is basic by manually for
Abrasive surface is polished, this kind of mode, grinding efficiency is low, and grinding effect is bad, and lavishes labor on.
Summary of the invention
The purpose of the present invention is to solve disadvantages existing in the prior art, and a kind of Mold polishing device proposed.
To achieve the goals above, present invention employs following technical solutions: a kind of Mold polishing device, including fixed bottom
Seat, has been bolted rotation controling mechanism at the top center position of the firm banking, on the rotation controling mechanism
It is sequentially connected by rotation axis and limit plate, the inside of the limit plate offers storage groove, the inside setting of the storage groove
There is adjusting bolt, is connect by mobile lantern ring with connecting rod at the side ports for adjusting bolt, the top of the connecting rod
It is welded with hemisphere polishing layer, is located on the outside of limit plate at another side ports for adjusting bolt and is welded with swing handle,
Bottom middle position on the limit plate positioned at storage groove is provided with infrared emittance, is provided on the infrared emittance
The top of infrared radiation head, the limit plate is connect by support column with clamping rings, the inside setting of the clamping rings
There is MYT3-23 hydraulic driver, the inside of the MYT3-23 hydraulic driver is connected by telescopic rod and semicolumn polishing stick transmission
It connects, and is welded with polishing layer on semicolumn polishing stick.
It is as above-mentioned technical proposal to further describe:
There are three the semicolumn polishing stick is arranged altogether, and angle is 60 degree to three semicolumn polishing sticks between any two.
It is as above-mentioned technical proposal to further describe:
The infrared emittance, MYT3-23 hydraulic driver and rotation controling mechanism pass through electric wire and connect with external power supply.
It is as above-mentioned technical proposal to further describe:
There are two the hemisphere polishing layer is arranged altogether, and two hemisphere polishing layers are symmetrical about the vertical center line of limit plate.
It is as above-mentioned technical proposal to further describe:
The center of the infrared radiation head and clamping rings is on same vertical line.
In the present invention, MYT3-23 hydraulic driver, and MYT3-23 hydraulic thrust are internally provided in clamping rings first
Pass through telescopic rod and semicolumn polishing stick transmission connection on dynamic device, polishing stick by semicolumn can be for mold progress burnishing part
Reason, this kind of mode can be by the position of the mobile semicolumn polishing stick of MYT3-23 hydraulic driver, to adjust three semicolumns
Spacing between polishing stick, can carry out polishing work for different size of mold, secondly be provided with below clamping rings
The hemisphere polishing layer of adjustable spacing, is used in conjunction with each other with semicolumn polishing stick, mold can integrally be beaten
Mill processing, using effect are more preferable.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of Mold polishing device proposed by the present invention；
Fig. 2 is the top view of clamping rings of the present invention；
Fig. 3 is the schematic diagram of internal structure of limit plate of the present invention.
Marginal data:
1- infrared emittance, 2- infrared radiation head, 3- clamping rings, 4- polishing layer, 5- semicolumn polishing stick, 6- telescopic rod,
7-MYT3-23 hydraulic driver, 8- hemisphere polishing layer, 9- connecting rod, the mobile lantern ring of 10-, 11- adjust bolt, 12- turning handle
Hand, 13- rotation axis, 14- rotation controling mechanism, 15- firm banking, 16- limit plate, 17- support column, 18- storage groove.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1-3, a kind of Mold polishing device, including firm banking 15, at the top center position of firm banking 15
It has been bolted rotation controling mechanism 14, has been sequentially connected on rotation controling mechanism 14 by rotation axis 13 and limit plate 16,
The inside of limit plate 16 offers storage groove 18, and being internally provided with for storage groove 18 adjusts bolt 11, adjust the side of bolt 11
It is connect by mobile lantern ring 10 with connecting rod 9 at port, the top of connecting rod 9 is welded with hemisphere polishing layer 8, adjusts bolt 11
Another side ports at be located at the outside of limit plate 16 and be welded with swing handle 12, the bottom of storage groove 18 is located on limit plate 16
Middle position is provided with infrared emittance 1, and infrared radiation head 2 is provided on infrared emittance 1, and the top of limit plate 16 is logical
It crosses support column 17 to connect with clamping rings 3, clamping rings 3 is internally provided with MYT3-23 hydraulic driver 7, and MYT3-23 is hydraulic
The inside of pusher 7 is sequentially connected by telescopic rod 6 and semicolumn polishing stick 5, and is welded with polishing layer on semicolumn polishing stick 5
4。
Semicolumn is polished there are three the total settings of stick 5, and angle is 60 degree to three semicolumns polishing sticks 5 between any two, infrared
Generator 1, MYT3-23 hydraulic driver 7 and rotation controling mechanism 14 are connect by electric wire with external power supply, hemisphere polishing
There are two layer 8 is arranged altogether, and two hemispheres polishing layers 8 are symmetrical about the vertical center line of limit plate 16,2 He of infrared radiation head
The center of clamping rings 3 is on same vertical line.
The infrared ray that infrared radiation head 2 irradiates facilitates user by mold center's point and infrared ray to it, thus convenient
Grinding process is carried out for mold, so that the effect of polishing is more preferable, the fixation of mold is fixed by external equipment, limit
The device of 16 or more plate may be rotated.
Working principle: in use, the mold polished to be placed into the inside of clamping rings 3, pass through infrared ray
The infrared ray that irradiation head 2 irradiates is adjusted the position for mold, and MYT3-23 hydraulic driver 7 passes through telescopic rod 6
The position of semicolumn polishing stick 5 is adjusted, so that being bonded to each other between semicolumn polishing stick 5 and mold, rotary motion handle
12, so that hemisphere polishing 8 position of layer that connecting rod 9 connects is adjusted in the adjusting bolt 11 of rotation, so that hemisphere
Polishing layer 8 is bonded with mold, and rotation controling mechanism 14 is driven on limit plate 16 and its limit plate 16 by rotation axis 13
Device is integrally rotated, to polish layer 8 for mold progress grinding process by semicolumn polishing stick 5 and hemisphere.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (5)
1. a kind of Mold polishing device, including firm banking (15), which is characterized in that the top center of the firm banking (15)
It has been bolted at position rotation controling mechanism (14), has passed through rotation axis (13) and limit on the rotation controling mechanism (14)
Position plate (16) is sequentially connected, and the inside of the limit plate (16) offers storage groove (18), and the inside of the storage groove (18) is set
It is equipped with and adjusts bolt (11), connect by mobile lantern ring (10) with connecting rod (9) at the side ports for adjusting bolt (11),
The top of the connecting rod (9) is welded with hemisphere polishing layer (8), is located at limit at another side ports for adjusting bolt (11)
It is welded with swing handle (12) on the outside of position plate (16), the bottom middle position of storage groove (18) is located on the limit plate (16)
Place is provided with infrared emittance (1), is provided with infrared radiation head (2) on the infrared emittance (1), the limit plate (16)
Top connect with clamping rings (3) by support column (17), the clamping rings (3) to be internally provided with MYT3-23 hydraulic
The inside of pusher (7), the MYT3-23 hydraulic driver (7) is connected by telescopic rod (6) and semicolumn polishing stick (5) transmission
It connects, and is welded with polishing layer (4) in semicolumn polishing stick (5).
2. a kind of Mold polishing device according to claim 1, which is characterized in that semicolumn polishing stick (5) sets altogether
There are three setting, and angle is 60 degree to three semicolumn polishings stick (5) between any two.
3. a kind of Mold polishing device according to claim 1, which is characterized in that the infrared emittance (1), MYT3-
23 hydraulic drivers (7) and rotation controling mechanism (14) are connect by electric wire with external power supply.
4. a kind of Mold polishing device according to claim 1, which is characterized in that hemisphere polishing layer (8) sets altogether
There are two setting, and two hemisphere polishings layer (8) are symmetrical about the vertical center line of limit plate (16).
5. a kind of Mold polishing device according to claim 1, which is characterized in that the infrared radiation head (2) and solid
The center of annulus (3) is determined on same vertical line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810065893.6A CN110064989A (en) | 2018-01-23 | 2018-01-23 | A kind of Mold polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810065893.6A CN110064989A (en) | 2018-01-23 | 2018-01-23 | A kind of Mold polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110064989A true CN110064989A (en) | 2019-07-30 |
Family
ID=67365164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810065893.6A Pending CN110064989A (en) | 2018-01-23 | 2018-01-23 | A kind of Mold polishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110064989A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090131890A (en) * | 2008-06-19 | 2009-12-30 | (주)케이.엠.피 | Grinding machine |
| CN205765496U (en) * | 2016-05-25 | 2016-12-07 | 安徽青花坊瓷业股份有限公司 | A kind of novel china outer wall buffing machine |
| CN106239281A (en) * | 2016-08-23 | 2016-12-21 | 朱林辉 | A kind of bearing special outer surface processing means |
| CN206373773U (en) * | 2016-12-27 | 2017-08-04 | 江苏洛克精密铸造有限公司 | A kind of efficient polishing grinding device of mould easy to use |
| CN206605361U (en) * | 2017-03-07 | 2017-11-03 | 江苏百安科技有限公司 | A kind of special-shaped piston outer wall automatic polishing device |
| CN107363681A (en) * | 2017-08-23 | 2017-11-21 | 芜湖凝鑫机械有限公司 | Mold polishing device with dust collector |
| CN107414193A (en) * | 2017-08-31 | 2017-12-01 | 中信戴卡股份有限公司 | A kind of high accuracy removes wheel rim burr device |
-
2018
- 2018-01-23 CN CN201810065893.6A patent/CN110064989A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090131890A (en) * | 2008-06-19 | 2009-12-30 | (주)케이.엠.피 | Grinding machine |
| CN205765496U (en) * | 2016-05-25 | 2016-12-07 | 安徽青花坊瓷业股份有限公司 | A kind of novel china outer wall buffing machine |
| CN106239281A (en) * | 2016-08-23 | 2016-12-21 | 朱林辉 | A kind of bearing special outer surface processing means |
| CN206373773U (en) * | 2016-12-27 | 2017-08-04 | 江苏洛克精密铸造有限公司 | A kind of efficient polishing grinding device of mould easy to use |
| CN206605361U (en) * | 2017-03-07 | 2017-11-03 | 江苏百安科技有限公司 | A kind of special-shaped piston outer wall automatic polishing device |
| CN107363681A (en) * | 2017-08-23 | 2017-11-21 | 芜湖凝鑫机械有限公司 | Mold polishing device with dust collector |
| CN107414193A (en) * | 2017-08-31 | 2017-12-01 | 中信戴卡股份有限公司 | A kind of high accuracy removes wheel rim burr device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190730 |