CN110061242B - Bipolar plate for testing current density of fuel cell and processing method thereof - Google Patents

Bipolar plate for testing current density of fuel cell and processing method thereof Download PDF

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Publication number
CN110061242B
CN110061242B CN201811125984.0A CN201811125984A CN110061242B CN 110061242 B CN110061242 B CN 110061242B CN 201811125984 A CN201811125984 A CN 201811125984A CN 110061242 B CN110061242 B CN 110061242B
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printed circuit
circuit board
current density
insulating
bipolar plate
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CN110061242A (en
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王亚军
陶有堃
陈进
周嫦
李辉
王海江
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Southwest University of Science and Technology
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Southwest University of Science and Technology
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/86Inert electrodes with catalytic activity, e.g. for fuel cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/86Inert electrodes with catalytic activity, e.g. for fuel cells
    • H01M4/88Processes of manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00Fuel cells; Manufacture thereof
    • H01M8/02Details
    • H01M8/0271Sealing or supporting means around electrodes, matrices or membranes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00Fuel cells; Manufacture thereof
    • H01M8/02Details
    • H01M8/0271Sealing or supporting means around electrodes, matrices or membranes
    • H01M8/0276Sealing means characterised by their form
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30Hydrogen technology
    • Y02E60/50Fuel cells

Abstract

The invention belongs to the technical field of fuel cell testing, and relates to a bipolar plate for testing current density of a fuel cell and a processing method thereof. Resistors are arranged in through holes of the two printed circuit boards, two ends of each resistor are connected to the side faces of the through holes of the two printed circuit boards respectively, and the printed circuit boards are embedded and arranged in the two insulating frames to obtain the current density test bipolar plate. The resistor has small volume, high precision and small temperature coefficient, and can improve the measurement precision; the embedded installation can avoid the influence on the battery structure, can reduce the thickness of the test bipolar plate, is convenient to install at any position of the galvanic pile and realizes the current density measurement of any position of the three-dimensional space in the galvanic pile; the printed circuit board is adopted to ensure that the wiring is neat and reliable, the short circuit phenomenon of each area can be avoided, the assembly complexity is reduced, and the contact pin socket is arranged on the printed circuit board to facilitate the voltage acquisition and wiring during the current density measurement; and the flow channel processing can be realized by mounting the conducting strip on the printed circuit board.

Description

Bipolar plate for testing current density of fuel cell and processing method thereof
Technical Field
The invention belongs to the technical field of fuel cell testing, and particularly relates to a bipolar plate for testing current density of a fuel cell and a processing method thereof.
Background
Fuel cells are power generation devices that directly convert chemical energy in fuel into electrical energy through electrochemical reactions. Fuel cells have gone through over 100 years since the invention. Since energy and environment have become the key issues for human society to live on, fuel cells, which are efficient and clean energy conversion devices, have gained general attention from governments, developers and research institutions of various countries in recent 20 years, and have shown wide application prospects in civil and military fields such as transportation, portable power supplies, decentralized power stations, aerospace and underwater vehicles.
The current density inside the fuel cell is the comprehensive reflection of electrochemical reaction under the action of factors such as reactants, temperature, water distribution and the like in the cell, and if the current density distribution is not uniform, the utilization rate of each region of the active area is not balanced, so that the difference of local voltage and in-plane current are generated, and potential loss is caused. In addition, when the membrane electrode passes through the hole, the current density can be reversed.
The online subarea current density testing technology can accurately test the local current density distribution of the fuel cell in real time, thereby reflecting the difference of electrochemical reaction inside the cell, and having important significance for improving the cell flow field design and avoiding major safety accidents caused by the attenuation through holes of the membrane electrode.
The current density test mainly comprises an inert network resistance method, a printed circuit board method and a Hall sensor method, wherein the inert network resistance method is mainly used for testing the current density of a monocell, and the printed circuit board method cannot be used as a bipolar plate to be placed at any position inside a galvanic pile for current density measurement because a flow channel cannot be processed due to the limitation of the printing thickness; the Hall sensor is complicated in steps of mounting the Hall sensor inside the polar plate, is low in detection precision and is not suitable for detecting the current density of any position inside the pile.
Disclosure of Invention
The invention aims to provide a fuel cell current density test bipolar plate and a processing method thereof, and aims to solve the technical problems that a current density test device in the prior art can only be used for testing the current density of a single cell, cannot be used as a bipolar plate to be placed at any position in a galvanic pile for current density measurement, and has complicated installation steps and low detection precision.
In order to achieve the purpose, the invention adopts the technical scheme that: there is provided a fuel cell current density testing bipolar plate comprising:
the printed circuit boards are stacked and provided with welding areas distributed in a matrix manner, the welding areas of the two printed circuit boards are distributed in a one-to-one correspondence manner, the printed circuit boards are provided with through holes in one-to-one correspondence with the welding areas, and the through holes of the two printed circuit boards are correspondingly communicated; the printed circuit board is provided with circuit wires which are correspondingly and electrically connected with the welding areas, and the tail end of the circuit wire of the printed circuit board is provided with a pin socket;
the resistors are respectively arranged in the through holes corresponding to the two printed circuit boards, and two ends of each resistor are respectively and electrically connected to the side faces of the through holes of the two printed circuit boards;
the two groups of conducting strips are distributed in a matrix manner, each group of conducting strips is correspondingly and electrically connected to the outer side surface of each welding area of one printed circuit board, and the conducting strips cover the corresponding through holes; and
the printed circuit board comprises two insulation frames which are arranged in a stacked mode, each insulation frame is provided with a mounting groove used for accommodating one printed circuit board, the two insulation frames clamp the two printed circuit boards, mounting holes used for accommodating the conducting strips in a one-to-one correspondence mode are formed in the bottom surfaces of the mounting grooves of the insulation frames, the mounting holes and the welding areas are arranged in a one-to-one correspondence mode, the number of the mounting holes of one insulation frame is equal to that of the welding areas of one printed circuit board, insulation ribs used for insulating the adjacent conducting strips are formed between the adjacent mounting holes of the insulation frames, flow channels are formed on the outer side surfaces of the insulation ribs and the outer side surfaces of the conducting strips together, and flow channel holes are formed in the insulation frames;
wherein one of the conductive sheets in one set of the conductive sheets, the corresponding land of the printed circuit board, the corresponding resistor, the corresponding land of the other printed circuit board, and the corresponding conductive sheet in the other set of the conductive sheets are connected in series to form a partition in the region where the two conductive sheets are located; the fuel cell current density testing bipolar plate has a plurality of partitions distributed in a matrix.
Furthermore, insulating glue is filled between the conducting strips and the insulating ribs;
and insulating glue is filled between the insulating frame and the printed circuit board.
Furthermore, in each printed circuit board, each welding area is correspondingly and electrically connected with two circuit wires, and the circuit wires are arranged on the printed circuit board; each resistor is measured by adopting four wires, two test points are arranged on the two welding areas corresponding to the resistors, two pairs of test points are formed by the two welding areas, one pair of the test points are used as current supplies to be connected into the two welding areas, and the other pair of the test points are used for measuring voltage and are respectively arranged on the two welding areas.
Further, the printed circuit board is provided with a mounting arm, the circuit routing extends to the mounting arm, and the pin socket is opened in the mounting arm; the insulating frame is provided with a through hole for the installation arm to pass through.
Further, the printed circuit board has at least two of the mounting arms; the mounting arms of the two printed circuit boards are arranged in a staggered mode.
Furthermore, two ends of the resistor are respectively and electrically connected to the side faces of the through holes of the two printed circuit boards through welding;
each group of conducting strips is electrically connected to the outer side surface of each welding area of the printed circuit board correspondingly through welding.
Furthermore, the printed circuit board is provided with filling grooves which correspond to the welding areas one to one, and the filling grooves are filled with soldering tin.
The invention provides a processing method of a bipolar plate for testing current density of a fuel cell, which comprises the following steps:
s1) printed circuit board welding positioning: the printed circuit boards are provided with positioning holes, and the positioning holes of the two printed circuit boards are aligned and welded for positioning;
s2) resistance welding: welding two ends of the resistor on the side surfaces of the through holes corresponding to the two printed circuit boards respectively;
s3) conducting strip welding: arranging soldering tin on a welding area, heating the soldering tin to a molten state by using an electric iron, covering the conducting sheet and aligning the conducting sheet to the welding area, heating the outer surface of the conducting sheet by using the electric iron until the conducting sheet is welded to the welding area, and repeating the above actions until all the conducting sheets are welded;
s4) mounting a printed circuit board to one of the insulating rims: mounting the printed circuit board welded with the conducting plate and the resistor in the mounting groove of one of the insulating frames;
s5) gluing and vacuumizing for multiple times on the matching surface of the insulating frame: coating insulating glue on the matching surfaces of the two insulating frames, and vacuumizing in a vacuum drying box for multiple times to discharge bubbles in the insulating glue;
s6) assembling another insulating frame, placing the insulating frame into a clamp, flattening, fixing and drying: assembling the other insulating frame to the insulating frame assembled with the printed circuit board, clamping and attaching the two insulating frames by using a clamp, locking the clamp, and putting the clamp into an oven for drying;
s7) applying glue to the outer side of one of the two insulating frames and vacuumizing for multiple times: filling insulating glue between the conducting strip and the insulating frame, and vacuumizing to discharge bubbles in the insulating glue to form an assembly body;
s8) placing the vacuumized assembly into a clamp, flatly clamping, fixing and drying: sticking an anti-sticking adhesive tape on the surface of the clamping side of the clamp, placing an assembly body which is coated with insulating glue and is vacuumized on one side into the clamp for clamping, locking the clamp and then placing the assembly body into an oven for drying;
s9) applying glue to the other outer side of the assembly body and vacuumizing for multiple times: filling insulating glue between the conducting strip of the unglued surface of the assembly in the step S7) and the insulating frame, and vacuumizing for many times;
s10) placing the vacuumized assembly into a clamp, flatly clamping, fixing and drying: the same operation as step S8);
s11) carrying out plane milling on two surfaces of the assembly body to a preset size;
s12) processing a flow channel and a flow channel hole on the assembly body after plane milling;
s13) gold plating the processed fuel cell current density test bipolar plate.
Further, in step S7), filling insulating glue between the conducting strip and the insulating frame by using a glue gun to cooperate with the needle head; if the insulation paste is not enough after vacuumizing, the local part is supplemented with the paste and vacuumized again until the insulation paste is filled up and bubbles do not appear any more.
Further, in step S13), a nickel layer having a thickness ranging from 0.1um to 3um is plated first, and then an 18K gold layer having a thickness ranging from 0.1um to 3um is plated.
Compared with the prior art, the invention has the technical effects that: resistors are arranged in through holes of the two printed circuit boards, two ends of each resistor are connected to the side faces of the through holes of the two printed circuit boards respectively, and the printed circuit boards are embedded into the two insulating frames to form a composite board, so that the current density test bipolar plate can be obtained. The adopted resistor has the advantages of small volume, high precision and very small temperature coefficient, the measurement precision of the current density can be greatly improved, in addition, the resistor has simple installation steps and small operation difficulty; the embedded installation can avoid influencing the battery structure, can greatly reduce the thickness of the current density test bipolar plate, is very convenient to install at any position of the galvanic pile, realizes the current density measurement at any position of the three-dimensional space in the galvanic pile, and has stable and reliable measurement; the printed circuit board is adopted, so that the wiring is tidy and reliable, the short circuit phenomenon of each area can be avoided, the assembly complexity is greatly reduced, the manufacturing cost is low, and the arrangement of the contact pin socket on the printed circuit board is very convenient for voltage acquisition and wiring during current density measurement; the conductive sheet is arranged on the printed circuit board, so that the processing of the flow channel can be realized, and the problem that the flow channel cannot be processed due to too thin copper foil when the printed circuit board is directly used is well solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a perspective assembly view of a fuel cell current density testing bipolar plate provided in accordance with an embodiment of the present invention;
FIG. 2 is a front view of the fuel cell current density testing bipolar plate of FIG. 1;
FIG. 3 is an exploded perspective view of the fuel cell current density testing bipolar plate of FIG. 1;
FIG. 4 is a front view of an insulating frame employed in the fuel cell current density testing bipolar plate of FIG. 3;
FIG. 5 is a front view of a printed circuit board employed in the fuel cell current density testing bipolar plate of FIG. 3;
FIG. 6 is an enlarged partial view of the printed circuit board of FIG. 5;
FIG. 7 is a partial cross-sectional view of the fuel cell current density testing bipolar plate of FIG. 1;
fig. 8 is a graph of current density test results obtained with the fuel cell current density testing bipolar plate of fig. 1.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 to 7, a bipolar plate for testing current density of a fuel cell according to the present invention will be described. The bipolar plate for testing current density of the fuel cell comprises a printed circuit board 10, a resistor 20, a conductive sheet 30 and an insulating frame 40. The two printed circuit boards 10 are stacked, the printed circuit boards 10 are provided with welding areas 11 distributed in a matrix shape, the welding areas 11 of the two printed circuit boards 10 are distributed in a one-to-one correspondence mode, the printed circuit boards 10 are provided with through holes 12 corresponding to the welding areas 11 in a one-to-one correspondence mode, and the through holes 12 of the two printed circuit boards 10 are correspondingly communicated; the printed circuit board 10 is provided with circuit traces 13 correspondingly and electrically connected with the welding areas 11, and the printed circuit board 10 is provided with pin sockets 14 at the tail ends of the circuit traces 13; the resistors 20 are distributed in a matrix, the number of the resistors 20 is equal to the number of the welding areas 11 of one printed circuit board 10, the resistors 20 are respectively installed in the through holes 12 corresponding to the two printed circuit boards 10, and two ends of the resistors 20 are respectively electrically connected to the side surfaces of the through holes 12 of the two printed circuit boards 10; two groups of conducting strips 30 are distributed in a matrix, each group of conducting strips 30 is correspondingly and electrically connected with the outer side surface of each welding area 11 of a printed circuit board 10, and the conducting strips 30 cover the corresponding through holes 12; two insulating frames 40 are stacked, each insulating frame 40 is provided with a mounting groove 41 for accommodating one printed circuit board 10, the two insulating frames 40 clamp the two printed circuit boards 10, mounting holes 42 for accommodating the conducting strips 30 are formed in the bottom surfaces of the mounting grooves 41 of the insulating frames 40 in a one-to-one correspondence manner, the mounting holes 42 are arranged in the one-to-one correspondence manner with the welding areas 11, the number of the mounting holes 42 of one insulating frame 40 is equal to that of the welding areas 11 of one printed circuit board 10, insulating ribs 43 for insulating the adjacent conducting strips 30 are formed between the adjacent mounting holes 42 of the insulating frames 40, flow channels 44 are formed on the outer side surfaces of the insulating ribs 43 and the outer side surfaces of the conducting strips 30 together, and the flow channel holes 45 are formed in; one of the conductive sheets 30 in one group of conductive sheets 30, the corresponding land 11 of the printed circuit board 10, the corresponding resistor 20, the corresponding land 11 of the other printed circuit board 10, and the corresponding conductive sheet 30 in the other group of conductive sheets 30 are connected in series, and a partition P is formed in the area where the two conductive sheets 30 are located; the fuel cell current density test bipolar plate has a plurality of partitions P distributed in a matrix.
The resistor 20 is arranged in the through hole 12 of the two printed circuit boards 10, two ends of the resistor 20 are respectively connected to the side surfaces of the through hole 12 of the two printed circuit boards 10, and the printed circuit boards 10 are embedded in the two insulating frames 40 to form a composite board, so that the current density test bipolar plate can be obtained. The adopted resistor 20 has the advantages of small volume, high precision and very small temperature coefficient, the measurement precision of the current density can be greatly improved, and in addition, the resistor 20 has simple installation steps and small operation difficulty; the embedded installation can avoid influencing the battery structure, can greatly reduce the thickness of a current density test bipolar plate (the thinnest can be less than 2 mm), is very convenient to install at any position of the galvanic pile, realizes the current density measurement at any position of a three-dimensional space in the galvanic pile, and has stable and reliable measurement; the printed circuit board 10 is adopted, so that the wiring is tidy and reliable, the short circuit phenomenon of each area can be avoided, the assembly complexity is greatly reduced, the manufacturing cost is low, and the pin inserting port 14 is formed in the printed circuit board 10, so that the voltage acquisition wiring during the current density measurement is very convenient; the conductive sheet 30 is mounted on the printed circuit board 10 to process the flow channel 44, which can solve the problem that the copper foil is too thin to process the flow channel when directly using the printed circuit board.
When current density detection is carried out, the current density test bipolar plate is arranged at a position to be detected in a galvanic pile, then a detection interface (not shown) of an upper computer is inserted into a pin socket 14 of a printed circuit board 10, voltage drop between two conducting strips 30 corresponding to the upper part and the lower part of each subarea P is respectively detected by fast switching of the existing control circuit, the current density of each subarea P can be calculated by dividing the voltage drop by the resistance 20 and the area of each subarea P, namely, the following formula is adopted:
Figure GDA0002658930780000081
wherein J is current density, I is each zone current, U is each zone voltage drop, R is each zone resistance, and A is each zone area size.
The current density test result graph shown in fig. 8 was obtained after data processing by the prior art. The bipolar plate for testing the current density of the fuel cell is skillfully combined with an inert network resistance method and a printed circuit board method.
The printed circuit board 10 is provided with the positioning holes 15, and the positioning holes 15 of the two printed circuit boards 10 are aligned and welded and positioned, so that the printed circuit boards 10 can be prevented from being dislocated when other parts are welded. The through hole 12 of the printed circuit board 10 is a square hole or a circular hole, which is easy to process and facilitates the soldering of the end of the resistor 20 to the side of the through hole 12 of the printed circuit board 10.
The conductive sheet 30 is rectangular, and the welding area 11 is rectangular, so that the forming is easy, and the positioning of the conductive sheet 30 during welding can be very convenient. The land 11 includes a rectangular portion 111 and a frame portion 112 connected to one side of the rectangular portion 111, a filling region for filling solder is formed in the rectangular portion 111, and the through hole 12 is formed in the frame portion 112, which is easy to form and facilitates connection of the conductive sheet 30 to the land 11.
The resistor 20 may be a chip resistor or a color ring resistor, and has the advantages of small size, high precision and very small temperature coefficient. The size of the resistor is not more than 10mm 2mm, the resistance value of the resistor is 5-10 milliohm, the power of the resistor is more than 1W, the resistor can bear heavy current of at least 10A, and the temperature coefficient of the resistor is not more than 1% when the temperature changes between 25 ℃ and 120 ℃. The patch resistor volume was 5mm 3mm 0.6 mm.
The two sets of conductive sheets 30 are not connected to each other. The conductive sheet 30 may be a copper sheet, an aluminum sheet, a silver sheet, or a graphite sheet having good electrical and thermal conductivity. The insulating frame 40 is made of high-temperature-resistant, corrosion-resistant and pollutant-release-free insulating high-strength plastic, and the material can be PEI (polyetherimide), glass fiber board and the like. The upper surface of one of the insulating frames 40 is provided with a glue filling groove 46 around the three flow passage holes 45 for preventing gas leakage. The respective sections P are separated by the insulating ribs 43 of the insulating frame 40, and the adjacent conductive sheets 30 are insulated from each other.
The flow channels 44 may be either anode or cathode flow fields and the type of flow channels 44 machined may be of any form. And processing the mounted composite board, and then plating gold to obtain the current density test bipolar plate.
The insulating frame 40 is made of high-strength insulating materials, can prevent the transverse lines of P current density of each subarea from flowing, eliminates current density detection errors caused by the transverse lines of current of each subarea, can enhance the strength of the current density test bipolar plate by the high-strength plastic insulating frame, and ensures that the groove of the sealing ring is not crushed when the current density test bipolar plate is assembled. The two insulating frames 40 encapsulate the printed circuit board 10 in the middle of the mounting groove 41 by bonding and form a composite structural plate. The sum of the total thicknesses of the two printed circuit boards 10 and the two corresponding upper and lower conductive sheets 30 is equal to the sum of the thicknesses of the two insulating frames 40, so that the outer surfaces of the conductive sheets 30 are flush with the outer sides of the corresponding insulating frames 40 after the printed circuit boards 10 are embedded and installed, and the overall structure is small in thickness.
Further, as a specific embodiment of the bipolar plate for testing current density of a fuel cell provided by the present invention, an insulating glue is filled between the conductive sheet 30 and the insulating rib 43, and an insulating glue is filled between the insulating frame 40 and the printed circuit board 10. The insulating glue has strong adhesive force, high temperature resistance and corrosion resistance, and realizes insulation and sealing. The insulating glue adopts single-component epoxy resin or other structural glue which is firm in bonding, high-temperature resistant (applicable temperature is minus 40 ℃ to 140 ℃) and corrosion resistant, and can realize the insulation between each partition P of the current density test bipolar plate and the gas isolation function of two sides of the current density test bipolar plate.
Further, referring to fig. 5 and fig. 6, as a specific embodiment of the bipolar plate for testing current density of a fuel cell provided by the present invention, in each printed circuit board 10, each welding area 11 is electrically connected to two circuit traces 13, and the circuit traces 13 are disposed on the printed circuit board 10; each resistor 20 is measured by four wires, two test points are respectively arranged on the two lands 11 corresponding to the resistor 20, two pairs of test points are formed by the two test points, one pair of test points is connected to the two lands 11 (namely, two ends of the resistor 20) as current supply, and the other pair of test points is used for measuring voltage and is respectively arranged on the two lands 11 and close to two ends of the resistor 20. The test point as the measurement voltage is closer to the end of the resistor 20 than the test point as the current supply, and the pair of test points as the current supply is outside the pair of test points as the measurement voltage. Two circuit wires 13 are led out from the upper printed circuit board 10 and the lower printed circuit board 10 to the pin sockets 14, so that the P resistors 20 of all the partitions can be accurately calibrated conveniently after installation. The resistance value of the resistor 20 changes with the temperature, and the resistance value of the resistor 20 is measured by adopting a four-wire method, so that the influence of measuring the wire resistance is eliminated. Because the impedance of the measured voltage loop is very high, the current flowing through the voltage lead is very small and can be ignored, so that the resistance value of the measured resistor is equal to the voltage measured by the voltage lead divided by the current passing through the current lead, the error caused by the resistance of the lead is effectively eliminated, and the accurate measurement of the resistance value of the measured resistor is realized. The method can accurately calibrate the resistance value of each resistor 20 for current density measurement at any operating temperature at any time, ensure the voltage drop at two ends of the resistor 20 to be accurately measured and avoid the current density calculation error caused by temperature interference.
Further, referring to fig. 1, fig. 3, fig. 5 and fig. 6, as an embodiment of the bipolar plate for testing current density of a fuel cell provided in the present invention, the printed circuit board 10 has a mounting arm 16, the circuit trace 13 extends to the mounting arm 16, and the pin socket 14 is opened on the mounting arm 16; the insulating frame 40 is provided with a through hole 47 for the mounting arm 16 to pass through. The structure is convenient for inserting the detection interface of the upper computer into the pin socket 14 of the printed circuit board 10, and the installation arm 16 is convenient to assemble on the insulating frame 40, so that the whole structure is small in thickness.
Further, as one embodiment of the fuel cell current density testing bipolar plate provided by the present invention, the printed circuit board 10 has at least two mounting arms 16. The mounting arms 16 of the two printed circuit boards 10 are offset. The structure is easy to form and assemble, a detection interface of the upper computer is convenient to insert into the pin inserting port 14 of the printed circuit board 10, and current density testing is carried out on more subareas P. Mounting arms 16 are distributed on two side edges of the printed circuit board 10, so that a detection interface of an upper computer can be conveniently inserted into the pin insertion holes 14 of the printed circuit board 10, and current density tests can be carried out on more subareas P.
Further, as a specific embodiment of the bipolar plate for testing current density of a fuel cell provided by the present invention, both ends of the resistor 20 are electrically connected to the sides of the through-hole 12 of the two printed circuit boards 10, respectively, by welding; the structure is easy to form and realizes the electrical connection between the two. Each set of the conductive sheets 30 is electrically connected to the outer side of each land 11 of one printed circuit board 10 by soldering. The structure is easy to form and realizes the electrical connection between the two.
Further, referring to fig. 5 and fig. 6, as an embodiment of the bipolar plate for testing current density of a fuel cell according to the present invention, the printed circuit board 10 is provided with filling grooves 17 corresponding to the soldering lands 11 one by one, and the filling grooves 17 are filled with solder. The filling groove 17 is i-shaped, solder is coated on one end of the filling groove 17 far away from the resistor 20, so that enough solder can be conveniently accommodated to weld the conducting strip 30, and meanwhile, the filling groove 17 is filled with the solder to increase the maximum current value borne by each partition P. And heating the soldering tin in the filling groove 17 to a molten state by using an electric iron, then quickly covering the conducting strip 30 and aligning the conducting strip with the welding area 11 which is arranged on the printed circuit board 10 in advance, and adjusting the temperature to 400 ℃ by using the electric iron to heat the corresponding position of the filling groove 17 on the upper surface of the conducting strip 30 until the conducting strip 30 is completely attached and welded to the printed circuit board 10.
The invention also provides a processing method of the bipolar plate for testing the current density of the fuel cell in any embodiment, which comprises the following steps:
s1) soldering the printed circuit board 10: the printed circuit boards 10 are provided with positioning holes 15, and the positioning holes 15 of the two printed circuit boards 10 are aligned and welded for positioning; this prevents the printed circuit board 10 from being misaligned when other parts are soldered.
S2) resistance 20 welding: respectively welding two ends of the resistor 20 on the side surfaces of the through holes 12 corresponding to the two printed circuit boards 10 to ensure that the resistor 20 is not short-circuited;
s3) bonding of conductive sheet 30: arranging soldering tin on the welding area 11, heating the soldering tin to a molten state by using an electric iron, covering the conducting strip 30 and aligning the conducting strip to the welding area 11, adjusting the temperature to 400 ℃ by using the electric iron, heating the outer surface of the conducting strip 30 until the conducting strip 30 is welded to the welding area 11, and repeating the above actions until all the conducting strips 30 are welded;
s4) mounting the printed circuit board 10 to one of the insulating rims 40: installing the printed circuit board 10 welded with the conducting sheet 30 and the resistor 20 in the installation groove 41 of one of the insulating frames 40, and ensuring no interference;
s5) applying glue to the mating surface 48 of the insulating border 40 and applying multiple vacuums: coating insulating glue on the matching surfaces 48 of the two insulating frames 40, and vacuumizing in a vacuum drying oven for many times to discharge bubbles in the insulating glue until no bubbles are generated;
s6) assembling another insulating frame 40, putting the insulating frame into a clamp, flattening, fixing and drying: assembling the other insulating frame 40 to the insulating frame 40 assembled with the printed circuit board 10, clamping and adhering the two insulating frames 40 by using a clamp, locking the clamp and putting the clamp into an oven for drying; setting the parameters of the oven to be baking for 4h at 80 ℃, or baking for 2h at 100 ℃ or baking for 30min at 120 ℃;
s7) applying glue to the outer side of one of the two insulating rims 40 and vacuumizing it a plurality of times: filling insulating glue between the conducting strip 30 and the insulating frame 40, and vacuumizing to discharge bubbles in the insulating glue to form an assembly body;
s8) placing the vacuumized assembly into a clamp, flatly clamping, fixing and drying: sticking an anti-sticking adhesive tape on the surface of the clamping side of the clamp, placing an assembly body which is coated with insulating glue and is vacuumized on one side into the clamp for clamping, locking the clamp and then placing the assembly body into an oven for drying; the drying process parameters are the same as those of step S6). The anti-sticking adhesive tape is a polytetrafluoroethylene anti-sticking adhesive tape. The clamp is clamped flatly, so that the bending of an assembly body caused by expansion with heat and contraction with cold of the insulating glue in the drying process can be effectively prevented. The internal defects caused by gluing are effectively avoided by repeated vacuumizing and drying operations, and the strength of the current density test bipolar plate is increased.
S9) applying glue to the other outer side of the assembly body and vacuumizing for multiple times: filling insulating glue between the conducting strip 30 and the insulating frame 40 of the unglued surface of the assembly in the step S7) and vacuumizing for multiple times; the specific operation is the same as step S7).
S10) placing the vacuumized assembly into a clamp, flatly clamping, fixing and drying: the operation is the same as the step S8), because the insulating glue is subjected to a stage with very good fluidity in the drying process, the insulating glue on the downward surface of the assembly body can be lost due to the gluing on the two sides of the assembly body, the gap between the two surfaces of the assembly body can not be simultaneously glued, the gluing operation can only be carried out on the upward surface of the assembly body, and the steps S7) and S8 are repeated after the gluing operation is finished and the downward surface is turned upward;
s11) carrying out plane milling on two surfaces of the assembly body to a preset size; carrying out plane rough milling on the current density test bipolar plate assembly body with the coated and dried surface having the residual excess insulating glue by using a machine tool, and then carrying out plane finish milling until the thickness of the assembly body reaches a preset size; the surface of the assembled current density test bipolar plate is subjected to finish milling, and the flatness is not more than 0.02 mm.
S12) processing the flow channel 44 and the flow channel hole 45 on the assembly body after plane milling; clamping the assembly body after the plane is finely milled by using a vacuum chuck, then machining the flow channel 44, the flow channel hole 45 and other characteristics on the surface of the assembly body by using an engraving and milling machine, and not milling the flow channel hole 45, otherwise, causing the chuck to leak gas and being incapable of clamping, machining the flow channel hole 45 from two sides to the middle and leaving a 0.2mm allowance, and cutting off the machining allowance of the flow channel 44 by using a knife after the assembly body is taken down from the vacuum chuck.
S13) gold plating the processed fuel cell current density test bipolar plate. The gold plating operation may prevent corrosion of the conductive sheet 30 during current density testing.
The resistor 20 is arranged in the through hole 12 of the two printed circuit boards 10, two ends of the resistor 20 are respectively connected to the side surfaces of the through hole 12 of the two printed circuit boards 10, and the printed circuit boards 10 are embedded in the two insulating frames 40 to form a composite board, so that the current density test bipolar plate can be obtained. The adopted resistor 20 has the advantages of small volume, high precision and very small temperature coefficient, the measurement precision of the current density can be greatly improved, and in addition, the resistor 20 has simple installation steps and small operation difficulty; the embedded installation can avoid influencing the battery structure, can greatly reduce the thickness of the current density test bipolar plate, is very convenient to install at any position of the galvanic pile, realizes the current density measurement at any position of the three-dimensional space in the galvanic pile, and has stable and reliable measurement; the printed circuit board 10 is adopted, so that the wiring is tidy and reliable, the short circuit phenomenon of each area can be avoided, the assembly complexity is greatly reduced, the manufacturing cost is low, and the pin inserting port 14 is formed in the printed circuit board 10, so that the voltage acquisition wiring during the current density measurement is very convenient; the conductive sheet 30 is mounted on the printed circuit board 10 to process the flow channel 44, which can solve the problem that the copper foil is too thin to process the flow channel when directly using the printed circuit board.
Further, as a specific implementation manner of the processing method of the fuel cell current density test bipolar plate provided by the present invention, in step S7), a glue gun is used to match with the needle head to fill insulating glue between the conductive sheet 30 and the insulating frame 40; if the insulating cement is not enough after vacuumizing, the local part is supplemented with the cement and vacuumized again until the insulating cement is filled up and bubbles do not appear any more, so that the operation is easy and the filling effect is good. The time for vacuumizing is generally about 15 min-30 min.
Further, as a specific embodiment of the processing method of the current density testing bipolar plate of the fuel cell provided by the present invention, in step S13), a nickel layer with a thickness ranging from 0.1um to 3um is plated, and then an 18K gold layer with a thickness ranging from 0.1um to 3um is plated. The nickel plating can increase the bonding force of gold and the conductive sheet 30, and the 18K gold plating can increase the wear resistance of the gold layer. The gold-plated copper sheet replaces graphite to collect current, so that the gold-plated copper sheet has good heat conduction and electrical conductivity, and the performance of the gold-plated copper sheet is even superior to that of a graphite bipolar plate. Specifically, a nickel layer with the thickness of 3um is plated firstly, and then an 18K gold layer with the thickness of 1um is plated, so that the bonding force and the wear resistance can be effectively improved.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A fuel cell current density testing bipolar plate, comprising:
the printed circuit boards are stacked and provided with welding areas distributed in a matrix manner, the welding areas of the two printed circuit boards are distributed in a one-to-one correspondence manner, the printed circuit boards are provided with through holes in one-to-one correspondence with the welding areas, and the through holes of the two printed circuit boards are correspondingly communicated; the printed circuit board is provided with circuit wires which are correspondingly and electrically connected with the welding areas, and the tail end of the circuit wire of the printed circuit board is provided with a pin socket;
the resistors are respectively arranged in the through holes corresponding to the two printed circuit boards, and two ends of each resistor are respectively and electrically connected to the side faces of the through holes of the two printed circuit boards;
the two groups of conducting strips are distributed in a matrix manner, each group of conducting strips is correspondingly and electrically connected to the outer side surface of each welding area of one printed circuit board, and the conducting strips cover the corresponding through holes; and
the printed circuit board comprises two insulation frames which are arranged in a stacked mode, each insulation frame is provided with a mounting groove used for accommodating one printed circuit board, the two insulation frames clamp the two printed circuit boards, mounting holes used for accommodating the conducting strips in a one-to-one correspondence mode are formed in the bottom surfaces of the mounting grooves of the insulation frames, the mounting holes and the welding areas are arranged in a one-to-one correspondence mode, the number of the mounting holes of one insulation frame is equal to that of the welding areas of one printed circuit board, insulation ribs used for insulating the adjacent conducting strips are formed between the adjacent mounting holes of the insulation frames, flow channels are formed on the outer side surfaces of the insulation ribs and the outer side surfaces of the conducting strips together, and flow channel holes are formed in the insulation frames;
wherein one of the conductive sheets in one set of the conductive sheets, the corresponding land of the printed circuit board, the corresponding resistor, the corresponding land of the other printed circuit board, and the corresponding conductive sheet in the other set of the conductive sheets are connected in series to form a partition in the region where the two conductive sheets are located; the fuel cell current density testing bipolar plate has a plurality of partitions distributed in a matrix.
2. The fuel cell current density test bipolar plate of claim 1, wherein an insulating glue is filled between the conductive sheet and the insulating rib;
and insulating glue is filled between the insulating frame and the printed circuit board.
3. The fuel cell current density testing bipolar plate of claim 1, wherein in each of said printed circuit boards, each of said lands electrically connects two corresponding circuit traces disposed on said printed circuit board; each resistor is measured by adopting four wires, two test points are arranged on the two welding areas corresponding to the resistors, two pairs of test points are formed by the two welding areas, one pair of the test points are used as current supplies to be connected into the two welding areas, and the other pair of the test points are used for measuring voltage and are respectively arranged on the two welding areas.
4. The fuel cell current density test bipolar plate of claim 1, wherein said printed circuit board has a mounting arm to which said circuit traces extend, said pin sockets opening into said mounting arm; the insulating frame is provided with a through hole for the installation arm to pass through.
5. The fuel cell current density testing bipolar plate of claim 4 wherein said printed circuit board has at least two of said mounting arms; the mounting arms of the two printed circuit boards are arranged in a staggered mode.
6. The fuel cell current density testing bipolar plate according to any one of claims 1 to 5, wherein both ends of the resistor are electrically connected to the through-hole sides of the two printed circuit boards, respectively, by soldering;
each group of conducting strips is electrically connected to the outer side surface of each welding area of the printed circuit board correspondingly through welding.
7. The bipolar plate for testing current density of fuel cell according to any one of claims 1 to 5, wherein said printed circuit board is formed with filling grooves corresponding to said welding areas one to one, said filling grooves being filled with solder.
8. The method of processing a fuel cell current density test bipolar plate according to any one of claims 1 to 7, comprising the steps of:
s1) printed circuit board welding positioning: the printed circuit boards are provided with positioning holes, and the positioning holes of the two printed circuit boards are aligned and welded for positioning;
s2) resistance welding: welding two ends of the resistor on the side surfaces of the through holes corresponding to the two printed circuit boards respectively;
s3) conducting strip welding: arranging soldering tin on a welding area, heating the soldering tin to a molten state by using an electric iron, covering the conducting sheet and aligning the conducting sheet to the welding area, heating the outer surface of the conducting sheet by using the electric iron until the conducting sheet is welded to the welding area, and repeating the above actions until all the conducting sheets are welded;
s4) mounting a printed circuit board to one of the insulating rims: mounting the printed circuit board welded with the conducting plate and the resistor in the mounting groove of one of the insulating frames;
s5) gluing and vacuumizing for multiple times on the matching surface of the insulating frame: coating insulating glue on the matching surfaces of the two insulating frames, and vacuumizing in a vacuum drying box for multiple times to discharge bubbles in the insulating glue;
s6) assembling another insulating frame, placing the insulating frame into a clamp, flattening, fixing and drying: assembling the other insulating frame to the insulating frame assembled with the printed circuit board, clamping and attaching the two insulating frames by using a clamp, locking the clamp, and putting the clamp into an oven for drying;
s7) applying glue to the outer side of one of the two insulating frames and vacuumizing for multiple times: filling insulating glue between the conducting strip and the insulating frame, and vacuumizing to discharge bubbles in the insulating glue to form an assembly body;
s8) placing the vacuumized assembly into a clamp, flatly clamping, fixing and drying: sticking an anti-sticking adhesive tape on the surface of the clamping side of the clamp, placing an assembly body which is coated with insulating glue and is vacuumized on one side into the clamp for clamping, locking the clamp and then placing the assembly body into an oven for drying;
s9) applying glue to the other outer side of the assembly body and vacuumizing for multiple times: filling insulating glue between the conducting strip of the unglued surface of the assembly in the step S7) and the insulating frame, and vacuumizing for many times;
s10) placing the vacuumized assembly into a clamp, flatly clamping, fixing and drying: the same operation as step S8);
s11) carrying out plane milling on two surfaces of the assembly body to a preset size;
s12) processing a flow channel and a flow channel hole on the assembly body after plane milling;
s13) gold plating the processed fuel cell current density test bipolar plate.
9. The method as claimed in claim 8, wherein in step S7), a glue gun is used to match the needle to fill the insulating glue between the conductive sheet and the insulating frame; if the insulation paste is not enough after vacuumizing, the local part is supplemented with the paste and vacuumized again until the insulation paste is filled up and bubbles do not appear any more.
10. The method of processing a fuel cell current density test bipolar plate according to claim 8, wherein in step S13), a nickel layer with a thickness ranging from 0.1um to 3um is plated, and then an 18K gold layer with a thickness ranging from 0.1um to 3um is plated.
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CN112068019B (en) * 2020-09-08 2021-05-28 清华大学 Flat-plate SOFC current density distributed end plate test structure and test method
CN113334582A (en) * 2021-06-08 2021-09-03 一汽解放汽车有限公司 Graphite bipolar plate processing device and processing method
CN113701824B (en) * 2021-09-29 2022-09-02 中国科学院大连化学物理研究所 Device and method for testing local current density-temperature distribution of fuel cell
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