CN110058102A - Electronic component temperature-detecting device - Google Patents
Electronic component temperature-detecting device Download PDFInfo
- Publication number
- CN110058102A CN110058102A CN201910410449.8A CN201910410449A CN110058102A CN 110058102 A CN110058102 A CN 110058102A CN 201910410449 A CN201910410449 A CN 201910410449A CN 110058102 A CN110058102 A CN 110058102A
- Authority
- CN
- China
- Prior art keywords
- upper cover
- cover plate
- test
- electronic component
- compression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to a kind of electronic component temperature-detecting devices, comprising: pedestal support component, holds down assembly, gas guide board and upper cover plate, and the pedestal and upper cover plate form the test cavity of sealing, offers air inlet on upper cover plate；Support component is located at test inside cavity, support component include supporting support and with the rigidly connected mounting plate of supporting support, supporting support is mounted on the base；It holds down assembly and is set to above mounting plate, hold down assembly including compressing sucker and compressing sucker fixed plate, compress sucker fixed plate and gas guide board is connected, gas guide board is mounted on upper cover plate.Detection device of the invention can require to can change temperature field conduction orientation according to different electronic products, solve the problems, such as that original temperature test box is only capable of heat/cool down to test product in one direction, keep test process temperature field conduction orientation controllable, quickly changes dynamic particularly suitable for the small electronic component of weight and volume or electronic product temperature and test.
Description
Technical field
The invention belongs to electrical detection device field more particularly to a kind of electronic component temperature-detecting devices.
Background technique
Existing electronic product and electronic component temperature-detecting device are mainly based on static test, and electronic product work
Temperature field during work is dynamic process, needs to carry out dynamic test to electronic product.Dynamic is carried out to electronic equipment at present
When test, the mode of temperature varia is generallyd use, temperature varia makes experimental box body internal temperature equipped with fan
Uniformly, not set measured device fixes device in chamber for variation；The dynamic test temperature variation of temperature varia is slow
And equipment under test or element are directly put in test chamber body, cause it that can only heat in single direction to test product
Or it is cooling, temperature varia is primarily adapted for use in volume and the biggish element of quality or equipment.
But in practice in electronic equipment or electronic component course of normal operation, heating status is that bottom or surrounding are generated heat
Device heat radiation increases inside of electronic component temperature, especially some weight and volumes small electronic component or the ministry of electronics industry
Part, being affected for tested person temperature change is higher to temperature requirement, when the quick dynamic changing process of electronic product operating temperature
In, existing dynamic checkout unit can not achieve the radiation or heat transfer of multiple directions, be unable to satisfy test request, be unsuitable for simulation electricity
Sub- product use environment requirement.
Therefore, in order to be influenced by peripheral devices fever on its electric property when simulation electronic product normal work, having must
A kind of device for the test of electronic component dynamic temperature is provided.
Summary of the invention
The present invention provides a kind of electronics member device for deficiency existing for above-mentioned existing electronic component system for detecting temperature
Part temperature-detecting device can require to can change temperature field conduction orientation according to different electronic products, make test process temperature
Field conduction orientation is controllable.
To achieve the goals above, the present invention provides a kind of electronic component temperature-detecting devices, comprising: pedestal, branch
Support component and upper cover plate, the pedestal and the upper cover plate form the test cavity of sealing, offered on the upper cover plate into
Air port；The support component is set to the test inside cavity, the support component include supporting support and with the branch
The rigidly connected mounting plate of bracket is supportted, the supporting support is mounted on the base.
Preferably, the air inlet is set to the middle position of the upper cover plate inside upper surface.
It preferably, further comprise gas guide board, the gas guide board is mounted on the inside of the upper cover plate, is located at institute
State air inlet lower end.
It preferably, further include holding down assembly, described hold down assembly is set to above the mounting plate；The packet that holds down assembly
It includes and compresses sucker and compress sucker fixed plate, the compression sucker is installed in the compression sucker fixed plate, the compression
Sucker fixed plate is fixedly connected with the gas guide board.
Preferably, the supporting support is mounted by means of bolts on the pedestal, and the mounting plate is solid by bolt
Dingan County is in the supporting support；The compression sucker fixed plate is mounted by means of bolts on the gas guide board,
The gas guide board is mounted by means of bolts on the upper cover plate.
It preferably, further include holding down assembly, it is described to hold down assembly including compressing sucker and compressing sucker fixed plate, it is described
It compresses sucker to be installed in the compression sucker fixed plate, the compression sucker fixed plate is mounted on the upper cover plate.
Preferably, described to hold down assembly including multiple compression suckers, multiple compression suckers are in the compression sucker fixed plate
Opposed bottom face is uniformly distributed.
Preferably, the groove matched with the upper cover plate low side size, the upper cover plate peace are offered on the pedestal
Loaded in the groove with closed test cavity.
Compared with prior art, the advantages and positive effects of the present invention are:
The present invention provides a kind of temperature-detecting device for the temperature detection of electronic component, with existing temperature measuring box
It compares, by the way that mounting plate is arranged in temperature test inside cavity and holds down assembly, mounting plate forms certain the present invention with pedestal
Tested electronic component when electronic component temperature test, is directly placed on mounting plate, holds down assembly and pressed by space
Tightly.The gas of different temperatures enters in test chamber body, can be realized simultaneously to the multiple directions such as electronic component bottom and top
Heating/cooling.Temperature-detecting device of the invention can require to change temperature field conduction orientation, solution according to different electronic products
Original temperature test box of having determined only can make test process temperature the problem of test product is heated or cooled in single direction
It is controllable to spend field conduction orientation, is particularly suitable for electronic product, communication terminal, smart machine, capacitance resistance ware, quartz-crystal resonator
The temperature test of the electronic component or electronic component small etc. some weight and volumes.
Detailed description of the invention
Fig. 1 is the structure chart of temperature-detecting device of the invention；
Wherein: 1- pedestal, 2- support component, 21- supporting support, 22- mounting plate, 3- upper cover plate, 31- air inlet, 4- are surveyed
Examination cavity, 5- gas guide board, 6- hold down assembly, 61- compresses sucker, 62- compresses sucker fixed plate, 7- bolt.
Specific embodiment
In order to make those skilled in the art more fully understand application scheme, below in conjunction in the embodiment of the present invention
Attached drawing, technical solution in the embodiment of the present invention are explicitly described, it is clear that described embodiment is of the invention one
A embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making
Every other embodiment obtained, should fall within the scope of the present invention under the premise of creative work.
Description and claims of this specification and term " includes " and their any deformations in above-mentioned attached drawing, meaning
Figure, which is to cover, non-exclusive includes.Such as process, method or system comprising a series of steps or units, product or equipment do not have
It is defined in listed step or unit, but optionally further comprising the step of not listing or unit, or optionally also wrap
Include the other step or units intrinsic for these process, methods, product or equipment.In addition, term " first ", " second " and
" third " etc. is for distinguishing different objects, not for description particular order.
By taking the temperature test of patch type crystal oscillator as an example, existing temperature test cabinet is primarily adapted for use in more substantially the present embodiment
The temperature detection of long-pending electronic product, and patch type quartz crystal oscillator is small in size, heating status is bottom or surrounding heating device heat
Radiation increases its internal temperature, and during operating temperature quickly changes (dynamic), existing test cabinet can not achieve more
The radiation or heat transfer in a direction, moreover, being caused when the electronic component of small sizes such as existing temperature measuring box bulk measurement crystal oscillator
Testing cost waste, and measuring accuracy is poor.Therefore, it is generated heat by peripheral devices to it when quartz crystal oscillator works normally to simulate
The influence of electric property present embodiments provides a kind of temperature-detecting device suitable for the detection of patch type crystal oscillator.
Refering to what is shown in Fig. 1, a kind of electronic component temperature-detecting device, comprising: pedestal 1, support component 2 and upper cover plate
3, pedestal 1 and upper cover plate 3 form the test cavity 4 sealed, offer air inlet 31 on upper cover plate 3；Support component 2 is set to survey
Try cavity 4 inside, support component 2 include supporting support 21 and with the rigidly connected mounting plate 22 of supporting support 21, support branch
Frame 21 is mounted on pedestal 1.
Since mounting plate 22 is mounted in supporting support 21, supporting support 21 is mounted on pedestal 1, so that 22 frame of mounting plate
It is located at 4 middle part of test cavity, certain space is formed between pedestal 1, when crystal oscillator is tested, it is only necessary to be placed in tested crystal oscillator
On mounting plate 22, the gas of different temperatures flows into test cavity 4 by air inlet 31 and heats to quartz oscillator, gas
Body conducts in test cavity 4 along different directions, experiences tested quartz-crystal resonator upper and lower surfaces simultaneously
Test the temperature change inside cavity 4.Meanwhile being evenly distributed to make to test gas in cavity 4, air inlet 31 can be arranged
In the middle position of 3 inside upper surface of upper cover plate.
Gas guide board 5 is further provided in the heat transfer tested in cavity 4, the present embodiment in order to accelerate gas,
Gas guide board 5 is mounted on 3 inside of upper cover plate, is located at 31 lower end of air inlet, the top of mounting plate 22.The gas of different temperatures passes through
It crosses air inlet 31 to flow into test cavity 4, the water conservancy diversion of gas is carried out by gas guide board 5, accelerate the heat in test cavity 4
In the conduction of different directions, make to test 4 internal heat of cavity and be evenly distributed, allow tested quartz crystal oscillator simultaneously from bottom with it is upper
The temperature change of the different directions such as portion impression test inside cavity, temperature test ring when Fast simulation quartz crystal oscillator works normally
Border.
When to further prevent crystal oscillator to test, since the gas in test cavity 4 flows through senior general's patch crystal oscillator from mounting plate 22
On phenomena such as blowing off or crystal oscillator is caused to move on a mounting board generation.It is further provided in the present embodiment and holds down assembly 6, pressure
Tight component 6 is set to 22 top of mounting plate；Hold down assembly 6 include multiple compressions suckers 61 and compress sucker fixed plate 62, press
Tight sucker 61, which is installed on, to be compressed in sucker fixed plate 62, is uniformly distributed compressing 62 opposed bottom face of sucker fixed plate.Work as test
When device is provided with gas guide board 5, compresses sucker fixed plate 62 and gas guide board 5 is connected.I.e. supporting support 21 passes through spiral shell
Bolt 7 is fixedly mounted on pedestal 1, and mounting plate 22 is fixedly mounted in supporting support 21 by bolt 7；Compress sucker fixed plate 62
It is fixedly mounted on gas guide board 5 by bolt 7, gas guide board 5 is fixedly mounted on upper cover plate 3 by bolt 7.Crystal oscillator
When test, patch crystal oscillator is placed on mounting plate 22, is rigid connection between upper cover plate, mutually without relative displacement, upper cover
Plate 3 moves the quartz oscillator that will be placed vertically downward and is pressed on mounting plate 22, compresses sucker 61 and carries out to crystal oscillator
It is fixed, and contact 4 electrodes of quartz oscillator reliably with 4 electrodes on mounting plate.The gas of different temperatures passes through
It crosses the inflow test cavity 4 of air inlet 31 to heat quartz crystal oscillator, passes through the water conservancy diversion that gas guide board 5 carries out gas, accelerate
The intracorporal heat of test chamber makes test 4 internal heat of cavity be evenly distributed in the conduction of different directions, makes tested quartz crystal oscillator can
The temperature change of test inside cavity is experienced from the different directions such as bottom and top simultaneously.
If when being not provided with gas guide board 5 in test device or gas guide board 5 be not located at mounting plate 22 just on
Fang Shi, compressing sucker fixed plate 62 can be directly installed on upper cover plate 3, compress sucker 61 and be installed on compression sucker fixed plate 62
On.When crystal oscillator is tested, crystal oscillator is placed on mounting plate 22, and the mobile drive vertically downward of upper cover plate 3, which will compress sucker 61, to be placed
Quartz crystal oscillator be pressed on mounting plate 22, crystal oscillator is fixed, the gas of different temperatures flows into test by air inlet 31
Cavity 4 heats quartz crystal oscillator, and the heating to crystal oscillator different directions equally may be implemented.
Meanwhile for further strengthen test cavity 4 sealing effect, prevent test 4 internal gas heat of cavity outflow,
The present embodiment offers the groove matched with 3 low side size of upper cover plate on pedestal 1, and when test, upper cover plate 3 is installed on groove
It is interior with closed test cavity 4；Meanwhile pedestal 1 uses silica gel material, the coefficient of heat conduction is small, prevents the air-flow inside test cavity 4
It is connected with external air flow, keeps the analog temperature variation for testing environment more accurate, improve measuring accuracy.
It is worth noting that, temperature-detecting device of the invention is not limited in the measurement of patch type quartz crystal oscillator, this hair
Bright detection device can require to change temperature field conduction orientation according to different electronic products, solve existing temperature measuring box and be only capable of
The problem for carrying out heating/cooling down to test product in one direction keeps test process temperature field conduction orientation controllable.Temperature of the invention
Degree detection device is particularly suitable for such as electronic product, communication terminal, smart machine, capacitance resistance ware, quartz-crystal resonator
The light-weight temperature detection with electronic component and electronic product small in size.
Claims (8)
1. a kind of electronic component temperature-detecting device characterized by comprising pedestal, support component and upper cover plate, it is described
Pedestal and the upper cover plate form the test cavity of sealing, offer air inlet on the upper cover plate；The support component setting
In the test inside cavity, the support component include supporting support and with the rigidly connected installation of the supporting support
Plate, the supporting support are mounted on the base.
2. electronic component temperature-detecting device according to claim 1, which is characterized in that the air inlet is set to institute
State the middle position of upper cover plate inside upper surface.
3. electronic component temperature-detecting device according to claim 1 or 2, which is characterized in that further comprise gas
Deflector, the gas guide board are mounted on the inside of the upper cover plate, are located at the air inlet lower end.
4. electronic component temperature-detecting device according to claim 3, which is characterized in that it further include holding down assembly, institute
It states to hold down assembly and be set to above the mounting plate；It is described to hold down assembly including compressing sucker and compressing sucker fixed plate, institute
It states compression sucker to be installed in the compression sucker fixed plate, the compression sucker fixed plate and the fixed company of the gas guide board
It connects.
5. electronic component temperature-detecting device according to claim 4, which is characterized in that the supporting support passes through spiral shell
Bolt is fixedly mounted on the base, and the mounting plate is mounted by means of bolts in the supporting support；The compression is inhaled
Disk fixed plate is mounted by means of bolts on the gas guide board, and the gas guide board is mounted by means of bolts on institute
It states on upper cover plate.
6. electronic component temperature-detecting device according to claim 1, which is characterized in that it further include holding down assembly, institute
It states and holds down assembly including compressing sucker and compressing sucker fixed plate, the compression sucker is installed on the compression sucker fixed plate
On, the compression sucker fixed plate is mounted on the upper cover plate.
7. according to the described in any item electronic component temperature-detecting devices of claim 4-6, which is characterized in that the compression group
Part includes multiple compression suckers, and multiple compression suckers are uniformly distributed in the compression sucker fixed plate opposed bottom face.
8. electronic component temperature-detecting device according to claim 1, which is characterized in that offered on the pedestal with
The groove that the upper cover plate low side size matches, the upper cover plate are installed in the groove with closed test cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910410449.8A CN110058102A (en) | 2019-05-16 | 2019-05-16 | Electronic component temperature-detecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910410449.8A CN110058102A (en) | 2019-05-16 | 2019-05-16 | Electronic component temperature-detecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110058102A true CN110058102A (en) | 2019-07-26 |
Family
ID=67323406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910410449.8A Pending CN110058102A (en) | 2019-05-16 | 2019-05-16 | Electronic component temperature-detecting device |
Country Status (1)
| Country | Link |
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| CN (1) | CN110058102A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112684214A (en) * | 2020-12-16 | 2021-04-20 | 烟台职业学院 | Electronic and electric noise-proof device |
| CN113125023A (en) * | 2021-03-05 | 2021-07-16 | 深圳市福浪电子有限公司 | Detection device for detecting temperature of crystal oscillator |
| CN114061928A (en) * | 2021-11-08 | 2022-02-18 | 广东大普通信技术有限公司 | Oscillator testing device |
| CN114252723A (en) * | 2022-02-28 | 2022-03-29 | 杭州长川科技股份有限公司 | Temperature control test board |
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| JP3494871B2 (en) * | 1997-02-12 | 2004-02-09 | 東京エレクトロン株式会社 | Probe device and probe method |
| CN108414911A (en) * | 2018-03-01 | 2018-08-17 | 上海华岭集成电路技术股份有限公司 | The wide temperature test method of semiconductor |
| CN108414912A (en) * | 2018-03-01 | 2018-08-17 | 上海华岭集成电路技术股份有限公司 | Finished semiconductor high/low temperature multistation test device |
| CN108761236A (en) * | 2018-05-28 | 2018-11-06 | 北京智芯微电子科技有限公司 | Performance Test System and test method of the RFID tag under high/low temperature condition |
| CN108957272A (en) * | 2017-05-18 | 2018-12-07 | 汉民科技股份有限公司 | Semiconductor testing device |
| CN109596973A (en) * | 2018-12-29 | 2019-04-09 | 北京智芯微电子科技有限公司 | The test method of chip parameter under different temperatures |
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2019
- 2019-05-16 CN CN201910410449.8A patent/CN110058102A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3494871B2 (en) * | 1997-02-12 | 2004-02-09 | 東京エレクトロン株式会社 | Probe device and probe method |
| CN108957272A (en) * | 2017-05-18 | 2018-12-07 | 汉民科技股份有限公司 | Semiconductor testing device |
| CN108414911A (en) * | 2018-03-01 | 2018-08-17 | 上海华岭集成电路技术股份有限公司 | The wide temperature test method of semiconductor |
| CN108414912A (en) * | 2018-03-01 | 2018-08-17 | 上海华岭集成电路技术股份有限公司 | Finished semiconductor high/low temperature multistation test device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112684214A (en) * | 2020-12-16 | 2021-04-20 | 烟台职业学院 | Electronic and electric noise-proof device |
| CN112684214B (en) * | 2020-12-16 | 2022-07-01 | 烟台职业学院 | Electronic and electric noise-proof device |
| CN113125023A (en) * | 2021-03-05 | 2021-07-16 | 深圳市福浪电子有限公司 | Detection device for detecting temperature of crystal oscillator |
| CN114061928A (en) * | 2021-11-08 | 2022-02-18 | 广东大普通信技术有限公司 | Oscillator testing device |
| CN114252723A (en) * | 2022-02-28 | 2022-03-29 | 杭州长川科技股份有限公司 | Temperature control test board |
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Application publication date: 20190726 |
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