CN110055538A - A kind of alumina slurry and preparation method thereof - Google Patents

Abstract

The invention discloses a kind of alumina slurries, and the component including per hundred parts including following parts by weight: 5-30 parts of alumina powder, 1-5 parts of accelerator, 0.1-1 parts of dispersing agent, 0.1-1 parts of hardening resisting agent, water is surplus.Using having uniform particle diameter distribution made from above-mentioned raw materials, and with high grinding and polishing speed and polishing precision when polishing.In the preparation method of alumina slurry provided by the invention, the magnetisable material content of aluminium oxide slurries is controlled by magnetic separator, it can inhibit the generation of scar during the polishing process, the higher abradant surface of precision is obtained, has the characteristics that polishing speed is fast, polishing precision is high, the cleaning performance of polished product is excellent.The present invention is suitable for the surface polishing processing of the metals such as aluminium alloy, stainless steel and resin lens.

Description

A kind of alumina slurry and preparation method thereof

Technical field

The invention belongs to Material Field, it is related to a kind of alumina slurry and preparation method thereof, is used for more particularly to one kind The alumina slurry and preparation method thereof of the metal surface polishings processing such as aluminium alloy, stainless steel.

Background technique

It in recent years, is the metal of representative in electronic products such as phone housing, computer casing and frames using stainless steel, aluminium alloy In field using more and more, in these areas, the generation of metal blank is typically all to first pass through in numerically-controlled machine tool Cutter be cut into the semi-finished product of just tool shape, then reach mirror surface effect after processing technologys using a few step surface grindings polishing etc. Fruit.And pass through the metal surface of cutter cutting, and there are a large amount of knife marks, i.e., macroscopical scratch.Therefore, in practical applications, it is necessary to right It is surface-treated, its surface state is improved.By taking aluminium alloy as an example, traditional processing of surface polishing is three kinds: i.e. mechanical to throw Light, chemical polishing and electrochemical polish.1. mechanical polishing is processed by cutting or making material surface generation plastic deformation to remove The protrusion in face and obtain even surface.Common mechanical polishing mode has mechanical buff polishing, belt polishing, tumbling, vibration to throw Light, the polishing of super lappingout etc..Although mechanical polishing can remove aluminium surface greasy dirt, oxide skin and burr etc., to complex-shaped Part be difficult to polish, moreover, by mechanical polishing aluminum component be easy to happen grain boundary corrosion or stress-corrosion cracking.2. chemistry is thrown Light can be divided into acid polishing and alkaline polishing.Common acid polishing slurry has phosphoric acid-nitric acid, the bodies such as phosphorus acid-sulfur acid-nitric acid System." three acid " polishing body system generates a large amount of oxides of nitrogen gas i.e. yellow smog during the polishing process.The gas toxicity is big, right Human body has strong harm, while serious ground contamination environment.Basic chemical polishing is molten in alkalinity using aluminium and Al-alloy parts Selective autolyzing solution in liquid acts on to flatten and polish article surface, to improve the chemical method of its surface smoothness.3. electricity Chemical polishing is a kind of using electrolyte and the metal surface treating method of DC power supply, similar with plating, except that electric Chemical polishing part to be processed is exactly the opposite with being electroplated as anode.After electrolytic cell is powered, formed on being polished metal surface One layer of passivating film, metal ion are spread by this tunic, the high point and burr of micro- (macroscopic view) salient point and coarse place on surface The current density specific surface rest part in area is big, and with the dissolution of faster speed, to achieve the purpose that leveling and deburring.On Stating three kinds of methods has the advantages that respective, while also having segmental defect.

For medal polish, as the requirement of the global planarizartion and mirror effect of metal surface improves, chemical machine Tool polishing is the currently the only method that can be mass-produced.It is different from traditional purely mechanic or pure chemistry polishing method, chemistry (Chemical Mechanical Polishing, CMP) is mechanically polished by chemistry and mechanical comprehensive function, to keep away Surface damage caused by being polished as simple mechanical and the slow, surface smoothness by the polishing velocity that easily causes of pure chemistry polishing are exempted from The disadvantages of poor with polishing consistency.The Alpha-alumina in cmp method, has been widely used in integrated circuit and glass The surface polishing of the components such as glass substrate has many advantages, such as that high rigidity, stability are good；As chemically mechanical polishing abrasive material, α- Shape, the size of aluminium oxide all directly affect polishing effect.Abrasive Particle Size is smaller, and size distribution is narrower, i.e. homogeneity Better.Otherwise, it will lead to the polishing speed polished on unilateral everywhere to differ, keep polishing uneven, influence the equal of rubbing paste mass transfer The distribution of even property and on piece pressure, it is more serious to the damage on surface in polishing process, not only cause surface roughness larger, it is also easy The surface defects such as polishing scratch, pit occur influences polishing effect.

Disclose partially polished dose in the prior art, but the throwing that current polishing agent granulation uniformity is poor, corresponding Light effect is also poor, if CN1398939A " polishing composition and the polishing method for using it " discloses a kind of polishing composition, It includes: (a) at least one grinding agent selected from silica and aluminium oxide；(b) at least one organic compound, it is selected from poly- Ethylene oxide, polypropylene oxide, polyoxyethylene alkyl ether, polyoxypropylene alkyl ether, polyoxyethylene polyoxy-propylene and tool The polyoxyalkylene addition polymers of tri- key of C-C: wherein R1-R6 is respectively H or C1-10 alkyl, and X and Y are respectively ethyleneoxy or propylene Oxygroup, m and n are respectively the positive integers of 1-20；(c) at least one selected from stubborn rib acid, oxalic acid, tartaric acid, glycine, α-alanine With the compound of the acceleration polishing of histidine；(d) at least one to be selected from benzotriazole, benzimidazole, triazole, imidazoles and toluene three The anticorrosive of azoles；(e) hydrogen peroxide；And (f) water.But above method purpose is that developing one kind has appropriate layers of copper mill The polishing composition for cutting rate, using it polish copper with coexist containing tantalum compound polishing article when, will not be in thin copper film part Upper formation pit can reduce the chemical erosion to copper simultaneously.It invents simultaneously using the preferred 10-100nm of grinding agent partial size, institute Stating partial size is the average grain diameter obtained on the surface area measured by BET method.The above method is at high cost using nano-milled dose, And mainly for polishing article semiconductor integrated circuit polishing copper and coexisted containing tantalum compound；Above-mentioned grinding-material is average grain Diameter is not mentioned the information such as the size distribution to grinding agent, pattern, can not be judged the size distribution of subsequent polishing material；System Standby process additive is complicated, and the hazardous chemical containing strong oxidizer class, and preparation process is complicated, used in preparation process Chemicals are larger.

CN1316477A " polishing composition and polishing method of manufacture memory, hard disk " discloses a kind of for storing The polishing composition of device hard disk, the composition include at least 0.1-50% of the following components (a) in terms of polishing composition total amount (weight) at least one abrasive material, is selected from silica, aluminium oxide, cerium oxide, zirconium oxide, titanium oxide, silicon nitride and manganese dioxide. But described method provide a kind of polishing composition for memory, hard disk, applicable main abrasive material be selected from silica, Aluminium oxide, cerium oxide, iron oxide, silicon nitride, zirconium oxide and manganese dioxide.Abrasive material is not limited to any specific one in these abrasive materials Kind, but preferably silica.Aluminium oxide, zirconium oxide, titanium oxide and silicon nitride granularity be usually 0.01-1 microns, compared with It is well 0.05-0.3 microns.The granularity is the average particle size that the surface area measured by BET method converts, and is not mentioned to grinding The information such as size distribution, the pattern of grinding agent can not judge the size distribution of subsequent polishing material.But above-mentioned grinding-material In do not mention the information such as relevant size distribution, pattern, the size distribution of subsequent polishing material can not be judged；Preparation process Additive is complicated, and the hazardous chemical containing strong oxidizer class, and preparation process is complicated, chemicals used in preparation process Harmfulness is larger.But for different polishing objects, the application of polishing material composition is also different.

CN103952084A " a kind of preparation method of the metal-polishing liquid of alumina host " discloses a kind of alumina base The preparation method of the metal-polishing liquid of matter, which is characterized in that the preparation method comprises the following steps: (1) raw material selection, (2) Calcining, the test of (3) specific surface, (4) grinding, the test of (5) blowing, (6) solid content, (7) ingredient, (8) detection.The above method is not public It opens and which kind of metal is suitable for, the granularity requirements to aluminium oxide are that granularity Eligibility requirements are 1.5-2.0 μm；Although increasing " dispal " keeps slurry suspension more preferable, is not easy to precipitate, and does not point out which kind of substance " dispal " is；As grinding-material, do not mention To relevant size distribution, pattern etc.；But it is either used as powder body material or grinding-material, granularity and distribution are must to examine The index of amount, and size distribution is uneven, causes more serious to the damage on surface in polishing process containing bulky grain, not only causes Surface roughness is larger, polishing also easily occurs and draws.

Have real density larger in view of aluminium oxide, lead to storage and be easy precipitating in use process, leads to the benefit of polishing powder It is lower with rate.In order to eliminate above-mentioned undesirable situation, in recent years using the addition inhibition polishing material slurry in polishing material slurries The method of the so-called dispersing agent of grinding-material particle precipitation in liquid.Although dispersing agents many at present can be played to polishing The peptizaiton of powder.But since dispersing agent is easy to cause slurry to be more prone to produce colloid substance in standing or use process (gum-like), it is inevitable in intermittent operating process, polishing slurries generate after standing in the bottom of storage tank A large amount of colloid substance and be hardened, cause polishing powder to be difficult to stir, which results in the declines of the effective rate of utilization of polishing powder, simultaneously The colloid substance that is hardened is also to generate one of the key factor scratched.

Micro/nano level inorganic particle is evenly dispersed in other media, is always important a research topic and industry Problem.Dispersing agent is can to promote the surface-active class chemical substance that particle disperses in suspension.Surfactant contains oleophylic The entirely different chemical group with hydrophilic two kinds of characteristics can be divided into ionic and two kinds non-ionic.Dispersant and proportion The dispersibility of polishing fluid is influenced very big, it is however generally that, single use anionic surfactant mainly plays electrostatic stabilization and makees With；Single use nonionic surface active agent mainly plays space stability ultimate load.Meanwhile the selection and addition of dispersing agent, Other than considering the effects of suspending, dispersing, it is also necessary to consider the evaluation to viscosity, rheological property and application performance, including polishing The mechanism etc. of selection, the effect of device.Therefore, the problems such as solving suspension, dispersion, gum deposit (gum-like) also has important Meaning.

Therefore, the size distribution in polishing material directly affects polishing effect, therefore studies a kind of even particle size distribution Polishing material have great importance.

Summary of the invention

The technical problem to be solved in the present invention is to provide a kind of alumina slurry and preparation method thereof, wherein aoxidizing aluminium paste The even particle size distribution of material, polishing precision with higher；And preparation method is easy to operate, and the alumina slurry prepared Particle diameter distribution is uniform.

In order to solve the above technical problems, the technical solution used in the present invention is:

A kind of magnetic oxygenated aluminum slurry, the component including per hundred parts including following parts by weight:

5-30 parts of alumina powder, 1-5 parts of accelerator, 0.1-1 parts of dispersing agent,

0.1-1 parts of hardening resisting agent, water surplus.

Wherein, the water is deionized water, and the conductivity of water is 10-50us/cm.

As a kind of restriction of the invention, the alumina powder is tabular aluminium oxide.Wherein, different-shape aoxidizes Aluminium is all different polishing velocity, the polishing precision etc. of the metal surface polishings such as alloy, stainless steel.Compare the oxygen of other patterns Change aluminium, there is optimal polishing velocity using plate aluminium oxide and polishes the synergistic effect of precision.

The tabular aluminium oxide of the invention has similar pattern with tabular alumina.The knot of tabular alumina Structure is characterized in that its grain shape is hexagon sheet, and has lesser thickness and biggish radius-thickness ratio, and each particle has At least radius-thickness ratio of 10:1.Radius-thickness ratio is classified as greatly tabular alumina, illustrates that alumina particle diameter is big or thickness and obtains diameter thickness Than big；Radius-thickness ratio is small to be classified as plate-like aluminum oxide, illustrates that alumina particle diameter is small or thickness is big and it is small to obtain radius-thickness ratio；And plate Shape aluminium oxide, on the one hand the contact area of aluminium oxide and polishing device increases in use, the oxidation of another aspect tabular Aluminium has small radius-thickness ratio, and identical granular size thickness is big, with suitable wear-resisting property, polishing velocity, polishing precision etc. Collaboration.Although the contact area of the big aluminium oxide of radius-thickness ratio and polishing device can be bigger, alumina slurry will affect simultaneously Service life and be easily broken off, and then lead to the aluminium oxide of irregular pattern and influence the precision of polishing；Although radius-thickness ratio Small aluminium oxide service life is big, but leads to the degradations such as suspended dispersed because of the specific gravity of material.Therefore, the selection of material It is extremely important.

As further limiting for above-mentioned restriction, the median D of the alumina powder₅₀It is 3~10 μm, and meets D₉₄/D₅₀< 1.3, D₅₀/D₃< 1.5.The particle size test method of the alumina powder is tested using laser particle analyzer Granularity and distribution.Wherein D₃、D₅₀、D₉₄Equal descriptions are the terms of laser particle analyzer test material granularity.With D₅₀For, " D₅₀" refer to Be that the cumulative particle sizes percentile an of sample reaches partial size corresponding when 50%.Its physical significance is that partial size is greater than Its particle accounts for 50%, and the particle less than it also accounts for 50%.Polishing process can be guaranteed using the partial size of above-mentioned alumina powder In cooperateed with good polishing velocity with polishing precision.

It is limited as another kind of the invention, the accelerator is one in nitric acid, hydrochloric acid, acetic acid or aluminum soluble salt Kind, two or more combination.The accelerator that the present invention selects has acidity in aqueous solution, has centainly to metal Corrosiveness；And the anionic acid and Al come is dissociated in aqueous solution³⁺Also there is corrosiveness Deng to metal.

As further limiting for above-mentioned restriction, the aluminum soluble salt is the one of aluminum nitrate, aluminium chloride or aluminum sulfate Kind, two or more combination.

Limited as another kind of the invention, the dispersing agent be polyethylene glycol, Sodium Polyacrylate, calgon, One of cetyltrimethylammonium bromide or lauryl sodium sulfate, two or more combination.Wherein, not of the same race The dispersing agent of class is tested to aluminium oxide suspension, the influence of dispersion performance, while by polishing performance, and then this point screened Powder has preferable dispersion performance, reduces the generation of colloid substance.

It is limited as another kind of the invention, the hardening resisting agent is one in kaolin, bentonite, montmorillonite etc. Kind, two or more combination.Wherein, the hardening resisting agent expands rapidly to quickly form three-dimensional space in aqueous solution Between colloform texture aluminosilicate inorganic material, select the material can be improved grinding-material slurry have suspend, dispersion, increase The effects of thick, thixotroping, without generating glue connection.

As further limiting for above-mentioned restriction, the granularity D of the hardening resisting agent₅₀It is 1~3 μm.The present invention limits anti- The granularity of hardening agent promotes the peptization thixotroping of hardening resisting agent in aqueous solution, while will not be to slurry use process because particle is small In cause scratch etc. adverse effect.

The present invention also provides a kind of methods for preparing above-mentioned magnetic oxygenated aluminum slurry, include the following steps:

(1) dispersion of dispersing agent:

It adds a dispersant in water, shearing 0.5~1h of dispersion obtains solution A；Wherein, the weight of the dispersing agent and water Than for 0.0028~0.017:1；

(2) dispersion of hardening resisting agent:

Hardening resisting agent is added in solution A, shearing dispersion 0.5-2.5h, filtering obtains slurries B；Wherein, the anti-plate The mass ratio for tying agent and solution A is 0.0026~0.013:1；

(3) dispersion of accelerator:

Accelerator is added in slurries B under agitation, shearing dispersion 0.5-2.5h obtains slurries C；

(4) prepared by alumina slurry:

Alumina powder is added in slurries C under agitation, shearing dispersion 0.5-2.5h, filtering obtains slurries D；

(5) magnetisable material controls:

By slurries D by generating magnetization, the magnetic oxygenated aluminum slurry being finally made, wherein magnetic oxygenated aluminium paste through excitation The granule density of material by weight≤5ppm.

The wherein above method comprehensively considers the physics and chemistry of a variety of materials such as dispersing agent, hardening resisting agent, accelerator, aluminium oxide Energy and application performance, it is determined that reasonable process route and order of addition；Meanwhile the present invention is controlled by magnetisable material, is prevented In slurry may because of a variety of materials magnetisable materials such as iron rust that may be present in process of production and in production process of the present invention, These foreign matters will be in alumina slurry use process to one of an important factor for generating scratch in polishing device surface quality； Meanwhile the present invention uses this method, is equivalent to and carries out full inspection to slurry, although defines median rather than aluminium oxide differential And size distribution, but no matter sampling before testing do not get or test process in the reasons such as precipitating caused by missing inspection with right The influence of size distribution.

Due to the adoption of the above technical solution, compared with prior art, the present invention acquired technological progress is:

Alumina slurry of the invention selects tabular alumina powder as raw material, and controls the granularity point of aluminium oxide Cloth, wherein the median D of alumina powder₅₀It is 3~10 μm, and meets D₉₄/D₅₀< 1.3, D₅₀/D₃< 1.5, above-mentioned oxidation The size distribution of aluminium micro mist ensure that alumina slurry has uniform particle diameter distribution, and with high grinding and polishing when polishing Speed and precision；Aluminum oxide grain size as polishing is more uniform, particle size distribution is narrower, and polishing precision is higher.But separately Outside, one of an important factor for maximum particle size for controlling grinding and polishing powder is elimination scratch.The number of coarse granule content, The wear intensity and life of grinding and polishing powder are influenced, fine particle content then influences the mass effect of polishing.Therefore, have The granularity and its size distribution of effect ground control grinding and polishing powder have important meaning for improving wear intensity and polishing effect Justice.Meanwhile needing to comprehensively consider polishing object and polishing requirement, seek the balance for polishing precision and polishing velocity, and then basis It polishes object and polishing requires, seek reasonable average grain diameter and size distribution.In addition, the accelerator of addition can be mentioned effectively The grinding and polishing speed of high-alumina slurry；The dispersing agent and hardening resisting agent added in raw material, solves aluminium oxide in slurries Suspended dispersed performance, it is suppressed that the precipitating of alumina powder avoids the generation of sediment.Alumina slurry provided by the invention Preparation method in, by magnetic separator control aluminium oxide slurries magnetisable material content, can inhibit to hurt during the polishing process The generation of trace obtains the higher abradant surface of precision, has fast polishing speed, polishing precision height, the cleaning performance of polished product excellent The features such as different.

The present invention is suitable for the surface polishing processing of the metals such as aluminium alloy, stainless steel and resin lens.

The present invention is described in further detail below in conjunction with specific embodiment.

Detailed description of the invention

Fig. 1 is the SEM figure of tabular alumina powder in the embodiment of the present invention 1.

Fig. 2 is the SEM figure of mellow and full spherical aluminium oxide in comparative example of the invention.

Fig. 3 is the SEM figure of dumb-bell shape alumina powder in comparative example of the invention.

Specific embodiment

Embodiment 1

A kind of alumina slurry, the component including per hundred parts including following parts by weight:

Tabular alumina powder (its SEM figure is as shown in Figure 1) 5kg, aluminium chloride 1kg, polyethylene glycol 0.1kg,

Sodium Polyacrylate 0.2kg, kaolin 0.1kg, deionized water 93.6kg.

Wherein, the conductivity of deionized water is 10-50us/cm；The median D of the tabular alumina powder₅₀ It is 3.4 μm, and meets D₉₄/D₅₀It is 1.2, D₅₀/D₃It is 1.4；

The method for preparing above-mentioned alumina slurry is as follows:

(1) dispersion of dispersing agent: 0.1kg polyethylene glycol, 0.2kg sodium polyacrylate disperant are added to 93.6kg conductance Rate is in the water of 10us/cm, and shearing dispersion 0.5h obtains solution A；

(2) dispersion of hardening resisting agent: 0.1kg1 μm of kaolin (igloss weightlessness is 10%) is added in solution A, is sheared Disperse 0.5h and obtains slurries B through 500 mesh wet method filtrations；

(3) dispersion of accelerator: under agitation, 1kg aluminium chloride being added in slurries B, disperse 0.5h, slurries C；

(4) prepared by alumina slurry: 5kg alumina powder is added in slurries C under agitation, disperses 0.5h, Through 500 mesh wet method filtrations, slurries D is obtained；

(5) magnetisable material controls: by slurries D by through excitation and magnetized magnetic material made of magnetic separator, Control to magnetic particle concentration is not more than 5ppm by weight.

The suspension of alumina slurry made from the above method is good, without hardened property.

304 stainless steel substrates are polished using Unipol-802 polishing machine, is tested and is produced using the aluminium oxide slurries in the present embodiment Stainless steel surface quality after the polishing efficiency of product and polishing.Polishing efficiency is indicated with relative polishing rate.Method And Principle are as follows: advising Under fixed test condition, alumina slurry is tested to the throwing erosion amount (m of stainless steel substrates_p) and provide alumina slurry to stainless steel substrates Throwing erosion amount (m_p0The ratio between).It throws erosion amount to be by weight, subtracts stainless steel substrates after polishing for the weight of stainless steel substrates before polishing Weight.

Wherein, it is specified that test condition are as follows: Unipol-802 polishing machine；For fixing the loading block diameter of stainless steel substrates 80mm, weight 2kg；304 stainless steel substrates sizes: 38mm*42mm.

Test condition are as follows: the revolving speed of polishing machine is 53rpm/min, polishing time 10min, flow 3g/min, polishing Skin is polyurethane, and polishing operation is carried out under above-mentioned polishing condition.

Wherein, it is 5% that " regulation alumina slurry ", which is that alumina powder and pure water are configured to mass fraction in embodiment 1, Slurry.

Alumina slurry manufactured in the present embodiment, relative polishing rates 110%, it is 0 that stainless steel surface, which scratches,.Wherein, phase To polishing velocity compared with " regulation alumina slurry ", the polishing velocity of " regulation alumina slurry " is defined as 100%.

Embodiment 2-6

Embodiment 2-6 is respectively a kind of alumina slurry and preparation method thereof, involved in raw material and preparation method It is similar to Example 1, it the difference is that only the type and dosage of raw material, technical parameter involved in preparation method is different, Shown in table specific as follows:

The suspension of obtained alumina slurry in embodiment 2-6, alumina slurry made from the above method is good, Without hardened property.The test performance of obtained alumina slurry is evaluated and implements 1 identical, dependence test result in embodiment 2-6 It sees the above table.

The results show that the alumina slurry of embodiment 2-6, because the suspension of alumina slurry is good, without hardened property；This The alumina slurry correlation polishing velocity of preparation is invented between 110%-130%, illustrates that polishing speed is significantly mentioned It rises.Wherein, compared with " regulation alumina slurry ", the polishing velocity of " regulation alumina slurry " is defined as relative polishing rates 100%.Wherein, " regulation alumina slurry " is that alumina powder and pure water are configured to the slurry that mass fraction is 5% in embodiment 1 Material.

Comparative example

1, aluminium oxide different-shape control experiment

The preparation that alumina slurry is carried out using the aluminium oxide of different-shape, is respectively adopted irregular pattern aluminium oxide, circle Moisten spherical (its SEM figure is as shown in Figure 2) and dumb-bell shape aluminium oxide (its SEM figure is as shown in Figure 3), tabular aluminium oxide carry out in fact It tests, preparation method is same as Example 1, and experimental result is as follows:

As can be seen from the above table, because preparation method is same as Example 1, the presence containing dispersing agent, hardening resisting agent etc., The suspension of alumina slurry obtained is good, without hardened.But use plate aluminium oxide that there are high relative polishing rates；No It is serious that the slurry of regular morphology aluminium oxide preparation causes scuffing in use, while relative polishing rate is slow；Using circle Moisten the slurry of the spherical preparation with dumb-bell shape aluminium oxide in use because pattern is mellow and full, no scuffing but related polishing speed Slowly, therefore using alumina slurry relative polishing rates with higher and lesser scuffing rate made from tabular aluminium oxide.

2, different dispersing agents and hardening resisting agent control experiment are added

The preparation of alumina slurry is carried out using different dispersing agents and hardening resisting agent, wherein except dispersing agent and hardening resisting agent Except type and dosage, remaining prepares raw material and preparation method is same as Example 1, as follows as the result is shown:

As can be seen from the above table, the presence of dispersing agent, improves alumina slurry suspension, but the plate of alumina slurry It is serious to tie performance, although relative polishing rates are improved, scratch and exists；There are the addition of hardening resisting agent, aluminium oxide obtained Slurry is without suspension, and without hardened, but relative polishing rates slightly reduce, this is primarily due to the addition of hardening resisting agent, influences The effectively reduction of abrasive alumina particles in slurry, causes opposite polishing efficiency to reduce.And there are dispersing agent and hardening resisting agent Common presence, by the collaboration of different additive, alumina slurry obtained have good suspended dispersed performance, without plate Knot, relative polishing rates have reached 110, while without scuffing.

3, magnetic step comparative test is removed

In the preparation process of alumina slurry, if carry out the preparation result shadow except magnetic step operation to alumina slurry Sound is larger, and referring to the preparation method in embodiment 1, the comparison is as follows shown in table:

As can be seen from the above table, by removing magnetic technique, magnetisable material in a variety of materials is reduced, does not influence suspension not only Can, without hardened, also to scratch and inhibited.

The above described is only a preferred embodiment of the present invention, being not that the invention has other forms of limitations, appoint What those skilled in the art is changed or is modified as equivalent variations as enlightenment possibly also with above-mentioned technology contents Equivalent embodiment.But without departing from the technical solutions of the present invention, according to the technical essence of the invention to above embodiments Made simple modification, equivalent variations and remodeling, still fall within the protection scope of the claims in the present invention.

Claims (9)

1. a kind of alumina slurry, it is characterised in that: the component including per hundred parts including following parts by weight:

5-30 parts of alumina powder, 1-5 parts of accelerator, 0.1-1 parts of dispersing agent,

0.1-1 parts of hardening resisting agent, water surplus.

2. alumina slurry according to claim 1, it is characterised in that: the alumina powder is tabular oxidation Aluminium.

3. the alumina slurry stated according to claim 2, it is characterised in that: the median D of the alumina powder₅₀It is 3 ~10 μm, and meet D₉₄/D₅₀< 1.3, D₅₀/D₃< 1.5.

4. alumina slurry according to claim 1, it is characterised in that: the accelerator be nitric acid, hydrochloric acid, acetic acid or One of aluminum soluble salt, two or more combination.

5. alumina slurry according to claim 4, it is characterised in that: the aluminum soluble salt is aluminum nitrate, chlorination One kind of aluminium or aluminum sulfate, two or more combination.

6. alumina slurry according to claim 1, it is characterised in that: the dispersing agent is polyethylene glycol, polypropylene One of sour sodium, calgon, cetyltrimethylammonium bromide or lauryl sodium sulfate, two or more Combination.

7. alumina slurry according to claim 1, it is characterised in that: the hardening resisting agent be kaolin, bentonite, One of montmorillonite etc., two or more combination.

8. alumina slurry according to claim 7, it is characterised in that: the granularity D of the hardening resisting agent₅₀For 1~3 μ m。

9. a kind of prepare the method such as alumina slurry according to any one of claims 1 to 8, it is characterised in that: including such as Lower step:

(1) dispersion of dispersing agent:

It adds a dispersant in water, shearing 0.5~1h of dispersion obtains solution A；Wherein, the mass ratio of the dispersing agent and water is 0.0028~0.017:1；

(2) dispersion of hardening resisting agent:

Hardening resisting agent is added in solution A, is beaten with water, shearing dispersion 0.5-2.5h, filtering obtains slurries B；Wherein, described Hardening resisting agent and the mass ratio of solution A are 0.0026~0.013:1；

(3) dispersion of accelerator:

Accelerator is added in slurries B under agitation, shearing dispersion 0.5-2.5h obtains slurries C；

(4) prepared by alumina slurry:

Alumina powder is added in slurries C under agitation, shearing dispersion 0.5-2.5h, filtering obtains slurries D；

(5) magnetisable material controls:

By slurries D by generating magnetization, the magnetic oxygenated aluminum slurry being finally made, wherein magnetic oxygenated aluminum slurry through excitation Granule density by weight≤5ppm.