CN110052962A - A kind of polishing pad trimmer, processing unit (plant) and method - Google Patents
A kind of polishing pad trimmer, processing unit (plant) and method Download PDFInfo
- Publication number
- CN110052962A CN110052962A CN201910339084.4A CN201910339084A CN110052962A CN 110052962 A CN110052962 A CN 110052962A CN 201910339084 A CN201910339084 A CN 201910339084A CN 110052962 A CN110052962 A CN 110052962A
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- China
- Prior art keywords
- base station
- abrasive grains
- polishing pad
- abrasive
- trimmer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
Abstract
The present invention provides a kind of polishing pad trimmer, processing unit (plant) and method, polishing pad trimmer includes: base station, an at least side surface for the base station is equipped with the abrasive grains of multiple and different partial sizes, and the end face of all abrasive grains on every side surface is located on the same plane parallel with the plane where the base station.Polishing pad trimmer according to the present invention, the surface of base station is equipped with the abrasive grains of multiple and different partial sizes, the end face of all abrasive grains on every side surface is located on the same plane parallel with the plane where base station, so that the abrasive grains end face of trimmer is generally aligned in the same plane, guarantee the planarization on trimmer surface, the finishing effect of finishing polishing pad is improved, number and the time of trimmer finishing polishing pad is reduced, improves dressing efficiency.
Description
Technical field
The present invention relates to polishing technology field, in particular to a kind of polishing pad trimmer, processing unit (plant) and method.
Background technique
Pad interface state is one of the important parameter for influencing silicon wafer quality, in order to polish the surface property of silicon wafer
It is improved and is maintained with the batch production stability of silicon wafer afterwards, we would generally lead to before polishing for the first time and repeatedly after polishing
It crosses special trimmer to modify polishing pad, and then restores its surface characteristic.Usually in finishing polyurathamc polishing pad
When, if diamond grain particle size number is too small, hard abrasive grain can be stuck in the hole of foaming portion, be caused in polishing pad
The hole of foaming portion occludes；In addition, since abrasive grain attenuates, from being unable to fully be roughened the surface of polishing pad.
During modifying polishing pad, the abrasive grains of trimmer directly affect the finishing effect of polishing pad, in order to make to repair
The height of the contact surface of abrasive grains and polished pad on whole device maintains in the same plane, to need for annular trimmer to be cut into
If stem portion, the thickness of the height of pedestal and diamond piece on trimmer is then adjusted again, with the increase of use time, is entirely repaired
The stability of the shape of whole device is bad, and precision is difficult to control, and causes grinding effect poor.In existing trimmer, if by abrasive grains
It is fixed on a trimmer, needs trimmer being divided into multiple portions, abrasive grains are fixed on a complete trimmer,
Trimmer surface irregularity causes grinding effect poor；In addition, usually polishing pad needs multiple repairing containing single particle size abrasive grains
Whole device is repeatedly modified, and the finishing time is long, and complicated dressing process is difficult to ensure that its finishing effect, dressing efficiency are low.
Summary of the invention
In view of this, the present invention provides a kind of polishing pad trimmer, processing unit (plant) and method, for solving polishing pad finishing
The problem of device finishing effect is bad, low efficiency.
In order to solve the above technical problems, the invention adopts the following technical scheme:
The polishing pad trimmer of embodiment according to a first aspect of the present invention, comprising:
Base station, an at least side surface for the base station are equipped with the abrasive grains of multiple and different partial sizes, the institute on every side surface
There is the end face of the abrasive grains to be located on the same plane parallel with the plane where the base station.
Further, multiple abrasive grains on every side surface include having the first abrasive grains of the first partial size and having
Second abrasive grains of the second partial size, first partial size is different from second partial size, and first abrasive grains are located at the base
The first area of platform, second abrasive grains are located at the second area of the base station, the first area on every side surface and
The second area is circumferentially distributed along the base station.
Further, the first area is with the second area along the circumferentially staggered distribution of the base station.
Further, the abrasive grains of multiple and different partial sizes, every side table are respectively equipped in the both side surface of the base station
The end face of all abrasive grains on face is located on the same plane parallel with the plane where the base station.
Further, the base station is formed as annulus.
Further, the base station be equipped with first annulus coaxial with the base station, at least the one of first annulus
Side surface is equipped with the abrasive grains of multiple and different partial sizes, the end face of the abrasive grains on every side surface on first annulus and institute
The end face for stating the abrasive grains on the same surface on base station is coplanar.
The processing unit (plant) of the polishing pad trimmer of embodiment according to a second aspect of the present invention, comprising:
Bearing structure, for carrying polishing pad trimmer, on an at least side surface for the base station of the polishing pad trimmer
Abrasive grains equipped with multiple and different partial sizes；
Abrasive structure, the abrasive structure is used to grind the abrasive grains on the base station of the polishing pad trimmer, so that institute
The end face for stating all abrasive grains on every side surface of base station is located at parallel with the plane where the base station same put down
On face.
Further, the abrasive structure includes:
Upper abrasive structure and lower abrasive structure, the bearing structure be rotationally arranged at the upper abrasive structure with it is described
Between lower abrasive structure.
Further, the processing unit (plant) further include:
Internal gear and the external gear being coaxially disposed with the internal gear, the bearing structure are that periphery is formed with external gear teeth
Disk, the external gear teeth of the bearing structure foreign steamer tooth engagement with the interior gear teeth of the internal gear and the external gear respectively, institute
State the rotation axis of abrasive structure and the lower abrasive structure and the axis collinear of external gear rotation.
The processing method of the polishing pad trimmer of embodiment according to a third aspect of the present invention, comprising the following steps:
Step S1 is formed with the abrasive grains of multiple and different partial sizes on an at least side surface for base station；
The base station is placed in bearing structure by step S2；
Step S3 grinds the abrasive grains on the base station on the polishing pad trimmer by abrasive structure so that every side surface
On the end faces of all abrasive grains be located on the same plane parallel with the plane where the base station.
Further, the step S1 includes:
First area on an at least side surface for the base station forms first abrasive grains with the first partial size, in institute
The second area stated on an at least side surface for base station forms second abrasive grains with the second partial size, first partial size and institute
The second partial size difference is stated, the first area and the second area on every side surface are along the circumferentially distributed of the base station.
The advantageous effects of the above technical solutions of the present invention are as follows:
Polishing pad trimmer according to the present invention, the surface of base station are equipped with the abrasive grains of multiple and different partial sizes, every side table
The end face of all abrasive grains on face is located on the same plane parallel with the plane where base station, so that the abrasive grains of trimmer
End face is generally aligned in the same plane, and guarantees the planarization on trimmer surface, improves the finishing effect of finishing polishing pad, is reduced trimmer and is repaired
The number of whole polishing pad and time improve dressing efficiency.
Detailed description of the invention
Fig. 1 a is a structural schematic diagram of the polishing pad trimmer of the embodiment of the present invention；
Fig. 1 b is another structural schematic diagram of the polishing pad trimmer of the embodiment of the present invention；
Fig. 1 c is another structural schematic diagram of the polishing pad trimmer of the embodiment of the present invention；
Fig. 2 is the local distribution schematic diagram of the abrasive grains of the polishing pad trimmer of the embodiment of the present invention；
Fig. 3 a is another structural schematic diagram of the polishing pad trimmer of the embodiment of the present invention；
Fig. 3 b is another structural schematic diagram of the polishing pad trimmer of the embodiment of the present invention；
Fig. 4 a is the schematic diagram before the abrasive grains grinding of the polishing pad trimmer of the embodiment of the present invention；
Fig. 4 b is the schematic diagram after the abrasive grains grinding of the polishing pad trimmer of the embodiment of the present invention；
Fig. 5 a is a structural schematic diagram of the processing unit (plant) of the polishing pad trimmer of the embodiment of the present invention；
Fig. 5 b is a top view of the processing unit (plant) of the polishing pad trimmer of the embodiment of the present invention.
Appended drawing reference
Base station 10；Abrasive grains 11；
First annulus 20；
Bearing structure 30；
Upper abrasive structure 40；Top lap 41；Upper grinding pad 42；
Lower abrasive structure 50；Lower abrasive disk 51；Lower grinding pad 52；
Internal gear 60；
External gear 70.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
Attached drawing, the technical solution of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this hair
Bright a part of the embodiment, instead of all the embodiments.Based on described the embodiment of the present invention, ordinary skill
Personnel's every other embodiment obtained, shall fall within the protection scope of the present invention.
Polishing pad trimmer according to an embodiment of the present invention is specifically described in conjunction with attached drawing first below.
As shown in Fig. 1 a to Fig. 5 b, polishing pad trimmer according to the present invention includes base station 10, at least side of base station 10
Surface is equipped with the abrasive grains 11 of multiple and different partial sizes, and the end face of all abrasive grains 11 on every side surface is located at and 10 institute of base station
The parallel same plane of plane on.
That is, polishing pad trimmer is mainly made of base station 10, wherein can be on an at least side surface for base station 10
Abrasive grains 11 equipped with multiple and different partial sizes, abrasive grains 11 can be uniformly distributed, and can be equipped with multiple points on the surface of base station 10
The abrasive grains of different-grain diameter are located on dispersible tablet by discrete piece.The shape of base station 10 can there are many kinds of, as shown in Figure 1a, base station
10 shape can be annular, the dispersible tablet of different the piece numbers can be equipped on annular base station 10, the quantity of dispersible tablet can basis
It needs to design, for example can be 6,8 or 12 etc., the abrasive grains of different-grain diameter can be set on dispersible tablet；As shown in Figure 1 b
Not have dispersible tablet on annular base station, abrasive grains are directly loaded on base station.It can be equipped on a side surface of base station 10 more
The abrasive grains 11 of a different-grain diameter can also be respectively equipped with the abrasive grains of multiple and different partial sizes in the both side surface of base station 10
11, the partial size of abrasive grains 11 may include it is a variety of, can reasonably select according to actual needs, the institute on every side surface of base station 10
There is the end face of abrasive grains 11 to be located on the same plane parallel with the plane where base station 10, that is to say, abrasive grains 11 are located at base
The one end on the surface of platform 10, abrasive grains 11 is connect with base station 10, and the other end of abrasive grains 11 is far from base station 10, the end of abrasive grains 11
Face refers to that the end face of the other end of abrasive grains 11, end face are parallel with the plane where base station 10, all grindings on every side surface
The end face of grain 11 is located on the same plane parallel with the plane where base station 10, so that the abrasive grains end face of trimmer is located at together
One plane guarantees the planarization on trimmer surface, improves the finishing effect of finishing polishing pad, in the mistake of trimmer finishing polishing pad
It can prevent the hole on polishing pad from blocking in journey, also pad interface can be made adequately to be roughened, reduce trimmer finishing and throw
The number of light pad and time improve dressing efficiency.
In some embodiments of the invention, as shown in Fig. 2, multiple abrasive grains 11 on every side surface may include having
First abrasive grains of the first partial size and the second abrasive grains with the second partial size, the first partial size is different from the second partial size, and first grinds
Abrasive grain can be located at the first area of base station 10, and the first abrasive grains can be uniformly distributed in first area, and the second abrasive grains can be with
Be located at the second area of base station 10, the second abrasive grains can be uniformly distributed in second area, the first area on every side surface and
Second area can be spaced apart distribution along the circumferentially distributed of base station 10, first area and second area.Optionally, the firstth area
Domain and second area can be distributed, by first area and second along the circumferentially staggered distribution of base station 10 with uniform crossover
Region is equipped with the abrasive grains of different-grain diameter, can preferably grinding and polishing pad, improve polishing effect.
In other embodiments of the invention, multiple and different partial sizes can be respectively equipped in the both side surface of base station 10
The end face of abrasive grains 11, all abrasive grains 11 on every side surface is located at the same plane parallel with the plane where base station 10
On, guarantee the end face planarization of the abrasive grains on trimmer surface, improves the finishing effect of finishing polishing pad.
Optionally, base station 10 can be formed as annulus, first area and second area can along the circumferentially distributed of base station 10,
The abrasive grains of different-grain diameter can be respectively set on first area and second area, simplify the structure of base station, be convenient for abrasive grains
Modify polishing pad.
According to some embodiments of the present invention, as illustrated in figure 1 c, first coaxial with base station 10 can be equipped on base station 10
Annulus 20, the first annulus 20 can be connected by beam column with base station, can be equipped on an at least side surface for the first annulus 20 more
The abrasive grains 11 of a different-grain diameter, the end face of the abrasive grains 11 on every side surface on the first annulus 20 with it is ipsilateral on base station 10
The end face of abrasive grains 11 on surface is coplanar.The grinding of multiple and different partial sizes can be respectively set in the both side surface of base station 10
Grain 11, while can be respectively set the abrasive grains 11 of multiple and different partial sizes in the both side surface of the first annulus 20, by the
The abrasive grains that one annulus 20 is equipped with different-grain diameter can enhance grinding effect, improve the finishing effect of finishing polishing pad.
Polishing pad trimmer according to the present invention, the surface of base station are equipped with the abrasive grains of multiple and different partial sizes, every side table
The end face of all abrasive grains on face is located on the same plane parallel with the plane where base station, so that the abrasive grains of trimmer
End face is generally aligned in the same plane, and guarantees the planarization on trimmer surface, improves finishing effect, improves dressing efficiency.
As shown in figure 5 a and 5b, the present invention also provides a kind of processing unit (plant) of polishing pad trimmer, processing unit (plant) includes
Base station 10 can be placed in carrying knot for carrying polishing pad trimmer by bearing structure 30 and abrasive structure, bearing structure 30
On structure 30, an at least side surface for the base station 10 of polishing pad trimmer is equipped with the abrasive grains 11 of multiple and different partial sizes.Grinding knot
Structure can be used for the abrasive grains 11 on the base station of grinding and polishing dresser, so that all grindings on every side surface of base station 10
The end face of grain 11 is located on the same plane parallel with the plane where base station 10, enables to modify by above-mentioned processing unit (plant)
The abrasive grains end face of device is generally aligned in the same plane, and guarantees the planarization on trimmer surface, convenient for improving trimmer finishing polishing pad
Finishing effect.
In some embodiments of the invention, abrasive structure may include upper abrasive structure 40 and lower abrasive structure 50, hold
Structure 30 is carried to be rotationally arranged between abrasive structure 40 and lower abrasive structure 50, it can be by the base station of polishing pad trimmer
10 are placed in bearing structure 30, and base station 10 can be rotated with bearing structure 30, in order to which abrasive structure can grind base station
Abrasive grains on 10 surfaces.Optionally, upper abrasive structure 40 may include top lap 41 and be located at upper on top lap 41
Grinding pad 42, lower abrasive structure 50 may include the lower lower grinding pad 52, Ke Yitong abrasive disk 51 and be located on lower abrasive disk 51
Grinding pad 42 and lower grinding pad 52 are crossed to grind the abrasive grains on 10 surface of base station, so that the different-grain diameter on base station 10 is ground
The end face of abrasive grain is located on the same plane parallel with the plane where base station 10.Further, top lap 41 and lower grinding
Disk 51 needs to guarantee hardness, and Steel material, molybdenum material, chromium material and tungsten material etc. may be selected in top lap 41 and lower abrasive disk 51,
To meet hardness and strength requirement.The ingredient of upper grinding pad 42 and lower grinding pad 52 may include: diamond abrasive 5-10%, glue
Stick 70-75%, clout are filler material, guarantee grinding effect.
In other embodiments of the invention, processing unit (plant) can also include internal gear 60 and coaxially set with internal gear 60
The external gear 70 set, bearing structure 30 are disk, and the periphery of bearing structure 30 could be formed with external gear teeth, bearing structure 30 it is outer
The gear teeth can respectively with the interior gear teeth of internal gear 60 and external gear 70 foreign steamer tooth engagement, bearing structure 30 can rotate, above grind
The axis collinear that the rotation axis and external gear 70 for grinding structure 40 and lower abrasive structure 50 rotate.During the grinding process, it can incite somebody to action
Base station containing varigrained polishing pad trimmer is placed in bearing structure 30, upper abrasive structure 40 and lower abrasive structure 50
Rotation can be carried out around axle shaft, the base station of trimmer can be in upper abrasive structure 40 and lower abrasive structure 50 and internal gear
60, cycloid motion is done under the collective effect of external gear 70.A certain amount of abrasive pastes can be added while grinding, for example, grinding
Mill cream can be made of synthetic diamond micropowder, vaseline oil, glycerin monostearate, stearic acid, glycerine and vaseline, thus
The flatness for improving the end face of the abrasive grains on the base station of trimmer during the grinding process, after the completion of finishing, can use high pressure water
Rifle is cleaned, and the pressure that high-pressure gun sprays water is not less than 10Mpa, to clean the base station after finishing.
In actual application, polishing pad trimmer can be modified by above-mentioned processing unit (plant), it can will be after finishing
Polishing pad trimmer be used to modify to be used or nonexpondable polishing pad, as shown in Figure 3a and Figure 3b shows, be attached to up and down
Polishing pad on polishing plate can be respectively upper polishing pad 81 and lower polishing pad 82, by the polishing pad trimmer after above-mentioned finishing point
It is not embedded between internal gear 83 and external gear 84, in dressing process, upper and lower polishing plate carries out rotation around axle shaft, passes through
The rotation of trimmer is to modify the surface of upper polishing pad 81 and lower polishing pad 82.
Polishing pad trimmer is carried by bearing structure 30, base station 10 can be placed in bearing structure 30, by grinding
Grinding structure can be with the abrasive grains 11 on the base station of grinding and polishing dresser, so that all grindings on every side surface of base station 10
The end face of grain 11 is located on the same plane parallel with the plane where base station 10, so that the abrasive grains end face of trimmer is located at together
One plane guarantees the planarization of the end face of abrasive grains on the base station of trimmer, improves the finishing effect of trimmer, and then can be fast
Speed efficiently modifies polishing pad and improves silicon wafer production efficiency.
The present invention also provides a kind of processing methods of polishing pad trimmer, comprising the following steps:
Step S1 is formed with the abrasive grains 11 of multiple and different partial sizes on an at least side surface for base station 10；
Base station 10 is placed in bearing structure 30 by step S2；
Step S3, by the abrasive grains 11 on the base station 10 on abrasive structure grinding and polishing dresser so that every side surface
On the end faces of all abrasive grains 11 be located on the same plane parallel with the plane where base station 10.Polishing as shown in Figure 4 a
Schematic diagram before the abrasive grains grinding of dresser, the end face of the abrasive grains of the different-grain diameter on base station is not in the same plane；
It is as shown in Figure 4 b the schematic diagram after the abrasive grains grinding of polishing pad trimmer, the abrasive grains of the different-grain diameter after grinding on base station
End face in the same plane.The above method is applied to the grinding that above-mentioned processing unit (plant) enables to the different-grain diameter on base station
In the same plane, the effect of the polishing pad trimmer finishing polishing pad processed is good for the end face of grain, improves the finishing of polishing pad
Efficiency.
In some embodiments of the invention, the step S1 may include: on an at least side surface for base station 10
First area forms first abrasive grains with the first partial size, and the second area on an at least side surface for base station 10 forms tool
There are the second abrasive grains of the second partial size, the first partial size is different from the second partial size, first area and second area on every side surface
It can preferably be ground along the circumferentially distributed of base station 10 by being equipped with the abrasive grains of different-grain diameter in first area and second area
Polishing pad is ground, polishing effect and efficiency are improved.
Unless otherwise defined, technical term or scientific term used in the present invention are should be in fields of the present invention
The ordinary meaning that personage with general technical ability is understood." first ", " second " used in the present invention and similar word
It is not offered as any sequence, quantity or importance, and is used only to distinguish different component parts." connection " or " connected "
It is not limited to physics or mechanical connection etc. similar word, but may include electrical connection, either directly
Or it is indirect."upper", " waits and is only used for indicating relative positional relationship, when the absolute position for being described object changes at "lower"
Afterwards, then the relative positional relationship also correspondingly changes.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (11)
1. a kind of polishing pad trimmer characterized by comprising
Base station, an at least side surface for the base station are equipped with the abrasive grains of multiple and different partial sizes, all institutes on every side surface
The end face for stating abrasive grains is located on the same plane parallel with the plane where the base station.
2. polishing pad trimmer according to claim 1, which is characterized in that multiple abrasive grains packets on every side surface
Include the first abrasive grains with the first partial size and the second abrasive grains with the second partial size, first partial size with described second
Diameter is different, and first abrasive grains are located at the first area of the base station, and second abrasive grains are located at the second of the base station
Region, the first area and the second area on every side surface are along the circumferentially distributed of the base station.
3. polishing pad trimmer according to claim 2, which is characterized in that the first area and the second area edge
The circumferentially staggered distribution of the base station.
4. polishing pad trimmer according to claim 1, which is characterized in that be respectively equipped in the both side surface of the base station
The abrasive grains of multiple and different partial sizes, the end face of all abrasive grains on every side surface be located at where the base station
On the parallel same plane of plane.
5. polishing pad trimmer according to claim 1, which is characterized in that the base station is formed as annulus.
6. polishing pad trimmer according to claim 5, which is characterized in that the base station is equipped with coaxial with the base station
The first annulus, at least side surface of first annulus is equipped with the abrasive grains of multiple and different partial sizes, first annulus
On every side surface on abrasive grains end face it is coplanar with the end face of abrasive grains on the same surface on the base station.
7. a kind of processing unit (plant) of polishing pad trimmer characterized by comprising
Bearing structure, for carrying polishing pad trimmer, an at least side surface for the base station of the polishing pad trimmer is equipped with
The abrasive grains of multiple and different partial sizes；
Abrasive structure, the abrasive structure is used to grind the abrasive grains on the base station of the polishing pad trimmer, so that the base
The end face of all abrasive grains on every side surface of platform is located on the same plane parallel with the plane where the base station.
8. processing unit (plant) according to claim 7, which is characterized in that the abrasive structure includes:
Upper abrasive structure and lower abrasive structure, the bearing structure be rotationally arranged at the upper abrasive structure with it is described under grind
It grinds between structure.
9. processing unit (plant) according to claim 8, which is characterized in that further include:
Internal gear and the external gear being coaxially disposed with the internal gear, the bearing structure are the circle that periphery is formed with external gear teeth
Disk, the external gear teeth of the bearing structure foreign steamer tooth engagement with the interior gear teeth of the internal gear and the external gear respectively are described
The axis collinear of the rotation axis and external gear rotation of upper abrasive structure and the lower abrasive structure.
10. a kind of processing method of polishing pad trimmer, which comprises the following steps:
Step S1 is formed with the abrasive grains of multiple and different partial sizes on an at least side surface for base station；
The base station is placed in bearing structure by step S2；
Step S3 grinds the abrasive grains on the base station on the polishing pad trimmer by abrasive structure so that on every side surface
The end face of all abrasive grains is located on the same plane parallel with the plane where the base station.
11. processing method according to claim 10, which is characterized in that the step S1 includes:
First area on an at least side surface for the base station forms first abrasive grains with the first partial size, in the base
Second area on an at least side surface for platform forms second abrasive grains with the second partial size, first partial size and described the
Two partial sizes are different, and the first area and the second area on every side surface are along the circumferentially distributed of the base station.
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| CN103991033A (en) * | 2013-02-15 | 2014-08-20 | 硅电子股份公司 | Method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafers |
| US20140235143A1 (en) * | 2013-02-15 | 2014-08-21 | Siltronic Ag | Method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafers |
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Application publication date: 20190726 |