CN110050761A - Insect body quality comprehensive test instrument - Google Patents
Insect body quality comprehensive test instrument Download PDFInfo
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- CN110050761A CN110050761A CN201910438077.XA CN201910438077A CN110050761A CN 110050761 A CN110050761 A CN 110050761A CN 201910438077 A CN201910438077 A CN 201910438077A CN 110050761 A CN110050761 A CN 110050761A
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- 241000238631 Hexapoda Species 0.000 title claims abstract description 57
- 210000000689 upper leg Anatomy 0.000 claims abstract description 15
- 239000000523 sample Substances 0.000 claims abstract description 12
- 208000006877 Insect Bites and Stings Diseases 0.000 claims abstract description 4
- 239000003990 capacitor Substances 0.000 claims description 144
- 230000005669 field effect Effects 0.000 claims description 29
- 239000013078 crystal Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 18
- 230000001052 transient effect Effects 0.000 claims description 17
- 230000005611 electricity Effects 0.000 claims description 13
- 230000001629 suppression Effects 0.000 claims description 11
- 102100032533 ADP/ATP translocase 1 Human genes 0.000 claims description 6
- 101000768061 Escherichia phage P1 Antirepressor protein 1 Proteins 0.000 claims description 6
- 101000796932 Homo sapiens ADP/ATP translocase 1 Proteins 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 102100026396 ADP/ATP translocase 2 Human genes 0.000 claims description 3
- 101100156949 Arabidopsis thaliana XRN4 gene Proteins 0.000 claims description 3
- 102100026190 Class E basic helix-loop-helix protein 41 Human genes 0.000 claims description 3
- 101000718417 Homo sapiens ADP/ATP translocase 2 Proteins 0.000 claims description 3
- 101000765033 Homo sapiens Class E basic helix-loop-helix protein 41 Proteins 0.000 claims description 3
- 101100215777 Schizosaccharomyces pombe (strain 972 / ATCC 24843) ain1 gene Proteins 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 241000238814 Orthoptera Species 0.000 description 12
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 210000002414 leg Anatomy 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- A01K67/033—
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- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The present invention discloses a kind of insect body quality comprehensive test instrument, comprising: probe, for measuring insect bite force and kick with the thigh leg strength；Micro treatment module, the data for obtaining to probe are analyzed and are stored；Antenna, the information exchange for micro treatment module and host computer；Display module, for that information will be shown after micro treatment module is handled；Connector, for micro treatment module to be connect with display；Power module, for being powered to all parts.The present invention can detect insect kick with the thigh leg strength amount and mouthpart bite force, without with hand contact insect both achievable kick with the thigh leg strength amounts and mouthpart bite force to insect, while can also reduce raiser cause because of contact insect death there is a situation where.
Description
Technical field
The present invention relates to technical field of electronic equipment.Specifically a kind of insect body quality comprehensive test instrument.
Background technique
With the improvement of living standards, more and more people start to raise pet, wherein just include insect, as katydid,
Cricket etc..For the insect of katydid, cricket etc, raiser needs from katydid, the figure of cricket, color and certain special
Details (such as head shape) can not pass through some intuitive numbers the physical fitness of insect that recognizes oneself purchase or capture
According to analyzing, such as the kicking strength of thigh, occlusal ability of mouthpart etc., if directly contacting katydid or cricket with hand to feel
Touch the strength and mouthpart occlusal ability of the kicking of its thigh, it is likely that will cause katydid or cricket body damage, as the falling off of leg,
The disconnected of antenna falls.
Summary of the invention
For this purpose, can be stung to insect kick with the thigh leg strength amount and mouthpart technical problem to be solved by the present invention lies in one kind is provided
The insect body quality comprehensive test instrument that resultant force is detected, without contacting insect both achievable kick with the thigh leg strength amounts to insect with hand
With mouthpart bite force, while can also reduce raiser cause because of contact insect death there is a situation where.
In order to solve the above technical problems, the invention provides the following technical scheme:
Insect body quality comprehensive test instrument, comprising:
Probe, for measuring insect bite force and kick with the thigh leg strength；
Micro treatment module, the data for obtaining to probe are analyzed and are stored；
Antenna, the information exchange for micro treatment module and host computer；
Display module, for that information will be shown after micro treatment module is handled；
Connector, for micro treatment module to be connect with display；
Power module, for being powered to all parts.
Above-mentioned insect body quality comprehensive test instrument, further includes the clock chip for timing, and the INTRB of the clock chip draws
Foot is electrically connected with the P0.27/AIN1/XL1 pin of the micro treatment module, the SCL pin of the clock chip and micro- place
Manage the P0.30 pin electrical connection of module, the SDA pin of the clock chip and the P0.0/AREF0 pin of the micro treatment module
Electrical connection, the GND pin ground connection of the clock chip, INTRA pin and the micro treatment module of the clock chip
The electrical connection of P0.23 pin, the OSCO pin of the clock chip are electrically connected and the clock core with there is the 2nd pin of source crystal oscillator Y2
The OSCO pin of piece is grounded through capacitor C17NC, the OSCI pin of the clock chip and the 1st pin for having source crystal oscillator Y2
The OSCI pin of electrical connection and the clock chip is grounded through capacitor C15NC, the VDD pin and the electricity of the clock chip
The VDD pin of source module electrical connection and the clock chip is grounded through capacitor C14；The SCL pin of the clock chip is through electricity
Resistance R12 is electrically connected with the power module, and the SDA pin of the clock chip is electrically connected to a power source through resistance R11；It is described active
The 3rd pin of crystal oscillator Y2 and the 4th pin are grounded respectively.
Above-mentioned insect body quality comprehensive test instrument, further includes switch module and light-emitting diode (LED) module, in the switch module,
It is grounded after 1st pin of push switch and the 2nd pins in parallel and is electrically connected with the 1st pin of Transient Suppression Diode TVS1, pressed
It is electrically connected through capacitor C13 with the P0.18 pin of the micro treatment module after the 1st pin to compress switch and the 2nd pins in parallel；Institute
Be electrically connected after stating the 3rd pin and the 4th pins in parallel of push switch with the 2nd pin of the Transient Suppression Diode TVS1 and with
The P0.18 pin of the micro treatment module is electrically connected；In the light-emitting diode (LED) module, the cathode of red diodes is through resistance R7
It is electrically connected with the P0.08 pin of the micro treatment module, the cathode of blue light diode is through resistance R8 and the micro treatment module
The electrical connection of P0.09 pin, green light diode is electrically connected by resistance R9 with the P0.07 pin of the micro treatment module, described red
The anode of the positive and described green diode of positive, the described blue light diode of optical diode is electric with the power module respectively
Connection.
Above-mentioned insect body quality comprehensive test instrument, the power module are electrically connected through micropower boost chip and the connector
It connects, the P0.10 pin of the micro treatment module is electrically connected through resistance R23 with the base stage of switching transistor MMBT3904, described to open
Close the emitter ground connection of triode MMBT3904, the grid electricity of the switching transistor MMBT3904 collector and field-effect tube Q2
Connection, the power module is electrically connected with the field-effect tube Q2 source electrode and the grid through resistance R21 Yu the field-effect tube Q2
Electrical connection, the drain electrode of the field-effect tube Q2 are electrically connected with the VIN pin of the micropower boost chip and connect through capacitor C25
Ground, the drain electrode of the field-effect tube Q2 through steel core inductance L6 respectively with the SW pin and Schottky two of the micropower boost chip
The electrical connection of pole pipe MBR0530 anode, the Schottky diode MBR0530 cathode are electrically connected and through capacitor with the connector
C24 ground connection, the Schottky diode MBR0530 cathode are electrically connected through resistance R22 with the micropower boost chip FB pin,
The Schottky diode MBR0530 cathode is successively grounded after resistance R22 and resistance R24 series connection；The micropower boosting core
Piece GND pin ground connection；The P0.10 pin of the micro treatment module is grounded after successively connecting with resistance R23 and resistance R25.
Above-mentioned insect body quality comprehensive test instrument, the micro treatment module are NRF51822 Bluetooth chip, the micro process mould
First VDD pin of block is electrically connected with the power module and the first VDD pin of the micro treatment module connects through capacitor C7
Ground, the DCC pin of the micro treatment module draw after successively connecting with inductance L3 and inductance L4 with the AVDD of the micro treatment module
Foot electrical connection, the DCC pin of the micro treatment module is grounded after successively connecting with inductance L3 and inductance L4 through capacitor C9, described
The AVDD pin of micro treatment module is grounded through capacitor C8；2nd VDD pin of the micro treatment module is electrically connected with power module
It connects and the 2nd VDD pin of micro treatment module is grounded through capacitor C12；The GND pin and VSS pin of the micro treatment module connect
Ground；The P0.17 pin of the micro treatment module is electrically connected with power module；The DEC2 pin of the micro treatment module is through capacitor
C10 ground connection；The micro treatment module VDD_PA draw foot meridian capacitor C11 ground connection, the micro treatment module VDD_PA pin successively with
It is electrically connected after inductance L5, inductance L2, capacitor C4 and inductance L1 series connection with the ANT1 pin of Anneta module, the micro treatment module
VDD_PA pin is grounded after successively connecting with inductance L5, inductance L2 and capacitor C4 through capacitor C5, the micro treatment module
VDD_PA pin is grounded after connecting with inductance L5, inductance L2, capacitor C4 and inductance L1 through capacitor C6；The micro treatment module
ANT1 pin connect with inductance L2 and in parallel with inductance L5, the ANT2 pin of the micro treatment module connect with capacitor C4 and
It is in parallel with inductance L2；The XC1 pin of the micro treatment module has the first pin of source crystal oscillator Y1 to be electrically connected with four feet, micro- place
The XC1 pin of reason module has the 4th pin of source crystal oscillator Y1 to be electrically connected through capacitor C2 with four feet, and four feet have the of source crystal oscillator Y1
Four pins ground connection；The XC2 pin of the micro treatment module has the third pin of source crystal oscillator Y1 to be electrically connected with four feet, the micro process
The XC2 pin of module has the second pin of source crystal oscillator Y1 to be electrically connected through capacitor C1 with four feet, and four foot has source crystal oscillator Y1's
Second pin ground connection；The DCE1 pin of the micro treatment module is grounded through capacitor C3；The P0.01/ of the micro treatment module
AIN2 pin, P0.02/AIN3 pin, P0.19 pin, P0.20 pin, P0.21 pin and P0.22 pin empty.
Above-mentioned insect body quality comprehensive test instrument, the power module include battery T1, battery T2, charging management chip and electricity
Source control chip, the battery T1 be electrically connected with the BAT pin of charging management chip and the battery T1 through resistance R18 with it is described
The P0.03/AIN4 pin of micro treatment module is electrically connected, and the battery T1 is grounded after successively connecting with resistance R18 and resistance R19,
The battery T1 is grounded after successively connecting with resistance R18 and capacitor C23, and the battery T1 is through capacitor C22 and the battery
T2 electrical connection, the battery T1 are grounded through capacitor C22 and capacitor C30 respectively, the battery T1 and the power management core
The VIN pin of piece is electrically connected and the VIN pin of the power management chip is grounded through capacitor C30, the power management chip
VSS pin ground connection, the OUT pin of the power management chip through resistance R30 respectively with the first VDD of the micro treatment module
Pin and the electrical connection of the 2nd VDD pin, the OUT of the power management chip draw foot meridian capacitor C31 ground connection；The Charge Management core
The PROG pin of piece is grounded through resistance R17, the GND pin ground connection of the charging management chip, the charging management chip
CHRG pin is electrically connected with the P0.17 pin of the micro treatment module, and the VCC pin of the charging management chip is through capacitor
C20 ground connection, the VCC pin of the charging management chip are electrically connected with usb interface module；In the usb interface module, VBUS
Pin is electrically connected through resistance R3 with the P0.26/AIN0/XL2 pin of the micro treatment module and the VBUS pin presses down through transient state
Diode TVS5 ground connection processed, the VBUS pin is electrically connected with the VCC pin of the charge management module and the VBUS pin
Be grounded after successively connecting with resistance R3 and resistance R2, D- pin be electrically connected with the SWDIO/NRST pin of the micro treatment module and
The D- pin is grounded through Transient Suppression Diode TVS4, and D+ pin is electrically connected institute with the SWCLK pin of the micro treatment module
It states D+ pin to be grounded through Transient Suppression Diode TVS3, described in ID pin is electrically connected with the P0.24 pin of the micro treatment module
ID pin is grounded through Transient Suppression Diode TVS2, and GND pin ground connection, FX1 pin, FX2 pin, FX3 pin and FX4 pin are simultaneously
It is grounded after connection；The SWCLK pin of the micro treatment module is grounded through resistance R1；The NC1 interface of the usb interface module empties.
Above-mentioned insect body quality comprehensive test instrument, in the probe, varistor R27 first end and the micro treatment module
P0.06/AIN7/AREF1 pin be directly electrically connected, the varistor R27 first end is through resistance R26 and the micro process mould
The P0.04/AIN5 pin of block is electrically connected and negative supply of the varistor R27 first end through resistance R26 and operational amplifier
Pin electrical connection, the varistor R27 first end are grounded after successively connecting with resistance R26 and capacitor C26, the pressure-sensitive electricity
Resistance R27 second end is electrically connected with the operational amplifier normal phase input end, and the varistor R27 second end is through ground resistance R29
It is electrically connected respectively with the operational amplifier negative-phase input and the operational amplifier output terminal, the varistor R27 points
Be not grounded through resistance R28 and capacitor C27, the operational amplifier positive supply pin ground connection, the operational amplifier with it is described
The P0.05/AIN6 pin of micro treatment module is electrically connected.
Above-mentioned insect body quality comprehensive test instrument, in the connector, the first VCC pin and the 2nd VCC of connector draw
It is electrically connected after foot is in parallel with the Schottky diode MBR0530 cathode, the first VCC pin and the second VCC pin of connector
It is grounded after parallel connection through electrolytic capacitor C16, is connect after the first VDD pin of connector and the 2nd VDD pins in parallel through capacitor C18
Ground is electrically connected after the first VDD pin of connector and the 2nd VDD pins in parallel, field-effect tube Q1 with the drain electrode of field-effect tube Q1
Source electrode be electrically connected with the power management chip OUT pin, the source electrode of field-effect tube Q1 is through resistance R14 and the micro process mould
The P0.16 pin of block is electrically connected, and the grid of field-effect tube Q1 is directly electrically connected with the P0.16 pin of the micro treatment module, even
It is grounded after connecing the BS2 pin, BS1 pin and BS0 pins in parallel of device, after the first VP pin of connector and the 2nd VP pins in parallel
It is grounded through capacitor C19, is connect after the first VCOMH pin of connector and the 2nd VCOMH pins in parallel through electrolytic capacitor C21
Ground is grounded after the VSS pin of connector, VLL pin, VLSS pin and VLLS pins in parallel, the first FIX pin of connector and
It is grounded after 2nd FIX pins in parallel, the IREF pin of connector is grounded through resistance R16, the first VSL pin of connector and second
VSL pin is grounded after being sequentially connected in series with resistance R15 and Schottky diode RB480K, the R/W# pin and RD# pin of connector
It is grounded after parallel connection, the CS# pin of connector is electrically connected with the P0.12 pin of the micro treatment module, the D/C# pin of connector
It is electrically connected with the P0.15 pin of the micro treatment module, the RES# pin of connector and the P0.13 pin of the micro treatment module
Electrical connection is grounded after the D2 pin of connector, D3 pin, D4 pin, D5 pin, D6 pin and D7 pins in parallel, connector
D1 pin is electrically connected with the P0.11 pin of the micro treatment module, the D0 pin of connector and the P0.14 of the micro treatment module
Pin electrical connection.
Above-mentioned insect body quality comprehensive test instrument, the micropower boost chip are MT3540 chip, the Charge Management core
Piece is AP5054 chip, and the power management chip LN620P332MR-G chip, the varistor R27 is RP-C7.6-ST
Film piezo-electric sensor, the connector are FH35C-31S-0.3SHW (50) chip.
Technical solution of the present invention achieves following beneficial technical effect:
Using the present invention can bite force to cricket and katydid and kick with the thigh leg strength amount measure, can be more intuitive
Ground reflects the physical condition of insect, raises consequently facilitating raiser can select insect according to the physical condition of insect,
Rather than personal experience is relied solely on to differentiate to the physical condition of insect.
Detailed description of the invention
Fig. 1 is the micro treatment module and antenna connection figure of insect body quality comprehensive test instrument of the present invention；
Fig. 2 is the connection figure of the connector of insect body quality comprehensive test instrument of the present invention；
Fig. 3 is the connection figure of the micropower boost chip of insect body quality comprehensive test instrument of the present invention；
Fig. 4 is the connection figure of the probe of insect body quality comprehensive test instrument of the present invention；
Fig. 5 is the connection figure of the clock module of insect body quality comprehensive test instrument of the present invention；
Fig. 6 is the connection figure of the charging management chip of insect body quality comprehensive test instrument of the present invention；
Fig. 7 is the connection figure of the power management chip of insect body quality comprehensive test instrument of the present invention；
Fig. 8 is the connection figure of the switch module of insect body quality comprehensive test instrument of the present invention；
Fig. 9 is the connection figure of the light-emitting diode (LED) module of insect body quality comprehensive test instrument of the present invention；
Figure 10 is the connection figure of the usb interface module of insect body quality comprehensive test instrument of the present invention.
Specific embodiment
Insect body quality comprehensive test instrument of the present invention, comprising: probe, for measuring insect bite force and kick with the thigh leg strength；It is micro-
Processing module, the data for obtaining to probe are analyzed and are stored；Antenna, the information for micro treatment module and host computer
Interaction；Display module, for that information will be shown after micro treatment module is handled；Connector, for by micro treatment module with
Display connection；Power module, for being powered to all parts.
Wherein, as shown in Figure 1, the micro treatment module be NRF51822 Bluetooth chip, the first of the micro treatment module
VDD pin is electrically connected with the power module and the first VDD pin of the micro treatment module is grounded through capacitor C7, described micro-
The DCC pin of processing module is successively electrically connected with after inductance L3 and inductance L4 series connection with the AVDD pin of the micro treatment module,
The DCC pin of the micro treatment module is grounded after successively connecting with inductance L3 and inductance L4 through capacitor C9, the micro process mould
The AVDD pin of block is grounded through capacitor C8；2nd VDD pin of the micro treatment module is electrically connected with power module and micro- place
2nd VDD pin of reason module is grounded through capacitor C12；The GND pin and VSS pin of the micro treatment module are grounded；It is described
The P0.17 pin of micro treatment module is electrically connected with power module；The DEC2 pin of the micro treatment module connects through capacitor C10
Ground；The micro treatment module VDD_PA draw foot meridian capacitor C11 ground connection, the micro treatment module VDD_PA pin successively with inductance
It is electrically connected after L5, inductance L2, capacitor C4 and inductance L1 series connection with the ANT1 pin of Anneta module, the micro treatment module VDD_
PA pin is grounded after successively connecting with inductance L5, inductance L2 and capacitor C4 through capacitor C5, the micro treatment module VDD_PA
Pin is grounded after connecting with inductance L5, inductance L2, capacitor C4 and inductance L1 through capacitor C6；The ANT1 of the micro treatment module
Pin is connected and in parallel with inductance L5 with inductance L2, and the ANT2 pin of the micro treatment module is connected with capacitor C4 and and inductance
L2 is in parallel；The XC1 pin of the micro treatment module has the first pin of source crystal oscillator Y1 to be electrically connected with four feet, the micro treatment module
XC1 pin there is the 4th pin of source crystal oscillator Y1 to be electrically connected with four feet through capacitor C2, four feet have the 4th pin of source crystal oscillator Y1
Ground connection；The XC2 pin of the micro treatment module has the third pin of source crystal oscillator Y1 to be electrically connected with four feet, the micro treatment module
XC2 pin has the second pin of source crystal oscillator Y1 to be electrically connected through capacitor C1 with four feet, and what four foot had source crystal oscillator Y1 second draws
Foot ground connection；The DCE1 pin of the micro treatment module is grounded through capacitor C3；The P0.01/AIN2 pin of the micro treatment module,
P0.02/AIN3 pin, P0.19 pin, P0.20 pin, P0.21 pin and P0.22 pin empty.In the present embodiment, capacitor
The capacitance of C1 and capacitor C2 are 12pF, and the capacitance of capacitor C3 is 100nF, and the capacitance of capacitor C4 is 2.2pF,
The capacitance of capacitor C5 is 1pF, and the capacitance of capacitor C6 is 1.5pF, and the capacitance of capacitor C7 is 4.7 μ F, capacitor
The capacitance of C8 is 1nF, and the capacitance of capacitor C9 is 1 μ F, and the capacitance of capacitor C10 is 47nF, the capacitor of capacitor C11
Amount is 2.2nF, and the capacitance of capacitor C12 is 100nF, and the frequency that four feet have source crystal oscillator Y1 is 16MHZ, the inductance of inductance L1
For 3.3nH, the inductance of inductance L2 is 4.7nH, and the inductance of inductance L3 is 15nH, and the inductance of inductance L4 is 10 μ H, inductance
The inductance of L5 is 10nH, and resistance R1 resistance value is 12K.
As shown in Fig. 2, in the connector, the first VCC pin of connector and the second VCC pin it is in parallel after with it is described
Through electrolysis electricity after the electrical connection of Schottky diode MBR0530 cathode, the first VCC pin of connector and the parallel connection of the second VCC pin
Container C16 ground connection, is grounded after the first VDD pin of connector and the 2nd VDD pins in parallel through capacitor C18, and the of connector
It is electrically connected after one VDD pin and the 2nd VDD pins in parallel with the drain electrode of field-effect tube Q1, the source electrode of field-effect tube Q1 and the electricity
The electrical connection of source control chip OUT pin, P0.16 pin of the source electrode of field-effect tube Q1 through resistance R14 Yu the micro treatment module
Electrical connection, the grid of field-effect tube Q1 are directly electrically connected with the P0.16 pin of the micro treatment module, the BS2 pin of connector,
It is grounded after BS1 pin and BS0 pins in parallel, is connect after the first VP pin of connector and the 2nd VP pins in parallel through capacitor C19
Ground is grounded after the first VCOMH pin of connector and the 2nd VCOMH pins in parallel, the VSS of connector through electrolytic capacitor C21
It is grounded after pin, VLL pin, VLSS pin and VLLS pins in parallel, the first FIX pin of connector and the 2nd FIX pin are simultaneously
It is grounded after connection, the IREF pin of connector is grounded through resistance R16, the first VSL pin of connector and the 2nd VSL pin and resistance
R15 and Schottky diode RB480K is grounded after being sequentially connected in series, and is grounded after the R/W# pin and RD# pins in parallel of connector, even
The CS# pin for connecing device is electrically connected with the P0.12 pin of the micro treatment module, the D/C# pin of connector and the micro process mould
The P0.15 pin of block is electrically connected, and the RES# pin of connector is electrically connected with the P0.13 pin of the micro treatment module, connector
D2 pin, D3 pin, D4 pin, D5 pin, be grounded after D6 pin and D7 pins in parallel, the D1 pin of connector with it is described micro-
The P0.11 pin of processing module is electrically connected, and the D0 pin of connector is electrically connected with the P0.14 pin of the micro treatment module.This
In embodiment, the connector is FH35C-31S-0.3SHW (50) chip, field-effect tube Q1 model SK2301AA, electrolysis electricity
The parameter of container C16 and electrolytic capacitor C21 are that the parameter of 4.7 μ F/25V, capacitor C18 and capacitor C19 is 1 μ F/
16V, resistance R14 resistance value are that the resistance value of 51K, resistance R15 and resistance R16 are 1M.
The power module is electrically connected through micropower boost chip with the connector, as shown in figure 3, the micro process mould
The P0.10 pin of block is electrically connected through resistance R23 with the base stage of switching transistor MMBT3904, the switching transistor MMBT3904
Emitter ground connection, the switching transistor MMBT3904 collector is electrically connected with the grid of field-effect tube Q2, the power supply mould
Block is electrically connected with the field-effect tube Q2 source electrode and is electrically connected through resistance R21 with the grid of the field-effect tube Q2, the field effect
Should the drain electrode of pipe Q2 be electrically connected and be grounded through capacitor C25, the field-effect tube with the VIN pin of the micropower boost chip
The drain electrode of Q2 is positive with the SW pin of the micropower boost chip and Schottky diode MBR0530 respectively through steel core inductance L6
Electrical connection, the Schottky diode MBR0530 cathode are electrically connected with the connector and are grounded through capacitor C24, Xiao
Special based diode MBR0530 cathode is electrically connected through resistance R22 with the micropower boost chip FB pin, two pole of Schottky
Pipe MBR0530 cathode is successively grounded after resistance R22 and resistance R24 series connection；The micropower boost chip GND pin ground connection；
The P0.10 pin of the micro treatment module is grounded after successively connecting with resistance R23 and resistance R25.In the present embodiment, the field effect
Should pipe Q2 model SK2301AA, the micropower boost chip model MT3540, capacitor R24 capacitance is 10 μ F, electricity
Container C25 capacitance is 4.7 μ F, and resistance R21 resistance value is 51K, and resistance R22 resistance value is 115K (precision 1%), resistance
R23 resistance value is 5.1K, and resistance R24 resistance value is 10K (precision 1%), and resistance R25 resistance value is 51K, steel core inductance L6's
Inductance is 4.7 μ H.
As shown in figure 4, in the probe, the P0.06/AIN7/ of varistor R27 first end and the micro treatment module
AREF1 pin is directly electrically connected, P0.04/ of the varistor R27 first end through resistance R26 Yu the micro treatment module
AIN5 pin is electrically connected and the varistor R27 first end is electrically connected through resistance R26 with the negative supply pin of operational amplifier,
The varistor R27 first end is grounded after successively connecting with resistance R26 and capacitor C26, the varistor R27 second end
Be electrically connected with the operational amplifier normal phase input end, the varistor R27 second end through ground resistance R29 respectively with the fortune
Calculate amplifier negative-phase input and operational amplifier output terminal electrical connection, the varistor R27 respectively through resistance R28 and
Capacitor C27 ground connection, the operational amplifier positive supply pin ground connection, the operational amplifier and the micro treatment module
The electrical connection of P0.05/AIN6 pin.In the present embodiment, the varistor R27 is RP-C7.6-ST film piezo-electric sensor,
The operational amplifier model NC/TP231-TR, capacitor C26 capacitance are 100nF, and capacitor C27 can not access circuit,
I.e. capacitor C27 can not be welded, so that capacitor C27 is in the state that empties, and is in capacitor C27 and is emptied state Shi Benfa
Bright performance is not exposed to influence, and resistance R26 resistance value is 10 Europe, and resistance R26 is used for and capacitor C26 constitutes resonance circuit to mention
The signal quality that the high varistor R27 is obtained, resistance R28 resistance value are 100K, and resistance R29 is fusing resistor.
The power module includes battery T1, battery T2, charging management chip and power management chip, such as Fig. 5 and Fig. 6 institute
Show, the battery T1 is electrically connected with the BAT pin of charging management chip and the battery T1 is through resistance R18 and the micro process mould
The P0.03/AIN4 pin of block is electrically connected, and the battery T1 is grounded after successively connecting with resistance R18 and resistance R19, the battery
T1 is grounded after successively connecting with resistance R18 and capacitor C23, and the battery T1 is electrically connected through capacitor C22 with the battery T2,
The battery T1 is grounded through capacitor C22 and capacitor C30 respectively, and the VIN of the battery T1 and the power management chip draw
The VIN pin of foot electrical connection and the power management chip is grounded through capacitor C30, the VSS pin of the power management chip
Ground connection, the OUT pin of the power management chip through resistance R30 respectively with the first VDD pin of the micro treatment module and the
The electrical connection of two VDD pins, the OUT of the power management chip draw foot meridian capacitor C31 ground connection；The PROG of the charging management chip
Pin is grounded through resistance R17, the GND pin of charging management chip ground connection, the CHRG pin of the charging management chip with
The P0.17 pin of the micro treatment module is electrically connected, and the VCC pin of the charging management chip is grounded through capacitor C20, described
The VCC pin of charging management chip is electrically connected with usb interface module；In the usb interface module, VBUS pin is through resistance R3
It is electrically connected with the P0.26/AIN0/XL2 pin of the micro treatment module and the VBUS pin is through Transient Suppression Diode TVS5
Ground connection, the VBUS pin be electrically connected with the VCC pin of the charge management module and the VBUS pin successively with resistance R3
It is grounded with after resistance R2 series connection, D- pin is electrically connected with the SWDIO/NRST pin of the micro treatment module and the D- pin passes through
Transient Suppression Diode TVS4 ground connection, D+ pin are electrically connected the D+ pin with the SWCLK pin of the micro treatment module through wink
State inhibits diode TVS3 ground connection, and ID pin is electrically connected the ID pin with the P0.24 pin of the micro treatment module through transient state
Inhibit diode TVS2 ground connection, GND pin is grounded, and is grounded after FX1 pin, FX2 pin, FX3 pin and FX4 pins in parallel；Institute
The SWCLK pin for stating micro treatment module is grounded through resistance R1；The NC1 interface of the usb interface module empties.In the present embodiment,
The charging management chip model AP5054, the power management chip model LN6206P332MR-G, capacitor C20 electricity
Capacity is 4.7 μ F, and capacitor C22 capacitance is 10 μ F, and capacitor C22 can not access circuit, i.e. capacitor C22 can not be welded,
So that capacitor C22 is in the state that empties, and the performance of the invention when capacitor C22 is in and empties state is not exposed to shadow
It rings, capacitor C23 capacitance is 100nF, and the capacitance of capacitor C30 and capacitor 31 is 1 μ F, the resistance value of resistance R17
For 3.3K, resistance R18 resistance value is 1.1M, and resistance R19 resistance value is 100K, and resistance R30 is fusing resistor.
In the present embodiment, the insect body quality comprehensive test instrument further includes switch module, light-emitting diode (LED) module and is used for
The clock chip of timing ground connection and presses down in the switch module, after the 1st pin of push switch and the 2nd pins in parallel with transient state
The 1st pin of diode TVS1 processed is electrically connected, after the 1st pin of push switch and the 2nd pins in parallel through capacitor C13 with it is described
The P0.18 pin of micro treatment module is electrically connected；Press down after 3rd pin of the push switch and the 4th pins in parallel with the transient state
The 2nd pin of diode TVS1 processed is electrically connected and is electrically connected with the P0.18 pin of the micro treatment module；The light emitting diode
In module, the cathode of red diodes is electrically connected through resistance R7 with the P0.08 pin of the micro treatment module, blue light diode
Cathode is electrically connected through resistance R8 with the P0.09 pin of the micro treatment module, and green light diode passes through resistance R9 and micro- place
Manage the P0.07 pin electrical connection of module, the positive and described green light two of positive, the described blue light diode of the red diodes
The anode of pole pipe is electrically connected with the power module respectively.In the clock chip, the INTRB pin of the clock chip with
The P0.27/AIN1/XL1 pin of the micro treatment module is electrically connected, the SCL pin of the clock chip and the micro process mould
The P0.30 pin of block is electrically connected, and the SDA pin of the clock chip is electrically connected with the P0.0/AREF0 pin of the micro treatment module
It connects, the GND pin ground connection of the clock chip, the INTRA pin and the P0.23 of the micro treatment module of the clock chip draws
Foot electrical connection, the OSCO pin of the clock chip are electrically connected and the clock chip with there is the 2nd pin of source crystal oscillator Y2
OSCO pin is grounded through capacitor C17NC, and the OSCI pin of the clock chip is electrically connected with the 1st pin for having source crystal oscillator Y2
It connects and the OSCI pin of the clock chip is grounded through capacitor C15NC, the VDD pin of the clock chip and the power supply mould
The VDD pin of block electrical connection and the clock chip is grounded through capacitor C14；The SCL pin of the clock chip is through resistance R12
It is electrically connected with the power module, the SDA pin of the clock chip is electrically connected to a power source through resistance R11；It is described to have source crystal oscillator
The 3rd pin of Y2 and the 4th pin are grounded respectively.In the present embodiment, the light-emitting diode (LED) module model FM-1515RGBA-
HF, the model BL5327T of the clock chip, the frequency for having source crystal oscillator are 32.768KHZ, the capacitor of capacitor C13
Amount is 100nF, and capacitor C14 capacitance is that 100nF, capacitor C15 and capacitor C17 can not access circuit, i.e. capacitor
C15 and capacitor C17 can not be welded, so that capacitor C15 and capacitor C17 are in the state of emptying, and in capacitor C15
It is in performance of the invention when emptying state with capacitor C17 and is not exposed to influence, the electricity of resistance R7, resistance R8 and resistance R9
Resistance value is that the resistance value of 1K, resistance R11 and resistance R12 are 10K.
In Fig. 1~10, TP1~TP7 is test point.
In the present invention, when the thigh of insect kicks or mouthpart bites the varistor R27, the varistor is flowed through
The electric current of R27 can change, and then the strength or mouth of the kicking of insect thigh can be calculated by size of current amplitude of variation
The bite force of device, and insect kick with the thigh leg strength amount or mouthpart occlusion strength can be shown on the display module, from
And strength is engaged by insect kick with the thigh leg strength amount and mouthpart convenient for insect raising fan, insect body quality is determined,
Without learning the knowledge (such as figure, body part feature, the sound that pipes etc.) of many and diverse identification insect body quality.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes among still in present patent application scope of protection of the claims.
Claims (9)
1. insect body quality comprehensive test instrument characterized by comprising
Probe, for measuring insect bite force and kick with the thigh leg strength；
Micro treatment module, the data for obtaining to probe are analyzed and are stored；
Antenna, the information exchange for micro treatment module and host computer；
Display module, for that information will be shown after micro treatment module is handled；
Connector, for micro treatment module to be connect with display；
Power module, for being powered to all parts.
2. insect body quality comprehensive test instrument according to claim 1, which is characterized in that further include the clock core for timing
Piece, the INTRB pin of the clock chip are electrically connected with the P0.27/AIN1/XL1 pin of the micro treatment module, the clock
The SCL pin of chip is electrically connected with the P0.30 pin of the micro treatment module, the SDA pin of the clock chip with it is described micro-
The P0.0/AREF0 pin of processing module is electrically connected, the GND pin ground connection of the clock chip, the INTRA of the clock chip
Pin is electrically connected with the P0.23 pin of the micro treatment module, the OSCO pin of the clock chip and has the 2nd of source crystal oscillator Y2
The pin electrical connection and OSCO pin of the clock chip is grounded through capacitor C17NC, the OSCI pin of the clock chip with
The OSCI pin of the electrical connection of the 1st pin and the clock chip for having source crystal oscillator Y2 is grounded through capacitor C15NC, when described
The VDD pin of clock chip is electrically connected with the power module and the VDD pin of the clock chip is grounded through capacitor C14；Institute
The SCL pin for stating clock chip is electrically connected through resistance R12 with the power module, and the SDA pin of the clock chip is through resistance
R11 is electrically connected to a power source；The 3rd pin for having source crystal oscillator Y2 and the 4th pin are grounded respectively.
3. insect body quality comprehensive test instrument according to claim 2, which is characterized in that further include switch module and luminous two
Pole pipe module ground connection and inhibits two poles with transient state in the switch module, after the 1st pin of push switch and the 2nd pins in parallel
The 1st pin of pipe TVS1 is electrically connected, through capacitor C13 and the micro process after the 1st pin of push switch and the 2nd pins in parallel
The P0.18 pin of module is electrically connected；Inhibit two poles with the transient state after 3rd pin of the push switch and the 4th pins in parallel
The 2nd pin of pipe TVS1 is electrically connected and is electrically connected with the P0.18 pin of the micro treatment module；The light-emitting diode (LED) module
In, the cathode of red diodes is electrically connected through resistance R7 with the P0.08 pin of the micro treatment module, the cathode of blue light diode
It is electrically connected through resistance R8 with the P0.09 pin of the micro treatment module, green light diode passes through resistance R9 and the micro process mould
The P0.07 pin of block is electrically connected, the positive and described green diode of positive, the described blue light diode of the red diodes
Anode be electrically connected respectively with the power module.
4. any insect body quality comprehensive test instrument according to claim 1~3, which is characterized in that the power module warp
Micropower boost chip is electrically connected with the connector, and the P0.10 pin of the micro treatment module is through resistance R23 and three pole of switch
The base stage of pipe MMBT3904 is electrically connected, the emitter ground connection of the switching transistor MMBT3904, the switching transistor
MMBT3904 collector is electrically connected with the grid of field-effect tube Q2, and the power module is electrically connected with the field-effect tube Q2 source electrode
And be electrically connected through resistance R21 with the grid of the field-effect tube Q2, the drain electrode of the field-effect tube Q2 and the micropower are boosted
The VIN pin of chip is electrically connected and is grounded through capacitor C25, the drain electrode of the field-effect tube Q2 through steel core inductance L6 respectively with institute
State SW pin and the electrical connection of Schottky diode MBR0530 anode of micropower boost chip, the Schottky diode
MBR0530 cathode is electrically connected with the connector and is grounded through capacitor C24, the Schottky diode MBR0530 cathode warp
Resistance R22 is electrically connected with the micropower boost chip FB pin, and the Schottky diode MBR0530 cathode is successively through resistance
It is grounded after R22 and resistance R24 series connection；The micropower boost chip GND pin ground connection；The P0.10 of the micro treatment module draws
Foot is grounded after successively connecting with resistance R23 and resistance R25.
5. insect body quality comprehensive test instrument according to claim 4, which is characterized in that the micro treatment module is
First VDD pin of NRF51822 Bluetooth chip, the micro treatment module is electrically connected with the power module and the micro process
First VDD pin of module is grounded through capacitor C7, and the DCC pin of the micro treatment module is successively gone here and there with inductance L3 and inductance L4
Be electrically connected after connection with the AVDD pin of the micro treatment module, the DCC pin of the micro treatment module successively with inductance L3 and electricity
It is grounded after sense L4 series connection through capacitor C9, the AVDD pin of the micro treatment module is grounded through capacitor C8；The micro process mould
2nd VDD pin of block is electrically connected with power module and the 2nd VDD pin of micro treatment module is grounded through capacitor C12；It is described
The GND pin and VSS pin of micro treatment module are grounded；The P0.17 pin of the micro treatment module is electrically connected with power module；Institute
The DEC2 pin for stating micro treatment module is grounded through capacitor C10；The micro treatment module VDD_PA draws foot meridian capacitor C11 ground connection,
The micro treatment module VDD_PA pin successively connect with inductance L5, inductance L2, capacitor C4 and inductance L1 after with Anneta module
ANT1 pin electrical connection, after the micro treatment module VDD_PA pin is successively connected with inductance L5, inductance L2 and capacitor C4
It is grounded through capacitor C5, after the micro treatment module VDD_PA pin is connected with inductance L5, inductance L2, capacitor C4 and inductance L1
It is grounded through capacitor C6；The ANT1 pin of the micro treatment module is connected with inductance L2 and, the micro process in parallel with inductance L5
The ANT2 pin of module is connected and in parallel with inductance L2 with capacitor C4；The XC1 pin and four feet of the micro treatment module are active
The first pin of crystal oscillator Y1 is electrically connected, and the XC1 pin of the micro treatment module has the of source crystal oscillator Y1 through capacitor C2 and four feet
The electrical connection of four pins, four feet have the 4th pin of source crystal oscillator Y1 to be grounded；The XC2 pin and the active crystalline substance of four feet of the micro treatment module
The third pin electrical connection of vibration Y1, the XC2 pin of the micro treatment module have the second of source crystal oscillator Y1 through capacitor C1 and four feet
Pin electrical connection, four foot have the second pin of source crystal oscillator Y1 to be grounded；The DCE1 pin of the micro treatment module is through capacitor
C3 ground connection；The P0.01/AIN2 pin of the micro treatment module, P0.02/AIN3 pin, P0.19 pin, P0.20 pin,
P0.21 pin and P0.22 pin empty.
6. insect body quality comprehensive test instrument according to claim 5, which is characterized in that the power module includes battery
T1, battery T2, charging management chip and power management chip, the battery T1 are electrically connected with the BAT pin of charging management chip
And the battery T1 is electrically connected through resistance R18 with the P0.03/AIN4 pin of the micro treatment module, the battery T1 successively with
It is grounded after resistance R18 and resistance R19 series connection, the battery T1 is grounded after successively connecting with resistance R18 and capacitor C23, described
Battery T1 is electrically connected through capacitor C22 with the battery T2, and the battery T1 is grounded through capacitor C22 and capacitor C30 respectively,
The battery T1 is electrically connected with the VIN pin of the power management chip and the VIN of the power management chip draws foot meridian capacitor
Device C30 ground connection, the VSS pin ground connection of the power management chip, the OUT pin of the power management chip is through resistance R30 points
It is not electrically connected with the first VDD pin of the micro treatment module and the 2nd VDD pin, the OUT pin of the power management chip
It is grounded through capacitor C31；The PROG pin of the charging management chip is grounded through resistance R17, and the GND of the charging management chip draws
Foot ground connection, the CHRG pin of the charging management chip are electrically connected with the P0.17 pin of the micro treatment module, the charging valve
The VCC pin of reason chip is grounded through capacitor C20, and the VCC pin of the charging management chip is electrically connected with usb interface module；
In the usb interface module, VBUS pin is electrically connected through resistance R3 and the P0.26/AIN0/XL2 pin of the micro treatment module
It connects and the VBUS pin is grounded through Transient Suppression Diode TVS5, the VCC of the VBUS pin and the charge management module
Pin electrical connection and the VBUS pin are grounded after successively connecting with resistance R3 and resistance R2, D- pin and the micro treatment module
The electrical connection of SWDIO/NRST pin and the D- pin be grounded through Transient Suppression Diode TVS4, D+ pin and the micro process
The SWCLK pin of module is electrically connected the D+ pin and is grounded through Transient Suppression Diode TVS3, ID pin and the micro process mould
The P0.24 pin of block is electrically connected the ID pin and is grounded through Transient Suppression Diode TVS2, GND pin ground connection, FX1 pin, FX2
It is grounded after pin, FX3 pin and FX4 pins in parallel；The SWCLK pin of the micro treatment module is grounded through resistance R1；The USB
The NC1 interface of interface module empties.
7. insect body quality comprehensive test instrument according to claim 6, which is characterized in that in the probe, varistor
R27 first end is directly electrically connected with the P0.06/AIN7/AREF1 pin of the micro treatment module, the varistor R27 first
End is electrically connected through resistance R26 with the P0.04/AIN5 pin of the micro treatment module and the varistor R27 first end is through electricity
Resistance R26 be electrically connected with the negative supply pin of operational amplifier, the varistor R27 first end successively with resistance R26 and capacitor
It is grounded after device C26 series connection, the varistor R27 second end is electrically connected with the operational amplifier normal phase input end, the pressure
Quick resistance R27 second end is exported with the operational amplifier negative-phase input and the operational amplifier respectively through ground resistance R29
End electrical connection, the varistor R27 are grounded through resistance R28 and capacitor C27 respectively, the operational amplifier positive supply pin
Ground connection, the operational amplifier are electrically connected with the P0.05/AIN6 pin of the micro treatment module.
8. insect body quality comprehensive test instrument according to claim 7, which is characterized in that in the connector, connector
The first VCC pin and the second VCC pin it is in parallel after be electrically connected with the Schottky diode MBR0530 cathode, connector
It is grounded after first VCC pin and the second VCC pin are in parallel through electrolytic capacitor C16, the first VDD pin of connector and second
Be grounded after VDD pins in parallel through capacitor C18, after the first VDD pin of connector and the 2nd VDD pins in parallel with field-effect tube
The drain electrode of Q1 is electrically connected, and the source electrode of field-effect tube Q1 is electrically connected with the power management chip OUT pin, the source of field-effect tube Q1
Pole is electrically connected through resistance R14 with the P0.16 pin of the micro treatment module, the grid of field-effect tube Q1 directly with the micro process
The P0.16 pin of module is electrically connected, and is grounded after the BS2 pin of connector, BS1 pin and BS0 pins in parallel, the first of connector
It is grounded after VP pin and the 2nd VP pins in parallel through capacitor C19, the first VCOMH pin of connector and the 2nd VCOMH pin
It is grounded after parallel connection through electrolytic capacitor C21, VSS pin, VLL pin, VLSS pin and the VLLS pins in parallel of connector are followed by
Ground is grounded after the first FIX pin of connector and the 2nd FIX pins in parallel, and the IREF pin of connector is grounded through resistance R16,
First VSL pin of connector and the 2nd VSL pin are grounded after being sequentially connected in series with resistance R15 and Schottky diode RB480K,
It is grounded after the R/W# pin and RD# pins in parallel of connector, the CS# pin and the P0.12 of the micro treatment module of connector draw
Foot electrical connection, the D/C# pin of connector is electrically connected with the P0.15 pin of the micro treatment module, the RES# pin of connector and
The P0.13 pin of the micro treatment module is electrically connected, the D2 pin of connector, D3 pin, D4 pin, D5 pin, D6 pin and
It is grounded after D7 pins in parallel, the D1 pin of connector is electrically connected with the P0.11 pin of the micro treatment module, and the D0 of connector draws
Foot is electrically connected with the P0.14 pin of the micro treatment module.
9. insect body quality comprehensive test instrument according to claim 8, which is characterized in that the micropower boost chip is
MT3540 chip, the charging management chip are AP5054 chip, the power management chip LN620P332MR-G chip, institute
Stating varistor R27 is RP-C7.6-ST film piezo-electric sensor, and the connector is FH35C-31S-0.3SHW (50) chip.
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