CN110049410A - 振膜基材及其制备方法、振膜及扬声器 - Google Patents
振膜基材及其制备方法、振膜及扬声器 Download PDFInfo
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Abstract
本发明公开了一种振膜基材及其制备方法、振膜及扬声器,其中,振膜基材包括第一粘接层、第二粘接层、由高分子材料制成的第一高分子材料层、由高分子材料制成的第二高分子材料层和由多孔阻尼材料制成的多孔阻尼材料层,所述多孔阻尼材料层具有相背设置的第一侧面和第二侧面,所述第一高分子材料层通过所述第一粘接层粘接于所述第一侧面,所述第二高分子材料层通过所述第二粘接层粘接于所述第二侧面。本发明的有益效果在于:(1)采用本发明振膜基材制成的产品尺寸可以保持一致性。(2)本发明的振膜基材能够抑制和改善高温情况下高分子材料性能的变异,因而采用本发明振膜基材的扬声器等产品振幅随温度升高偏移较小,提高了产品性能的稳定性。
Description
技术领域
本发明涉及声学设备领域,尤其涉及一种振膜基材、该振膜基材的制备方法、采用该振膜基材制备的振膜及具有该振膜的扬声器。
背景技术
目前,振膜基材一般采用弹性模量较小的高分子材料制成,这些高分子材料弹性模量较小,有比较好的弹性。但是,由于这些高分子材料不耐高温,在部分扬声器等产品上,当温度上升到一定程度的时候(产品持续振动或者做可靠性实验),产品振幅会越来越大,产生偏移,致使产品摇摆,可直接导致产品性能失效。图1为采用现有的振膜基材在不同的温度下,分别震动20ms和500ms的振幅变化图,20ms与500ms代表测试现有振膜基材同一个频率阶段区间所用不同的时间,时间越长,振动次数越多,产品温度越高。从图中我们可以看到现有振膜基材在20ms与500ms测试条件下,产品上同一个点振幅出现显著的偏移。
发明内容
为了克服现有技术的不足,本发明的目的之一在于提供一种高温下振幅偏移小的振膜基材。
本发明的目的之二在于提供高温下振幅偏移小的振膜基材的制备方法。
本发明的目的之三在于提供采用高温下振幅偏移小的振膜基材制备的振膜。
本发明的目的之四在于提供一种具有高温下振幅偏移小的振膜的扬声器。
本发明的目的之一采用如下技术方案实现:一种振膜基材,包括第一粘接层、第二粘接层、由高分子材料制成的第一高分子材料层、由高分子材料制成的第二高分子材料层和由多孔阻尼材料制成的多孔阻尼材料层,所述多孔阻尼材料层具有相背设置的第一侧面和第二侧面,所述第一高分子材料层通过所述第一粘接层粘接于所述第一侧面,所述第二高分子材料层通过所述第二粘接层粘接于所述第二侧面。
进一步地,所述第一粘接层和/或所述第二粘接层由胶水固化形成。
进一步地,所述第一高分子材料层和所述第二高分子材料层分别采用硅橡胶、热塑性弹性体、热塑性聚氨酯弹性体橡胶、聚醚醚酮、聚对苯二甲酸乙二酯中的至少一种制成。
可选地,所述第一高分子材料层和所述第二高分子材料层的材质不同。
进一步地,所述多孔阻尼材料层采用聚邻苯二甲酰胺、聚醚酮材料中的至少一种制成。
进一步地,所述多孔阻尼材料层为具有多个通孔的网格状结构。
本发明的目的之二采用如下技术方案实现:
一种上述的振膜基材的制备方法,包括以下步骤:
分别制备第一高分子材料层、第二高分子材料层和多孔阻尼材料层;
将所述第一高分子材料层和和所述第二高分子材料层分别粘接固定于所述多孔阻尼材料层的第一侧面和第二侧面,制成所述振膜基材。
可选地,所述第一高分子材料层、所述第二高分子材料层与所述多孔阻尼材料层的粘接方式为:分别在第一高分子材料层和第二高分子材料层的一侧面上涂布胶水,将所述第一高分子材料层涂布有胶水的侧面贴合于所述第一侧面,将所述第二高分子材料层涂布有胶水的侧面贴合于所述第二侧面;或者,
所述第一高分子材料层、所述第二高分子材料层与所述多孔阻尼材料层的粘接方式为:分别在所述第一侧面和所述第二侧面上涂布胶水,将所述第一高分子材料层贴合于涂布有胶水的所述第一侧面,将所述第二高分子材料层贴合于涂布有胶水的所述第二侧面;或者,
所述第一高分子材料层、所述第二高分子材料层与所述多孔阻尼材料层的粘接方式为:在第一高分子材料层的一侧面上涂布胶水,将所述第一高分子材料层涂布有胶水的侧面贴合于所述第一侧面上,在所述第二侧面上涂布胶水,然后将所述第二高分子材料层贴合于涂有胶水的所述第二侧面上。
本发明的目的之三采用如下技术方案实现:一种振膜,由上述的振膜基材加工而成。
本发明的目的之四采用如下技术方案实现:一种扬声器,包括磁路系统、振动系统以及设有收容腔的盆架,所述磁路系统和振动系统均收容于所述收容腔中,所述振动系统包括与所述盆架顶部连接的振膜,所述振膜采用上述的振膜,第一高分子材料层或第二高分子材料层位于所述振膜靠近所述盆架的一侧。
相比现有技术,本发明的有益效果在于:(1)多孔阻尼材料具有较高的结构强度,能够抑制高分子材料的收缩性,因而可确保采用本发明振膜基材制成的产品尺寸保持一致性。(2)本发明的振膜基材能够抑制和改善高温情况下高分子材料性能的变异,因而采用本发明振膜基材的扬声器等产品振幅随温度升高偏移较小,提高了产品性能的稳定性。
附图说明
图1为现有振膜材料在不同的温度下分别震动20ms和500ms的振幅变化示意图;
图2为本发明实施例提供的振膜基材的立体结构示意图;
图3为本发明实施例提供的振膜基材的主视平面图;
图4为本发明实施例提供的振膜基材的爆炸示意图;
图5为本发明实施例提供的振膜基材在不同的温度下分别震动20ms和500ms的振幅变化示意图;
图6为本发明实施例提供的扬声器一个视角的立体图;
图7为图6中A-A的剖视图。
图中:1、振膜基材;111、第一高分子材料层;112、第二高分子材料层;12、多孔阻尼材料层;121、通孔;122、第一侧面;123、第二侧面;131、第一粘接层;132、第二粘接层;20、扬声器;21、磁路系统;211、磁框;212、永磁铁;213、极芯;22、振动系统;221、振膜;222、音圈;23、盆架。
具体实施方式
下面,结合附图以及具体实施方式,对本发明做进一步描述,需要说明的是,在不相冲突的前提下,以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。
如图2-5所示,本发明实施例提供的一种振膜基材1,包括第一粘接层131、第二粘接层132、由高分子材料制成的第一高分子材料层111、由高分子材料制成的第二高分子材料层112和由多孔阻尼材料制成的多孔阻尼材料层12,多孔阻尼材料层12具有相背设置的第一侧面122和第二侧面123,第一高分子材料层111通过第一粘接层131粘接于第一侧面122,第二高分子材料层112通过第二粘接层132粘接于第二侧面123。因为在本实施例振膜基材1中增加了多孔阻尼材料层12,多孔阻尼材料具有较高的结构强度,能够抑制高分子材料的收缩性,因而可确保采用本实施例振膜基材1制成的产品尺寸保持一致性,并且本实施例的振膜基材1能够抑制和改善高温情况下高分子材料性能的变异,因而采用本实施例振膜基材1的扬声器等产品振幅随温度升高偏移较小,提高了产品性能的稳定性。
优选地,第一粘接层131和/或第二粘接层132由胶水固化形成。本发明第一粘接层131和第二粘接层132都是通过胶水涂布后固化形成。
优选地,第一高分子材料层111和第二高分子材料层112分别采用硅橡胶、热塑性弹性体、热塑性聚氨酯弹性体橡胶、聚醚醚酮、聚对苯二甲酸乙二酯中的至少一种制成。这些高分子材料弹性模量较小,有比较好的弹性。第一高分子材料层111和第二高分子材料层112的材质可以相同也可以不同。本实施例中采用材质不同的高分子材料,当然也可以采用材质相同的高分子材料,均可以获得高温下振膜偏小的振膜基材1。
优选地,多孔阻尼材料层12采用聚邻苯二甲酰胺、聚醚酮材料中的至少一种制成。这些多孔阻尼材料结构强度较高,能在高温的情况下抑制高分子材料性能变异。本实施例中,多孔阻尼材料层12为具有多个通孔121的网格状结构。
图5为采用本实施例的振膜基材1在不同的温度下,分别震动20ms和500ms的振幅变化图,20ms与500ms代表测试本实施例振膜基材1同一个频率阶段区间所用不同的时间。从图中我们可以看到本实施例振膜基材1在20ms与50ms测试条件下,产品上同一个点振幅偏移小。
本实施例还提供了上述振膜基材1的制备方法,包括以下步骤:
分别制备高分子材料层和多孔阻尼材料层12;
将高分子材料层和多孔阻尼材料层12层叠粘接固定在一起,制成振膜基材1。
优选地,第一高分子材料层111、第二高分子材料层112与多孔阻尼材料层12的粘接方式为以下五种中的任意一种:第一种,分别在第一高分子材料层111和第二高分子材料层112的一侧面上涂布胶水,将第一高分子材料层111涂布有胶水的侧面贴合于第一侧面122,然后将第一高分子材料层111压紧于多孔阻尼材料层12,再将第二高分子材料层112涂布有胶水的侧面贴合于第二侧面123,最后将第二高分子材料层112压紧于多孔阻尼材料层12;第二种,分别在第一高分子材料层111和第二高分子材料层112的一侧面上涂布胶水,将第一高分子材料层111涂布有胶水的侧面贴合于第一侧面122,将第二高分子材料层112涂布有胶水的侧面贴合于第二侧面123,然后将第一高分子材料层111和第二高分子材料层112压紧于多孔阻尼材料层12;第三种,分别在第一侧面122和第二侧面123上涂布胶水,将第一高分子材料层111贴合于涂布有胶水的第一侧面122,将第二高分子材料层112贴合于涂布有胶水的第二侧面123,然后将第一高分子材料层111和第二高分子材料层112压紧于多孔阻尼材料层12上;第四种,在第一高分子材料层111的一侧面上涂布胶水,将第一高分子材料层111涂布有胶水的侧面贴合于第一侧面122上,之后将第一高分子材料层111压紧于多孔阻尼材料层12上,然后在第二侧面123上涂布胶水,并将第二高分子材料层112贴合于涂有胶水的第二侧面123上,最后将第二高分子材料层112压紧于多孔阻尼材料层12上;第五种,在第一高分子材料层111的一侧面上涂布胶水,将第一高分子材料层111涂布有胶水的侧面贴合于第一侧面122上,在第二侧面123上涂布胶水,然后将第二高分子材料层112贴合于涂有胶水的第二侧面123上,然后将第一高分子材料层111和第二高分子材料层112压紧于多孔阻尼材料层12。
本实施例提供的振膜,由上述振膜基材1加工而成。由于采用上述的振膜基材1加工而成,故振膜的振幅随温度升高偏移较小,产品性能比较稳定。将振膜基材1加工形成振膜,具体可包括对振膜基材1进行裁切、冲压成型等加工操作。
如图6-7所示,本实施例提供的扬声器20,包括磁路系统21、振动系统22以及设有收容腔的盆架23,磁路系统21和振动系统22均收容于收容腔中,振动系统22包括与盆架23顶部连接的振膜221,振膜221采用本实施例提供的振膜,第一高分子材料层111或第二高分子材料层112位于振膜211靠近盆架23的一侧。在一较佳实施方案中,磁路系统21包括与盆架23底部连接的磁框211、收容于磁框211中的永磁铁212和固定于永磁铁212的顶部的极芯213,永磁铁212的底部固定至磁框211内,振动系统22包括与盆架23顶部连接的振膜221和设于振膜221底部且位于收容腔中的音圈222,音圈222在磁路系统21产生的磁场的作用下进行运动,从而带动振膜221上下震动。
上述实施方式仅为本发明的优选实施方式,不能以此来限定本发明保护的范围,本领域的技术人员在本发明的基础上所做的任何非实质性的变化及替换均属于本发明所要求保护的范围。
Claims (10)
1.一种振膜基材,其特征在于,包括第一粘接层、第二粘接层、由高分子材料制成的第一高分子材料层、由高分子材料制成的第二高分子材料层和由多孔阻尼材料制成的多孔阻尼材料层,所述多孔阻尼材料层具有相背设置的第一侧面和第二侧面,所述第一高分子材料层通过所述第一粘接层粘接于所述第一侧面,所述第二高分子材料层通过所述第二粘接层粘接于所述第二侧面。
2.根据权利要求1所述的振膜基材,其特征在于,所述第一粘接层和/或所述第二粘接层由胶水固化形成。
3.根据权利要求2所述的振膜基材,其特征在于,所述第一高分子材料层和所述第二高分子材料层分别采用硅橡胶、热塑性弹性体、热塑性聚氨酯弹性体橡胶、聚醚醚酮、聚对苯二甲酸乙二酯中的至少一种制成。
4.根据权利要求3所述的振膜基材,其特征在于,所述第一高分子材料层和所述第二高分子材料层的材质不同。
5.根据权利要求1至4任一项所述的振膜基材,其特征在于,所述多孔阻尼材料层采用聚邻苯二甲酰胺、聚醚酮材料中的至少一种制成。
6.根据权利要求5所述的振膜基材,其特征在于,所述多孔阻尼材料层为具有多个通孔的网格状结构。
7.一种如权利要求1至6任一项所述的振膜基材的制备方法,其特征在于,包括以下步骤:
分别制备第一高分子材料层、第二高分子材料层和多孔阻尼材料层;
将所述第一高分子材料层和所述第二高分子材料层分别粘接固定于所述多孔阻尼材料层的第一侧面和第二侧面,制成所述振膜基材。
8.根据权利要求7所述的振膜基材的制备方法,其特征在于,所述第一高分子材料层、所述第二高分子材料层与所述多孔阻尼材料层的粘接方式为:分别在第一高分子材料层和第二高分子材料层的一侧面上涂布胶水,将所述第一高分子材料层涂布有胶水的侧面贴合于所述第一侧面,将所述第二高分子材料层涂布有胶水的侧面贴合于所述第二侧面;或者,
所述第一高分子材料层、所述第二高分子材料层与所述多孔阻尼材料层的粘接方式为:分别在所述第一侧面和所述第二侧面上涂布胶水,将所述第一高分子材料层贴合于涂布有胶水的所述第一侧面,将所述第二高分子材料层贴合于涂布有胶水的所述第二侧面;或者,
所述第一高分子材料层、所述第二高分子材料层与所述多孔阻尼材料层的粘接方式为:在第一高分子材料层的一侧面上涂布胶水,将所述第一高分子材料层涂布有胶水的侧面贴合于所述第一侧面上,在所述第二侧面上涂布胶水,然后将所述第二高分子材料层贴合于涂有胶水的所述第二侧面上。
9.一种振膜,其特征在于,由上述权利要求1至6中任一项所述的振膜基材加工而成。
10.一种扬声器,包括磁路系统、振动系统以及设有收容腔的盆架,所述磁路系统和振动系统均收容于所述收容腔中,所述振动系统包括与所述盆架顶部连接的振膜,其特征在于,所述振膜采用如权利要求9所述的振膜,第一高分子材料层或第二高分子材料层位于所述振膜靠近所述盆架的一侧。
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