CN110048016B - Thin film packaging structure, OLED display panel and manufacturing method thereof - Google Patents
Thin film packaging structure, OLED display panel and manufacturing method thereof Download PDFInfo
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- CN110048016B CN110048016B CN201910232697.8A CN201910232697A CN110048016B CN 110048016 B CN110048016 B CN 110048016B CN 201910232697 A CN201910232697 A CN 201910232697A CN 110048016 B CN110048016 B CN 110048016B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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Abstract
The invention provides a thin film packaging structure, an OLED display panel and a manufacturing method thereof. The thin film encapsulation structure includes: a first inorganic thin film; a first organic thin film on the first inorganic thin film; a second inorganic thin film covering the first organic thin film and the first inorganic thin film; wherein the material constituting the first organic film is an organic polymer having self-healing ability. The thin film packaging structure, the OLED display panel and the manufacturing method thereof can delay the loss and aging of the organic film layer in TFE.
Description
Technical Field
The invention relates to the field of electronic display, in particular to a thin film packaging structure, an OLED display panel and a manufacturing method thereof.
Background
The Organic Light Emitting Diode (OLED) device has the advantages of light weight, wide viewing angle, fast response time, high light emitting efficiency and the like, and has a great application prospect. In addition, the OLED device can be manufactured on the flexible substrate to form a flexible display screen capable of being bent, so that the OLED display panel has greater advantages compared with a traditional liquid crystal panel.
In order to ensure the flexibility of the OLED device, a Thin Film Encapsulation (TFE) technology is generally used to encapsulate the OLED device. TFE often employs an inorganic/organic/inorganic overlapping membrane layer structure. The inorganic film layer is used as a water and oxygen blocking layer, and the organic film layer is used as a buffer layer for slowly releasing the internal stress of the inorganic film layer and enhancing the flexibility of the OLED device. For the foldable flexible equipment, after being folded for many times, the organic film layer in the TFE inevitably generates loss and aging phenomena, and cracks appear on the outer bending surface, so that the buffering stress capability of the organic film layer of the TFE is seriously reduced, and the service life of the foldable mobile phone is limited.
Therefore, how to delay the loss and aging of the organic film layer in the TFE and further improve the bending capability of the OLED device is a real problem that needs to be solved urgently.
Disclosure of Invention
The invention provides a thin film packaging structure, an OLED display panel and a manufacturing method thereof, which are used for delaying loss and aging of an organic film layer in TFE.
In order to solve the above problems, the present invention provides a thin film encapsulation structure, which includes:
a first inorganic thin film;
a first organic thin film on the first inorganic thin film;
a second inorganic thin film covering the first organic thin film and the first inorganic thin film; wherein the content of the first and second substances,
the material of the first organic film is an organic polymer with self-repairing capability.
According to one aspect of the present invention, the organic polymer having self-healing ability includes 6 methyl-2 butyl ureidopyrimidinone dimer.
According to one aspect of the invention, the 6 methyl-2 butylureidopyrimidinone dimer comprises a first tautomer, the first tautomer being a 4[1H ] -pyrimidinone monomer, the 4[1H ] -pyrimidinone monomer having the chemical structure:
according to one aspect of the invention, the 6 methyl-2 butylureidopyrimidinone dimer includes a second tautomer, the second tautomer being a 6[1H ] -pyrimidinone monomer, the 6[1H ] -pyrimidinone monomer having the chemical structure:
according to one aspect of the invention, the 6 methyl-2 butylureidopyrimidinone dimer includes a third tautomer, the third tautomer being a pyrimidin-4-ol monomer having the chemical structure:
correspondingly, the invention also provides an OLED display panel which comprises the thin film packaging structure.
Correspondingly, the invention also provides a manufacturing method of the OLED display panel, which comprises the following steps:
providing a flexible substrate;
an OLED device formed on the flexible substrate;
forming a first inorganic thin film covering the OLED device;
forming a first organic thin film covering the first inorganic thin film;
forming a second inorganic thin film covering the first organic thin film; wherein the material constituting the first organic film is an organic polymer having self-healing ability.
According to one aspect of the present invention, the organic polymer having self-healing ability includes 6 methyl-2 butyl ureidopyrimidinone dimer.
According to one aspect of the invention, the method for forming the organic polymer with self-repairing capability comprises ink-jet printing, electrofluidic printing, spin coating and printing.
According to one of the aspects of the present invention, the first inorganic thin film and the second inorganic thin film include one or a combination of silicon nitride, silicon oxide, silicon oxynitride, silicon carbide, silicon carbonitride and aluminum oxide.
The organic film in the original film packaging structure is replaced by the organic polymer 6 methyl-2 butyl ureido pyrimidone dimer with self-repairing capability. The 6 methyl-2 butyl ureido pyrimidone dimer has super strong self-repairing capability, can realize self-healing at normal temperature and normal pressure through a large amount of hydrogen bonds in the dimer after tensile damage occurs, and has the same mechanical property as that before damage after self-healing. The 6 methyl-2 butyl ureido pyrimidone dimer is used as the organic film, so that the loss and the aging of the packaging structure after being folded for many times can be effectively avoided, and the bending capability of the OLED device is further improved.
Drawings
FIG. 1 is a schematic diagram illustrating a prior art film package structure before and after bending;
FIG. 2 is a schematic structural diagram of an OLED display panel before encapsulation according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an OLED display panel after being covered with a first inorganic thin film according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an OLED display panel after being covered with a first organic thin film according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of an OLED display panel after being covered with a second inorganic thin film according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of an OLED display panel according to another embodiment of the present invention;
fig. 7 is a schematic diagram of a process for the damage and self-repair of a first organic film in a film package structure according to the present invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
The prior art will first be briefly described. Referring to fig. 1, fig. 1 is a schematic diagram illustrating a prior art film encapsulation structure before and after bending. Conventional thin film encapsulation structures often include a film structure composed of a first inorganic film 102, a first organic film 104, and a second inorganic film 106. Wherein the first inorganic film 102 and the second inorganic film 106 serve as a water and oxygen barrier layer; the first organic film 104 is used as a buffer layer for slowly releasing the internal stress of the inorganic film layer and enhancing the flexibility of the OLED device.
Referring to fig. 1, for a foldable flexible device, after being folded for many times, the organic film in the film encapsulation structure inevitably suffers loss and aging, and cracks appear on the outer curved surface, which causes severe reduction of the buffering stress capability of the TFE organic film layer, and limits the service life of the foldable mobile phone.
Therefore, the invention provides a thin film packaging structure, an OLED display panel and a manufacturing method thereof, so as to delay the loss and aging of an organic film layer in TFE.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an OLED display panel after being covered with a second inorganic thin film according to an embodiment of the present invention.
Referring to fig. 5, the present invention provides an OLED display panel including a substrate 20 and an OLED device 30 on the substrate 20. The OLED display panel further comprises a thin film packaging structure, wherein the thin film packaging structure comprises:
a first inorganic thin film 12;
a first organic thin film 14, the first organic thin film 14 being positioned on the first inorganic thin film 12;
a second inorganic thin film 16, the second inorganic thin film 16 covering the first organic thin film 14 and the first inorganic thin film 12.
Of course, the number and structure of the organic film and the inorganic film in the encapsulation structure may be set according to the needs, and is not limited to the embodiment. Referring to fig. 6, in order to enhance the water and oxygen blocking effect of the thin film encapsulation structure, in another embodiment of the present invention, the thin film encapsulation structure further includes a third inorganic thin film 13 positioned over the second inorganic thin film 16, a second organic thin film 15 positioned over the third inorganic thin film 13, and a fourth inorganic thin film 17 positioned over the second organic thin film 15.
In other embodiments of the present invention, the number and the structure of the organic thin film and the inorganic thin film of the thin film encapsulation structure may be set as needed, and are not limited to the embodiments of the present invention.
In the present invention, the material constituting the first organic film 14 is an organic polymer having self-healing ability. Specifically, the organic polymer with self-repairing capability comprises 6 methyl-2 butyl ureido pyrimidone dimer. The monomers of the 6 methyl-2 butylureidopyrimidinone dimer have 3 tautomers, each tautomer containing 2 pairs of hydrogen bond donors and 2 pairs of hydrogen bond acceptors. The existence of the 4 hydrogen bond pair enables the 6 methyl-2 butyl ureido pyrimidone dimer to have super self-repairing capability.
Referring to fig. 7, fig. 7 is a schematic view illustrating a process of damage and self-repair of the first organic thin film in the thin film encapsulation structure according to the present invention. After tensile failure, the 6 methyl-2 butyl ureido pyrimidone dimer can realize self-healing under normal temperature and normal pressure through a large amount of hydrogen bonds in the dimer, and the dimer has the same mechanical properties after the self-healing as before the failure.
Specifically, the 6 methyl-2 butyl ureido pyrimidone dimer comprises a first tautomer, the first tautomer is a 4[1H ] -pyrimidone monomer, and the chemical structure of the 4[1H ] -pyrimidone monomer is as follows:
the 6 methyl-2 butylureidopyrimidinone dimer includes a second tautomer, the second tautomer being a 6[1H ] -pyrimidinone monomer, the 6[1H ] -pyrimidinone monomer having the chemical structure:
the 6 methyl-2 butylureidopyrimidinone dimer includes a third tautomer, the third tautomer being a pyrimidin-4-ol monomer, the chemical structure of the pyrimidin-4-ol monomer being:
referring to fig. 2 to 5, the present invention further provides a method for manufacturing an OLED display panel. FIG. 2 is a schematic structural diagram of an OLED display panel before encapsulation according to an embodiment of the present invention; FIG. 3 is a schematic structural diagram of an OLED display panel after being covered with a first inorganic thin film according to an embodiment of the present invention; fig. 4 is a schematic structural diagram of an OLED display panel after being covered with a first organic thin film according to an embodiment of the present invention. The method comprises the following steps:
first, as shown in fig. 2, a flexible substrate 20 is provided, and an OLED device 30 is formed on the flexible substrate 20. Methods of forming OLED devices are conventional in the art and will not be described in detail herein.
Thereafter, as shown in fig. 3, a first inorganic thin film 12 covering the OLED device is formed. The first inorganic thin film 12 includes one or a combination of silicon nitride, silicon oxide, silicon oxynitride, silicon carbide, silicon carbonitride, and aluminum oxide. Methods of forming the first inorganic thin film 12 include, but are not limited to, chemical vapor deposition, atomic layer deposition, and like techniques.
Thereafter, as shown in fig. 4, a first organic film 14 covering the first inorganic film 12 is formed. The material constituting the first organic film 14 is an organic polymer having self-healing ability. The organic polymer with self-repairing capability comprises 6 methyl-2 butyl ureido pyrimidone dimer. Methods of forming the organic polymer having self-healing capabilities include inkjet printing, electrofluidic printing, spin coating, and printing.
The monomers of the 6 methyl-2 butylureidopyrimidinone dimer have 3 tautomers, each tautomer containing 2 pairs of hydrogen bond donors and 2 pairs of hydrogen bond acceptors. The existence of the 4 hydrogen bond pair enables the 6 methyl-2 butyl ureido pyrimidone dimer to have super self-repairing capability.
Referring to fig. 7, fig. 7 is a schematic view illustrating a process of damage and self-repair of the first organic thin film in the thin film encapsulation structure according to the present invention. After tensile failure, the 6 methyl-2 butyl ureido pyrimidone dimer can realize self-healing under normal temperature and normal pressure through a large amount of hydrogen bonds in the dimer, and the dimer has the same mechanical properties after the self-healing as before the failure.
Specifically, the 6 methyl-2 butyl ureido pyrimidone dimer comprises a first tautomer, the first tautomer is a 4[1H ] -pyrimidone monomer, and the chemical structure of the 4[1H ] -pyrimidone monomer is as follows:
the 6 methyl-2 butylureidopyrimidinone dimer includes a second tautomer, the second tautomer being a 6[1H ] -pyrimidinone monomer, the 6[1H ] -pyrimidinone monomer having the chemical structure:
the 6 methyl-2 butylureidopyrimidinone dimer includes a third tautomer, the third tautomer being a pyrimidin-4-ol monomer, the chemical structure of the pyrimidin-4-ol monomer being:
finally, a second inorganic thin film 16 is formed covering the first organic thin film 14. The second inorganic thin film 16 includes a combination of one or more of silicon nitride, silicon oxide, silicon oxynitride, silicon carbide, silicon carbonitride, and aluminum oxide. Methods of forming the second inorganic thin film 16 include, but are not limited to, chemical vapor deposition, atomic layer deposition, and like techniques.
The organic film in the original film packaging structure is replaced by the organic polymer 6 methyl-2 butyl ureido pyrimidone dimer with self-repairing capability. The 6 methyl-2 butyl ureido pyrimidone dimer has super strong self-repairing capability, can realize self-healing at normal temperature and normal pressure through a large amount of hydrogen bonds in the dimer after tensile damage occurs, and has the same mechanical property as that before damage after self-healing. The 6 methyl-2 butyl ureido pyrimidone dimer is used as the organic film, so that the loss and the aging of the packaging structure after being folded for many times can be effectively avoided, and the bending capability of the OLED device is further improved.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (5)
1. A thin film encapsulation structure, comprising:
a first inorganic thin film;
a first organic thin film on the first inorganic thin film;
a second inorganic thin film covering the first organic thin film and the first inorganic thin film; wherein the content of the first and second substances,
the material for forming the first organic film is an organic polymer with self-repairing capability; the organic polymer with self-repairing capability comprises 6 methyl-2 butyl ureido pyrimidone dimer; the 6 methyl-2 butylureidopyrimidone dimer includes a first tautomer, a second tautomer, or a third tautomer, the first tautomer being a 4[1H ] -pyrimidone monomer, the second tautomer being a 6[1H ] -pyrimidone monomer, and the third tautomer being a pyrimidin-4-ol monomer, the chemical structures of the 4[1H ] -pyrimidone monomer, the 6[1H ] -pyrimidone monomer, and the pyrimidin-4-ol monomer being:
2. an OLED display panel comprising the thin film encapsulation structure of claim 1.
3. A manufacturing method of an OLED display panel is characterized by comprising the following steps:
providing a flexible substrate;
an OLED device formed on the flexible substrate;
forming a first inorganic thin film covering the OLED device;
forming a first organic thin film covering the first inorganic thin film;
forming a second inorganic thin film covering the first organic thin film; wherein, the material of the first organic film is organic polymer with self-repairing ability; the organic polymer with self-repairing capabilityThe compound comprises 6 methyl-2 butyl ureido pyrimidone dimer; the 6 methyl-2 butylureidopyrimidone dimer includes a first tautomer, a second tautomer, or a third tautomer, the first tautomer being 4[1H ]]-a pyrimidone monomer, the second tautomer being 6[1H]-a pyrimidinone monomer, said third tautomer being a pyrimidin-4-ol monomer, said 4[1H]-pyrimidone monomer, said 6[1H]-the chemical structures of the pyrimidinone monomer and the pyrimidin-4-ol monomer are respectively:
4. the method for manufacturing the OLED display panel according to claim 3, wherein the method for forming the organic polymer with self-repairing capability comprises inkjet printing, electrofluidic printing, spin coating and printing.
5. The method of claim 3, wherein the first and second inorganic films comprise one or more of silicon nitride, silicon oxide, silicon oxynitride, silicon carbide, silicon carbonitride, and aluminum oxide.
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| CN201910232697.8A CN110048016B (en) | 2019-03-26 | 2019-03-26 | Thin film packaging structure, OLED display panel and manufacturing method thereof |
| PCT/CN2019/087554 WO2020191907A1 (en) | 2019-03-26 | 2019-05-20 | Thin film encapsulation structure, and oled display panel and manufacturing method therefor |
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| CN106409873B (en) * | 2016-10-12 | 2019-06-04 | 上海天马微电子有限公司 | Flexible display apparatus and manufacturing method |
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