CN110047877A - A kind of organic LED display panel, display module and electronic device - Google Patents
A kind of organic LED display panel, display module and electronic device Download PDFInfo
- Publication number
- CN110047877A CN110047877A CN201910235443.1A CN201910235443A CN110047877A CN 110047877 A CN110047877 A CN 110047877A CN 201910235443 A CN201910235443 A CN 201910235443A CN 110047877 A CN110047877 A CN 110047877A
- Authority
- CN
- China
- Prior art keywords
- layer
- organic
- display panel
- led display
- organic layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
It includes: underlay substrate that the present invention, which provides a kind of organic LED display panel, display module and electronic device, the display panel,；Organic light emitting display layer is set on the underlay substrate；First inorganic layer is set on the organic light emitting display layer；First organic layer is set on first inorganic layer；Doped with Heat Conduction Material in the material of first organic layer；The Heat Conduction Material includes hexagonal boron nitride nanosheet；Second inorganic layer is set on first organic layer.Organic LED display panel, display module and electronic device of the invention, can be improved the heat dissipation effect of display panel, to extend the service life of display panel.
Description
[technical field]
The present invention relates to field of display technology, more particularly to a kind of organic LED display panel, display module
And electronic device.
[background technique]
Organic LED display panel (Organic Light-Emitting Diode, OLED) device with it is more traditional
LCD, which is compared, has many advantages, such as that light-weight, visual angle is wide, the response time is fast, low temperature resistant, luminous efficiency is high, therefore is regarded it as next
For novel display technology.
In order to realize the encapsulation of OLED device, thin-film package (TFE) is increasingly becoming the mainstream encapsulation technology of OLED, and TFE is normal
The film layer structure overlapped using inorganic/organic/inorganic, this closed packaged type greatly protect oled panel, effectively
Prevent destruction of the extraneous water oxygen to OLED device.However, high closed encapsulating structure will lead to panel heat dissipation difficulty, thus sternly
The service life of oled panel is shortened again.
Therefore, it is necessary to a kind of organic LED display panel, display module and electronic device are provided, it is existing to solve
There is the problems of technology.
[summary of the invention]
The purpose of the present invention is to provide a kind of organic LED display panel, display module and electronic device, energy
The heat dissipation effect for enough improving display panel, to extend the service life of display panel.
In order to solve the above technical problems, the present invention provides a kind of organic LED display panel comprising:
Underlay substrate；
Organic light emitting display layer is set on the underlay substrate；
First inorganic layer is set on the organic light emitting display layer；
First organic layer is set on first inorganic layer；Doped with Heat Conduction Material in the material of first organic layer；
Wherein the Heat Conduction Material includes hexagonal boron nitride nanosheet；
Second inorganic layer is set on first organic layer.
The present invention also provides a kind of display modules comprising above-mentioned organic LED display panel.
The present invention also provides a kind of electronic devices comprising above-mentioned display module.
Organic LED display panel, display module and electronic device of the invention, due to the material in organic layer
Middle doping Heat Conduction Material, it is thus possible to which the heat for generating OLED display panel is exported by thin-film encapsulation layer in time, is improved
The heat dissipation effect of display panel, and then extend the service life of display panel.
[Detailed description of the invention]
Fig. 1 is the structural schematic diagram of existing organic LED display panel；
Fig. 2 is the structural schematic diagram of the organic LED display panel of the embodiment of the present invention one；
Fig. 3 is the enlarged structure schematic diagram of organic layer of the present invention；
Fig. 4 is the structural schematic diagram of the organic LED display panel of the embodiment of the present invention two.
[specific embodiment]
The explanation of following embodiment is to can be used to the particular implementation of implementation to illustrate the present invention with reference to additional schema
Example.The direction term that the present invention is previously mentioned, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outside", " side "
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is to be given the same reference numerals in the figure.
As shown in Figure 1, existing organic LED display panel includes underlay substrate 11, organic light emitting display layer
12, the first inorganic layer 13, organic layer 14 and the second inorganic layer 15.
Underlay substrate 11 includes substrate and switch arrays layer, and switch arrays layer is set on substrate.Substrate can be glass base
Plate or flexible base board.Switch arrays layer includes multiple thin film transistor (TFT)s.
Organic light emitting display layer 12 includes anode, organic luminous layer and cathode.Wherein organic light emitting display layer 12 is located at
Gap location between the two neighboring pixel definition unit.Organic light emitting display layer 12 may also include pixel defining layer.Pixel
Definition layer includes multiple spaced pixel definition units.Pixel defining layer is located on anode.
First inorganic layer 13 is set on the organic light emitting display layer 12, and is coated on the organic light emitting display layer 12
Outside.
Organic layer 14 is set on the first inorganic layer 13, and wherein organic layer 14 is located at the first inorganic layer 13 in display area
On.
Second inorganic layer 15 is set on organic layer 14.Wherein the first inorganic layer 13 and the second inorganic layer 15 are used to barrier water
Oxygen, organic layer 14 enhance the flexibility of oled panel for buffering and discharging the stress in inorganic layer.
Referring to figure 2. to the structural schematic diagram for the organic LED display panel that 3, Fig. 2 is the embodiment of the present invention one.
Organic LED display panel of the invention includes underlay substrate 11, organic light emitting display layer 12, the first nothing
Machine layer 13, the first organic layer 21 and the second inorganic layer 15.
Underlay substrate 11 includes glass substrate and switch arrays layer, and switch arrays layer is set on substrate.Substrate can be glass
Glass substrate or flexible base board.Switch arrays layer includes multiple thin film transistor (TFT)s.
Organic light emitting display layer 12 includes anode, organic luminous layer and cathode.Wherein organic light emitting display layer 12 is located at
Gap location between the two neighboring pixel definition unit.Furthermore organic light emitting display layer 12 may also include pixel defining layer.
Pixel defining layer includes multiple spaced pixel definition units.Pixel defining layer is located on anode.
First inorganic layer 13 is set on the organic light emitting display layer 12, wherein.The thickness model of first inorganic layer 13
Enclose is 0.1~1.5 μm.
The preparation process of first inorganic layer 13 includes one of PECVD, ALD, PLD or multiple combinations, and described
The material of one inorganic layer 13 includes at least one of silicon nitride, silica, silicon carbide, carbonitride of silicium, aluminium oxide etc..
First organic layer 21 is set on first inorganic layer 13.In conjunction with Fig. 3, mixed in the material of first organic layer 21
It is miscellaneous to have Heat Conduction Material 211.The Heat Conduction Material 211 includes hexagonal boron nitride nanosheet (BNNS).
Wherein the thermal coefficient of the Heat Conduction Material 211 is greater than preset value.Such as the thermal coefficient of the Heat Conduction Material 211
Greater than the thermal coefficient of most of metal material.
Wherein, in order to improve heat dissipation effect, the Heat Conduction Material 211 is used for the heat in the display panel from described
The two sides of first organic layer 21 export.Such as when the Heat Conduction Material 211 is hexagonal boron nitride nanosheet, the six sides nitridation
Angle between the heat dissipation direction and horizontal line of boron nanometer sheet is acute angle, by the heat in the display panel from described first
The two sides of organic layer export.
In one embodiment, wherein the hexagonal boron nitride nanosheet is by carrying out ultrasonic removing to hexagonal boron nitride
It obtains.Hexagonal boron nitride is similar with graphene, has anisotropic heating conduction, in face thermal coefficient be 180~
360W/mK, thermal coefficient is 5~30W/mK outside face, and heating conduction is better than most of metal material.
In order to improve the heat dissipation effect of organic layer, and its buffering effect is not influenced, the Heat Conduction Material 211 is organic first
Weight percentage ranges in layer 21 are 0.1wt% to 5wt%.Namely the Heat Conduction Material 211 is in the first organic layer 21
Weight percent is no more than 5wt%.
In one embodiment, the thickness range of first organic layer 21 is 8 μm~12 μm.
In order to improve heat dissipation effect, in one embodiment, the preparation process of first organic layer 21 includes that ink-jet is beaten
One of print, spin coating and silk-screen printing.Solidify or be heating and curing by UV later and it is solidified.Due to passing through ink-jet
Two-dimentional BNNS is filled in organic material by the modes such as printing, spin coating, silk-screen printing can form good orientation, to make to have
Machine layer has anisotropic heating conduction.
Wherein the material of first organic layer 21 includes epoxy resin, silicon-based polymer and polymethyl methacrylate
At least one of.
Second inorganic layer 15 is set on first organic layer 21.Wherein the preparation process of second inorganic layer 15 includes
One of PECVD, ALD, PLD or multiple combinations, the material of second inorganic layer 15 include silicon nitride, silica, carbonization
At least one of silicon, carbonitride of silicium, aluminium oxide etc..The thickness range of second inorganic layer 15 is 0.1~1.5 μm.
Wherein the first inorganic layer 13, the first organic layer 21, the second inorganic layer 15 constitute thin-film encapsulation layer.
Referring to figure 4., Fig. 4 is the structural schematic diagram of the organic LED display panel of the embodiment of the present invention two.
On the basis of a upper embodiment, the organic LED display panel of the present embodiment further include: second is organic
Layer 22 and third inorganic layer 23.
Second organic layer 22 is set on second inorganic layer 15；The material of second organic layer 22 is also doped with thermally conductive
Material；Wherein the material of second organic layer 22 can be identical as the material of first organic layer 21.Wherein the second organic layer
22 heat-conducting mode is identical as the thermally conductive direction of first organic layer 21.
Third inorganic layer 23 is set on second organic layer 22.The preparation process of the third inorganic layer 23 may include
One of PECVD, ALD, PLD or multiple combinations；The material of the third inorganic layer 23 may include silicon nitride, silica, carbon
At least one of SiClx, carbonitride of silicium, aluminium oxide etc..The thickness range of the third inorganic layer 23 can be 0.1~1.5 μm.
Wherein the first inorganic layer 13, the first organic layer 21,15 second organic layer 22 of the second inorganic layer and third inorganic layer
23 constitute thin-film encapsulation layer.
Due to adulterating Heat Conduction Material in the material of organic layer, and the Heat Conduction Material includes hexagonal boron nitride nanosheet,
And since the heating conduction of hexagonal boron nitride nanosheet is preferable, it is thus possible to lead to the heat that OLED display panel generates in time
Thin-film encapsulation layer export is crossed, improves the heat dissipation effect of display panel, and then extend display panel service life.Additionally due to will
The heat that OLED display panel generates when working transfers out in time to be come, to protect to OLED device, guarantees its effect that shines
Rate；And it is possible to prevente effectively from film layer lower section appearance " overheat " region, prevents from " overheating " pixel failures in region, extends pixel
Service life.
The present invention also provides a kind of display modules comprising any one of the above organic LED display panel, it should
Display module may also include touch screen.
The present invention also provides a kind of electronic devices comprising above-mentioned display module, the electronic device can be mobile phone, plate
Apparatus such as computer.
Organic LED display panel, display module and electronic device of the invention, due to the material in organic layer
Middle doping Heat Conduction Material, it is thus possible to which the heat for generating OLED display panel is exported by thin-film encapsulation layer in time, is improved
The heat dissipation effect of display panel, and then extend the service life of display panel.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (11)
1. a kind of organic LED display panel characterized by comprising
Underlay substrate；
Organic light emitting display layer is set on the underlay substrate；
First inorganic layer is set on the organic light emitting display layer；
First organic layer is set on first inorganic layer；Doped with Heat Conduction Material in the material of first organic layer；Wherein
The Heat Conduction Material includes hexagonal boron nitride nanosheet；
Second inorganic layer is set on first organic layer.
2. organic LED display panel according to claim 1, which is characterized in that the Organic Light Emitting Diode
Display panel further include:
Second organic layer is set on second inorganic layer；The material of second organic layer is also doped with the Heat Conduction Material；
Third inorganic layer is set on second organic layer.
3. organic LED display panel according to claim 1, which is characterized in that
The thermal coefficient of the Heat Conduction Material is greater than preset value.
4. organic LED display panel according to claim 1, which is characterized in that
The hexagonal boron nitride nanosheet is obtained by carrying out ultrasound removing to hexagonal boron nitride.
5. organic LED display panel according to claim 1, which is characterized in that
Weight percentage ranges of the Heat Conduction Material in first organic layer are 0.1wt% to 5wt%.
6. organic LED display panel according to claim 1, which is characterized in that
The Heat Conduction Material is used to export the heat in the display panel from the two sides of first organic layer.
7. organic LED display panel according to claim 1, which is characterized in that
The thickness range of first organic layer is 8 μm~12 μm.
8. organic LED display panel according to claim 1, which is characterized in that
The preparation process of first organic layer includes at least one of inkjet printing, spin coating and silk-screen printing.
9. organic LED display panel according to claim 1, which is characterized in that
The material of first organic layer includes at least one in epoxy resin, silicon-based polymer and polymethyl methacrylate
Kind.
10. a kind of display module, which is characterized in that including Organic Light Emitting Diode as claimed in any one of claims 1 to 9
Display panel.
11. a kind of electronic device, which is characterized in that including display module as claimed in claim 10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910235443.1A CN110047877A (en) | 2019-03-27 | 2019-03-27 | A kind of organic LED display panel, display module and electronic device |
| PCT/CN2019/085806 WO2020191859A1 (en) | 2019-03-27 | 2019-05-07 | Organic light emitting diode display panel, display module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910235443.1A CN110047877A (en) | 2019-03-27 | 2019-03-27 | A kind of organic LED display panel, display module and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110047877A true CN110047877A (en) | 2019-07-23 |
Family
ID=67275112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910235443.1A Pending CN110047877A (en) | 2019-03-27 | 2019-03-27 | A kind of organic LED display panel, display module and electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110047877A (en) |
| WO (1) | WO2020191859A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110690356A (en) * | 2019-09-03 | 2020-01-14 | 武汉华星光电半导体显示技术有限公司 | Thin film packaging layer, organic light emitting diode device and manufacturing method thereof |
| CN111063825A (en) * | 2019-12-09 | 2020-04-24 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED packaging structure, manufacturing method thereof and display device |
| CN113130810A (en) * | 2019-12-30 | 2021-07-16 | Tcl集团股份有限公司 | Packaging structure, packaging method thereof and display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102140256A (en) * | 2010-01-29 | 2011-08-03 | 日东电工株式会社 | Thermally conductive sheet |
| US20110259569A1 (en) * | 2010-01-29 | 2011-10-27 | Nitto Denko Corporation | Thermal conductive sheet |
| CN106009445A (en) * | 2016-07-25 | 2016-10-12 | 昆山隆浩鼎新材料科技有限公司 | Heat-conducting polymer nano composite and preparation method thereof |
| CN106084219A (en) * | 2016-06-02 | 2016-11-09 | 黑龙江科技大学 | A kind of preparation method of high-performance polyimide/ultrathin boron nitride laminated film |
| CN106450029A (en) * | 2016-10-25 | 2017-02-22 | 武汉华星光电技术有限公司 | OLED (organic light emitting diode) displaying device and manufacturing method thereof |
| CN207068857U (en) * | 2017-08-24 | 2018-03-02 | 京东方科技集团股份有限公司 | A kind of display panel |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101482313B1 (en) * | 2012-10-10 | 2015-01-13 | 주식회사 포스코 | Encapsulant for Packaging an Organic Electric Device, Method for Preparing the Same, Method for Encapsulating the Organic Electric Device by Using the Same and Organic Electric Device Packaged by the same |
| CN104638165A (en) * | 2013-11-12 | 2015-05-20 | 海洋王照明科技股份有限公司 | Organic light-emitting device and preparation method thereof |
| CN106554514B (en) * | 2016-10-28 | 2018-10-23 | 上海大学 | A method of with poly-dopamine modification boron nitride nanosheet surface |
| CN106972113B (en) * | 2017-05-25 | 2018-09-11 | 深圳市华星光电技术有限公司 | The package assembling and packaging method of OLED device, display device |
-
2019
- 2019-03-27 CN CN201910235443.1A patent/CN110047877A/en active Pending
- 2019-05-07 WO PCT/CN2019/085806 patent/WO2020191859A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102140256A (en) * | 2010-01-29 | 2011-08-03 | 日东电工株式会社 | Thermally conductive sheet |
| US20110259569A1 (en) * | 2010-01-29 | 2011-10-27 | Nitto Denko Corporation | Thermal conductive sheet |
| CN106084219A (en) * | 2016-06-02 | 2016-11-09 | 黑龙江科技大学 | A kind of preparation method of high-performance polyimide/ultrathin boron nitride laminated film |
| CN106009445A (en) * | 2016-07-25 | 2016-10-12 | 昆山隆浩鼎新材料科技有限公司 | Heat-conducting polymer nano composite and preparation method thereof |
| CN106450029A (en) * | 2016-10-25 | 2017-02-22 | 武汉华星光电技术有限公司 | OLED (organic light emitting diode) displaying device and manufacturing method thereof |
| CN207068857U (en) * | 2017-08-24 | 2018-03-02 | 京东方科技集团股份有限公司 | A kind of display panel |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110690356A (en) * | 2019-09-03 | 2020-01-14 | 武汉华星光电半导体显示技术有限公司 | Thin film packaging layer, organic light emitting diode device and manufacturing method thereof |
| CN111063825A (en) * | 2019-12-09 | 2020-04-24 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED packaging structure, manufacturing method thereof and display device |
| CN113130810A (en) * | 2019-12-30 | 2021-07-16 | Tcl集团股份有限公司 | Packaging structure, packaging method thereof and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020191859A1 (en) | 2020-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110047877A (en) | A kind of organic LED display panel, display module and electronic device | |
| KR102327796B1 (en) | OLED element encapsulation module and encapsulation method, display device | |
| US20170018729A1 (en) | Oled substrate and producing method thereof, panel, and display apparatus | |
| CN101645478A (en) | Light emitting diode (LED) radiating structure | |
| CN104183785A (en) | OLED device packaging method, OLED display panel and OLED display device | |
| TW200411699A (en) | Plasma display | |
| CN104701353A (en) | Organic light-emitting display panel and display device | |
| CN204011490U (en) | A kind of organic electroluminescence device and display unit | |
| CN111508991B (en) | Display device and manufacturing method thereof | |
| US20180342698A1 (en) | Oled device packaging component, packaging method and display device thereof | |
| CN103439831B (en) | Side-light type liquid crystal module, directly-down liquid crystal module and televisor | |
| CN109216427A (en) | The production method and display device of a kind of display panel, display panel | |
| WO2014121550A1 (en) | Array substrate and oled display device | |
| CN110828530A (en) | Display panel, preparation method thereof and display device | |
| WO2020215421A1 (en) | Display panel and encapsulating method therefor, and display device | |
| CN102709480B (en) | Organic electroluminescence device and display | |
| CN210136381U (en) | Shielding heat dissipation buffer module | |
| CN110148685A (en) | Display panel and preparation method thereof | |
| CN110085761A (en) | Encapsulation cover plate and the display panel for using the encapsulation cover plate | |
| CN110993827B (en) | OLED display panel and display device | |
| CN104752487B (en) | Flexible base board and flexible display device preparation method | |
| US20220240418A1 (en) | Thermal conductive structure and electronic device | |
| CN113299846B (en) | Display panel and preparation method thereof | |
| KR20140091403A (en) | Electrode structure and method of fabricating thereof, display device having thereof | |
| TWI227095B (en) | Organic light emitting diode (OLED) display and fabrication method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190723 |