CN110039406A - A kind of ultra-precision machining tool and processing method of monocrystalline silicon optics complex surface - Google Patents
A kind of ultra-precision machining tool and processing method of monocrystalline silicon optics complex surface Download PDFInfo
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- CN110039406A CN110039406A CN201910379630.7A CN201910379630A CN110039406A CN 110039406 A CN110039406 A CN 110039406A CN 201910379630 A CN201910379630 A CN 201910379630A CN 110039406 A CN110039406 A CN 110039406A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
- B24B13/01—Specific tools, e.g. bowl-like; Production, dressing or fastening of these tools
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- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The present invention provides the ultra-precision machining tool and processing method of a kind of monocrystalline silicon optics complex surface, belongs to Ultraprecision Machining field.The invention firstly uses machining tools to carry out examination processing to examination workpiece, detects respectively to two right-angled intersection arc groove surface figure accuracies in examination work piece surface after examination processing, and then obtain accurate R2And R1Value；Then to describe monocrystalline silicon optics complex surface element multinomial or discrete point cloud carry out data calculating, obtain lathe coordinate system under three-dimensional rectangle data, then further according to this three-dimensional rectangle data, R2、R1Carry out Toolpath Generation；The processing of monocrystalline silicon optics complex surface element is finally carried out by machining locus.The present invention solves the problems, such as that the Ultraprecision Machining processing efficiency of existing monocrystalline silicon optics complex surface is lower, precision is not high.The present invention can be used for the Ultra-precision Turning on a variety of hard crisp difficult-to-machine material surfaces such as glass, ceramics, crystal.
Description
Technical field
The present invention relates to the ultra-precision machining tools and processing method of a kind of hard brittle material optics complex surface, belong to superfinishing
Close processing technique field.
Background technique
By the driving of infrared imagery technique application demand, monocrystalline silicon optics complex surface (including it is off-axis aspheric surface, freely bent
Face and body structure surface) Ultra-precision Turning demand be continuously increased.Currently, for the conventionally manufactured of monocrystalline silicon optics complex surface
Processing technology needs to undergo a series of technical process such as milling, fine grinding, grinding, polishing.However, due to machining process
Process it is more, need that machining tool or workpiece are installed repeatedly, not only increase the non-cutting time of forming, and bring
Biggish installation error, greatly reduces processing efficiency and the accuracy of manufacture.Moreover, the processing efficiency of polishing is lower, worker's technology
Dependence is strong, and the processing during polishing alternately and repeatedly increases the process-cycle of workpiece with characterization processes process.In addition,
With being continuously increased for Surface complexity, conventional machining process has been increasingly difficult to be applicable in.
In view of the above problems, many scholars have studied the monocrystalline silicon complex surface optics element based on Ultraprecision Machining
Forming and machining method improves its processing efficiency and the accuracy of manufacture, reduces the subsequent polishing time, such as uses single-point diamond
The ultra-precise cutting processing technology of cutter and use the precision grinding machining technology of diamond abrasive grain grinding wheel with replace milling, essence
Mill, grinding three-step process process, or even replace polishing process.However, although ultra-precise cutting processing technology can significantly improve
Machining accuracy, but since when processing large scale or the higher blank material of hardness, the abrasion of single-point diamond lathe tool is very fast, it leads
Its range of work is caused to be limited, higher cost.It is a variety of not that superfine grinding technology can be suitable for crystal, metal, glass, ceramics etc.
It is the current most common ultraprecise processing method of monocrystalline silicon infrared optical element with the hard brittle material of physical property, but when processing
Conventional sintering skive, which is easily worn, causes surface figure accuracy to lose, and skive needs continuous iteration finishing, this is greatly
Processing efficiency is reduced, and influences machining accuracy.In addition, for monocrystalline silicon optics complex surface, due to its surface texture
Particularity, can not be using traditional spherical surface or aspherical description method, and when design mostly uses multinomial or discrete point cloud data
Optical surface structure is described.When using CAM (Computer Aided Manufacturing, computer-aided manufacturing) software into
When row Toolpath Generation, track generation is carried out generally according to the surface of multinomial or the approximated fitting of discrete point cloud data,
Therefore it can be generated due to data conversion and bring initial error when track generates, greatly reduce machining accuracy.Therefore, needle
To monocrystalline silicon optics complex surface, the Ultra-precision Turning process for needing one kind new is to solve the above problems.
Summary of the invention
The present invention be solve existing monocrystalline silicon optics complex surface Ultraprecision Machining processing efficiency is lower, precision not
High problem provides the ultra-precision machining tool and processing method of a kind of monocrystalline silicon optics complex surface.
A kind of ultra-precision machining tool of monocrystalline silicon optics complex surface of the present invention, the machining tool are disk
Shape, radius R2；The fillet that the side surface circumference of machining tool is 180 °, radius of corner R1；The machining tool the center point is set
There is through-hole, the through-hole is used to the machining tool being installed to machining tool rotary shaft, R1Less than monocrystalline silicon optics complexity table
The surface texture minimum profile curvature radius r of face element part1；R2Less than on monocrystalline silicon optics complex surface element with minimum profile curvature radius r1
Minimum profile curvature radius r on the vertical other direction of direction2；The arc-shaped surface of the machining tool is equipped with equally distributed
Micro- sword array；It is 45 ° that the anterior angle of micro- sword array, which is 45 ° of inclination angles,；Spacing between adjacent every micro- sword of row of micro- sword array
For W, a height of H of sword；The spacing W and a height of H of sword of micro- sword array meet the functional relation of formula (1) and formula (2):
Wherein, dcChange critical depth for the crisp modeling of monocrystalline silicon, N is the revolving speed of machining tool, and D is the straight of machining tool
Diameter, f are feed rate, apFor working depth.
A kind of ultraprecise processing method of monocrystalline silicon optics complex surface of the present invention, it is real by the following technical programs
It is existing:
Step 1: machining tool is mounted in machining tool rotary shaft；Examination workpiece is horizontally mounted on the table；
Examination processing is carried out to examination workpiece using machining tool, radial feed mode and axial feed mode is respectively adopted in examination workpiece
Two arc grooves of right-angled intersection are processed on surface；The axial direction refers to the direction of machining tool rotary shaft, the diameter
To referring to direction that is vertical with the direction of machining tool rotary shaft and being parallel to horizontal plane；Respectively to examination workpiece after examination processing
Two right-angled intersection arc groove surface figure accuracies on surface are detected, and then obtain accurate R2And R1Value；
Step 2: monocrystalline silicon optics complex surface element to be processed and examination workpiece are horizontally mounted on the table；
The surface texture minimum profile curvature radius r of monocrystalline silicon optics complex surface element is set to be in radial direction；
Step 3: to multinomial or discrete point cloud progress data meter to describe monocrystalline silicon optics complex surface element
It calculates, the three-dimensional rectangle data [x, y, z] under lathe coordinate system XYZ is obtained, then further according to this three-dimensional rectangle data, R2、R1It carries out
Toolpath Generation obtains the coordinate data of machining locus；
Step 4: carrying out the processing of monocrystalline silicon optics complex surface element by machining locus.
Present invention feature the most prominent and significant beneficial effect are:
The ultra-precision machining tool and method of a kind of monocrystalline silicon optics complex surface according to the present invention are added using described
Work tool is to obtain high-wearing feature to inhibit the damage of the error as brought by traditional grinding wheel or wear of diamond cutter, Yi Jiduo
The low problem of processing efficiency caused by secondary tooling revisions；Utilize the trajectory planning scheme in the Ultra-precision Turning process
The introduced face shape error of data conversion is generated to eliminate existing complex surface；Utilize the excellent of the Ultra-precision Turning process
Change technological parameter with improve processing after monocrystalline silicon surface smoothness, to realize that the ultraprecise of monocrystalline silicon optics complex surface adds
Work.Specifically have the advantage that
1) ultra-precision machining tool of a kind of monocrystalline silicon optics complex surface of the present invention, since machining tool uses
Diamond coating tool, wearability is very good, is not required to be modified in processing.Since coating film thickness is easily controllable, system
Manufacturing accuracy is high.Additionally due to micro- sword array arranged regular on its surface, has good consistency, therefore in process more
It is easy to accurately control the undeformed thickness of cutting of machined material, help to obtain better machined surface quality.And due to
When Toolpath Generation, number of coordinates strong point and three-dimensional rectangle of the monocrystalline silicon optics complex surface element 3 under lathe coordinate system
Data point is overlapped, therefore avoids error in the past introduced by data conversion, and is reduced and calculated the time.Experimental result table
Bright, the wearability of machining tool 1 can be 30 times or more of conventional resins base grinding wheel, and circle jumps and is smaller than 2 microns.Under same precision,
The Toolpath Generation calculating time reduces 40%.Monocrystalline silicon after processing shows roughness up to 8nm, and surface figure accuracy can be improved
10%.
2) ultraprecise processing method of a kind of monocrystalline silicon optics complex surface of the present invention, due to using " cross circle
Arc fluting " tries processing method and carries out the detection in place of machining tool 1, therefore can once obtain very accurate processing work in place
The multinomial geometric dimension of tool is conducive to the computational accuracy for improving following process track, to obtain higher processing surface precision.
The experimental results showed that the detection accuracy in place of machining tool is smaller than 0.5 micron.
3) this kind of ultraprecise processing method of monocrystalline silicon optics complex surface of the present invention, has stronger general
Property.It can be used for the Ultra-precision Turning on the Various Complexes such as off-axis aspheric surface, free form surface and body structure surface surface, material removes monocrystalline silicon
It could be applicable to a variety of hard crisp difficult-to-machine materials such as glass, ceramics, crystal in addition.
Detailed description of the invention
Fig. 1 is a kind of ultraprecise processing method schematic diagram of monocrystalline silicon optics complex surface of the present invention；
Fig. 2 is the side view of machining tool of the present invention；
Fig. 3 is the structural schematic diagram of machining tool of the present invention；
Fig. 4 is two arc groove schematic diagrames that right-angled intersection is processed in examination work piece surface of the present invention；
Fig. 5 is machining locus schematic diagram of the present invention；
Fig. 6 is influence schematic diagram of the machining locus radial feed interval to theoretical roughness of surface；
Wherein, 1. machining tool, 2. machining tool rotary shafts, 3. monocrystalline silicon optics complex surface elements, 4. examination workpieces,
5. micro- sword array, the micro- sword of 5-1..
Specific embodiment
Specific embodiment 1: be illustrated in conjunction with Fig. 1, Fig. 2, Fig. 3 to present embodiment, present embodiment provide one
The ultra-precision machining tool of kind monocrystalline silicon optics complex surface, the machining tool 1 are disc type, and disk radius is R2；Processing
The fillet that the side surface circumference of tool is 180 °, radius of corner R1, as shown in Figure 2；The machining tool the center point is equipped with through-hole,
The through-hole is used to the machining tool 1 being installed to machining tool rotary shaft 2, R1Less than monocrystalline silicon optics complex surface element
3 surface texture minimum profile curvature radius r1；R2Less than on monocrystalline silicon optics complex surface element 3 with minimum profile curvature radius r1Place
Minimum profile curvature radius r on the vertical other direction in direction2；As shown in figure 3, the arc-shaped surface of the machining tool 1 is equipped with
Micro- sword array 5 of cloth；The anterior angle of micro- sword array 5 is 45 °, and (arrow in the upper right corner indicates machining tool rotation side in Fig. 3
To), obtaining best anterior angle according to the single-blade cutting experiment of monocrystalline silicon is 45 °, is conducive to the plastic region material removal of monocrystalline silicon, inclines
Angle is 45 °, is conducive to the chip removal in process；Spacing between adjacent every micro- sword 5-1 of row of micro- sword array 5 is W, and sword is high
For H；
Since monocrystalline silicon is fragile material, in process to acquisition nanoscale surface smoothness, it is necessary to
Material removal process is controlled in plastic region, i.e., the undeformed thickness h of maximum in processmaxIt should be less than the crisp modeling of monocrystalline silicon
Change critical depth dc.Change critical depth d according to the crisp modeling that fragile material plastic processing theory can obtain monocrystalline siliconc:
Wherein E is the elasticity modulus of material, and H ' is the Vickers hardness of material, KcFor the fracture toughness of material.
Maximum undeformed thickness h can be obtained according to the geometrical relationship of Fig. 3max:
Wherein fzFor total cutting edge number of every sword amount of feeding machining tool 1, can be acquired by following formula:
Wherein z is total cutting edge number of machining tool 1, can be acquired by following formula:
According to formula (4)-(7), the spacing W that can acquire micro- sword array 5 need to meet following functional relation:
And in order to guarantee that machining tool 1 has enough chip spaces, need to guarantee that the high H of micro- sword is greater than maximum undeformed thickness
Spend hmax, while in order to guarantee that machining tool 1 has enough micro- sword intensity, need to guarantee simultaneously that micro- land portion angle is greater than
90 °, in conjunction with the geometrical relationship of 45 ° of anterior angles, and need to guarantee that the high H of micro- sword is less than spacing W and obtains in conjunction with formula (8)-(10):
Wherein, dcChange critical depth for the crisp modeling of monocrystalline silicon, N is the revolving speed of machining tool 1, and D is the straight of machining tool 1
Diameter, f are feed rate, apFor working depth.
Specific embodiment 2: the present embodiment is different from the first embodiment in that, the side of the machining tool
Face circumferential surface is equipped with CVD or PVD diamond thin coating, and thickness of coating is 3-5 μm；The CVD indicates chemical vapor deposition
(Chemical Vapor Deposition), the PVD indicate physical vapor deposition (Physical Vapor
Deposition)。
Other steps and parameter are same as the specific embodiment one.
Specific embodiment 3: be illustrated in conjunction with Fig. 1, Fig. 4, Fig. 5 to present embodiment, present embodiment provide one
The ultraprecise processing method of kind monocrystalline silicon optics complex surface, specifically includes the following steps:
Step 1: machining tool is mounted in machining tool rotary shaft, installation error is less than 1 μm；It will try workpiece water
It is flat to be installed on the workbench；Examination processing is carried out to examination workpiece using machining tool, radial feed mode and axial direction is respectively adopted
Feeding mode processes two arc grooves of right-angled intersection in examination work piece surface；The axial direction refers to that machining tool revolves
The direction of shaft, the radial direction refer to direction that is vertical with the direction of machining tool rotary shaft and being parallel to horizontal plane；Examination adds
Two right-angled intersection arc groove surface figure accuracies in examination work piece surface are detected respectively after work, and then accurately obtain essence
True ground R2And R1Value；Need to modify before processing due to machining tool, it is trimmed after size can change, including side
Chamfer radius therefore obtains accurate R by the way of examination processing here with radial radius (similar grinding wheel)2And R1Value.
Step 2: monocrystalline silicon optics complex surface element to be processed and examination workpiece are horizontally mounted on the table；
The surface texture minimum profile curvature radius r of monocrystalline silicon optics complex surface element is set to be in radial direction；
Step 3: to multinomial or discrete point cloud progress data meter to describe monocrystalline silicon optics complex surface element
It calculates, the three-dimensional rectangle data [x, y, z] under lathe coordinate system XYZ is obtained, then further according to this three-dimensional rectangle data, R2、R1It carries out
Toolpath Generation obtains the coordinate data of machining locus；Wherein, the X-axis of lathe coordinate system is directed toward axial direction, and Y-axis is directed toward
Radial direction, Z axis are directed toward vertical direction；
Step 4: carrying out the processing of monocrystalline silicon optics complex surface element by machining locus.
Specific embodiment 4: present embodiment is unlike specific embodiment three, it is wherein described in step 1 to add
The radius R of work tool2It is 10 times of axial arc groove depth；The R1It is 3 times of radial arc groove depth.
Other steps and parameter are the same as the specific implementation mode 3.
Specific embodiment 5: present embodiment is added described in step 3 unlike specific embodiment four
Work trajectory planning, the detailed process for obtaining the coordinate data of machining locus include:
The number of coordinates strong point of the machining locus and three-dimensional of the monocrystalline silicon optics complex surface element under lathe coordinate system
Rectangle data point is overlapped, and machining locus is grid scan-type track；In the three-dimensional rectangle data [x, y, z] with machining tool axis
0.005-0.02mm is divided between the corresponding ordered series of numbers in direction；In the three-dimensional rectangle data [x, y, z] with machining tool radial direction side
D is divided between corresponding ordered series of numbers.
Other steps and parameter are identical as specific embodiment four.
Specific embodiment 6: present embodiment, unlike specific embodiment five, the ordered series of numbers interval d is by monocrystalline
The surface roughness editing objective value of silicon optics complex surface element determines:
The theoretical roughness of surface value of processing rear surface can be sought by geometrical relationship in Fig. 6, as follows:
Therefore can according to the target roughness value of finished surface come reverse, the machining locus that needs to set in actual processing
Radial feed interval:
Wherein, RzFor the theoretical surface roughness target value after processing.
Other steps and parameter are identical as specific embodiment five.
Specific embodiment 7: present embodiment is unlike specific embodiment three to six, described in step 4 into
Row monocrystalline silicon optics complex surface element is processed as axial feed processing.
Other steps and parameter are identical as specific embodiment three to six.
Specific embodiment 8: present embodiment is unlike specific embodiment seven, monocrystalline silicon described in step 4
The processing of optics complex surface element, specific machined parameters are as follows:
The revolving speed of machining tool is 7200rpm, and roughing axial feed rate is 9mm/min, and finishing axial feed rate is
1mm/min, roughing depth are 10 μm, and finishing depth is 1 μm, are divided into 8mm between roughing radial feed, finishing it is radial into
It is divided into 2mm to, it is primary to carry out light processing after machining tool radial direction offset 1mm after processing.
Other steps and parameter are identical as specific embodiment seven.
Embodiment
Beneficial effects of the present invention are verified using following embodiment:
A kind of ultraprecise processing method of monocrystalline silicon optics complex surface, machined parameters described in the present embodiment pass through monocrystalline
Silicon process technology experiment obtains, and experiment arranges as follows:
The experiment of 1 single crystal silicon material process optimization of table arranges
Optimal result is obtained by technological experiment interpretation of result, i.e. the revolving speed of machining tool 1 is 7200rpm, and roughing is axial
Feed rate is 9mm/min, and finishing axial feed rate is 1mm/min, and roughing depth is 10 μm, and finishing depth is 1 μm, slightly
It is divided into 8mm between processing radial feed, is divided into 2mm between finishing radial feed, is deviated after processing along 1 radial direction of machining tool
It is primary that light processing is carried out after 1mm.
Then it is processed according to the method for the present invention, and the workpiece after processing is measured；Measurement result shows this hair
Monocrystalline silicon after bright method processing shows that roughness averagely reaches 8nm, and it is micro- that the detection accuracy in place of machining tool is smaller than 0.5
Rice.
The present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, this field
Technical staff makes various corresponding changes and modifications in accordance with the present invention, but these corresponding changes and modifications all should belong to
The protection scope of the appended claims of the present invention.
Claims (8)
1. a kind of ultra-precision machining tool of monocrystalline silicon optics complex surface, which is characterized in that the machining tool is disc type,
Its radius is R2；The fillet that the side surface circumference of machining tool is 180 °, radius of corner R1；The machining tool the center point is equipped with
Through-hole, the through-hole are used to the machining tool being installed to machining tool rotary shaft, R1Less than monocrystalline silicon optics complex surface
The surface texture minimum profile curvature radius r of element1；R2Less than on monocrystalline silicon optics complex surface element with minimum profile curvature radius r1Institute
Minimum profile curvature radius r on the vertical other direction in direction2；The arc-shaped surface of the machining tool is equipped with equally distributed micro-
Sword array；The anterior angle of micro- sword array is 45 °, and inclination angle is 45 °；Spacing between adjacent every micro- sword of row of micro- sword array is
W, a height of H of sword；The spacing W and a height of H of sword of micro- sword array meet the functional relation of formula (1) and formula (2):
Wherein, dcChange critical depth for the crisp modeling of monocrystalline silicon, N is the revolving speed of machining tool, and D is the diameter of machining tool, and f is
Feed rate, apFor working depth.
2. a kind of ultra-precision machining tool of monocrystalline silicon optics complex surface according to claim 1, which is characterized in that described
The side surface circumference surface of machining tool is equipped with CVD or PVD diamond thin coating, and thickness of coating is 3-5 μm；The CVD is indicated
Chemical vapor deposition, the PVD indicate physical vapor deposition.
3. a kind of processing method of the ultra-precision machining tool using monocrystalline silicon optics complex surface as claimed in claim 1 or 2,
It is characterized in that, specifically includes the following steps:
Step 1: machining tool is mounted in machining tool rotary shaft；Examination workpiece is horizontally mounted on the table；It utilizes
Machining tool carries out examination processing to examination workpiece, and radial feed mode and axial feed mode is respectively adopted in examination work piece surface
On process two arc grooves of right-angled intersection；The axial direction refers to the direction of machining tool rotary shaft, and the radial direction refers to
Be direction that is vertical with the direction of machining tool rotary shaft and being parallel to horizontal plane；Respectively to examination work piece surface after examination processing
On two right-angled intersection arc groove surface figure accuracies detected, and then obtain accurate R2And R1Value；
Step 2: monocrystalline silicon optics complex surface element to be processed and examination workpiece are horizontally mounted on the table；Make list
The surface texture minimum profile curvature radius r of crystal silicon optics complex surface element is in radial direction；
Step 3: to describe monocrystalline silicon optics complex surface element multinomial or discrete point cloud carry out data calculating, obtain
The three-dimensional rectangle data [x, y, z] under lathe coordinate system XYZ are obtained, then further according to this three-dimensional rectangle data, R2、R1It is processed
Trajectory planning obtains the coordinate data of machining locus；
Step 4: carrying out the processing of monocrystalline silicon optics complex surface element by machining locus.
4. a kind of ultraprecise processing method of monocrystalline silicon optics complex surface according to claim 3, which is characterized in that step
The wherein radius R in one2It is 10 times of axial arc groove depth；The R1It is 3 times of radial arc groove depth.
5. a kind of ultraprecise processing method of monocrystalline silicon optics complex surface according to claim 4, which is characterized in that step
Toolpath Generation is carried out described in three, the detailed process for obtaining the coordinate data of machining locus includes:
The number of coordinates strong point of the machining locus and three-dimensional rectangle of the monocrystalline silicon optics complex surface element under lathe coordinate system
Data point is overlapped, and machining locus is grid scan-type track；In the three-dimensional rectangle data [x, y, z] with machining tool axial direction side
0.005-0.02mm is divided between corresponding ordered series of numbers；In the three-dimensional rectangle data [x, y, z] with machining tool radial direction pair
D is divided between the ordered series of numbers answered.
6. a kind of ultraprecise processing method of monocrystalline silicon optics complex surface according to claim 5, which is characterized in that described
Ordered series of numbers interval d is determined by the surface roughness editing objective value of monocrystalline silicon optics complex surface element, can be asked by formula (3)
:
Wherein, RzFor the theoretical surface roughness target value after processing.
7. a kind of ultraprecise processing method of monocrystalline silicon optics complex surface according to claim 3~6 any one, special
Sign is that progress monocrystalline silicon optics complex surface element described in step 4 is processed as axial feed processing.
8. a kind of ultraprecise processing method of monocrystalline silicon optics complex surface according to claim 7, which is characterized in that step
The processing of the complex surface element of monocrystalline silicon optics described in four, specific machined parameters are as follows:
The revolving speed of machining tool is 7200rpm, and roughing axial feed rate is 9mm/min, and finishing axial feed rate is 1mm/
Min, roughing depth are 10 μm, and finishing depth is 1 μm, and 8mm is divided between roughing radial feed, are finished between radial feed
It is divided into 2mm, it is primary to carry out light processing after machining tool radial direction offset 1mm after processing.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110900319A (en) * | 2019-12-04 | 2020-03-24 | 南阳利达光电有限公司 | Correction method for optical part die repairing |
| CN112496876A (en) * | 2020-12-04 | 2021-03-16 | 天津津航技术物理研究所 | Ultra-precise turning method for aspheric surface of silicon lens |
| CN113319656A (en) * | 2021-06-25 | 2021-08-31 | 泉州华中科技大学智能制造研究院 | Grinding method for special-shaped workpiece |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5472374A (en) * | 1992-08-10 | 1995-12-05 | Sumitomo Metal Mining Co., Ltd. | Polishing method and polishing device using the same |
| CN102230979A (en) * | 2011-06-27 | 2011-11-02 | 哈尔滨工业大学 | Method for batch preparation of binary optical elements having continuous embossment structures |
| CN103331473A (en) * | 2013-05-17 | 2013-10-02 | 西安交通大学 | Ultra-dense tooth face milling cutter and design method thereof |
| CN104339243A (en) * | 2014-11-26 | 2015-02-11 | 哈尔滨工业大学 | Grinding machine tool and method for processing aspherical monocrystalline silicon lens on machine tool |
| CN107243848A (en) * | 2017-06-16 | 2017-10-13 | 长沙理工大学 | Spiral orderly-arranged fiber cutter capable of machining positive rake angle and preparation method thereof |
-
2019
- 2019-05-08 CN CN201910379630.7A patent/CN110039406B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5472374A (en) * | 1992-08-10 | 1995-12-05 | Sumitomo Metal Mining Co., Ltd. | Polishing method and polishing device using the same |
| CN102230979A (en) * | 2011-06-27 | 2011-11-02 | 哈尔滨工业大学 | Method for batch preparation of binary optical elements having continuous embossment structures |
| CN103331473A (en) * | 2013-05-17 | 2013-10-02 | 西安交通大学 | Ultra-dense tooth face milling cutter and design method thereof |
| CN104339243A (en) * | 2014-11-26 | 2015-02-11 | 哈尔滨工业大学 | Grinding machine tool and method for processing aspherical monocrystalline silicon lens on machine tool |
| CN107243848A (en) * | 2017-06-16 | 2017-10-13 | 长沙理工大学 | Spiral orderly-arranged fiber cutter capable of machining positive rake angle and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110900319A (en) * | 2019-12-04 | 2020-03-24 | 南阳利达光电有限公司 | Correction method for optical part die repairing |
| CN112496876A (en) * | 2020-12-04 | 2021-03-16 | 天津津航技术物理研究所 | Ultra-precise turning method for aspheric surface of silicon lens |
| CN113319656A (en) * | 2021-06-25 | 2021-08-31 | 泉州华中科技大学智能制造研究院 | Grinding method for special-shaped workpiece |
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| CN110039406B (en) | 2020-06-12 |
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