CN110034066A - The dividing method and segmenting device of machined object - Google Patents
The dividing method and segmenting device of machined object Download PDFInfo
- Publication number
- CN110034066A CN110034066A CN201811579344.7A CN201811579344A CN110034066A CN 110034066 A CN110034066 A CN 110034066A CN 201811579344 A CN201811579344 A CN 201811579344A CN 110034066 A CN110034066 A CN 110034066A
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- Prior art keywords
- machined object
- extension piece
- piece
- workbench
- unit
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- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000010438 heat treatment Methods 0.000 claims abstract description 50
- 230000011218 segmentation Effects 0.000 claims abstract description 26
- 230000002401 inhibitory effect Effects 0.000 claims abstract description 3
- 238000003754 machining Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 description 17
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 238000001179 sorption measurement Methods 0.000 description 8
- 230000007423 decrease Effects 0.000 description 6
- 230000008602 contraction Effects 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The dividing method and segmenting device of machined object are provided, the device after inhibiting segmentation is rubbing against one another.The dividing method of machined object includes fixing step (ST1), is placed in machined object in the retaining surface for keeping workbench across extension piece, ring-shaped frame is fixed using frame fixed part；Piece spread step (ST2) makes that workbench and frame fixed part is kept to relatively move on the direction vertical with machined object, is extended to the annular section of extension piece；Attracting holding step (ST3) maintains the extension of extension piece using keeping the retaining surface of workbench to carry out attracting holding to machined object across extension piece；The annular section of the extension piece after extension is heated and shrinks annular section after implementing attracting holding step with heating stepses (ST4).In heating stepses, make the holding workbench separated in piece spread step and frame fixed part close on one side, extension piece is heated using heating unit on one side and shrinks annular section.
Description
Technical field
The present invention relates to the dividing method of machined object and segmenting devices.
Background technique
It has been known that there is following processing methods: laser beam is irradiated to the chip for being formed with device on front, along segmentation
Preset lines form modification layer in inside, are extended to the extension piece (dicing tape) for being pasted with chip and are broken with modifying layer
Point is divided into each device.
Above-mentioned processing method is extended the extension piece of the periphery of chip, therefore pine occurs for extension piece after expansion
Relax, slowly become extension after device between narrower intervals or conveying when extension piece shake and cause device rubbing against one another from
And the reason of defect.Therefore, the processing that the extension piece loosely to be relaxed to extension is heated and shrinks it is developed
Technology and segmenting device (for example, referring to patent document 1).
Patent document 1: No. 5791866 bulletins of Japanese Patent Publication No.
But there are following projects for segmenting device shown in patent document 1: elongation is very easy to according to extension piece,
And it is easy to produce relaxation, therefore at the position and ring-shaped frame same plane for making the machined object above pushed away, extension piece is big
Width protuberance, extension piece can not carry out attracting holding to machined object, the extension for extending piece restores to original from workbench removing is kept
Shape and cause segmentation after device it is rubbing against one another.
Summary of the invention
The present invention is completed in view of the problem, and its purpose is to provide the dividing methods of machined object and segmentation dress
It sets, the device after being able to suppress segmentation is rubbing against one another.
Purpose, expansion of the dividing method of machined object of the invention to machined object unit are realized in order to solve the above problems
Exhibition piece is extended and is broken machined object, which includes: being formed with segmentation starting point along segmentation preset lines
Plate the machined object；It is pasted with the extension piece of the machined object；And it is pasted with the ring-type of the periphery of the extension piece
Frame, which is characterized in that the dividing method of the machined object has following step: fixing step, should across the extension piece
The machined object of machined object unit is placed in the retaining surface for keeping workbench, and using frame fixed part to the ring-type frame
Frame is fixed；Piece spread step, after implementing the fixing step, make the holding workbench and the frame fixed part with
The machined object relatively moves on vertical direction, to the expansion between the periphery of the machined object and the inner circumferential of the ring-shaped frame
The annular section of exhibition piece is extended；Attracting holding step utilizes the guarantor of the holding workbench after the piece spread step
It holds face and attracting holding is carried out to the machined object across the extension piece, maintain the extension of the extension piece；And heating stepses, in reality
After having applied the attracting holding step, the annular section of the extension piece after the extension is heated and makes the extension piece
The annular section is shunk, and in the heating stepses, is made the separated holding workbench in the piece spread step on one side and is somebody's turn to do
Frame fixed part is close, is heated on one side using heating unit to the extension piece and shrinks the extension piece, so that inhibiting should
It extends piece to remove from the retaining surface, the attraction of the retaining surface is inhibited to reduce.
Segmenting device of the invention is segmenting device used in the dividing method of the machined object, and feature exists
In, which includes holding workbench, have across the extension piece to the machined object of the machined object unit into
The retaining surface of row attracting holding；The ring-shaped frame of the machined object unit is fixed in frame fixed part；Piece extension is single
Member, with movable workbench unit and frame fixed part mobile unit, which makes the holding workbench exist
It is moved on the direction vertical with the retaining surface, which makes the frame fixed part vertical with the retaining surface
Direction on move, which is extended the extension piece；Heating unit, to the extension piece after the extension
The annular section is heated and shrinks the annular section of the extension piece；And control unit, to the piece expanding element
It is controlled with the heating unit, which has apart from adjustment section, from the holding workbench and the frame fixed part
From and the expanding location that is extended of the extension piece rise to the holding workbench and the close position of the frame fixed part
It is set to only, this makes between the holding workbench and the frame fixed part while heating to the extension piece apart from adjustment section
Distance it is close.
The present application has the following effect: the device after being able to suppress segmentation is rubbing against one another.
Detailed description of the invention
Fig. 1 is the machined object for showing the processing object of dividing method and segmenting device of the machined object of embodiment 1
An example perspective view.
Fig. 2 is the perspective view for showing an example of the machined object unit with machined object shown in FIG. 1.
Fig. 3 is the perspective view for showing the structural example of segmenting device of embodiment 1.
Fig. 4 is the flow chart for showing the process of the dividing method of machined object of embodiment 1.
Fig. 5 is the major part for showing the segmenting device after the fixing step of the dividing method of machined object shown in Fig. 4
Cross-sectional view.
Fig. 6 is the main portion for showing the segmenting device after the piece spread step of the dividing method of machined object shown in Fig. 4
The cross-sectional view divided.
Fig. 7 is the cross-sectional view for amplifying the portion VII in Fig. 6 and showing.
Fig. 8 is the major part for showing the segmenting device in the heating stepses of the dividing method of machined object shown in Fig. 4
Cross-sectional view.
Fig. 9 is the cross-sectional view for amplifying the portion IX in Fig. 8 and showing.
Figure 10 is the major part for showing the segmenting device after the heating stepses of the dividing method of machined object shown in Fig. 4
Cross-sectional view.
Figure 11 is the cross-sectional view for amplifying the portion XI in Figure 10 and showing.
Label declaration
1: machined object；3: segmentation preset lines；7: extension piece；8: ring-shaped frame；9: machined object unit；10: segmentation dress
It sets；30: keeping workbench；31: retaining surface；40: frame fixed part；50: piece expanding element；60: heating unit；70: control is single
Member；71: apart from adjustment section；100: modification layer (segmentation starting point)；101: annular section；ST1: fixing step；ST2: piece extension step
Suddenly；ST3: attracting holding step；ST4: heating stepses.
Specific embodiment
Referring to attached drawing, mode for carrying out the present invention (embodiment) is described in detail.The present invention not by with
Content documented by lower embodiment limits.In addition, including those skilled in the art's energy in following documented constituent element
Content, substantially the same content being enough readily apparent that.It can be appropriately combined in addition, being constituted documented by following.Furthermore it is possible to
Various omissions, displacement or the change constituted without departing from the spirit and scope of the invention.
[embodiment 1]
With reference to the accompanying drawings, the dividing method and segmenting device of the machined object of embodiments of the present invention 1 are illustrated.Figure
1 be show the machined object of the processing object of dividing method and segmenting device of the machined object of embodiment 1 an example it is vertical
Body figure.Fig. 2 is the perspective view for showing an example of the machined object unit with machined object shown in FIG. 1.Fig. 3 is to show implementation
The perspective view of the structural example of the segmenting device of mode 1.Fig. 4 is the process for showing the dividing method of machined object of embodiment 1
Flow chart.
The dividing method of the machined object of embodiment 1 is the dividing method of machined object 1 shown in FIG. 1.In embodiment party
In formula 1, machined object 1 is the disk-shaped semiconductor core using silicon, sapphire, GaAs or SiC (silicon carbide) etc. as substrate 2
Piece or optical device chip.As shown in Figure 1, what machined object 1 was divided in the cross one another a plurality of segmentation preset lines 3 by positive 5
Each region is respectively formed with device 4.Machined object 1 is pasted with extension piece 7 on the back side 6 of the back side in front 5, in extension piece
7 periphery is pasted with ring-shaped frame 8, has the wavelength of permeability for substrate 2 from the segmentation irradiation of preset lines 3 of 6 lateral edge of the back side
Laser beam, substrate 2 inside formed along segmentation preset lines 3 as segmentation starting point modification layer 100 (in Fig. 2
Shown in dotted line).In addition, modification layer 100 refers to that density, refractive index, mechanical strength and other physical characteristics are in and surrounding
The region of the different state of characteristic may be exemplified out fused region, slit region, insulation breakdown region, variations in refractive index
The region etc. that region and these regions are mixed in.
As shown in Fig. 2, by along segmentation preset lines 3 and be formed with modification layer 100 machined object 1, be pasted on it is processed
The ring-shaped frame 8 that the extension piece 7 at the back side 6 of object 1 and the periphery for extending piece 7 are pasted constitutes machined object unit 9.That is, by
Machining object unit 9 is made of machined object 1, extension piece 7 and ring-shaped frame 8.In addition, extension piece 7 is by the tree with retractility
Rouge is constituted, and has the heat-shrinkable shunk when heating.
The dividing method of the machined object of embodiment 1 uses segmenting device 10 shown in Fig. 3.That is, segmentation shown in Fig. 3
Device 10 is the device used in the dividing method of the machined object of embodiment 1, will be formed with along segmentation preset lines 3
The machined object 1 of modification layer 100 is divided into the device of each device 4.As shown in figure 3, segmenting device 10 has chamber 20, keeps
Workbench 30, frame fixed part 40, piece expanding element 50, heating unit 60 and control unit 70.
Chamber 20 is formed as the box-like of upper opening.The frame load of 20 pairs of holding workbench 30 of chamber, frame fixed part 40
It sets plate 41 and piece expanding element 50 is stored.
It keeps workbench 30 to have and attracting holding is carried out to the machined object of machined object unit 91 across extension piece 7
Retaining surface 31.Keeping workbench 30 is circular plate shape, includes disk-shaped framework 32, is made of metals such as stainless steels；With
And disk-shaped adsorption section 33, it is made of porous materials such as porous ceramics and is surrounded by framework 32.Framework 32 and adsorption section
33 upper surface configuration in the same plane, constitutes the retaining surface 31 that attracting holding is carried out to machined object 1.Adsorption section 33 and quilt
The substantially same diameter of machining object 1.
Keep workbench 30 that will be processed across the extension piece 7 of the machined object unit 9 transported by transport unit 80
6 side of the back side of object 1 is placed in retaining surface 31.It keeps in workbench 30, adsorption section 33 is connect with vacuum attraction source 34, by true
Suction is drawn source 34 and is attracted adsorption section 33, so as to by the 6 side attracting holding of the back side of machined object 1 in retaining surface 31.
The ring-shaped frame 8 of machined object unit 9 is fixed in frame fixed part 40.Frame fixed part 40 is carried with frame
Set plate 41 and frame pressing plate 42.It is circular opening portion 411 that frame loading plate 41, which is provided with flat shape, and is formed as upper table
Face 412 and horizontal direction parallel and the plate being formed flatly.The internal diameter of the opening portion 411 of frame loading plate 41 forms to compare ring
The internal diameter of shape frame 8 is bigger.Frame loading plate 41 configures in opening portion 411 keeps workbench 30, and opening portion 411 is configured to
It is coaxial with holding workbench 30.The quadrangle of the upper surface of frame loading plate 41 412 is provided with centering guiding piece 44, which draws
Guiding element 44 is arranged to move freely in the horizontal direction, and the position of ring-shaped frame 8 is adjusted and moving in the horizontal direction,
To which machined object 1 to be positioned to the position coaxial with the adsorption section 33 of holding workbench 30.
Frame pressing plate 42 is formed as the plate of size almost the same with frame loading plate 41, is provided with and is open in center
The circular opening portion 421 of the identical size in portion 411.Frame pressing plate 42 is installed on the front end of the piston rod 451 of cylinder 45, passes through
Piston rod 451 stretches, so that frame pressing plate 42 is in the position of the top of frame loading plate 41 and from frame loading plate 41
The position kept out of the way of top on move freely.Being provided in the quadrangle of frame pressing plate 42 can be for the centering entrance of guiding piece 44
Long hole 422.
Frame pressing plate 42 is positioned at the position kept out of the way from the top of frame loading plate 41 by frame fixed part 40, is being felt relieved
The ring-shaped frame 8 of the machined object unit 9 transported by transport unit 80 is carried in the state that guiding piece 44 is away from each other to each other
It is placed on the upper surface 412 of frame loading plate 41.Frame fixed part 40 make feel relieved guiding piece 44 it is closer to each other and to machined object
The machined object 1 of unit 9 is positioned.Frame pressing plate 42 is positioned at the top of frame loading plate 41 by frame fixed part 40,
The piston rod 431 of cylinder 43 is set to stretch and carry frame by the aftermentioned frame fixed part mobile unit 54 of piece expanding element 50
The rising of plate 41 is set, to sandwiching the ring-shaped frame 8 of machined object unit 9 between frame loading plate 41 and frame pressing plate 42
And it is fixed.
Piece expanding element 50 makes that workbench 30 and frame fixed part 40 is kept to relatively move along the axle center of vertical direction
Extension piece 7 is extended to the position being separated from each other.Piece expanding element 50 has movable workbench unit 53 and frame solid
Determine portion's mobile unit 54.Movable workbench unit 53 makes to keep workbench 30 in the direction vertical with retaining surface 31 i.e. vertical direction
Upper movement.Movable workbench unit 53 has upper push part 51 and lifting unit 52.
Upper push part 51 is formed as cylindric, according to outer diameter than the ring that is placed on the upper surface 412 of frame loading plate 41
The internal diameter of shape frame 11 is small and internal diameter is than the mode that is pasted on the machined object 1 of extension piece 7 and to keep the outer diameter of workbench 30 big
It is formed.Upper push part 51 will keep the configuration of workbench 30 in inside, and upper push part 51 is configured to and keeps workbench 30 coaxial.?
The upper end of upper push part 51 is rotatably freely equipped with roller part 511 (shown in Fig. 5 etc.), the roller part 511 and holding work
Make the configuration of retaining surface 31 of platform 30 in the same plane.
Lifting unit 52 has motor 521 and ball-screw 522.Motor 521 is fixed on frame unit 22, the frame
Unit 22 is fixed on the bottom surface 21 of chamber 20.Ball-screw 522 be configured to it is parallel with vertical direction, and be fixed on holding work
The nut 523 (shown in Fig. 5 etc.) for making platform 30 and upper push part 51 screws togather.When ball-screw 522 is revolved by motor 521 around axle center
When turning, make that workbench 30 and upper push part 51 is kept integrally to go up and down.
Frame fixed part mobile unit 54 make frame fixed part 40 frame loading plate 41 and frame pressing plate 42 with guarantor
It holds and is moved in the vertical direction in face 31 i.e. vertical direction.Frame fixed part mobile unit 54 has ball-screw 55 and motor
56.Ball-screw 55 is configured to parallel with vertical direction, and screws togather with the nut 57 for the quadrangle for being fixed on frame loading plate 41.Electricity
Motivation 56 and ball-screw 55 are fixed on correspondingly on the bottom surface 21 of chamber 20.Motor 56 makes corresponding ball-screw 55
It is rotated around axle center.
Roller part 511 He of the movable workbench unit 53 of piece expanding element 50 from the upper end for being installed on upper push part 51
Retaining surface 31 is located to be risen with the state on 412 same plane of upper surface of frame loading plate 41, makes above to push away by lifting unit 52
Component 51 and holding workbench 30 integrally rise, so that extension piece 7 be made to extend in the surface direction.The frame of piece expanding element 50
Fixed part mobile unit 54 rotates corresponding ball-screw 55 around axle center by motor 56, to make frame fixed part 40
Frame loading plate 41 and frame pressing plate 42 are gone up and down.
Inner circumferential, that is, the inner edge of ring-shaped frame 8 and the periphery of machined object 1 of extension piece 7 after 60 pairs of heating unit extensions are
Annular section 101 (shown in Fig. 2) between outer rim is heated and makes its contraction.Heating unit 60 includes disk-shaped unit
Main body 61；And it is mounted on multiple heaters 62 in unit main body 61.
Unit main body 61 configuration keep workbench 30 top and be configured to holding workbench 30 it is coaxial.In addition, single
First main body 61 is arranged to go up and down freely by mobile unit (not shown), and is arranged to rotate around the axle center parallel with vertical direction
Freely.
Heater 62 is circumferentially, equally spaced configured in the outer edge of unit main body 61.Heater 62 is configured at and keeps work
The annular section 101 for making the extension piece 7 for the machined object unit 9 that platform 30 and frame fixed part 40 are kept is right in vertical direction
The position set.In the embodiment 1, there are four heaters 62 for setting, but are not limited to four in the present invention.Heater 62 be to
Infrared ray is irradiated to the form that the annular section 101 of extension piece 7 is heated in lower section, is e.g. added when applying voltage
Ultrared-ray ceramic heater that is hot and radiating infrared ray.
Control unit 70 is respectively to above-mentioned constituent element, that is, piece expanding element 50 and heating unit 60 etc. of segmenting device 10
It is controlled and segmenting device 10 is made to implement the processing action to machined object 1.In addition, control unit 70 is computer.Control
Unit 70 and the display unit (not shown) that is made of liquid crystal display device of the state of display processing action or image etc. etc. and
The input unit (not shown) connection that operator uses when registering processing content information etc..Input unit is single by being set to display
At least one of external input devices such as the touch panel and keyboard of member are constituted.
As shown in figure 3, control unit 70 has apart from adjustment section 71.Apart from adjustment section 71 from making to keep workbench 30 and frame
Frame fixed part 40 separates along axle center and acts the expanding location for extending the extension of piece 7 and extremely keep workbench 30 and frame fixed part 40
Until close approximated position, heated on one side using 60 pairs of extension pieces 7 of heating unit.Made on one side by piece expanding element 50
Keep the distance of the axis direction of the upper surface 412 of the retaining surface 31 of workbench 30 and the frame loading plate 41 of frame fixed part 40
It is close.Wherein, expanding location indicates to keep the upper of the frame loading plate 41 of the retaining surface 31 of workbench 30 and frame fixed part 40
The position of holding workbench 30 and frame fixed part 40 of the surface 412 when separating on axis direction, approximated position indicates to keep
When the upper surface 412 of the frame loading plate 41 of the retaining surface 31 and frame fixed part 40 of workbench 30 is positioned on same plane
Keep the position of workbench 30 and frame fixed part 40.
The dividing method of the machined object of embodiment 1 is carried out to the extension piece 7 of machined object unit 9 shown in Fig. 2
It extends and makes machined object 1 to modify method of 100 starting point of the layer fracture to be divided into each device 4.As shown in figure 4, by
The dividing method of machining object has fixing step ST1, piece spread step ST2, attracting holding step ST3 and heating stepses ST4.
(fixing step)
Fig. 5 is the major part for showing the segmenting device after the fixing step of the dividing method of machined object shown in Fig. 4
Cross-sectional view.Fixing step ST1 is to be placed in the machined object 1 of machined object unit 9 across extension piece 7 to keep workbench 30
Retaining surface 31 on and the step of ring-shaped frame 8 is fixed using frame fixed part 40.
In fixing step ST1, the frame pressing plate 42 of frame fixed part 40 is positioned at retreating position by control unit 70,
Make upper push part 51 by the movable workbench unit 53 of piece expanding element 50 and workbench 30 is kept integrally to decline, and leads to
Crossing frame fixed part mobile unit 54 declines the frame loading plate 41 of frame fixed part 40.In fixing step ST1, control is single
Member 70 is positioned proximate to position in the state of making frame loading plate 41 and keeping the decline of workbench 30, in this state by removing
It send unit 80 that will be formed with and extremely keeps workbench 30 along the conveying of machined object unit 9 of the modification layer 100 of segmentation preset lines 3
Top.In fixing step ST1, control unit 70 is by transport unit 80 across extension piece 7 by the back side 6 of machined object 1
It is placed in retaining surface 31, and ring-shaped frame 8 is placed on the upper surface 412 of frame loading plate 41.
In fixing step ST1, control unit 70 keeps the centering guiding piece 44 of frame fixed part 40 closer to each other and to quilt
The machined object 1 of machining object unit 9 is positioned, and the piston rod 451 of cylinder 45 is made to stretch and be positioned at frame pressing plate 42
The top of frame loading plate 41.In addition, control unit 70 is made by frame fixed part mobile unit 54 in fixing step ST1
Frame loading plate 41 rise, and by movable workbench unit 53 make push part 51 and keep workbench 30 integrally on
It rises.In fixing step ST1, control unit 70 sandwiches the ring-shaped frame 8 of machined object unit 9 to frame loading plate 41 and frame
Between frame pressing plate 42.
In fixing step ST1, as shown in figure 5, the ring-shaped frame 8 of machined object unit 9 is fixed on by control unit 70
Between frame loading plate 41 and frame pressing plate 42.In fixing step ST1, consolidate when by the ring-shaped frame 8 of machined object unit 9
When between frame loading plate 41 and frame pressing plate 42, frame loading plate 41 and holding workbench 30 are located adjacent to position,
In the approximated position, the upper surface 412 of frame loading plate 41 be installed on push part 51 upper end roller part 511 and protect
Hold that face 31 is in the same plane, the roller part 511 of upper push part 51 is abutted with the annular section 101 of extension piece 7.In fixation
In step ST1, when ring-shaped frame 8 of the control unit 70 to machined object unit 9 is fixed, piece spread step is entered to
ST2。
(piece spread step)
Fig. 6 is the main portion for showing the segmenting device after the piece spread step of the dividing method of machined object shown in Fig. 4
The cross-sectional view divided.Fig. 7 is the cross-sectional view for amplifying the portion VII in Fig. 6 and showing.Piece spread step ST2 is to implement fixation
Make to keep workbench 30 and frame fixed part 40 phase on the axis direction of the front vertical with machined object 1 after step ST1
The step of mobile annular section 101 to extension piece 7 is extended.
In piece spread step ST2, control unit 70 passes through the lifting of the movable workbench unit 53 of piece expanding element 50
The motor 521 of unit 52 rotates ball-screw 522 around axle center, to make push part 51 and keep workbench 30 integrally
Rise.Then, the roller part 511 for being set to the upper end of push part 51 is abutted with the annular section 101 of extension piece 7, therefore
Extension piece 7 extends in the surface direction.In piece spread step ST2, extend piece 7 extension as a result, radial to extension
Piece 7 acts on drawing force.
When the 7 radial effect drawing force of extension piece in this way to the back side 6 for being pasted on machined object 1, due to being added
Work object 1 as shown in Figure 6 along segmentation preset lines 3 be formed with modification layer 100, therefore with modify layer 100 be starting point and along
Segmentation preset lines 3 are split, and are extended between device 4 and formed interval between device 4.In addition, in piece spread step
After ST2, in the annular section 101 of extension piece 7, as shown in fig. 7, the section of annular section 101 is from the lower surface of ring-shaped frame 8
It is linearly towards the upper surface of roller part 511.In piece spread step ST2, when control unit 70 makes upper 51 He of push part
When workbench 30 being kept integrally to rise, attracting holding step ST3 is entered to.
(attracting holding step)
Attracting holding step ST3 is using the retaining surface 31 of holding workbench 30 after piece spread step ST2 across expansion
The step of exhibition piece 7 carries out attracting holding to machined object 1 and maintains the extension of extension piece 7.In attracting holding step ST3, control
Unit 70 processed drives vacuum attraction source 34 and is attracted by vacuum attraction source 34 adsorption section 33, by machined object
16 side of the back side, in retaining surface 31, maintains the interval between device 4 across extension 7 attracting holding of piece.In attracting holding step ST3
In, when control unit 70 drives vacuum attraction source 34, enter to heating stepses ST4.
(heating stepses)
Fig. 8 is the major part for showing the segmenting device in the heating stepses of the dividing method of machined object shown in Fig. 4
Cross-sectional view.Fig. 9 is the cross-sectional view for amplifying the portion IX in Fig. 8 and showing.Figure 10 is point for showing machined object shown in Fig. 4
The cross-sectional view of the major part of segmenting device after the heating stepses of segmentation method.Figure 11 is to show the portion the XI amplification in Figure 10
Cross-sectional view.
Heating stepses ST4 is after implementing attracting holding step ST3 to the annular section of the extension piece 7 after extension
101 the step of being heated and making its contraction.In heating stepses ST4, heater 62 of the control unit 70 to heating unit 60
Apply voltage etc., is heated to defined temperature and radiates infrared ray from heater 62, and pass through mobile unit (not shown)
Decline heating unit 60, as shown in figure 8, making heater 62 close to annular section 101, and revolves heating unit 60 around axle center
Turn.In addition, as shown in figure 8, in heating stepses ST4, the work for making piece expanding element 50 apart from adjustment section 71 of control unit 70
Make the lifting unit 52 of platform mobile unit 53 motor 521 driving and make push part 51 and keep workbench 30 integrally under
Drop, and the motor 47 of frame fixed part mobile unit 54 is made to drive and make frame loading plate 41 and frame pressing plate 42 and protect
The decline for holding workbench 30 rises in linkage.
In this way, control unit 70 makes in piece spread step ST2 on one side apart from adjustment section 71 in heating stepses ST4
It is moved along the holding workbench 30 of axis direction separation and frame fixed part 40 this both sides towards approximated position, utilizes heating on one side
Unit 60 heats annular section 101 and makes its contraction.Then, it extends in piece 7, after being extended in piece spread step ST2
Annular section 101 be intended to the decline for keeping workbench 30 equal and relaxation occur and according to the mode isolated from retaining surface 31
Bending, but by heating unit 60 heat and shrink annular section 101, therefore as shown in figure 9, extension piece 7 keeps quilt
Attract in the state of retaining surface 31.In this way, control unit 70 makes the edge in piece spread step ST2 on one side in heating stepses ST4
Axis direction separation keeps the frame loading plate 41 of workbench 30 and frame fixed part 40 close, utilizes heating unit 60 on one side
Heat shrink is carried out to the annular section 101 of extension piece 7, so as to inhibit the annular section 101 of extension piece 7 from retaining surface 31
Removing, the attraction for being able to suppress retaining surface 31 reduce.
In addition, in heating stepses ST4, when control unit 70 apart from adjustment section 71 by the upper surface of frame loading plate 41
412 and retaining surface 31 when being positioned at the approximated position on same plane, as shown in Figure 10, make in the state of maintaining approximated position
Workbench 30 and frame fixed part 40 is kept to drop to the position of fixing step ST1.
In heating stepses ST4, when control unit 70 makes to keep workbench 30 and frame fixed part as shown in Figure 10
40 drop to the position of fixing step ST1 and make frame loading plate 41 and upper push part 51 and workbench 30 is kept to be located adjacent to position
When setting, stop the heating of heater 62 and vacuum attraction source 34, increase heating unit 60, releases frame fixed part 40 to ring
The fixation of shape frame 8 terminates the dividing method of machined object.Then, machined object unit 9 is as shown in Figure 11, after extension
Extension piece 7 annular section 101 shrink, thus even if release keep workbench 30 adsorption section 33 attraction, can also maintain
Interval between device 4.
As discussed above, in the dividing method of the machined object of embodiment 1 and segmenting device 10, make on one side
It is connect in piece spread step ST2 along the holding workbench 30 of axis direction separation and the frame loading plate 41 of frame fixed part 40
Closely, the annular section 101 for extending piece 7 using 60 pairs of heating unit on one side is heated and shrinks the annular section 101.Cause
This, the dividing method and segmenting device 10 of the machined object of embodiment 1 are able to suppress in piece spread step ST2 after extension
Annular section 101 is bent up with the movement for keeping workbench 30 etc. from the side for keeping the retaining surface 31 of workbench 30 isolated
It is bent.As a result, the dividing method and segmenting device 10 of the machined object of embodiment 1 are able to suppress the ring-shaped area of extension piece 7
Domain 101 is removed from retaining surface 31, and the attraction for being able to suppress retaining surface 31 reduces, and is able to maintain that the interval between device 4.By
This, the device 4 that the dividing method and segmenting device 10 of the machined object of embodiment 1 are able to suppress after segmentation is rubbing against one another.
In addition, in the dividing method and segmenting device 10 of the machined object of embodiment 1, in heating stepses ST4, control
Unit 70 makes frame loading plate 41 and frame pressing plate 42 and keeps the decline linkage of workbench 30 and rise.Therefore, embodiment party
The dividing method and segmenting device 10 of the machined object of formula 1 make to keep workbench 30 and this both sides of frame fixed part 40 from expansion on one side
Exhibition position, which is set, to be moved to approximated position and heats on one side to the annular section 101 of extension piece 7, therefore can be in annular section 101
Occur to carry out heating immediately when relaxation to make its contraction.
In addition, the segmenting device 10 of embodiment 1 can make frame fixed part 40 and upper push part 51 and keep work
Platform 30 moves respectively, so as to the height not to heating unit 60 is finely adjusted and by the extension piece 7 and heating unit of protuberance
The distance between 60 are adjusted to constant.
The control unit 70 of the segmenting device 10 of above-mentioned embodiment 1 includes arithmetic processing apparatus, with CPU
Microprocessor as (central processing unit: central processing unit)；Storage device, with ROM (read
Only memory: read-only memory) or the such storage of RAM (random access memory: random access memory)
Device；And input/output interface device.The arithmetic processing apparatus of control unit 70 is according to the computer journey for being stored in storage device
Sequence implements calculation process, and the control signal for being used to control segmenting device 10 is exported via input/output interface device to segmentation
The above-mentioned constituent element of device 10.In addition, the function apart from adjustment section 71 is stored in storage dress by arithmetic processing apparatus execution
The computer program set and realize.
In addition, present invention is not limited to the embodiments described above.I.e., it is possible to without departing from the spirit and scope of the invention into
Row various modifications are simultaneously implemented.
Claims (2)
1. a kind of dividing method of machined object is extended the extension piece of machined object unit and is broken machined object,
The machined object unit includes: the machined object of the plate of segmentation starting point is formed with along segmentation preset lines；It is pasted with the quilt
The extension piece of machining object；And it is pasted with the ring-shaped frame of the periphery of the extension piece, wherein
The dividing method of the machined object has following step:
The machined object of the machined object unit is placed in the retaining surface for keeping workbench across the extension piece by fixing step
On, and the ring-shaped frame is fixed using frame fixed part；
Piece spread step adds the holding workbench and the frame fixed part with this after implementing the fixing step
Work object relatively moves on vertical direction, to the extension piece between the periphery of the machined object and the inner circumferential of the ring-shaped frame
Annular section is extended；
Attracting holding step, after the piece spread step, using the retaining surface of the holding workbench across the extension piece pair
The machined object carries out attracting holding, maintains the extension of the extension piece；And
Heating stepses carry out the annular section of the extension piece after the extension after implementing the attracting holding step
It heats and shrinks the annular section of the extension piece,
In the heating stepses,
Make the holding workbench and the frame fixed part separated in the piece spread step close on one side, utilizes heating on one side
Unit heats the extension piece and shrinks the extension piece, so that the extension piece be inhibited to remove from the retaining surface, inhibiting should
The attraction of retaining surface reduces.
2. a kind of segmenting device is segmenting device used in the dividing method of machined object described in claim 1,
In,
The segmenting device includes
Workbench is kept, there is the guarantor for carrying out attracting holding to the machined object of the machined object unit across the extension piece
Hold face；
The ring-shaped frame of the machined object unit is fixed in frame fixed part；
Piece expanding element, with movable workbench unit and frame fixed part mobile unit, which makes this
Keep workbench moved on the direction vertical with the retaining surface, the frame fixed part mobile unit make the frame fixed part with
The retaining surface moves on vertical direction, which is extended the extension piece；
Heating unit is heated and is made the ring-shaped area of the extension piece to the annular section of the extension piece after the extension
It shrinks in domain；And
Control unit controls the piece expanding element and the heating unit,
The control unit has apart from adjustment section, from the holding workbench and the frame fixed part from and the extension piece carry out
The expanding location of extension rises until the holding workbench and the frame fixed part close approximated position, this is apart from adjustment section
Keep the holding workbench and the distance between the frame fixed part close while heating to the extension piece.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-252139 | 2017-12-27 | ||
| JP2017252139A JP2019117896A (en) | 2017-12-27 | 2017-12-27 | Method and device for dividing workpiece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110034066A true CN110034066A (en) | 2019-07-19 |
Family
ID=67225736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811579344.7A Pending CN110034066A (en) | 2017-12-27 | 2018-12-24 | The dividing method and segmenting device of machined object |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2019117896A (en) |
| KR (1) | KR20190079512A (en) |
| CN (1) | CN110034066A (en) |
| TW (1) | TW201929122A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979261A (en) * | 2014-04-14 | 2015-10-14 | 株式会社迪思科 | Chip interval maintaining method |
| CN107275256A (en) * | 2016-04-01 | 2017-10-20 | 株式会社迪思科 | Expanding unit |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5791866A (en) | 1980-11-26 | 1982-06-08 | Kubota Ltd | Production of composite roll for rolling which is not constant in thickness of outside shell layer |
| JP2006054246A (en) * | 2004-08-10 | 2006-02-23 | Disco Abrasive Syst Ltd | Wafer separation method |
-
2017
- 2017-12-27 JP JP2017252139A patent/JP2019117896A/en active Pending
-
2018
- 2018-12-10 KR KR1020180158004A patent/KR20190079512A/en not_active Application Discontinuation
- 2018-12-24 CN CN201811579344.7A patent/CN110034066A/en active Pending
- 2018-12-24 TW TW107146816A patent/TW201929122A/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979261A (en) * | 2014-04-14 | 2015-10-14 | 株式会社迪思科 | Chip interval maintaining method |
| CN107275256A (en) * | 2016-04-01 | 2017-10-20 | 株式会社迪思科 | Expanding unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019117896A (en) | 2019-07-18 |
| TW201929122A (en) | 2019-07-16 |
| KR20190079512A (en) | 2019-07-05 |
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Application publication date: 20190719 |