CN110026328B - Method for forming lens module - Google Patents
Method for forming lens module Download PDFInfo
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- CN110026328B CN110026328B CN201910314942.XA CN201910314942A CN110026328B CN 110026328 B CN110026328 B CN 110026328B CN 201910314942 A CN201910314942 A CN 201910314942A CN 110026328 B CN110026328 B CN 110026328B
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- lens module
- film layer
- end surface
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- hard film
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
- B05D7/26—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials synthetic lacquers or varnishes
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
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Abstract
The invention provides a method for forming a lens module, which comprises the following steps: providing a substrate, sequentially arranging an adhesive film layer and a hard film layer on the surface of the substrate, wherein the hard film layer is provided with a hard film through hole; placing the lens module on the hard film layer, wherein a welding ball is arranged on the first end surface of the lens module, a protective film layer is adhered on the second end surface of the lens module, the welding ball is embedded in the hard film through hole and fixed on the adhesive film layer, and the first end surface of the lens module covers the hard film through hole; arranging a shading layer on the surface of the side wall of the lens module; and pulling out the lens module. The first end surface of the lens module covers the hard film through hole and is not sprayed to the shading layer; the film layer enables the lens module to be well fixed and easy to pull out; the lens module is placed on the hard film layer and does not sink, so that the side wall of the lens module can completely form a light shielding layer, the lens module is not influenced by redundant light rays on the side wall, the light leakage problem of the lens module is solved, and the imaging quality of the lens module is improved.
Description
Technical Field
The invention relates to the field of camera module manufacturing, in particular to a lens module forming method.
Background
The miniature lens module has the characteristics of small volume and strong function, and the main components of the lens module comprise a lens and an image sensor. The main working principle is as follows: the optical image generated by the scene through the lens is projected on the surface of the image sensor and converted into an electric signal.
The lens is formed by combining different lenses, is an important component of the lens module and plays a very important role in the imaging effect. The lens mainly determines the image clarity (image clarity, light, distance view) and image display range, and affects the highest pixels. The image sensor is a core module of the lens module and converts light rays into electric signals.
However, the sidewall of the lens module has a light leakage problem, which affects the imaging quality of the lens module, and it is urgently needed to effectively solve the light leakage problem of the lens module.
Disclosure of Invention
The invention aims to provide a method for forming a lens module to solve the problem of light leakage of the lens module, so that the imaging quality of the lens module is improved.
To solve the above technical problem, the present invention provides a method for forming a lens module, comprising the steps of:
providing a substrate, sequentially arranging an adhesive film layer and a hard film layer on the surface of the substrate, wherein the hard film layer is provided with a hard film through hole;
placing a lens module on the hard film layer, wherein a first end surface of the lens module is provided with a welding ball, a second end surface of the lens module is adhered with a protective film layer, the first end surface and the second end surface are oppositely arranged, the welding ball is embedded in the hard film through hole and fixed on the adhesive film layer, and the first end surface of the lens module covers the hard film through hole;
arranging a light shielding layer on the surface of the side wall of the lens module, which is connected with the first end surface and the second end surface;
and pulling out the lens module.
Optionally, provide a base plate the base plate surface sets gradually glue film layer and hard coat layer, be provided with the dura mater through-hole on the hard coat layer, include: and adhering the adhesive film layer on the surface of the substrate, and adhering the hard film layer on the surface of the adhesive film layer.
Optionally, the depth of the hard mask through hole is smaller than the height of the solder ball.
Optionally, the light shielding layer is black paint or black glue.
Optionally, a light shielding layer is disposed on a sidewall surface of the lens module connecting the first end surface and the second end surface, and the light shielding layer includes:
spraying the black paint on the surface of the side wall of the lens module;
baking the black paint to cure the black paint.
Optionally, the second end surface of the lens module is used for generating an optical image.
Optionally, the dura mater through-hole is array distribution, the camera lens module with the dura mater through-hole one-to-one sets up.
Optionally, the adhesive film layer has elasticity.
Optionally, the adhesive film layer is made of any one of a hot-press adhesive film, a hot-melt adhesive film and a heat-resistant plastic film.
Optionally, the hard coat layer is made of a polyester film.
Compared with the prior art, the method has the following beneficial effects:
the forming method of the lens module provided by the invention comprises the following steps: providing a substrate, sequentially arranging an adhesive film layer and a hard film layer on the surface of the substrate, wherein the hard film layer is provided with a hard film through hole; placing a lens module on the hard film layer, wherein a first end surface of the lens module is provided with a welding ball, a second end surface of the lens module is adhered with a protective film layer, the first end surface and the second end surface are oppositely arranged, the welding ball is embedded in the hard film through hole and fixed on the adhesive film layer, and the first end surface of the lens module covers the hard film through hole; arranging a light shielding layer on the surface of the side wall of the lens module, which is connected with the first end surface and the second end surface; and pulling out the lens module. The first end surface of the lens module is not sprayed to the shading layer because the hard film through hole is covered; the lens module can be well fixed and easily pulled out in the process of forming the light shielding layer by the aid of the adhesive film layer, and rapid placement and taking out (pulling out) are realized; the lens module is placed on the hard film layer and does not sink, so that the surface of the side wall of the lens module can be completely covered by the shading layer, the lens module is not influenced by redundant light of the side wall of the lens module in the optical imaging process, the light leakage problem of the lens module is solved, and the imaging quality of the lens module is improved. The extra shading structure of the client is removed, which is beneficial to the size reduction and cost control of the client product.
Drawings
Fig. 1 is a schematic view of a lens module after a silicon-based adhesive material is coated thereon;
FIG. 2 is a schematic diagram of a method for forming a lens module after the lens module is placed on a silicon-based adhesive material;
FIG. 3 is a schematic diagram illustrating a cured silicon-based adhesive material in a method for forming a lens module;
FIG. 4 is a schematic view illustrating a lens module after a light-shielding layer is sprayed on the lens module in a method for forming the lens module;
FIG. 5 is a schematic view illustrating a cured light-shielding layer in a method for forming a lens module;
FIG. 6 is a schematic view of a method for forming a lens module after the lens module is pulled out;
FIG. 7 is a flowchart illustrating a method of forming a lens module according to an embodiment of the invention;
fig. 8 is a schematic diagram illustrating a hard mask layer formed in a method for forming a lens module according to an embodiment of the invention;
FIG. 9 is a schematic view illustrating a lens module after being placed in a method for forming a lens module according to an embodiment of the invention;
fig. 10 is a schematic view illustrating a protective film layer formed in a method for forming a lens module according to an embodiment of the invention;
FIG. 11 is a schematic view illustrating a light-shielding layer formed in a method for forming a lens module according to an embodiment of the invention;
FIG. 12 is a schematic view illustrating a cured light-shielding layer in a method for forming a lens module according to an embodiment of the invention;
fig. 13 is a schematic view illustrating a lens module pulled out in a method for forming a lens module according to an embodiment of the invention.
Description of reference numerals:
11-a substrate; 12-silicon-based glue material; 14-a lens module; 141-lens; 142-an image sensor; 143-solder balls; 16-a light-shielding layer;
21-a substrate; 22-a glue film layer; 23-a hard coat layer; 23 a-hard mask via; 24-a lens module; 241-lens; 242-an image sensor; 243-solder balls; 25-a protective film layer; 26-light shielding layer.
Detailed Description
As mentioned in the background art, the sidewall of the conventional lens module has a light leakage problem, which affects the imaging quality of the lens module. For a micro (ultra-small) lens module, because the size of the image sensor is small, the light leakage exists in the image sensor part covered by the shading layer, the imaging quality of the lens module is more obviously affected, and a user needs to adopt an additional shading process or a shading structure to prevent the light leakage when using the lens module, so that inconvenience is brought to the use.
The inventor tries to shield the lens module by the following steps, i.e. as shown in fig. 1, providing a substrate 11, and coating a silicon-based adhesive material 12 on the substrate; step two, as shown in fig. 2, the lens module 14 is placed on the silicon-based adhesive material 12, the lens module 14 includes a lens 141, an image sensor 142, and a solder ball 143 located on a side surface of the image sensor 142, it should be understood that the side surface of the image sensor 142 including the solder ball 143 is used for signal connection of the lens module 14 and cannot be sprayed with a light shielding layer, so that the side surface of the image sensor 142 including the solder ball 143 is embedded in the silicon-based adhesive material 12 to prevent the light shielding layer from being sprayed in a subsequent process; step three, as shown in fig. 3, baking to solidify the silicon-based adhesive material 12; step four, as shown in fig. 4, spraying a light shielding layer 16 on the side wall of the lens module 14 and the surface of the silicon-based adhesive material 12; step five, as shown in fig. 5, baking to solidify the light shielding layer 16; sixthly, as shown in fig. 6, the lens module 14 is pulled out.
The inventor has found that, since the silicon-based adhesive 12 is a soft material, the lens module 14 will sink in the silicon-based adhesive 12 due to gravity in the process that the solder balls 143 are embedded in the silicon-based adhesive 12, and the silicon-based adhesive 12 ' adheres (the rod-climbing effect of the silicon-based adhesive 12 ') around the contact between the lens module 14 and the silicon-based adhesive 12, and when the bottom of the lens module 14 (the end near the silicon-based adhesive 12) is coated with the light-shielding layer 16 in the fourth step (as shown in fig. 4) due to the adhesion of the silicon-based adhesive 12 ', the light-shielding layer 16 is sprayed on the adhesion layer of the silicon-based adhesive 12 ' at the bottom of the lens module 12, so that the side wall portion of the lens module 14 wrapped by the silicon-based adhesive 12 ' and the portion of the lens module 14 embedded in the silicon-based adhesive 12 cannot be sprayed on the light-shielding layer 16, and in the sixth step (as shown in fig. 6), after the lens module 14 is pulled out, the side wall of the bottom of the lens module 14 is not coated with the light-shielding layer 16, external light can enter from the bottom peripheral side wall of the lens module 14, which may affect the imaging quality of the lens module 14, and the shading effect is still not ideal.
Based on the research, the invention provides a forming method of a lens module, wherein the surface of the first end of the lens module is not sprayed to the shading layer because the first end of the lens module covers the hard film through hole; the film layer enables the lens module to be well fixed and easy to pull out; the lens module is placed on the hard film layer and does not sink, so that the side wall of the lens module can be completely covered by the shading layer, the lens module is not influenced by redundant light of the side wall, the light leakage problem of the lens module is solved, and the imaging quality of the lens module is improved.
The following describes a method for forming a lens module according to the present invention in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Fig. 7 is a flowchart illustrating a method for forming a lens module according to the present embodiment. As shown in fig. 7, the present embodiment provides a method for forming a lens module, including the following steps:
step S1, providing a substrate, sequentially arranging a glue film layer and a hard film layer on the surface of the substrate, wherein the hard film layer is provided with a plurality of hard film through holes;
step S2, placing a lens module on the hard film layer, wherein a solder ball is arranged on the first end surface of the lens module, a protective film layer is adhered on the second end surface of the lens module, the first end surface and the second end surface are oppositely arranged, the solder ball is embedded in the hard film through hole and fixed on the adhesive film layer, and the first end surface of the lens module covers the hard film through hole;
step S3, disposing a light-shielding layer on a sidewall surface of the lens module connecting the first end surface and the second end surface;
and step S4, pulling out the lens module.
The following describes the forming method of the lens module disclosed in this embodiment in more detail with reference to fig. 8 to 13.
As shown in fig. 8, in step S1, providing a substrate 21, sequentially disposing a glue layer 22 and a hard film layer 23 on a surface of the substrate 21, where the hard film layer 23 is disposed with a plurality of hard film through holes 23 a; specifically, for example, the adhesive film layer 22 is attached to the surface of the substrate 21, and the hard coat layer 23 is attached to the adhesive film layer 22. Only a single hard film via 23a is shown in fig. 8, it being understood that the hard film via 23a may be several, for example, several hard film vias 23a are distributed in an array. The adhesive film layer 22 has elasticity, and the material of the adhesive film layer 22 is, for example, any one of a hot-press adhesive film, a hot-melt adhesive film, and a heat-resistant plastic film. After the adhesive film layer 22 is adhered to the surface of the substrate 21, for example, the adhesive film layer 22 is placed in an oven, and is heated from room temperature to a high temperature, for example, 200 ℃ to 250 ℃, and then cooled to a high temperature, the adhesive film layer 22 has a certain viscosity and is not adhered to an object to be fixed (when the object to be fixed is pulled out by external force, the adhesive film layer is not adhered to the object to be fixed, for example, the lens module 24). The hard coat layer 23 is made of a polyester film, such as mylar.
Next, as shown in fig. 8 and 9, in step S2, the lens module 24 is placed on the hard film layer 23, and the hard film layer 23 supports the lens module 24. The first end surface of the lens module 24 is provided with a solder ball 243, and the second end surface of the lens module 24 is adhered with a protective film 25. The first end surface is disposed opposite the second end surface. The second end surface of the lens module 24 is used for generating an optical image and cannot be covered by the light shielding layer in the subsequent process. The first end surface of the lens module 24 is used for signal connection and cannot be covered by the light shielding layer in the subsequent process. The solder balls 243 are solder balls, for example. The solder balls 243 are embedded in the hard film through holes 23a and fixed on the glue film layer 22, and the first end surface of the lens module 24 covers the hard film through holes 23 a. Specifically, the lens module 24 includes a lens 241, an image sensor 142 disposed on the lens 241, and a solder ball 243 disposed on a surface of the image sensor 242 on a side away from the lens 241. The hard film layer 23 is a hard film layer, so that the periphery of the first end surface of the lens module 24 except the solder balls 243 is not sunk (embedded) into the hard film layer 23, and the periphery of the sidewall of the lens module 24 is not sunk (embedded) into the hard film layer 23, so that the periphery of the sidewall of the lens module 24 is completely exposed and can be completely covered by the light shielding layer in the subsequent process. The depth of hard mask through hole 23a is less than the height of solder ball 243, specifically, the height of solder ball 243 is the height (along the direction of perpendicular to first end surface) that solder ball 243 protrudes lens module 24, so that solder ball 243 inlays and locates in hard mask through hole 23a and fix on plastic film layer 22. The adhesive film layer 22 has high bonding fastness and has good bonding effect on various fabrics, non-woven fabrics, PVC, PET, metals, paper and the like. The adhesive layer 22 in this embodiment is used for adhering and fixing the solder balls 243 in the lens module 24. The adhesive film layer 22 has certain elasticity and viscosity, the solder balls 243 are adhered and fixed in the adhesive film layer 22, the adhesive film layer 22 is deformed correspondingly like plasticine or maltose in the process of placing the lens module 24, pits (grooves) matched with the solder balls 243 are formed, and the solder balls 243 are adhered and fixed. When the lens module 24 is pulled out by external force, the solder balls 243 can be separated from the adhesive film layer 22. The lens modules 24 may have a plurality of lens modules 24, and the plurality of independent lens modules 24 correspond to the hard film through holes 23a distributed in an array one to one.
Next, as shown in fig. 10, a protective film 25 is adhered to the second end surface of the lens module 24 to prevent a light shielding layer from being sprayed on the second end surface of the lens module 24 in a subsequent process, and the second end surface of the lens module 24 is used for generating an optical image of a scene through the lens 241 and cannot be sprayed on the light shielding layer, otherwise, the imaging quality is affected. The step of adhering the protective film layer 25 is performed before step S3 (providing the light shielding layer on the sidewall surface of the lens module), and may be specifically performed according to the actual situation, for example, the protective layer may be adhered when the lens module 24 is not divided on a whole wafer, and then the protective layer is divided into several independent units along with the lens module 24. The protective film layer 25 is, for example, a PET film.
Next, as shown in fig. 11 and 12, in step S3, a light-shielding layer 26 is provided on the sidewall surface of the lens module 24. The light shielding layer 26 is, for example, black paint or black glue. The specific process for forming the black paint comprises the following steps: step S31, spraying the black paint on the surface of the sidewall of the lens module 24; further, in the process of spraying the black paint on the surface of the side wall of the lens module 24, the black paint is also sprayed on the surface of the hard coat layer 23; and step S32, baking the black paint to cure the black paint.
Next, as shown in fig. 13, in step S4, the lens module 24 is pulled out. After the lens module 24 is pulled out, the pits (grooves) where the adhesive film layer 22 is matched with the solder balls 243 can be elastically deformed and restored to an original flat state, or the pits matched with the solder balls 243 can be kept without being restored after being deformed so as to facilitate the use of the next batch of the same products, and specifically, the parameters such as the elastic modulus of the adhesive film layer 22 can be selected according to actual requirements and set.
The top surface of the lens module 24 is used for generating an optical image of a scene through the lens 241, and is protected from being sprayed on the light shielding layer by the protective film 25; the first end surface of the lens module 24 is used for signal connection and is not sprayed to the light shielding layer because the hard film through hole 23a is covered; the sidewall of the lens module 24 is completely covered by the light shielding layer 26, so that the process of generating an optical image from a scene through the lens 241 is not affected by the excessive light on the sidewall of the lens module 24, and the problem of light leakage of the lens module 24 (specifically, the problem of light leakage on the sidewall of the lens module 24) is solved, thereby improving the imaging quality of the lens module 24.
In summary, the forming method of the lens module provided by the invention includes: providing a substrate, sequentially arranging an adhesive film layer and a hard film layer on the surface of the substrate, wherein the hard film layer is provided with a hard film through hole; placing a lens module on the hard film layer, wherein a first end surface of the lens module is provided with a welding ball, a second end surface of the lens module is adhered with a protective film layer, the first end surface and the second end surface are oppositely arranged, the welding ball is embedded in the hard film through hole and fixed on the adhesive film layer, and the first end surface of the lens module covers the hard film through hole; arranging a light shielding layer on the surface of the side wall of the lens module, which is connected with the first end surface and the second end surface; and pulling out the lens module.
The first end surface of the lens module is used for signal connection, and the hard film through hole is covered so as not to be sprayed to the shading layer; the second end surface of the lens module is used for enabling the scenery to generate an optical image through the lens, and the optical image is protected by the protective film layer and is not sprayed on the shading layer; the lens module can be well fixed and easily pulled out in the process of forming the light shielding layer by the aid of the adhesive film layer, and rapid placement and taking out (pulling out) are realized; the lens module is placed on the hard film layer and does not sink, so that the surface of the side wall of the lens module can be completely covered by the shading layer, the lens module is not influenced by redundant light of the side wall of the lens module in the optical imaging process, the light leakage problem of the lens module is solved, and the imaging quality of the lens module is improved. The extra shading structure of the client is removed, which is beneficial to the size reduction and cost control of the client product.
It is to be understood that while the present invention has been described in conjunction with the preferred embodiments thereof, it is not intended to limit the invention to those embodiments. It will be apparent to those skilled in the art from this disclosure that many changes and modifications can be made, or equivalents modified, in the embodiments of the invention without departing from the scope of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention, unless the contents of the technical solution of the present invention are departed.
Claims (10)
1. A method for forming a lens module is characterized by comprising the following steps:
providing a substrate, sequentially arranging an adhesive film layer and a hard film layer on the surface of the substrate, wherein the hard film layer is provided with a hard film through hole;
placing a lens module on the hard film layer, wherein a first end surface of the lens module is provided with a welding ball, a second end surface of the lens module is adhered with a protective film layer, the first end surface and the second end surface are oppositely arranged, the welding ball is embedded in the hard film through hole and fixed on the adhesive film layer, and the first end surface of the lens module covers the hard film through hole;
arranging a light shielding layer on the surface of the side wall of the lens module, which is connected with the first end surface and the second end surface;
and pulling out the lens module.
2. The method for forming a lens module according to claim 1, wherein providing a substrate, sequentially disposing a film layer and a hard film layer on a surface of the substrate, the hard film layer having a hard film through hole formed therein, comprises: and adhering the adhesive film layer on the surface of the substrate, and adhering the hard film layer on the surface of the adhesive film layer.
3. The method for forming a lens module as claimed in claim 1, wherein the hard mask through holes have a depth smaller than a height of the solder balls.
4. The method as claimed in claim 1, wherein the light-shielding layer is black paint or black glue.
5. The method as claimed in claim 4, wherein disposing a light shielding layer on a sidewall surface of the lens module connecting the first end surface and the second end surface comprises:
spraying the black paint on the surface of the side wall of the lens module;
baking the black paint to cure the black paint.
6. The method as claimed in claim 1, wherein the second end surface of the lens module is used for generating an optical image.
7. The method as claimed in claim 1, wherein the hard mask through holes are distributed in an array, and the lens modules are disposed in one-to-one correspondence with the hard mask through holes.
8. The method for forming a lens module of claim 1, wherein the adhesive layer has elasticity.
9. The method of claim 8, wherein the adhesive layer is made of any one of a hot-press adhesive film, a hot-melt adhesive film, and a heat-resistant plastic film.
10. The method as claimed in claim 1, wherein the hard coating is a polyester film.
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| CN201910314942.XA CN110026328B (en) | 2019-04-18 | 2019-04-18 | Method for forming lens module |
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| CN201910314942.XA CN110026328B (en) | 2019-04-18 | 2019-04-18 | Method for forming lens module |
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| CN110026328B true CN110026328B (en) | 2021-12-17 |
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| CN110534539A (en) * | 2019-09-03 | 2019-12-03 | 豪威光电子科技（上海）有限公司 | Lens module and forming method thereof |
| CN113058770A (en) * | 2021-03-30 | 2021-07-02 | 蒋秀莲 | Building board surface paint spraying device with function of sealing side end of board through plasticine |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990058A (en) * | 2009-07-30 | 2011-03-23 | 鸿富锦精密工业（深圳）有限公司 | Method of coating wafer-level camera module and wafer-level camera module |
| CN106653784A (en) * | 2015-11-03 | 2017-05-10 | 豪威科技股份有限公司 | Chip-scale packaged image sensor packages with black masking and associated packaging methods |
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| JP5324890B2 (en) * | 2008-11-11 | 2013-10-23 | ラピスセミコンダクタ株式会社 | Camera module and manufacturing method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990058A (en) * | 2009-07-30 | 2011-03-23 | 鸿富锦精密工业（深圳）有限公司 | Method of coating wafer-level camera module and wafer-level camera module |
| CN106653784A (en) * | 2015-11-03 | 2017-05-10 | 豪威科技股份有限公司 | Chip-scale packaged image sensor packages with black masking and associated packaging methods |
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