CN110010550A - A kind of array substrate preparation method and display panel preparation method - Google Patents
A kind of array substrate preparation method and display panel preparation method Download PDFInfo
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- CN110010550A CN110010550A CN201910312099.1A CN201910312099A CN110010550A CN 110010550 A CN110010550 A CN 110010550A CN 201910312099 A CN201910312099 A CN 201910312099A CN 110010550 A CN110010550 A CN 110010550A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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Abstract
The present invention relates to display equipment preparation technical fields, and disclosing a kind of array substrate preparation method and display panel preparation method, array substrate preparation method therein includes: cutting motherboard, form the array substrate of multiple array distributions；Wherein, each array substrate includes the viewing area along column direction arrangement and non-display area, and non-display area includes the area Pad and the stripping area that is set on the area Pad line direction；In each array substrate, stripping area extends to viewing area other than the side that column direction extends along line direction；Hemisection is carried out to the junction of viewing area and non-display area, so that the separated state of the film of viewing area and the junction of non-display area；It is needled into the film at stripping area using Pin, film is pushed, swells film, clamp film bump pad using fixture, film is torn；By the Regional resection other than the area Pad in non-display area.In above-mentioned array substrate preparation method, due to increasing the area of stripping area, it is not easy to injure the route in the area Pad.
Description
Technical field
The present invention relates to display equipment preparation technical field, in particular to a kind of array substrate preparation method and display panel
Preparation method.
Background technique
When preparing array substrate, motherboard is cut into multiple array substrates, then, needs to remove non-aobvious in array substrate
Show PET (the Polyethylene Terephthalate in area；Polyethylene terephthalate) etc. films；Common practice
It is to be needled into film first with removing, pushes film using stripping needle, swell film, fixture is recycled to clamp film protuberance
Place, tears film.
In the prior art, when motherboard being cut into array substrate, as shown in Figure 1, holding when being needled into film using removing
It easily leads to following consequence: stripping needle is pricked to too deep, the circuit in the area Pad in damage non-display area；Stripping needle is pricked too shallow, removing
Needle cannot push film；Film bump height is too small, and fixture is easy to crush the area Pad.
Summary of the invention
The invention discloses a kind of array substrate preparation methods, and damage is easy when removing the film in the region Pad for avoiding
The case where hurting the area Pad route.
In order to achieve the above objectives, the present invention the following technical schemes are provided:
A kind of array substrate preparation method includes:
Motherboard is cut, the array substrate of multiple array distributions is formed；Wherein,
Each array substrate includes including along the viewing area of column direction arrangement and non-display area, the non-display area
The area Pad and the stripping area being set on the area Pad line direction；In each array substrate, stripping area extends to display along line direction
Area is other than the side that column direction extends；
Hemisection is carried out to the junction of the viewing area and the non-display area so that the viewing area with it is described non-display
The separated state of the film of the junction in area；
It is needled into the film at stripping area using Pin, film is pushed, swells film, film is clamped using fixture and swells
Place, film is torn；
By the Regional resection other than the area Pad in non-display area.
In above-mentioned array substrate preparation method: due to cutting motherboard, after forming the array substrate of multiple array distributions,
The stripping area of array substrate extends to viewing area other than the side that column direction extends along line direction, and is cutting in the prior art
Array substrate is cut rectangular situation when motherboard to compare, the area of stripping area in non-display area can be increased, convenient for stripping
It is operated from needle in stripping area, stripping needle will not be fallen into easily in the range of the area Pad, be needled into the thin of stripping area using removing
When film, even if the depth that removing is needled into film is big, the route in the area Pad will not be injured；Simultaneously as the area of stripping area increases
Add, after removing is needled into the film of stripping area, when pushing film mobile to the area Pad, increase for the mobile distance of stripping needle,
The height that film can swell increases, and fixture is easier to clamp film bump pad；And the increase of stripping area area, make film
Bump pad and the area Pad keep certain distance, and fixture is not easy to crush the route in the area Pad.
Preferably, in the array substrate of the multiple array distribution, each array base in array substrate described in every a line
The extending direction of the stripping area of plate is identical；
And along the every two adjacent array substrates of the extending direction of stripping area, the stripping area of previous array substrate extends
To the viewing area of the latter array substrate between the extended line for two sides that column direction extends.
Preferably, in each array substrate, the size of stripping area in a column direction and the size of the area Pad in a column direction
It is identical.
Preferably, in each array substrate, a side of stripping area far from the corresponding area Pad extends along column direction.
Preferably, along the every two adjacent array substrates of extending direction of stripping area, the removing of previous array substrate
Respective side of the opposite side in the area Qu Zhongyu Pad along the area Pad of the latter array substrate extends.
Preferably, in each array substrate, the size of stripping area in a column direction is less than the ruler of the area Pad in a column direction
It is very little；
And the bottom edge of stripping area is concordant with the bottom edge in the area Pad.
Preferably, a line array substrate includes multipair array substrate；
In each pair of array substrate, the stripping area of each array substrate extends to the viewing area of another array substrate along column
Between the extended line for two sides that direction extends.
Preferably, the promotion film, specifically includes:
Film first is pushed to the direction far from viewing area, then pushes film to the direction close to the area Pad.
Preferably, when film swells, stripping area expose portion is resisted with press part, is further continued for pushing stripping needle.
The invention also discloses a kind of display panel preparation methods, comprising:
Array substrate is obtained using above-mentioned array substrate preparation method.
The display panel preparation method and above-mentioned array substrate preparation method are possessed compared with the existing technology
Advantage is identical, and details are not described herein.
Detailed description of the invention
Fig. 1 is the flow diagram one of array substrate preparation method provided in an embodiment of the present invention；
Fig. 2 is the flow diagram two of array substrate preparation method provided in an embodiment of the present invention；
Fig. 3 is the structural representation of array substrate after S100 step in array substrate preparation method provided in an embodiment of the present invention
Figure；
A pair of of array substrate cooperation in motherboard when Fig. 4 is S100 in array substrate preparation method provided in an embodiment of the present invention
Structural schematic diagram.
Icon: 1000- motherboard；100- array substrate；The viewing area 110-；120- non-display area；The area 121-Pad；122- stripping
From area；The redundant area 123-.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment one
100 preparation method of array substrate provided in an embodiment of the present invention includes:
S100: cutting motherboard 1000 forms the array substrate 100 of multiple array distributions；Wherein,
Each array substrate 100 includes the viewing area 110 and non-display area 120 along column direction arrangement, and non-display area 120 wraps
The stripping area 122 for including the area Pad 121 and being set on 121 line direction of the area Pad；In each array substrate 100,122 edge of stripping area
Line direction extends to viewing area 110 other than the side that column direction extends；
S200: hemisection is carried out to the junction of viewing area 110 and non-display area 120, so that viewing area 110 and non-display area
The separated state of the film of 120 junction；
S300: it is needled into the film at stripping area 122 using Pin, film is pushed, swells film, clamped using fixture
Film bump pad, film is torn；
S400: by the Regional resection other than the area Pad 121 in non-display area 120.
It should be understood that above-mentioned S100 step and S200 step can be interchanged；In S400 step " other than the area Pad 121
Region " refer to cutting away stripping area 122, if in non-display area 120 other than stripping area 122 and the area Pad 121, also
Other areas to be cut including other are formed in S100 step including redundant area 123 etc., then " region other than the area Pad 121 "
Refer to stripping area 122 and area to be cut；Meanwhile above-mentioned area to be cut can also be cut off in S100 step；Film therein
Including but not limited to PET (Polyethylene terephthalate；Poly terephthalic acid class plastics) film.
In above-mentioned 100 preparation method of array substrate: due to cutting motherboard 1000, forming the array of multiple array distributions
After substrate 100, the stripping area 122 of array substrate 100 along line direction extend to viewing area 110 along the side that column direction extends with
Outside, compared with array substrate 100 is cut rectangular situation when cutting motherboard 1000 in the prior art, can increase non-
The area of stripping area 122 in viewing area 120, is operated convenient for stripping needle in stripping area 122, and stripping needle will not be fallen into easily
In the range of the area Pad 121, when being needled into the film of stripping area 122 using removing, even if the depth that removing is needled into film is big,
The route in the area Pad 121 will not be injured；Simultaneously as the area of stripping area 122 increases, removing is needled into stripping area 122
After film, when pushing film mobile to the area Pad 121, increase for the mobile distance of stripping needle, the height that film can swell increases
Add, fixture is easier to clamp film bump pad；And the increase of 122 area of stripping area, make bump pad and the area Pad 121 of film
Certain distance is kept, fixture is not easy to crush the route in the area Pad 121.
Wherein, in each array substrate 100, stripping area 122 extends to viewing area 110 along line direction and extends along column direction
Side other than, include at least following form:
The first form, in two adjacent array substrates 100, stripping area 122 is extended to adjacent two on line direction
Between the extended line of the column direction side of the viewing area 110 of a array substrate 100；Array in 1000 line direction top edge of motherboard
In substrate 100, stripping area 122 extends to the extended line and motherboard 1000 of the column direction side of itself corresponding viewing area 110
Between column direction side.
Second of form, in the row direction in two adjacent array substrates 100, the stripping area of an array substrate 100
122 extend between the extended line of two column direction sides of the viewing area 110 of another array substrate 100；In motherboard 1000
In the array substrate 100 of line direction top edge, stripping area 122 extends to the column direction side of itself corresponding viewing area 110
Between extended line and the column direction side of motherboard 1000；In second of form, 122 energy of stripping area of an array substrate 100
It enough extends within the extended line of the viewing area 110 of another adjacent array substrate 100, with tradition according to viewing area 110
The case where column extension wire cutting array substrate 100, is compared, and the stripping area 122 of an array substrate 100, which can be utilized actively, to be passed
The region in the non-display area 120 of another array substrate 100 is originally belonged in system cutting mode, not additional waste motherboard 1000
The area of stripping area 122 can be increased under the premise of (without increasing the gap between array substrate 100).
In second of form, and including following situation:
For example, in figs. 1 to 3, in the array substrate 100 of multiple array distributions, each battle array in every a line array substrate 100
The extending direction of the stripping area 122 of column substrate 100 is identical；And along the extending direction of stripping area 122 per two adjacent array bases
In plate 100, the stripping area 122 of previous array substrate 100 extends to the viewing area 110 of the latter array substrate 100 along column side
To between the extended line of two sides of extension.
As shown in figure 1 in A1 state and Fig. 2 shown in B1 state, in each array substrate 100, stripping area 122 is in column direction
On size it is identical as the size of the area Pad 121 in a column direction, that is, the width of stripping area 122 and the width phase in the area Pad 121
Together, in this way, the glass region area for leaving stripping needle stripping film for is larger, it is convenient for stripping needle stripping film.
When the size of stripping area 122 in a column direction is identical as the size of the area Pad 121 in a column direction, at least just like
Lower situation:
As shown in Figure 1, in each array substrate 100, stripping area 122 is far from the corresponding area Pad 121 in A1 state
A side along column direction extend；When being cut using right edge of the laser cutting tool to the area Pad 121, cutting path is only
It need to extend according to line direction or column direction, reduce cutting difficulty.
In Fig. 1, array substrate 100 by motherboard 1000 of the S100 step to A1 state the preparation method is as follows: cut
It cuts, obtains the array substrate 100 of A2 state；S200 step is executed to the array substrate 100 of A2 state again, by the area Pad 121 and stripping
It is cut respectively with the film of 110 junction of viewing area from area 122；S300 step is executed, the battle array of A2 state is needled into using removing
The film of stripping area 122 in column substrate 100, the area Bing Xiang Pad 121 push film, swell film, it is grand to pick up film using fixture
At rising, and film of tearing；S400 step is executed to array substrate 100 again, by the redundant area 123 and the other side of 121 side of the area Pad
Stripping area 122 cut away, with obtain in B3 state include the area Pad 121 and viewing area 110 array substrate 100.
Such as Fig. 2, along the every two adjacent array substrates 100 of extending direction of stripping area 122, previous array substrate
The respective side in Pad area 121 of the opposite side in 100 122 area 121 Zhong Yu Pad of stripping area along the latter array substrate 100 is prolonged
It stretches；
In Fig. 2, when B1 state, the stripping area 122 of every a line array substrate 100 extends to another array to the right
Within the extended line of the column side of the viewing area 110 of substrate 100；
In Fig. 2, step S100 first is executed to the motherboard 1000 of B1 state, obtains the array substrate 100 of B2 state；It is right again
The array substrate 100 of B2 state executes S200 step, by the area Pad 121 and stripping area 122 respectively with 110 junction of viewing area
Film is cut；S300 step is executed, is needled into the film of stripping area 122 in the array substrate 100 of B2 state using removing, and to
121 direction of the area Pad pushes film, swells film, picks up film bump pad using fixture, and film of tearing；Again to array base
Plate 100 executes S400 step, and the stripping area 122 of 121 other side of the area Pad is cut away, and includes the area Pad in B3 state to obtain
121 and viewing area 110 array substrate 100；
By the cutting process analysis to above-mentioned Fig. 2 it is found that on line direction in every two adjacent array substrates 100, by
The left side in the area Pad 121 of adjacent array substrate 100 on the right side of the right edge of the stripping area of left side array substrate 100 122
Extend, the redundant area 123 of left side array substrate 100 all occupies in the region in 121 left side of the area Pad in right side array substrate 100；
Therefore, on the one hand, in the case where not 1000 area of additional waste motherboard, the area of stripping area 122 can be maximized；It is another
Aspect, according to the cutting mode of Fig. 2, when executing S400 step, because need to only cut the area Pad 121 1 without redundant area 123
The stripping area 122 of side, saves cutting action.
When the extending direction of stripping area 122 of each array substrate 100 is identical in a line array substrate 100, such as
Shown in Fig. 3, in each array substrate 100, the size of stripping area 122 in a column direction is less than the area Pad 121 in a column direction
Size；And the bottom edge of stripping area 122 is concordant with the bottom edge in the area Pad 121；Wherein, the bottom edge of stripping area 122, which refers in Fig. 3, removes
The lower side in area 122, the bottom edge in the area Pad 121 refer to the lower side in the area Tu3Zhong Pad 121.
Since the area Pad 121 is generally in inverted trapezoidal, i.e., one end adjacent with viewing area 110 is wider, one far from the area Pad 121
Hold it is relatively narrow, by way of above-mentioned motherboard 1000 as shown in Figure 3 is cut into array substrate 100, the removing of an array substrate 100
Area 122 can extend to the side at relatively narrow place, the area Pad 121 in adjacent array substrate 100, long to increase stripping area 122 as far as possible
Degree operates convenient for the stripping film of stripping needle.
For another example a line array substrate 100 includes multipair array substrate 100；
In each pair of array substrate 100, the stripping area 122 of each array substrate 100 extends to another array substrate 100
Viewing area 110 between the extended line for two sides that column direction extends；
As shown in figure 4, the array substrate 100 being disposed adjacent for a pair in motherboard 1000 along line direction, wherein left side array
The stripping area 122 of substrate 100 is located at 121 right side of the area Pad, and extends to viewing area 110 in the array substrate 100 of right side to the right
Lower section, the stripping area 122 of right side array substrate 100 extend to 110 lower section of viewing area of the array substrate 100 in left side；It needs
Bright, the stripping area 122 of side belongs to the array substrate 100 in left side in fig. 4, the upper, and the stripping area 122 of downside belongs to right side
Array substrate 100；
In Fig. 4, in pairs of array substrate 100, the stripping area 122 of two adjacent array substrates 100 is staggered,
When cutting to motherboard 1000, need to only bending road be carried out to the non-display area 120 between two pairs of array substrates 100
Diameter cutting, and the non-display area 120 of the side for deviating from another array substrate 100 in each array substrate 100 only needs edge
Column direction is cut always, and two array substrates 100 can obtain the stripping area 122 with larger area respectively.
Wherein, in S300 step, film is pushed to specifically include:
Film first is pushed to the direction far from viewing area 110, makes the film of non-display area 120 and the film of viewing area 110
Separation, then film is pushed to the direction close to the area Pad 121, make the film separation on non-display area 120.
In S300 step, when film protuberance, 122 expose portion of stripping area is resisted with press part, to avoid array substrate
100 stripping area 122 is tilted with film, is further continued for pushing stripping needle, is swelled film.
Embodiment two
Display panel preparation method provided in an embodiment of the present invention, comprising:
Array substrate 100 is obtained using above-mentioned 100 preparation method of array substrate；
Array substrate 100 is further processed again, to obtain display panel.
In above-mentioned display panel preparation method, when preparing array substrate 100: due to cutting motherboard 1000, being formed more
After the array substrate 100 of a array distribution, the stripping area 122 of array substrate 100 extends to viewing area 110 along column side along line direction
To other than the side of extension, and array substrate 100 is cut to rectangular situation when cutting motherboard 1000 in the prior art
It compares, the area of stripping area 122 in 120 domain of non-display area can be increased, operated convenient for stripping needle in stripping area 122, shelled
In the range of the area Pad 121 will not be fallen into easily from needle, when being needled into the film of stripping area 122 using removing, even if stripping needle pierces
The depth for entering film is big, will not injure the route in the area Pad 121；Simultaneously as the area of stripping area 122 increases, stripping needle
After being pierced into the film of stripping area 122, when pushing film mobile to the area Pad 121, increase for the mobile distance of stripping needle, film
The height that can be swelled increases, and fixture is easier to clamp film bump pad；And the increase of 122 area of stripping area, make film
Bump pad and the area Pad 121 keep certain distance, and fixture is not easy to crush the route in the area Pad 121.
Obviously, those skilled in the art can carry out various modification and variations without departing from this hair to the embodiment of the present invention
Bright spirit and scope.In this way, if these modifications and changes of the present invention belongs to the claims in the present invention and its equivalent technologies
Within the scope of, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of array substrate preparation method characterized by comprising
Motherboard is cut, the array substrate of multiple array distributions is formed；Wherein,
It includes the area Pad that each array substrate, which includes along the viewing area of column direction arrangement and non-display area, the non-display area,
With the stripping area being set on the area Pad line direction；In each array substrate, stripping area extends to viewing area along column along line direction
Other than the side that direction extends；
Hemisection is carried out to the junction of the viewing area and the non-display area, so that the viewing area and the non-display area
The separated state of the film of junction；
It is needled into the film at stripping area using Pin, film is pushed, swells film, clamp film bump pad using fixture, with
Film is torn；
By the Regional resection other than the area Pad in non-display area.
2. array substrate preparation method according to claim 1, which is characterized in that the array base of the multiple array distribution
In plate, the extending direction of the stripping area of each array substrate is identical in array substrate described in every a line；
And along the every two adjacent array substrates of the extending direction of stripping area, after the stripping area of previous array substrate extends to
The viewing area of one array substrate is between the extended line for two sides that column direction extends.
3. array substrate preparation method according to claim 2, which is characterized in that in each array substrate, stripping area
Size in a column direction is identical as the size of the area Pad in a column direction.
4. array substrate preparation method according to claim 3, which is characterized in that in each array substrate, stripping area
A side far from the corresponding area Pad extends along column direction.
5. array substrate preparation method according to claim 3, which is characterized in that the extending direction along stripping area is per adjacent
Two array substrates in, the opposite side in the stripping area area Zhong Yu Pad of previous array substrate is along the latter array substrate
The respective side in the area Pad extends.
6. array substrate preparation method according to claim 2, which is characterized in that in each array substrate, stripping area
Size in a column direction is less than the size of the area Pad in a column direction；
And the bottom edge of stripping area is concordant with the bottom edge in the area Pad.
7. array substrate preparation method according to claim 1, which is characterized in that a line array substrate includes multipair array
Substrate；
In each pair of array substrate, the stripping area of each array substrate extends to the viewing area of another array substrate along column direction
Between the extended line of two sides extended.
8. array substrate preparation method according to claim 1, which is characterized in that the promotion film specifically includes:
Film first is pushed to the direction far from viewing area, then pushes film to the direction close to the area Pad.
9. array substrate preparation method according to claim 1, which is characterized in that when film protuberance, supported with press part
Firmly stripping area expose portion is further continued for pushing stripping needle.
10. a kind of display panel preparation method characterized by comprising
Array substrate is obtained using the array substrate preparation method that any one of claim 1-9 is provided.
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| US20030017663A1 (en) * | 2001-07-04 | 2003-01-23 | Shinya Takyu | Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time |
| CN106654063A (en) * | 2016-12-28 | 2017-05-10 | 武汉华星光电技术有限公司 | Manufacturing method of flexible OLED display panel |
| CN107650484A (en) * | 2017-09-12 | 2018-02-02 | 京东方科技集团股份有限公司 | The preparation method of the attaching method of film layer, display panel and display device |
| CN109326629A (en) * | 2018-09-17 | 2019-02-12 | 武汉华星光电半导体显示技术有限公司 | The motherboard structure and cutting method of flexible OLED display panel |
-
2019
- 2019-04-18 CN CN201910312099.1A patent/CN110010550B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030017663A1 (en) * | 2001-07-04 | 2003-01-23 | Shinya Takyu | Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time |
| CN106654063A (en) * | 2016-12-28 | 2017-05-10 | 武汉华星光电技术有限公司 | Manufacturing method of flexible OLED display panel |
| CN107650484A (en) * | 2017-09-12 | 2018-02-02 | 京东方科技集团股份有限公司 | The preparation method of the attaching method of film layer, display panel and display device |
| CN109326629A (en) * | 2018-09-17 | 2019-02-12 | 武汉华星光电半导体显示技术有限公司 | The motherboard structure and cutting method of flexible OLED display panel |
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