CN110000445A - A kind of reflow soldering cooling device - Google Patents
A kind of reflow soldering cooling device Download PDFInfo
- Publication number
- CN110000445A CN110000445A CN201910445515.5A CN201910445515A CN110000445A CN 110000445 A CN110000445 A CN 110000445A CN 201910445515 A CN201910445515 A CN 201910445515A CN 110000445 A CN110000445 A CN 110000445A
- Authority
- CN
- China
- Prior art keywords
- water
- work box
- fixed link
- case lid
- limiting valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 30
- 238000005476 soldering Methods 0.000 title claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 84
- 239000007921 spray Substances 0.000 claims abstract description 12
- 238000005507 spraying Methods 0.000 claims abstract description 7
- 238000009434 installation Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of reflow soldering cooling devices, including water-supply-pipe, handle, case lid, work box, connecting rod, water limiting valve, valve switch, connecting tube, spray head, connecting plate, fastening bolt, water outlet, water tank, hole for water spraying, upper fixed link, lower fixed link and rubber layer.The beneficial effects of the present invention are: there are two handle settings, and handle is in symmetrically to set to be mounted at left and right sides of the upper surface of case lid, and handle and case lid are in detachable connection, be conducive to be easy to open case lid, check whether internal component damages, valve switch is arranged at the right lateral surface center of water limiting valve, and valve switch is in rotatably to connect with water limiting valve, be conducive to facilitate the size of control water flow, improve the practicability of the equipment, connecting rod is mounted at left and right sides of the inside of work box in symmetrical expression, and connecting rod and work box are in fixed connection.
Description
Technical field
The present invention relates to a kind of cooling device, specially a kind of reflow soldering cooling device belongs to reflow tin soldering technology
Field.
Background technique
Reflow tin soldering machine is common a kind of welding equipment in surface mount industry, and process specifically includes that 1, incites somebody to action
One or more PCB circuit board is placed in the heater box of reflow machine；2, by equally distributed heating tube to PCB circuit board
Being evenly heated under hot environment is carried out, keeps after a certain period of time, completing the disposable welding of PCB circuit board surface solder joint；3,
Radiator fan in heater box is opened, PCB circuit board is quickly cooled down, takes out PCB circuit board, welding process is completed.Wherein, high temperature
The quality of cooling velocity butt welding point is affected after being welded, if failing timely cooling, the brightness of solder joint is not high, easily broken
It splits, remove.
Existing cooling device is relatively simple, and one, existing cooling device not can control the size of water flow, leads to the dress
The cooling effect set is not good enough, secondly, existing cooling device be inconvenient to open case lid, cause the device be inconvenient to observe it is internal
Whether element damages, thirdly, the outlet effect of the water outlet of existing cooling device it is bad, lead to the heap of the device internal water
Product, it is very dangerous, four, the effect of the fixed battery plate of existing cooling device it is bad, cause the using effect of the device inadequate
It is good.
Summary of the invention
The object of the invention is that providing a kind of reflow soldering cooling device to solve the above-mentioned problems.
The present invention is through the following technical solutions to achieve the above objectives: a kind of reflow soldering cooling device, including water delivery
Pipe, handle, case lid, work box, connecting rod, water limiting valve, valve switch, connecting tube, spray head, connecting plate, fastening bolt, water outlet
Mouth, water tank, hole for water spraying, upper fixed link, lower fixed link and rubber layer；The water-supply-pipe, work box and water tank constitute cooling dress
The main structure set, the water-supply-pipe is connected to the upper end of water limiting valve, and water-supply-pipe and water limiting valve are in detachable connection, described
Handle is mounted on the upper surface of case lid, and the case lid is mounted on the upper end of work box, and case lid and work box are in mobile detachable
Connection, the connecting rod are mounted on the inside two sides of work box, the upper surface connection water-supply-pipe of the water limiting valve, and water limiting valve
Connecting tube is installed in lower surface, and the valve switch is mounted on the right side of water limiting valve, and the upper end of the connecting tube is mounted on water limiting valve
Lower surface center at, and the lower surface of connecting tube connects spray head, and there are two connecting plate settings, and connecting plate is in symmetrical expression
It is mounted on the end of connecting rod, and connecting plate and connecting rod are in fixed connection, there are four the fastening bolt settings, and fastens
Bolt is mounted on the surface of connecting plate in symmetrical expression, and fastening bolt and connecting plate are in the fixed connection of rotation, the water outlet
Positioned at the bottom inner surface of work box, the water tank is mounted on the lower surface of work box, and water tank is in detachable with work box
Connection, the hole for water spraying are mounted on the lower surface of spray head, and fixed bar is mounted on the side surface of link block, the lower fixation
Bar is mounted on the side surface of link block, and the rubber layer is mounted on the surface of fixed link and lower fixed link.
Preferably, case lid is opened for convenience, and there are two the handle settings, and handle is in symmetrically to set to be mounted on case lid
At left and right sides of upper surface, and handle and case lid are in detachable connection.
Preferably, the size of water flow is controlled for convenience, and the right lateral surface center of water limiting valve is arranged in the valve switch
Place, and valve switch is in rotatably to connect with water limiting valve.
Preferably, stronger in order to which battery plate is fixed, the connecting rod is mounted on the inside of work box in symmetrical expression
The left and right sides, and connecting rod and work box are in fixed connection.
Preferably, in order to make water flow quickly flow out work box, there are two the water outlet settings, and water outlet is mounted on
At left and right sides of the bottom end of work box.
Preferably, in order to protect battery plate not to be damaged in use, there are two the rubber layer settings, and rubber layer is in pair
Title formula is mounted on the protrusion surface of fixed link and lower fixed link, and rubber layer and upper fixed link and lower fixed link are in detachable
Connection.
The beneficial effects of the present invention are: the reflow soldering is designed rationally with cooling device, there are two handle settings, and handle
In symmetrically setting at left and right sides of the upper surface for being mounted on case lid, and handle and case lid are in detachable connection, are conducive to be easy to open
Case lid, checks whether internal component damages, and valve switch is arranged at the right lateral surface center of water limiting valve, and valve switch and limit
Water valve is conducive to the size for facilitating control water flow in rotary connection, improves the practicability of the equipment, connecting rod is in symmetrical peace
At left and right sides of the inside of work box, and connecting rod and work box are in fixed connection, are conducive to battery plate is fixed more
Securely, it is not moved battery plate in cooling procedure, there are two water outlet settings, and water outlet is mounted on a bottom end left side for work box
Right two sides are conducive to that water flow is made quickly to flow out work box, protect the safety inside work box, and there are two rubber layer settings, and
Rubber layer is mounted on the protrusion surface of fixed link and lower fixed link, and rubber layer and upper fixed link and lower fixed link in symmetrical expression
In detachable connection, be conducive to that battery plate is protected not to be damaged in use.
Detailed description of the invention
Fig. 1 is cooling device structural schematic diagram of the present invention；
Fig. 2 is nozzle structure schematic diagram of the present invention；
Fig. 3 is fixed rod structure schematic diagram of the present invention.
In figure: 1, water-supply-pipe, 2, handle, 3, case lid, 4, work box, 5, connecting rod, 6, water limiting valve, 7, valve switch, 8,
Connecting tube, 9, spray head, 10, connecting plate, 11, fastening bolt, 12, water outlet, 13, water tank, 14, hole for water spraying, 15, upper fixed link,
16, lower fixed link and 17, rubber layer.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 1 ~ 3, a kind of reflow soldering cooling device, including water-supply-pipe 1, handle 2, case lid 3, work box 4, company
Extension bar 5, water limiting valve 6, valve switch 7, connecting tube 8, spray head 9, connecting plate 10, fastening bolt 11, water outlet 12, water tank 13, spray
Water hole 14, upper fixed link 15, lower fixed link 16 and rubber layer 17；The water-supply-pipe 1, work box 4 and water tank 13 constitute the cooling
The main structure of device, the water-supply-pipe 1 is connected to the upper end of water limiting valve 6, and water-supply-pipe 1 and water limiting valve 6 are in detachable company
It connects, the handle 2 is mounted on the upper surface of case lid 3, and the case lid 3 is mounted on the upper end of work box 4, and case lid 3 and work box 4
It is detachably connected in movement, the connecting rod 5 is mounted on the inside two sides of work box 4, and the upper surface connection of the water limiting valve 6 is defeated
Water pipe 1, and connecting tube 8 is installed in the lower surface of water limiting valve 6, the valve switch 7 is mounted on the right side of water limiting valve 6, the connection
The upper end of pipe 8 is mounted at the lower surface center of water limiting valve 6, and the lower surface of connecting tube 8 connects spray head 9, the connecting plate 10
There are two settings, and connecting plate 10 is mounted on the end of connecting rod 5 in symmetrical expression, and connecting plate 10 is in fixed with connecting rod 5
Connection, there are four the settings of fastening bolt 11, and fastening bolt 11 is mounted on the surface of connecting plate 10 in symmetrical expression, and fastens
In the fixed connection of rotation, the water outlet 12 is located at the bottom inner surface of work box 4, the water tank for bolt 11 and connecting plate 10
13 are mounted on the lower surface of work box 4, and water tank 13 and work box 4 are in detachable connection, and the hole for water spraying 14 is mounted on spray
First 9 lower surface, fixed bar 15 are mounted on the side surface of link block 10, and the lower fixed link 16 is mounted on link block 10
Side surface, the rubber layer 17 is mounted on the surface of fixed link 15 and lower fixed link 16.
There are two the handle 2 settings, and handle 2 is in symmetrically to set to be mounted at left and right sides of the upper surface of case lid 3, and handle
2 with case lid 3 be in detachable connection, is conducive to be easy to open case lid, checks whether internal component damages, the valve switch 7
It is arranged at the right lateral surface center of water limiting valve 6, and valve switch 7 is in rotatably to connect with water limiting valve 6, is conducive to facilitate control
The size of water flow processed, improves the practicability of the equipment, and the connecting rod 5 is mounted on inside of work box 4 or so two in symmetrical expression
Side, and connecting rod 5 and work box 4 are in fixed connection, and the stronger of battery plate fixation is conducive to make battery plate in cooling procedure
In be not moved, there are two the water outlet 12 settings, and water outlet 12 is mounted at left and right sides of the bottom end of work box 4, favorably
In making water flow quickly flow out work box, the safety inside work box is protected, there are two the settings of rubber layer 17, and rubber layer 17 is in
Symmetrical expression is mounted on the protrusion surface of fixed link 15 and lower fixed link 16, and rubber layer 17 and upper fixed link 15 and lower fixed link
16 be in detachable connection, is conducive to that battery plate is protected not to be damaged in use.
Working principle: when using the reflow soldering cooling device, first opening case lid 3 by handle 2, then
Battery plate is fixed by upper fixed link 15 and lower fixed link 16, then valve switch 7 is opened, and is controlled the size of water flow, is finally existed
It after equipment, checks whether rubber layer 17 is damaged, can be replaced.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (6)
1. a kind of reflow soldering cooling device, it is characterised in that: including water-supply-pipe (1), handle (2), case lid (3), work box
(4), connecting rod (5), water limiting valve (6), valve switch (7), connecting tube (8), spray head (9), connecting plate (10), fastening bolt
(11), water outlet (12), water tank (13), hole for water spraying (14), upper fixed link (15), lower fixed link (16) and rubber layer (17)；Institute
The main structure that water-supply-pipe (1), work box (4) and water tank (13) constitute the cooling device is stated, the water-supply-pipe (1) is connected to limit
The upper end of water valve (6), and water-supply-pipe (1) and water limiting valve (6) they are in detachable connection, the handle (2) is mounted on case lid (3)
Upper surface, the case lid (3) is mounted on the upper end of work box (4), and case lid (3) is detachably connected with work box (4) in movement,
The connecting rod (5) is mounted on the inside two sides of work box (4), and the upper surface of the water limiting valve (6) connects water-supply-pipe (1), and
Connecting tube (8) are installed in the lower surface of water limiting valve (6), and the valve switch (7) is mounted on the right side of water limiting valve (6), the connection
The upper end of pipe (8) is mounted at the lower surface center of water limiting valve (6), and the lower surface of connecting tube (8) connects spray head (9), described
There are two connecting plate (10) settings, and connecting plate (10) is mounted on the ends of connecting rod (5) in symmetrical expression, and connecting plate (10) with
Connecting rod (5) is in fixed connection, and there are four fastening bolt (11) settings, and fastening bolt (11) is mounted in symmetrical expression
The surface of connecting plate (10), and fastening bolt (11) and connecting plate (10) are in the fixed connection of rotation, water outlet (12) position
Bottom inner surface in work box (4), the water tank (13) are mounted on the lower surface of work box (4), and water tank (13) and work
Case (4) is in detachable connection, and the hole for water spraying (14) is mounted on the lower surface of spray head (9), fixed bar (15) installation
In the side surface of link block (10), the lower fixed link (16) is mounted on the side surface of link block (10), the rubber layer (17)
It is mounted on the surface of fixed link (15) and lower fixed link (16).
2. a kind of reflow soldering cooling device according to claim 1, it is characterised in that: the handle (2) is provided with
Two, and handle (2) is mounted at left and right sides of the upper surface of case lid (3) in symmetrical set, and handle (2) is in removable with case lid (3)
Unload formula connection.
3. a kind of reflow soldering cooling device according to claim 1, it is characterised in that: the valve switch (7) sets
It sets at the right lateral surface center of water limiting valve (6), and valve switch (7) is in rotatably to connect with water limiting valve (6).
4. a kind of reflow soldering cooling device according to claim 1, it is characterised in that: the connecting rod (5) is in pair
Title formula is mounted at left and right sides of the inside of work box (4), and connecting rod (5) and work box (4) are in fixed connection.
5. a kind of reflow soldering cooling device according to claim 1, it is characterised in that: water outlet (12) setting
There are two, and water outlet (12) is mounted at left and right sides of the bottom end of work box (4).
6. a kind of reflow soldering cooling device according to claim 1, it is characterised in that: rubber layer (17) setting
There are two, and rubber layer (17) is mounted on the protrusion surface of fixed link (15) and lower fixed link (16), and rubber in symmetrical expression
Layer (17) and upper fixed link (15) and lower fixed link (16) are in detachable connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910445515.5A CN110000445A (en) | 2019-05-27 | 2019-05-27 | A kind of reflow soldering cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910445515.5A CN110000445A (en) | 2019-05-27 | 2019-05-27 | A kind of reflow soldering cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110000445A true CN110000445A (en) | 2019-07-12 |
Family
ID=67177888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910445515.5A Pending CN110000445A (en) | 2019-05-27 | 2019-05-27 | A kind of reflow soldering cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110000445A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0679451A (en) * | 1992-09-02 | 1994-03-22 | Nippon Dennetsu Keiki Kk | Atomized flux collecting device |
| CN201969995U (en) * | 2010-11-08 | 2011-09-14 | 哈尔滨锅炉厂有限责任公司 | Water-cooled hot-wire tungsten electrode argon arc welding device for austenitic stainless steel pipe |
| CN205650981U (en) * | 2016-04-20 | 2016-10-19 | 张家港市华尊宝特种材料科技有限公司 | Welding cooling adjusting device |
| CN206614158U (en) * | 2017-03-27 | 2017-11-07 | 宁夏佳晶科技有限公司 | A kind of guided mode grows the cutter device of flaky sapphire |
| CN207386864U (en) * | 2017-11-04 | 2018-05-22 | 山东潍坊精鹰医疗器械有限公司 | Miller plate welds heat sink |
| CN208079518U (en) * | 2018-02-26 | 2018-11-09 | 江西吉为科技有限公司 | A kind of reflow soldering cooling device |
| KR20180126907A (en) * | 2017-05-19 | 2018-11-28 | 삼원동관 주식회사 | Cooling device of brazing |
| CN210080896U (en) * | 2019-05-27 | 2020-02-18 | 江苏优茂电子科技有限公司 | Cooling device for reflow soldering |
-
2019
- 2019-05-27 CN CN201910445515.5A patent/CN110000445A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0679451A (en) * | 1992-09-02 | 1994-03-22 | Nippon Dennetsu Keiki Kk | Atomized flux collecting device |
| CN201969995U (en) * | 2010-11-08 | 2011-09-14 | 哈尔滨锅炉厂有限责任公司 | Water-cooled hot-wire tungsten electrode argon arc welding device for austenitic stainless steel pipe |
| CN205650981U (en) * | 2016-04-20 | 2016-10-19 | 张家港市华尊宝特种材料科技有限公司 | Welding cooling adjusting device |
| CN206614158U (en) * | 2017-03-27 | 2017-11-07 | 宁夏佳晶科技有限公司 | A kind of guided mode grows the cutter device of flaky sapphire |
| KR20180126907A (en) * | 2017-05-19 | 2018-11-28 | 삼원동관 주식회사 | Cooling device of brazing |
| CN207386864U (en) * | 2017-11-04 | 2018-05-22 | 山东潍坊精鹰医疗器械有限公司 | Miller plate welds heat sink |
| CN208079518U (en) * | 2018-02-26 | 2018-11-09 | 江西吉为科技有限公司 | A kind of reflow soldering cooling device |
| CN210080896U (en) * | 2019-05-27 | 2020-02-18 | 江苏优茂电子科技有限公司 | Cooling device for reflow soldering |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190712 |