CN110000287B - Optimized forming system and method for rivet-free adhesive riveting connection - Google Patents
Optimized forming system and method for rivet-free adhesive riveting connection Download PDFInfo
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- CN110000287B CN110000287B CN201910236686.7A CN201910236686A CN110000287B CN 110000287 B CN110000287 B CN 110000287B CN 201910236686 A CN201910236686 A CN 201910236686A CN 110000287 B CN110000287 B CN 110000287B
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- 239000000853 adhesive Substances 0.000 title claims abstract description 162
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 162
- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000002407 reforming Methods 0.000 claims abstract description 137
- 238000010438 heat treatment Methods 0.000 claims abstract description 68
- 238000001816 cooling Methods 0.000 claims abstract description 53
- 238000000465 moulding Methods 0.000 claims abstract description 33
- 230000008569 process Effects 0.000 claims description 33
- 230000002093 peripheral effect Effects 0.000 claims description 20
- 238000007711 solidification Methods 0.000 claims description 15
- 230000008023 solidification Effects 0.000 claims description 15
- 238000012544 monitoring process Methods 0.000 claims description 13
- 238000004080 punching Methods 0.000 claims description 6
- 230000001276 controlling effect Effects 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000009467 reduction Effects 0.000 description 1
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- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
- B21D22/02—Stamping using rigid devices or tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Insertion Pins And Rivets (AREA)
Abstract
The invention discloses an optimized forming system and method for rivet-free adhesive riveting connection, wherein the system comprises a forming device, a reforming device and a manipulator positioned between the forming device and the reforming device; the molding device comprises a molding female die, a molding bottom fixing block and a molding male die; the molding female die and the molding male die are respectively positioned above and below the molding bottom fixing block; a temperature sensor and a heating electrode are arranged on the molding bottom fixing block, and a temperature sensor and a cooling pipeline are arranged on the molding male die; the reshaping device comprises a blank holder, a reshaping female die, a reshaping bottom fixing block and a reshaping male die; the blank holder and the reforming female die are positioned above the reforming bottom fixing block, and the reforming male die is positioned below the reforming bottom fixing block; the reforming bottom fixing block is provided with a temperature sensor and a cooling pipeline, and the reforming male die and the reforming female die are respectively provided with a temperature sensor and a heating electrode. The system can increase the thickness value and the self-locking value of the adhesive rivet joint and reduce the protruding height of the adhesive rivet joint.
Description
Technical Field
The invention relates to the field of rivetless stamping dies, in particular to an optimized forming system and method for rivetless adhesive riveting connection.
Background
The rapid development of the transportation industry brings huge pressure to the aspects of energy and environment, and the weight of the vehicle can be reduced by utilizing a light weight technology, so that the purposes of energy conservation, emission reduction and environmental protection are achieved. The method of partially replacing the traditional steel plate by light materials such as aluminum, magnesium alloy and the like has become an important means for realizing light weight, and how to realize the connection between dissimilar metals is an important difficulty in light weight research.
The traditional rivet-free riveting is a technology for connecting the plates together by locally deforming the plates by using stamping force, and has the advantages of low cost, high efficiency, simple working procedure and the like. In addition, it has an advantage that it does not damage the surface of the work piece and does not generate hard brittle intermetallic compounds, compared to welding. However, the rivet-free riveted joint between dissimilar metals has the same defects of easy electrochemical corrosion, abrupt brittle fracture and the like.
The adhesive riveting composite connection technology is to rivet glued plates, separate the plates by taking an adhesive layer as an insulating material, has good corrosion resistance and connection fixing effect, is an important connection mode for lightening the vehicle body, and has the following two main technological routes: 1. pretreatment of bonding surfaces of upper and lower metal plates, bonding of the upper and lower metal plates, complete solidification of adhesive in bonding areas, and riveting of the upper and lower metal plates; 2. the method comprises the steps of pretreatment of bonding surfaces of upper and lower metal plates, bonding of the bonding areas, curing of the adhesive to a certain extent, riveting of the upper and lower metal plates, and complete curing of the adhesive at the rivet joint. Test data show that the adhesive is riveted before being completely cured, so that the excellent mechanical property of the adhesive rivet joint can be obtained, and the adhesive rivet connection between metal plates is carried out by adopting a 2 nd process route in actual production.
The strength of the existing rivet-free adhesive riveting connection is mainly limited by the thickness value and the self-locking value of the neck after the rivet-free adhesive riveting connection is formed, and the protruding height of the joint has higher requirements on the assembly clearance between parts, so that the application range of the rivet-free adhesive riveting connection process is limited. In addition, in the whole forming process of the adhesive riveting connection, the state of the adhesive in the joint and the peripheral area directly influences the mechanical property of the adhesive riveting joint. If the adhesive is completely cured, the adhesive layer can be torn during riveting; if the curing degree of the adhesive is low, the adhesive can be extruded during riveting, so that no adhesive layer or few adhesive layers exist in the adhesive-rivet joint. The strength and reliability of the adhesive rivet joint can be reduced due to the two phenomena, so that the curing degree of the adhesive during riveting needs to be properly selected, and the adhesive in the adhesive rivet joint can still meet the process requirements after being formed.
Therefore, it is necessary to provide an optimized forming method for the rivetless adhesive riveting connection, which can further increase the neck thickness and the self-locking value of the rivetless adhesive riveting joint and reduce the protruding height of the adhesive riveting joint by reasonably controlling the forming process of the rivetless adhesive riveting connection and the state of the adhesive in the joint and the peripheral area during forming.
Disclosure of Invention
In order to solve the defects in the prior art, the main purpose of the invention is to provide an optimized forming system and method for rivet-free adhesive riveting connection. The system solves the problems that the neck thickness and the self-locking value of the existing rivet-free adhesive rivet joint are smaller, the protruding height of the joint is larger, and the process application range is limited; in addition, the method reasonably controls the states of the adhesive in the joint and the peripheral area in the molding and reforming process, and can solve the problem that the adhesive layer is easy to tear and can not be used in the traditional adhesive-riveting connection technology.
In order to achieve the above object, in a first aspect, the present invention provides an optimized forming system for rivet-free adhesive-rivet connection, comprising a forming device, a reforming device and a manipulator; the manipulator is positioned between the forming device and the reforming device;
the molding device comprises a molding female die, a molding bottom fixing block and a molding male die; the forming bottom fixing block is provided with an opening, and the forming female die and the forming male die are respectively positioned above and below the forming bottom fixing block; the temperature sensor and the heating electrode are arranged on the forming bottom fixing block, and the temperature sensor and the cooling pipeline are arranged on the forming male die;
the reshaping device comprises a blank holder, a reshaping female die, a reshaping bottom fixing block and a reshaping male die; the reshaping bottom fixing block is provided with an opening, the blank holder and the reshaping female die are positioned above the reshaping bottom fixing block, and the reshaping male die is positioned below the reshaping bottom fixing block; the temperature sensor and the cooling pipeline are arranged on the reforming bottom fixing block, and the temperature sensor and the heating electrode are respectively arranged on the reforming male die and the reforming female die.
As a preferred embodiment, the periphery of the molding bottom fixing block is provided with a heating electrode through hole for installing the heating electrode, and the upper surface of the molding bottom fixing block is provided with a groove for placing the temperature sensor.
As a preferred embodiment, a groove for placing the temperature sensor is formed in the side wall, close to the top, of the forming male die, and a cooling pipeline through hole for installing the cooling pipeline is formed in the top of the forming male die.
As a preferred embodiment, the upper surface of the reformed bottom fixture block is provided with a groove for placing the temperature sensor, the groove being arranged in the vicinity of the opening; and a cooling pipeline through hole for installing the cooling pipeline is formed in the reforming bottom fixing block.
As a preferred embodiment, a groove for placing the temperature sensor is formed in the side wall, close to the bottom, of the reforming female die, and a heating electrode through hole for installing the heating electrode is formed in the bottom of the reforming female die.
As a preferred embodiment, a groove for placing the temperature sensor is formed in the side wall, close to the top, of the reforming male die, and a heating electrode through hole for installing the heating electrode is formed in the top of the reforming male die.
In a second aspect, the invention provides an optimized forming method of a rivet-free adhesive-riveting connection based on the system, which comprises the following steps:
s1, fixing an upper plate and a lower plate coated with an adhesive on the forming device, heating and cooling the upper plate and the lower plate to solidify the adhesive in the areas on two sides of the upper plate and the lower plate and uncured adhesive in the middle area, and forming the upper plate and the lower plate to obtain a formed adhesive rivet joint; wherein the adhesive rivet joint comprises a peripheral area and a convex part;
s2, transferring the adhesive rivet joint to the reshaping device;
and S3, fixing the adhesive rivet joint on the reshaping device, carrying out reshaping treatment on the adhesive rivet joint, and carrying out heating and cooling treatment on the reshaped adhesive rivet joint to realize solidification of the adhesive of the bulge part of the reshaped adhesive rivet joint.
As a preferred embodiment, the step S1 specifically includes:
fixing the upper plate and the lower plate coated with the adhesive on the forming bottom fixing block, driving the forming female die to move towards the forming bottom fixing block until the forming female die contacts with the upper plate, and driving the forming male die to move towards the forming bottom fixing block until the forming male die contacts with the lower plate;
controlling heating electrodes on the forming bottom fixed block to heat the two side areas of the upper plate and the lower plate, simultaneously controlling cooling pipelines on the forming male die to cool the middle areas of the upper plate and the lower plate, monitoring temperature changes in the heating and cooling processes in real time, and realizing solidification of adhesives in the two side areas of the upper plate and the lower plate and solidification of adhesives in the middle area;
and driving the forming male die to move upwards, and simultaneously monitoring the position of the forming male die in the moving process in real time to obtain a formed adhesive rivet joint, wherein the adhesive rivet joint comprises a peripheral area and a protruding part.
As a preferred embodiment, the step S3 specifically includes:
driving the reforming male die to move towards the reforming bottom fixed block until reaching a preset surface distance;
driving the blank holder to move so as to fix the adhesive rivet joint;
driving the reforming female die to move until the lower surface of the reforming female die contacts with the adhesive rivet joint;
punching the adhesive rivet joint, and simultaneously monitoring the pressure applied to the reforming female die and the reforming male die and the positions of the reforming female die and the reforming male die in the punching process in real time to finish reforming of the adhesive rivet joint and obtain a reformed adhesive rivet joint;
and controlling heating electrodes on the reforming male die and the reforming female die to heat the convex parts of the reformed adhesive rivet joint, simultaneously controlling a cooling pipeline on the reforming bottom fixing block to cool the peripheral area of the reformed adhesive rivet joint, and monitoring temperature changes in the heating and cooling processes in real time to realize solidification of the adhesive of the convex parts of the reformed adhesive rivet joint.
The beneficial effects that above-mentioned technical scheme brought lie in:
1. the system can change the shape of the rivet-free adhesive rivet joint, increase the neck thickness value and the self-locking value of the rivet-free adhesive rivet joint, and improve the connection strength of the adhesive rivet joint;
2. the system can reduce the protruding height of the rivet-free adhesive rivet joint and enlarge the application range of the rivet-free adhesive rivet process;
3. the system ensures that the performance of each reshaped adhesive rivet joint is kept consistent, and is suitable for mass production;
4. according to the system, the heating electrode, the cooling pipeline and the temperature sensor are arranged on the forming device and the reforming device, so that the states of the adhesive in the joint and the peripheral area are further controlled by controlling the heating electrode, the cooling pipeline and the temperature sensor in the optimal forming process of the adhesive joint, and the problem that the adhesive layer is easy to tear and cannot be used in the traditional adhesive-riveting connection technology can be solved;
5. the method can adjust the relative position between the dies in real time or keep constant stamping force by adopting a model predictive control algorithm, breaks down the dynamic reshaping process into a plurality of sub-stamping processes, avoids damage to the adhesive rivet joint caused by one-time rapid stamping, prevents the plate from cracking, and improves the integrity and the connection strength of the joint.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a full section view of a front view of an optimized forming system for a rivetless tack connection provided by the present invention;
FIG. 2 is a top view of a molded bottom fixture block provided by the present invention;
FIG. 3 is a top view of a reshaped bottom anchor block provided by the present invention;
FIG. 4 is a schematic view showing a state that a bonded sheet is placed on a molded bottom fixing block according to the present invention;
fig. 5 is a schematic diagram showing a state that a forming female die is contacted with an upper plate and a forming male die is contacted with a lower plate;
FIG. 6 is a schematic view showing the state of the adhesive rivet joint when the forming is completed;
FIG. 7 is a schematic view of a formed rivet joint according to the present invention;
FIG. 8 is a schematic view showing the placement of the formed adhesive rivet joint provided by the invention on the reformed bottom fixed block;
FIG. 9 is a schematic view of a reforming male provided by the present invention moving toward a reforming bottom fixture and reaching a predetermined surface distance;
fig. 10 is a schematic view of a state of the blank holder provided by the invention when contacting with a rivet joint;
FIG. 11 is a schematic view showing a state of the reforming die provided by the invention when the reforming die is contacted with the adhesive rivet joint;
fig. 12 is a schematic view showing a state that a reforming male die is separated from a reformed cohesive rivet joint and a reforming female die is separated from a reformed cohesive rivet joint.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "X-axis," "Y-axis," "Z-axis," "vertical," "parallel," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Example 1
An optimized forming system 100 for a rivet-free rivet-to-rivet connection, see fig. 1, the system 100 comprising a forming device, a reforming device and a robot 11; the manipulator 11 is located between the forming device and the reforming device and is used for transferring the formed adhesive rivet joint to the reforming device; the molding device comprises a molding female die 1, a molding bottom fixing block 2 and a molding male die 3; the forming bottom fixed block 2 is provided with an opening, the forming female die 1 is positioned above the forming bottom fixed block 2, and the forming male die 3 is positioned below the forming bottom fixed block 2; the forming bottom fixed block 2 is provided with a temperature sensor 5 and a heating electrode 4, and the forming male die 3 is provided with a temperature sensor 6 and a cooling pipeline 7;
the reforming device comprises a blank holder 13, a reforming female die 12, a reforming bottom fixing block 14 and a reforming male die 15; the reforming bottom fixed block 14 is provided with an opening, the blank holder 13 and the reforming female die 12 are positioned above the reforming bottom fixed block 14, and the reforming male die 15 is positioned below the reforming bottom fixed block 14; the reforming bottom fixed block 14 is provided with a temperature sensor 19 and a cooling pipeline 18, the reforming male die 15 is provided with a temperature sensor 17 and a heating electrode 16, and the reforming female die 12 is provided with a temperature sensor 20 and a heating electrode 21.
Specifically, in this embodiment, the driving device is a motor; in the forming device, a forming female die 1, a forming bottom fixed block 2 and a forming male die 3 are sequentially arranged up and down, and the axes of the forming female die 1, the forming bottom fixed block 2 and the forming male die 3 are overlapped, so that the arrangement mode is beneficial to saving the forming time of the adhesive rivet joint; correspondingly, in the reforming device, the blank holder 13 is sleeved outside the reforming female die 12, the blank holder 13, the reforming female die 12, the reforming bottom fixing block 14 and the reforming male die 15 are sequentially arranged up and down and the axes of the two are coincident, and the arrangement mode is beneficial to saving the reforming time of the adhesive rivet joint.
When the adhesive rivet joint is formed, the driving device drives the forming female die 1 to move towards the forming bottom fixing block 2, when the forming female die 1 is in contact with the upper surface of the upper plate 8, the forming female die 1 stops moving, meanwhile, the driving device drives the forming male die 3 to move towards the forming bottom fixing block 2, and when the forming male die 3 is in contact with the lower surface of the lower plate 10, the forming male die 3 stops moving. And then, the heating electrode 4 on the bottom fixing block 2 is formed to heat the two side areas of the upper plate 8 and the lower plate 10, and the cooling pipeline 7 on the forming male die 3 is formed to cool the middle areas of the upper plate 8 and the lower plate 10, so that the subsequent further reforming is facilitated.
Wherein, the forming die 1 is of a rotationally symmetrical structure, and a cavity is arranged in the forming die. The forming bottom fixing block 2 is of a cuboid structure, referring to fig. 2, heating electrode through holes for installing the heating electrodes 4 are formed in the periphery of the forming bottom fixing block 2, preferably, the number of the heating electrode through holes is four, and the four heating electrode through holes are arranged in the periphery of the forming bottom fixing block 2, so that the curing speed of the adhesive 9 in the areas at two sides of the upper plate 8 and the lower plate 10 can be increased; in addition, grooves for placing the temperature sensors 5 are provided on the upper surface of the molding bottom fixing block 2, and preferably, the number of grooves is four, and the four grooves are uniformly arranged at positions far from the opening of the molding bottom fixing block 2.
In addition, in this embodiment, the entire structure of the molding punch 3 resembles a cylinder, and the upper surface thereof is non-planar. Grooves for placing the temperature sensors 6 are formed in the side wall, close to the top, of the forming male die 3, and preferably, the number of the grooves is four, and the four grooves are uniformly distributed along the circumferential direction of the forming male die 3; in addition, a cooling pipeline through hole for installing a cooling pipeline 7 is arranged in the center of the top of the forming male die 3, and cooling liquid nitrogen is filled in the cooling pipeline 7.
In the forming process of the upper plate 8 and the lower plate 10, the areas at the two sides of the upper plate 8 and the lower plate 10 can be heated through the heating electrode 4 on the forming bottom fixing block 2 according to actual demands, meanwhile, the middle areas of the upper plate 8 and the lower plate 10 are cooled through the cooling pipeline 7 on the forming male die 3, the adhesive 9 in the areas at the two sides is ensured to be completely solidified before being formed, and meanwhile, the adhesive 9 in the middle area is sealed, so that the upper plate 8 and the lower plate 10 are subjected to forming treatment, and a cohesive rivet joint can be obtained, wherein the cohesive rivet joint comprises a peripheral area and a protruding portion. The peripheral area is composed of two side areas of the upper plate 8 and the lower plate 10 and an adhesive 9 positioned in the two side areas, and the convex part is composed of a middle area of the upper plate 8 and the lower plate 10 and the adhesive 9 positioned in the middle area.
When the adhesive rivet joint is in reshaping work, the driving device drives the reshaping male die 15 to move in the direction of the reshaping bottom fixing block 14, and when the distance between the upper surface of the reshaping male die 15 and the upper surface of the reshaping bottom fixing block 14 is equal to the depth of a cavity of the adhesive rivet joint, the movement is stopped; the driving device drives the blank holder 13 to move along the axis of the blank holder to the direction of the reforming bottom fixed block 14 until the blank holder contacts with the upper surface of the sticky riveting head, and then drives the reforming female die 12 to move to the direction of the reforming bottom fixed block 14 until the lower surface of the blank holder contacts with the upper surface of the sticky riveting head; subsequently, the adhesive rivet joint is punched to complete the reshaping, and finally, the heating electrode 21 on the reshaping female die 12 and the heating electrode 16 on the reshaping male die 15 heat the convex part of the reshaped adhesive rivet joint, and meanwhile, the cooling pipeline 18 on the reshaping bottom fixing block 14 cools the peripheral area of the reshaped adhesive rivet joint, so that the adhesive of the convex part is solidified while the adhesive of the peripheral area is not solidified.
The blank holder 13 is in a rotationally symmetrical structure and is integrally in a cylindrical shape, the inner diameter of the inner side wall of the blank holder is slightly larger than the diameter of the protruding part of the adhesive rivet joint before reshaping, and the reserved space is used for deformation of the protruding part of the adhesive rivet joint in the reshaping process.
In addition, the overall structure of the reforming die 12 resembles a cylinder with a non-planar lower surface. Grooves for placing the temperature sensors 20 are formed in the side wall, close to the bottom, of the reforming female die 12, and preferably, the number of the grooves is four, and the four grooves are uniformly distributed along the circumferential direction of the reforming female die 12; in addition, the bottom of the reforming die 12 is provided with a heating electrode through hole for mounting the heating electrode 21. The number of the heating electrode through holes is two, and the two heating electrode through holes are radially formed along the reforming female die 12.
The upper surface of the reforming bottom fixing block 14 is provided with grooves for placing the temperature sensor 19, see fig. 3, and the grooves are arranged near the openings of the reforming bottom fixing block 14, which is beneficial to improving the monitoring accuracy in the heating and cooling processes of the adhesive rivet joint. Inside the reforming bottom fixing block 14, there are provided cooling pipe through holes for installing the cooling pipes 18, preferably two in number, and cooling liquid nitrogen is contained in the cooling pipes 18.
Similarly, in the present embodiment, the overall structure of the reforming male 15 is similar to a cylinder, and the upper surface thereof is non-planar, corresponding to the reforming female 12. Grooves for placing the temperature sensors 17 are formed in the side wall, close to the top, of the reforming male die 15, preferably four grooves, and the four grooves are uniformly distributed along the circumferential direction of the reforming male die 15; further, a heating electrode through hole for mounting the heating electrode 16 is provided at the top of the reforming male 15. The number of the heating electrode through holes is two, and the two heating electrode through holes are formed along the radial direction of the reforming male die 15.
After the adhesive rivet joint is reformed, the raised part of the reformed adhesive rivet joint can be heated by the heating electrode 21 on the reforming female die 12 and the heating electrode 16 on the reforming male die 15 according to actual demands, and the peripheral area of the reformed adhesive rivet joint is cooled by the cooling pipeline 18 on the reforming bottom fixing block 14, in addition, in the heating and cooling process, the temperature change is monitored in real time by the temperature sensor 19 arranged on the reforming bottom fixing block 14, the temperature sensor 20 on the reforming female die 12 and the temperature sensor 17 on the reforming male die 15, so that an effective closed loop system is formed.
Example two
The method for optimizing and forming the adhesive rivet joint by adopting the system 100 comprises the following steps:
s1, fixing an upper plate 8 and a lower plate 10 coated with an adhesive on a forming device, heating and cooling the upper plate 8 and the lower plate 10 to realize solidification of the adhesive 9 in the areas at two sides of the upper plate 8 and the lower plate 10 and non-solidification of the adhesive 9 in the middle area, and forming the upper plate 8 and the lower plate 10 to obtain a formed adhesive rivet joint; the adhesive rivet joint comprises a peripheral area and a convex part.
The method specifically comprises the following steps:
s11, fixing the upper plate 8 and the lower plate 10 coated with the adhesive on the forming bottom fixing block 2, driving the forming female die 1 to move towards the forming bottom fixing block 2 until the forming female die 1 contacts with the upper plate 8, and driving the forming male die 3 to move towards the forming bottom fixing block 2 until the forming male die 3 contacts with the lower plate 10.
Referring to fig. 4, an upper plate 8 and a lower plate 10 coated with an adhesive 9 are placed on a molding bottom fixed block 2, and a molding female die 1 is driven to move towards the molding bottom fixed block 2 until the lower surface of the molding female die contacts with the upper surface of the upper plate 8. When the lower surface of the forming die 1 is contacted with the upper surface of the upper plate 8, the forming die 1 is driven to slightly move downwards, and a certain blank holder force is applied to the upper plate 8 and the lower plate 10.
Subsequently, the forming punch 3 is driven to move toward the forming bottom fixing block 2 until its upper surface contacts the lower surface of the lower plate 10, see fig. 5 in particular. Thereby, the upper plate 8 and the lower plate 10 have been completely fixed to the forming device.
S12, controlling the heating electrodes 4 on the forming bottom fixing blocks 2 to heat the two side areas of the upper plate 8 and the lower plate 10, simultaneously controlling the cooling pipelines 7 on the forming male die 3 to cool the middle areas of the upper plate 8 and the lower plate 10, monitoring temperature changes in the heating and cooling processes in real time, and realizing solidification of the adhesive 9 in the two side areas of the upper plate 8 and the lower plate 10 and non-solidification of the adhesive 9 in the middle area.
Specifically, after the upper plate 8 and the lower plate 10 are fixed, the heating electrodes 4 on the forming bottom fixing blocks 2 are controlled to heat the two side areas of the upper plate 8 and the lower plate 10, meanwhile, the cooling pipelines 7 on the forming male die 3 are controlled to cool the middle areas of the upper plate 8 and the lower plate 10, the temperature change in the heating and cooling processes is monitored in real time, and the speed in the heating and cooling processes is regulated in real time by using a model predictive control algorithm, so that the adhesive 9 in the two side areas is completely solidified before forming, and the adhesive 9 in the middle area is sealed.
S13, driving the forming male die 3 to move upwards, and simultaneously monitoring the position of the forming male die 3 in the moving process in real time to obtain a formed adhesive rivet joint, wherein the adhesive rivet joint comprises a peripheral area and a protruding portion.
Specifically, the forming male die 3 is driven to move towards the forming bottom fixing block 2, the forming male die 3 passes through an opening on the forming bottom fixing block 2 to be in contact with the lower plate 10, when reaching a preset position, the forming male die 3 stops moving, so that the forming of the upper plate 8 and the lower plate 10 is completed, specifically referring to fig. 6, and further, the formed adhesive rivet joint shown in fig. 7 is obtained.
S2, transferring the adhesive rivet joint to a reshaping device.
Specifically, referring to fig. 8, the robot 11 transfers the rivet joint from the forming device to the reforming device while ensuring that the cavity of the rivet joint is on the same axis as the opening of the reforming bottom fixture 14.
And S3, fixing the adhesive rivet joint on a reshaping device, carrying out reshaping treatment on the adhesive rivet joint, and carrying out heating and cooling treatment on the adhesive rivet joint after reshaping treatment to realize solidification of the adhesive 9 of the protruding part of the adhesive rivet joint after reshaping treatment.
The method specifically comprises the following steps:
and S31, driving the reforming male die 15 to move towards the reforming bottom fixed block 14 until reaching a preset surface distance.
Referring to fig. 7 and 9, the reforming male 15 is driven to move toward the reforming bottom fixing block 14, and stops moving when the distance between the upper surface thereof and the upper surface of the reforming bottom fixing block 14 is equal to the cavity depth H of the post-formation rivet joint.
S32, driving the blank holder 13 to move so that the adhesive rivet joint is fixed.
Specifically, referring to fig. 10, the edge pressing ring 13 is driven to move toward the reformed bottom fixing block 14, and slightly moves downward after the lower surface thereof contacts with the upper surface of the upper plate 8, so as to apply a certain edge pressing force to the plate.
S33, driving the reforming female die 12 to move until the lower surface of the reforming female die contacts with the adhesive rivet joint.
Specifically, referring to fig. 11, the reforming female die 12 is driven to move toward the reforming bottom fixing block 14, and stops moving when the lower surface thereof contacts the rivet joint boss.
And S34, punching the adhesive rivet joint, and simultaneously monitoring the pressure applied to the reshaping female die 12 and the reshaping male die 15 and the positions of the reshaping female die and the reshaping male die in the punching process in real time to finish reshaping of the adhesive rivet joint and obtain the reshaped adhesive rivet joint.
The dynamic reforming process is decomposed into a plurality of sub-stamping processes by using a model predictive control algorithm, so that the reforming female die 12 and the reforming male die 15 slowly move downwards under the drive of a servo device. In the whole process, real-time feedback is carried out through pressure sensors and displacement sensors which are arranged on the reforming female die 12 and the reforming male die 15, and the position difference of the reforming female die 12 and the reforming male die 15 is always controlled within a certain range. When the reforming female die 12 and the reforming male die 15 reach the preset positions, the movement is stopped, the reforming process of the adhesive rivet joint is completed, and the adhesive rivet joint after reforming is obtained.
S35, controlling the heating electrode 21 and the heating electrode 16 on the reforming female die 12 and the reforming male die 15 to heat the convex part of the reformed adhesive rivet joint, simultaneously controlling the cooling pipeline 18 on the reforming bottom fixing block 14 to cool the peripheral area of the reformed adhesive rivet joint, monitoring the temperature change in the heating and cooling processes in real time, and realizing the solidification of the adhesive 9 of the convex part of the reformed adhesive rivet joint.
Specifically, the raised part of the adhesive rivet joint after the reshaping is heated by the heating electrode 21 on the reshaping female die 12 and the heating electrode 16 on the reshaping male die 15, the peripheral area of the adhesive rivet joint after the reshaping is cooled by the cooling pipeline 18 on the reshaping bottom fixing block 14, and meanwhile, the temperature change of the adhesive rivet joint is fed back in real time by the temperature sensor 17 on the reshaping male die 15, the temperature sensor 19 on the reshaping bottom fixing block 14 and the temperature sensor 20 on the reshaping female die 12, and the heating and cooling rates are regulated in real time by a model predictive control algorithm, so that the adhesive 9 in the raised part of the adhesive rivet joint after the reshaping can be completely solidified, and the adhesive 9 in the peripheral area of the adhesive rivet joint after the reshaping is not excessively solidified.
After step S35, referring specifically to fig. 12, the driving device drives the reforming male die 15 and the reforming female die 12 to move downward and upward respectively until the reforming male die and the reforming female die are separated from the reformed adhesive rivet joint, and finally, the reformed adhesive rivet joint is obtained.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (9)
1. An optimized forming system for rivet-free adhesive riveting connection is characterized by comprising a forming device, a reforming device and a manipulator; the manipulator is positioned between the forming device and the reforming device;
the molding device comprises a molding female die, a molding bottom fixing block and a molding male die; the forming bottom fixing block is provided with an opening, and the forming female die and the forming male die are respectively positioned above and below the forming bottom fixing block; the forming bottom fixing block is provided with a temperature sensor and a heating electrode, and the forming male die is provided with a temperature sensor and a cooling pipeline;
the reshaping device comprises a blank holder, a reshaping female die, a reshaping bottom fixing block and a reshaping male die; the reshaping bottom fixing block is provided with an opening, the blank holder and the reshaping female die are positioned above the reshaping bottom fixing block, and the reshaping male die is positioned below the reshaping bottom fixing block; the reforming bottom fixing block is provided with a temperature sensor and a cooling pipeline, and the reforming male die and the reforming female die are respectively provided with a temperature sensor and a heating electrode.
2. The system of claim 1, wherein the molded bottom fixture block is provided with heating electrode through holes around for mounting the heating electrodes, and the upper surface of the molded bottom fixture block is provided with grooves for placing the temperature sensors.
3. The system of claim 1, wherein a groove for placing the temperature sensor is provided on a side wall of the molding punch near the top, and a cooling pipe through hole for installing the cooling pipe is provided on the top of the molding punch.
4. A system according to any one of claims 1 to 3, wherein the upper surface of the reshaped bottom block is provided with a recess for the placement of the temperature sensor, the recess being arranged near the opening; and a cooling pipeline through hole for installing the cooling pipeline is formed in the reforming bottom fixing block.
5. A system according to any one of claims 1 to 3, wherein a groove for placing the temperature sensor is formed in a side wall of the reforming die close to the bottom, and a heating electrode through hole for installing the heating electrode is formed in the bottom of the reforming die.
6. A system according to any one of claims 1 to 3, wherein a groove for placing the temperature sensor is formed in a side wall of the reforming male die close to the top, and a heating electrode through hole for installing the heating electrode is formed in the top of the reforming male die.
7. The method for optimizing forming of rivet-free adhesive rivet connection of any one of the systems according to claims 1 to 6, characterized in that the method comprises the following steps:
s1, fixing an upper plate and a lower plate coated with an adhesive on the forming device, heating and cooling the upper plate and the lower plate to solidify the adhesive in the areas on two sides of the upper plate and the lower plate and uncured adhesive in the middle area, and forming the upper plate and the lower plate to obtain a formed adhesive rivet joint; wherein the adhesive rivet joint comprises a peripheral area and a convex part;
s2, transferring the adhesive rivet joint to the reshaping device;
and S3, fixing the adhesive rivet joint on the reshaping device, carrying out reshaping treatment on the adhesive rivet joint, and carrying out heating and cooling treatment on the reshaped adhesive rivet joint to realize solidification of the adhesive of the bulge part of the reshaped adhesive rivet joint.
8. The method according to claim 7, wherein the step S1 specifically includes:
fixing the upper plate and the lower plate coated with the adhesive on the forming bottom fixing block, driving the forming female die to move towards the forming bottom fixing block until the forming female die contacts with the upper plate, and driving the forming male die to move towards the forming bottom fixing block until the forming male die contacts with the lower plate;
controlling heating electrodes on the forming bottom fixed block to heat the two side areas of the upper plate and the lower plate, simultaneously controlling cooling pipelines on the forming male die to cool the middle areas of the upper plate and the lower plate, monitoring temperature changes in the heating and cooling processes in real time, and realizing solidification of adhesives in the two side areas of the upper plate and the lower plate and solidification of adhesives in the middle area;
and driving the forming male die to move upwards, and simultaneously monitoring the position of the forming male die in the moving process in real time to obtain a formed adhesive rivet joint, wherein the adhesive rivet joint comprises a peripheral area and a protruding part.
9. The method according to claim 7, wherein the step S3 specifically includes:
driving the reforming male die to move towards the reforming bottom fixing block until the distance between the upper surface of the reforming male die and the upper surface of the reforming bottom fixing block is equal to the depth of a cavity of the formed adhesive rivet joint;
driving the blank holder to move so as to fix the adhesive rivet joint;
driving the reforming female die to move until the lower surface of the reforming female die contacts with the adhesive rivet joint;
punching the adhesive rivet joint, and simultaneously monitoring the pressure applied to the reforming female die and the reforming male die and the positions of the reforming female die and the reforming male die in the punching process in real time to finish reforming of the adhesive rivet joint and obtain a reformed adhesive rivet joint;
and controlling heating electrodes on the reforming male die and the reforming female die to heat the convex parts of the reformed adhesive rivet joint, simultaneously controlling a cooling pipeline on the reforming bottom fixing block to cool the peripheral area of the reformed adhesive rivet joint, and monitoring temperature changes in the heating and cooling processes in real time to realize solidification of the adhesive of the convex parts of the reformed adhesive rivet joint.
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| CN111079257B (en) * | 2019-11-18 | 2023-05-02 | 中国第一汽车股份有限公司 | Modeling and simulation method for hot-melt self-tapping riveting joint |
| CN112733393B (en) * | 2020-11-27 | 2023-06-20 | 长春工业大学 | Method for optimizing performance of rivet-free riveting joint of metal heterogeneous plate |
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