CN109994660B - Rechargeable battery with improved circuit unit - Google Patents
Rechargeable battery with improved circuit unit Download PDFInfo
- Publication number
- CN109994660B CN109994660B CN201910197861.6A CN201910197861A CN109994660B CN 109994660 B CN109994660 B CN 109994660B CN 201910197861 A CN201910197861 A CN 201910197861A CN 109994660 B CN109994660 B CN 109994660B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- plating layer
- gold plating
- housing
- board assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000007747 plating Methods 0.000 claims abstract description 80
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 76
- 239000010931 gold Substances 0.000 claims abstract description 76
- 229910052737 gold Inorganic materials 0.000 claims abstract description 76
- 239000007769 metal material Substances 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
- H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
- H01M10/488—Cells or batteries combined with indicating means for external visualization of the condition, e.g. by change of colour or of light density
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
- H01M2010/4271—Battery management systems including electronic circuits, e.g. control of current or voltage to keep battery in healthy state, cell balancing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
- H01M2010/4278—Systems for data transfer from batteries, e.g. transfer of battery parameters to a controller, data transferred between battery controller and main controller
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Battery Mounting, Suspending (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
A rechargeable battery having an improved circuit unit includes a housing and a circuit board assembly. The housing is made of a metal material and has a receiving cavity having an opening. The circuit board assembly is disposed in the receiving cavity and includes a circuit board and an electronic component disposed on the circuit board. The circuit board includes a base portion, a conductive layer, and a gold plating layer. The conductive layer partially covers the outer surface of the base body part; the gold plating layer covers the outer surface of the conductive layer, and the gold plating layer is used for abutting against the inner surface of the shell to conduct electricity. According to the rechargeable battery, the outer surface of the conductive layer is covered with the gold plating layer, so that the oxidation of the circuit board can be prevented, the conductive performance of the circuit board can be improved, the heat dissipation effect of the circuit board can be improved, and meanwhile, the reliability of welding the circuit board and other electronic components can be improved.
Description
Technical Field
The present invention relates to the field of battery technology, and more particularly to a rechargeable battery having an improved circuit unit.
Background
In recent years, rechargeable batteries have been widely used in various portable electric and electronic devices, such as toys, hand-held device lamps, which place increasing demands on the rechargeable battery energy storage. In particular, lithium ion rechargeable batteries are increasingly used in the above fields because of their high energy, high power discharge, environmental protection, and the like.
Existing rechargeable batteries include a housing, a battery cell and a circuit board assembly disposed within the housing, and the like. The metal conductive layer of the circuit board assembly is used for contacting with the inner surface of the shell to conduct electricity. However, the conductive layer is usually made of copper material, which is easily oxidized, resulting in reduced electrical and thermal conductivity, affecting the performance of the rechargeable battery and reducing the user experience.
Accordingly, there is a need to provide a rechargeable battery with an improved circuit unit to at least partially solve the above-mentioned problems.
Disclosure of Invention
In the summary, a series of concepts in a simplified form are introduced, which will be further described in detail in the detailed description. The summary of the invention is not intended to define the key features and essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
To at least partially solve the above problems, the present invention discloses a rechargeable battery having an improved circuit unit, comprising:
a housing made of a metal material and having a receiving cavity having an opening; and
the circuit board subassembly, the circuit board subassembly sets up hold the chamber, the circuit board subassembly includes the circuit board and sets up electronic component on the circuit board, the circuit board includes:
a base portion;
a conductive layer partially covering an outer surface of the base portion; and
and the gold plating layer is covered on the outer surface of the conductive layer and is used for abutting against the inner surface of the shell to conduct electricity.
According to the rechargeable battery, the outer surface of the conductive layer is covered with the gold plating layer, so that the oxidation of the circuit board can be prevented, the conductive performance of the circuit board can be improved, the heat dissipation effect of the circuit board can be improved, and meanwhile, the reliability of welding the circuit board and other electronic components can be improved.
Optionally, the gold plating layer is located at an outer peripheral edge of the base portion.
Optionally, the gold plating layers include a first gold plating layer located on an upper surface of the base portion, a second gold plating layer located on a lower surface of the base portion, and a third gold plating layer located on a side surface of the base portion, a top end of the third gold plating layer is connected to the first gold plating layer, and a bottom end of the third gold plating layer is connected to the second gold plating layer.
Optionally, the base portion has a through hole extending from an upper surface to a lower surface of the base portion, the gold plating layer includes a fourth gold plating layer, the conductive layer and the fourth gold plating layer completely cover an inner surface of the through hole, and the fourth gold plating layer is located outside the conductive layer.
Optionally, the conductive layer is made of a copper material; and/or
The gold plating layer is made of gold material.
Optionally, the housing has a wire tying portion for supporting the circuit board assembly, the wire tying portion is configured to be recessed inward from an outer surface of the housing, and a surface of the wire tying portion for supporting the circuit board assembly is a plane.
Optionally, the inner surface of the housing is provided with a nickel plating layer against which the gold plating layer abuts in a state in which the circuit board assembly is mounted in the housing.
Optionally, the rechargeable battery further comprises an insulating ring extending through the opening and captured between the housing, the electrode cap and the circuit board assembly for securing the circuit board assembly and spacing the housing and the electrode cap apart.
Optionally, the rechargeable battery further comprises a battery core and a conductive substrate, wherein the battery core and the conductive substrate are arranged in the accommodating cavity and are located below the circuit board assembly, and the battery core is electrically connected with the circuit board assembly through the conductive substrate.
Optionally, the rechargeable battery further includes an electrode cap disposed over the circuit board assembly to cover the opening, the electrode cap being electrically connected to the circuit board assembly, the electrode cap and the housing having opposite polarities.
Drawings
The following drawings of embodiments of the present invention are included as part of the invention. Embodiments of the present invention and their description are shown in the drawings to explain the principles of the invention. In the drawings of which there are shown,
fig. 1 is an exploded perspective view of a rechargeable battery according to a preferred embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the rechargeable battery of FIG. 1;
FIG. 3 is a schematic view of the partial structure of FIG. 2;
FIG. 4 is an enlarged partial schematic view at A in FIG. 2; and
fig. 5 is a schematic plan view of the circuit board assembly of fig. 1.
Reference numerals illustrate:
100: rechargeable battery 110: shell body
111: the accommodation chamber 112: an opening
113: wire binding portion 114: positive electrode cap
115: nickel plating layer 120: circuit board assembly
121: circuit board 122: electronic component
123: base portion 124: conductive layer
125: gold plating layer 126: first gold plating layer
127: second gold plating layer 128: third gold plating layer
129: through hole 130: electrode cap
131: fourth gold plating layer 140: battery cell
141: positive electrode connection line 142: negative electrode connecting wire
150: conductive substrate 160: insulating ring
Detailed Description
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that embodiments of the invention may be practiced without one or more of these details. In other instances, well-known features have not been described in detail in order to avoid obscuring the embodiments of the invention.
In the following description, a detailed structure will be presented for a thorough understanding of embodiments of the present invention. It will be apparent that embodiments of the invention may be practiced without limitation to the specific details that are set forth by those skilled in the art.
The present invention provides a rechargeable battery 100 having an improved circuit unit, which mainly includes a case 110, a circuit board assembly 120, an electrode cap 130, a battery cell 140, a conductive substrate 150, and an insulating ring 160.
The rechargeable battery 100 according to the present invention will be described in detail with reference to fig. 1 to 5.
As shown in fig. 1 to 3, the housing 110 is made of a metal material and has a receiving chamber 111. Specifically, the housing 110 may be made of a steel material. The present embodiment exemplarily shows that the housing 110 is generally constructed in a circular columnar thin-walled structure. The receiving chamber 111 is located inside the housing 110. The receiving chamber 111 has an opening 112. The opening 112 may be located at one end (e.g., the upper end in fig. 1-3) of the case 110, and the case 110 includes a positive cap 114 located at the other end (i.e., the lower end in fig. 1-3). It will be appreciated by those skilled in the art that the structure of the housing 110 is not limited to this embodiment, and the housing 110 may be configured as a rectangular parallelepiped, a square, or any other suitable shape as desired.
The circuit board assembly 120 is disposed in the receiving cavity 111. Specifically, the circuit board assembly 120 may be disposed at a side of the receiving chamber 111 near the opening 112. In the illustrated embodiment, the housing 110 is disposed in a vertical direction, and the circuit board assembly 120 is disposed in a horizontal direction in the receiving chamber 111. The circuit board assembly 120 may be used for charge protection, charge indication, discharge protection, short circuit protection, over-discharge protection, control of output voltage, etc. of the rechargeable battery 100.
The case 110 may have a wire tying portion 113 for supporting the circuit board assembly 120, the wire tying portion 113 being configured to be recessed inward from an outer surface of the case 110. Specifically, the wire tying portion 113 may be configured as a U-shaped structure recessed inward from the outer surface of the housing 110, both ends of which are respectively connected to the body portion of the housing 110. Preferably, the surface of the wire binding portion 113 for supporting the circuit board assembly 120 is a plane. Specifically, the top surface of the wire tying portion 113 is configured as a plane extending in the horizontal direction for supporting and abutting against the circuit board 121.
The circuit board assembly 120 includes a circuit board 121 and electronic components 122 disposed on the circuit board 121. The circuit board 121 may be provided with a plurality of electronic components 122 of the same type or different types according to the functional requirements thereof. The electronic component 122 may be disposed on the upper side of the circuit board 121 or may be disposed on the lower side of the circuit board 121. As shown in fig. 3 to 5, the circuit board 121 mainly includes a base portion 123, a conductive layer 124, and a gold plating layer 125. The base portion 123 is an insulating substrate to perform an insulating function.
The conductive layer 124 may be made of a copper material. Specifically, the conductive layer 124 may be a copper plating layer. The conductive layer 124 partially covers the outer surface of the base portion 123. For example, the conductive layer 124 may be used to contact an inner surface of the housing 110 for electrical conduction, and may also be used to solder with other electronic components 122, such as the conductive substrate 150. Specifically, in the present embodiment, the conductive layer 124 may cover the outer peripheral edge of the base body portion 123, for example, the upper surface, the lower surface, and the circumferential side surface of the outer peripheral edge.
In the present invention, in order to prevent oxidation of the conductive layer 124 on the circuit board 121, the gold plating layer 125 covers the outer surface of the conductive layer 124, thereby protecting the conductive layer 124 and replacing the conductive layer 124 against the inner surface of the case 110 to conduct electricity. The gold plating layer 125 may at least partially cover the outer surface of the conductive layer. Specifically, the gold plating layer 125 is made of gold material. The gold plating layer 125 is located at the outer peripheral edge of the base body 123 to cover the outer surface of the conductive layer 124 located at the outer peripheral edge of the base body 123.
More specifically, the gold plating layer 125 includes a first gold plating layer 126 located on the upper surface of the base body portion 123, a second gold plating layer 127 located on the lower surface of the base body portion 123, and a third gold plating layer 128 located on the side surface of the base body portion 123, the top end of the third gold plating layer 128 being connected to the first gold plating layer 126, the bottom end of the third gold plating layer 128 being connected to the second gold plating layer 127. The second gold plating layer 127 may abut against the upper surface of the wire binding portion 113, and the third gold plating layer 128 may abut against the inner surface of the body portion of the housing 110. Since the surface of the wire bonding portion 113 for supporting the circuit board assembly 120 is a plane, the contact area of the second gold plating layer 127 with the upper surface of the wire bonding portion 113 can be increased to improve heat dissipation and conductivity of the circuit board 121.
Preferably, the inner surface of the housing 110 is provided with a nickel plating layer 115, and in a state in which the circuit board assembly 120 is mounted in the housing 110, a gold plating layer 125 (specifically, a second gold plating layer 127 and a third gold plating layer 128) of the circuit board 121 abuts against the nickel plating layer 115 of the housing 110. The nickel plating layer 115 may be provided on the entire inner surface of the case 110, or may be provided on a region of the case 110 (specifically, an upper surface including the wire binding portion 113) for contact with the gold plating layer 125, for example, a region of the case 110 in contact with the second gold plating layer 127 and the third gold plating layer 128.
The base portion 123 may also have a through hole 129, the through hole 129 extending from an upper surface to a lower surface of the base portion 123. Specifically, in the present embodiment, the base body portion 123 may have a plurality of through holes 129, and the plurality of through holes 129 may be disposed at the outer peripheral edge of the circuit board 121 at equal intervals in the circumferential direction. The gold plating layer 125 includes a fourth gold plating layer 131, the conductive layer 124 and the fourth gold plating layer 131 entirely cover the inner surface of the through hole 129, and the fourth gold plating layer 131 covers the outside of the conductive layer 124, and the first gold plating layer 126 and the second gold plating layer 127 are connected via the fourth gold plating layer 131 to further improve the heat and electrical conductivity of the circuit board 121.
Referring back to fig. 1 to 3, the battery cell 140 and the conductive substrate 150 are disposed in the receiving cavity 111 below the circuit board assembly 120, and the battery cell 140 is electrically connected to the circuit board assembly 120 through the conductive substrate 150. Specifically, the cell 140 has a negative electrode connection line 141 and a positive electrode connection line 142. The negative electrode connection line 141 and the positive electrode connection line 142 may be located at both ends of the battery cell 140. The conductive substrate 150 is constructed in a thin plate-like structure to be bendable so that it can be attached to the outside of the battery cell 140. The positive electrode connection line 142 and the negative electrode connection line 141 may be electrically connected to the conductive substrate 150, respectively, for example, may be electrically connected to both ends of the conductive substrate 150, respectively. The conductive substrate 150 may be electrically connected to the circuit board 121, thereby electrically connecting the battery cells 140 to the circuit board 121. By arranging the conductive substrate 150, the welding strength between the negative electrode connecting wire 141, the positive electrode connecting wire 142 and the circuit board 121 of the battery cell 140 can be improved, so that the connection between the battery cell 140 and the circuit board 121 is firm.
The electrode cap 130 may be made of a conductive material (e.g., a metallic material). The electrode cap 130 may shield electromagnetic radiation generated by the electronic components. The electrode cap 130 is disposed over the circuit board assembly 120 to cover the opening 112, the electrode cap 130 is electrically connected to the circuit board assembly 120, and polarities of the electrode cap 130 and the case 110 are opposite. Thus, the electrode cap 130 is a negative electrode cap with respect to the positive electrode cap 114 of the housing 110. The electrode cap 130 may be fixed on the upper surface of the circuit board 121 by welding, or the electrode cap 130 may be abutted to the circuit board 121 by a snap-fit manner, or the electrode cap 130 may be mounted on the circuit board 121 by a combination of both. In one embodiment of the invention, not shown, the housing may have a negative cap, and the electrode cap covering the opening of the housing may be a positive cap of opposite polarity to the housing.
The insulating ring 160 may be made of an insulating material having flexibility, and may be configured in a ring-shaped structure. An insulating ring 160 extends through the opening 112 and is captured between the housing 110, the electrode cap 130 and the circuit board assembly 120 for securing the circuit board assembly 120 and spacing the housing 110 and the electrode cap 130 apart. Specifically, the insulating ring 160 is used to press the circuit board assembly 120 on top of the wire binding portion 113, thereby fixing the circuit board assembly 120. Meanwhile, the insulating ring 160 serves to isolate the case 110 and the electrode cap 130 from direct contact therebetween to conduct electricity.
According to the rechargeable battery, the outer surface of the conductive layer is covered with the gold plating layer, so that the oxidation of the circuit board can be prevented, the conductive performance of the circuit board can be improved, the heat dissipation effect of the circuit board can be improved, and meanwhile, the reliability of welding the circuit board and other electronic components can be improved.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular implementations only and is not intended to be limiting of the invention. Terms such as "disposed" or the like as used herein may refer to either one element being directly attached to another element or one element being attached to another element through an intermediate member. Features described herein in one embodiment may be applied to another embodiment alone or in combination with other features unless the features are not applicable or otherwise indicated in the other embodiment.
The present invention has been described in terms of the above embodiments, but it should be understood that the above embodiments are for purposes of illustration and description only and are not intended to limit the invention to the embodiments described. Those skilled in the art will appreciate that many variations and modifications are possible in light of the teachings of the invention, which variations and modifications are within the scope of the invention as claimed.
Claims (6)
1. A rechargeable battery having an improved circuit unit, comprising:
a housing made of a metal material and having a receiving cavity having an opening; and
the circuit board subassembly, the circuit board subassembly sets up hold the chamber, the circuit board subassembly includes the circuit board and sets up electronic component on the circuit board, the circuit board includes:
a base portion having a through hole extending from an upper surface to a lower surface thereof;
a conductive layer partially covering an outer surface of the base portion and entirely covering an inner surface of the through hole; and
a gold plating layer covering an outer surface of the conductive layer, the gold plating layer being for electrical conduction against an inner surface of the housing,
wherein the gold plating layer is located at an outer peripheral edge of the base portion, an inner surface of the housing is provided with a nickel plating layer against which the gold plating layer abuts in a state in which the circuit board assembly is mounted in the housing,
the gold plating layer comprises a first gold plating layer positioned on the upper surface of the base body part, a second gold plating layer positioned on the lower surface of the base body part, a third gold plating layer positioned on the side surface of the base body part and a fourth gold plating layer completely covering the inner surface of the through hole, the top end of the third gold plating layer is connected with the first gold plating layer, the bottom end of the third gold plating layer is connected with the second gold plating layer, and the first gold plating layer and the second gold plating layer are connected through the fourth gold plating layer.
2. The rechargeable battery of claim 1, wherein the battery comprises a battery pack,
the conductive layer is made of copper material; and/or
The gold plating layer is made of gold material.
3. The rechargeable battery of claim 1, wherein the case has a wire binding portion for supporting the circuit board assembly, the wire binding portion is configured to be recessed inward from an outer surface of the case, and a surface of the wire binding portion for supporting the circuit board assembly is a plane.
4. The rechargeable battery of claim 1, further comprising a battery cell and a conductive substrate disposed in the receiving cavity and below the circuit board assembly, the battery cell being electrically connected to the circuit board assembly through the conductive substrate.
5. The rechargeable battery of claim 1, further comprising an electrode cap disposed over the circuit board assembly to cover the opening, the electrode cap electrically connected to the circuit board assembly, the electrode cap and the housing being of opposite polarity.
6. The rechargeable battery of claim 5, further comprising an insulating ring extending through the opening and captured between the housing, the electrode cap and the circuit board assembly for securing the circuit board assembly and spacing the housing and the electrode cap apart.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910197861.6A CN109994660B (en) | 2019-03-15 | 2019-03-15 | Rechargeable battery with improved circuit unit |
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CN201910197861.6A CN109994660B (en) | 2019-03-15 | 2019-03-15 | Rechargeable battery with improved circuit unit |
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CN109994660A CN109994660A (en) | 2019-07-09 |
CN109994660B true CN109994660B (en) | 2023-12-05 |
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CN111755634A (en) * | 2020-01-17 | 2020-10-09 | 深圳市麦格松电气科技有限公司 | Battery controller and columnar battery |
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