CN109981047A - Pi-shaped interconnection wire structure - Google Patents
Pi-shaped interconnection wire structure Download PDFInfo
- Publication number
- CN109981047A CN109981047A CN201711443515.9A CN201711443515A CN109981047A CN 109981047 A CN109981047 A CN 109981047A CN 201711443515 A CN201711443515 A CN 201711443515A CN 109981047 A CN109981047 A CN 109981047A
- Authority
- CN
- China
- Prior art keywords
- type
- shaped
- conducting wire
- supporting leg
- shaped interconnection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 7
- 230000008646 thermal stress Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a pi-shaped interconnection wire structure, which relates to the technical field of aerospace power supplies and comprises a plurality of bus bars, a plurality of batteries and a plurality of connecting wires, wherein the plurality of bus bars are used for connecting the batteries in series; the method is characterized in that: two adjacent bus bars are connected through a pi-shaped interconnection lead; the method specifically comprises the following steps: the pi-shaped interconnection wire comprises an L-shaped first supporting leg, an L-shaped second supporting leg and a linear middle section positioned between the first supporting leg and the second supporting leg; the first supporting leg, the middle section and the second supporting leg are in an integrally formed structure, and the pi-shaped interconnection lead is in a pi shape; two ends of the pi-shaped interconnection lead are respectively welded with the bus bar, and the length of each welding point is 3 mm; radians with the radius of 2mm are arranged at the corners of the pi-shaped interconnection wires; the length of the active wire between two welding points of the pi-shaped interconnection wire is 20 mm. By adopting the pi-shaped interconnection wire structure, the influence of thermal stress on welding spots during lunar surface cold and hot alternation is reduced, and the safety and the reliability of the welding spots are ensured.
Description
Technical field
The present invention relates to space power technical fields, interconnect conductor structure more particularly to a kind of π type.
Background technique
Solar battery array is as satellite, the main power source of detector, after solar cell is by the irradiation of sunlight, by incidence
Luminous energy be converted to can direct applied electric energy, which is sent to primary power source by the cable being mounted on solar battery array
Equipment is controlled, is whole device load supplying, while being battery charging.
Cell piece in solar battery array is pooled together the power output of each battery by way of series and parallel,
Wherein cell piece in parallel pools together the output electric current of monolithic battery, output electricity of the concatenated cell piece monolithic battery
Pressure pools together.In a power supply circuit, there are several batteries series-parallel, is converged between each string by certain mode whole
A circuit is powered.Solar cell series and parallel schematic diagram is shown in Fig. 1.
For lunar orbiter, the voltage of solar battery array is required to be 30V or so, belongs to low pressure solar cell
Battle array, but the current value requirement of its single circuit is larger, and the number in parallel of solar battery string is more in single circuit, will be multiple using conducting wire
Battery strings are safe and reliable to be connected in parallel.This patent devises a kind of π type interconnection conductor structure, which there is reduction heat to answer
Power, appearance are clean and tidy, facilitate the features such as welding.
Summary of the invention
The technical problem to be solved by the present invention is in order to meet space power to the adaptability of environment.Provide a kind of π type
Interconnect conductor structure.
The technical scheme adopted by the present invention to solve the technical problems existing in the known art is that
A kind of π type interconnection conductor structure, including multiple busbars that multiple batteries are contacted；Between two neighboring busbar
Conducting wire connection is interconnected by π type；Specifically: the π type interconnection conducting wire includes L-shaped first leg, L-shaped second supporting leg and position
Linear interlude between first leg and the second supporting leg；The first leg, interlude and the second supporting leg and linear
It is an integral molding structure, and π type interconnection conducting wire is at π type；The both ends of the π type interconnection conducting wire are welded with busbar respectively,
The length of each pad is 3mm；The π type interconnection each corner of conducting wire is provided with the radian that radius is 2mm.
Further, active wire length is 20mm between π type interconnection two solder joint of conducting wire.
The advantages and positive effects of the present invention are:
By using technical solution of the present invention, directly the positive and negative electrode busbar of multiple battery strings is interconnected, advantage
Have with good effect:
1) by using π type interconnect conductor structure, reduce lunar surface alternating hot and cold when thermal stress butt welding point influence, it is ensured that
Solder joint is safe and reliable；
2) the interconnection conducting wire has the characteristics that appearance is clean and tidy, facilitates welding；
3) an interconnection conducting wire is welded at each busbar both ends, interconnects for two point two-wire, and effectively increase product can
By property.
Detailed description of the invention
Fig. 1 is the series and parallel schematic diagram of traditional solar cell；
Fig. 2 is π type interconnecting lead and busbar type of attachment schematic diagram in the preferred embodiment of the present invention；
Fig. 3；It is that π type interconnects conductor structure size in the preferred embodiment of the present invention；
Wherein: 1, π type interconnects conducting wire；2, busbar.
Specific embodiment
In order to further understand the content, features and effects of the present invention, the following examples are hereby given, and cooperate attached drawing
Detailed description are as follows:
It please refers to Fig.1 to Fig.3, a kind of π type interconnection conductor structure, including multiple busbars 2 that multiple batteries are contacted；Phase
Conducting wire 1 is interconnected by π type between adjacent two busbars to connect；Specifically: the π type interconnection conducting wire 1 includes L-shaped first
Leg, L-shaped second supporting leg and the linear interlude between first leg and the second supporting leg；The first leg, centre
Section and the second supporting leg and linear are an integral molding structure, and π type interconnection conducting wire is at π type；The two of the π type interconnection conducting wire
End is welded with busbar respectively, and the length of each pad is 3mm；The π type interconnection each corner of conducting wire is provided with radius and is
The radian of 2mm.
Active wire length is 20mm between π type interconnects two solder joint of conducting wire
The battery of single circuit counts in series and parallel as 14 simultaneously, by using above-mentioned technical proposal of the present invention, directly in detector
The positive and negative electrode busbar of each battery strings is interconnected.The conducting wire both ends are separately connected two adjacent busbars, and conducting wire is formed
π type radian be suitable for the alternating hot and cold in lunar surface environment, reduce thermal stress, avoid solder joint stress.
π type interconnecting lead and busbar type of attachment schematic diagram are shown in Fig. 2.
Interconnecting solder joint Design of length between conducting wire and busbar is 3mm, is welded on the middle position of busbar.On π type cabling
The radian that each corner's setting radius is 2mm, avoids right-angle turning, damage wires.Active wire is long between interconnecting two solder joint of conducting wire
Degree is 20mm, and the thermal stress applied when adapting to lunar surface alternating hot and cold to conducting wire avoids two solder joint stress.
In solar battery array, cell piece is pasted onto the front of substrate.The implementation process of the art of this patent need to use special tool
Conducting wire both ends at required shape, are then welded on the busbar in front-side circuit by tool by wire producing.
The achievable technical method of the present invention has:
1. conducting wire and busbar welding technique；
2. π type conducting wire forming method.
The embodiments of the present invention have been described in detail above, but content is only the preferred embodiment of the present invention,
It should not be considered as limiting the scope of the invention.Any changes and modifications in accordance with the scope of the present application,
It should still be within the scope of the patent of the present invention.
Claims (2)
1. a kind of π type interconnects conductor structure, including multiple busbars that multiple batteries are contacted；It is characterized by: two neighboring
Conducting wire connection is interconnected by π type between busbar；Specifically: π type interconnection conducting wire includes L-shaped first leg, L-shaped the
Two supporting legs and the linear interlude between first leg and the second supporting leg；The first leg, interlude and second
Leg and linear are an integral molding structure, and π type interconnection conducting wire is at π type；The both ends of π type interconnection conducting wire respectively with remittance
Item welding is flowed, the length of each pad is 3mm；The π type interconnection each corner of conducting wire is provided with the radian that radius is 2mm.
2. π type according to claim 1 interconnects conductor structure, it is characterised in that: activity is led between π type interconnection two solder joint of conducting wire
Line length is 20mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711443515.9A CN109981047A (en) | 2017-12-27 | 2017-12-27 | Pi-shaped interconnection wire structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711443515.9A CN109981047A (en) | 2017-12-27 | 2017-12-27 | Pi-shaped interconnection wire structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109981047A true CN109981047A (en) | 2019-07-05 |
Family
ID=67071528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711443515.9A Pending CN109981047A (en) | 2017-12-27 | 2017-12-27 | Pi-shaped interconnection wire structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109981047A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090081901A1 (en) * | 2007-09-21 | 2009-03-26 | Japan Aviation Electronics Industry, Limited | Cable connector, method of connecting a cable connector and a cable |
| CN102569291A (en) * | 2010-12-22 | 2012-07-11 | 美国亚德诺半导体公司 | Vertically integrated systems |
| CN102754240A (en) * | 2010-02-09 | 2012-10-24 | 株式会社Lg化学 | Battery module having enhanced welding reliability and medium or large battery pack including same |
-
2017
- 2017-12-27 CN CN201711443515.9A patent/CN109981047A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090081901A1 (en) * | 2007-09-21 | 2009-03-26 | Japan Aviation Electronics Industry, Limited | Cable connector, method of connecting a cable connector and a cable |
| CN102754240A (en) * | 2010-02-09 | 2012-10-24 | 株式会社Lg化学 | Battery module having enhanced welding reliability and medium or large battery pack including same |
| CN102569291A (en) * | 2010-12-22 | 2012-07-11 | 美国亚德诺半导体公司 | Vertically integrated systems |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190705 |
|
| RJ01 | Rejection of invention patent application after publication |