CN109980174A - Method for improving surface adhesion of battery hot-melt polymer copper foil and surface treating agent - Google Patents
Method for improving surface adhesion of battery hot-melt polymer copper foil and surface treating agent Download PDFInfo
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- CN109980174A CN109980174A CN201711444130.4A CN201711444130A CN109980174A CN 109980174 A CN109980174 A CN 109980174A CN 201711444130 A CN201711444130 A CN 201711444130A CN 109980174 A CN109980174 A CN 109980174A
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- Prior art keywords
- copper foil
- hot
- melt polymer
- treating agent
- foil surface
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 147
- 239000011889 copper foil Substances 0.000 title claims abstract description 111
- 239000012943 hotmelt Substances 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 54
- 229920000642 polymer Polymers 0.000 title claims abstract description 54
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 33
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 claims abstract description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000000243 solution Substances 0.000 claims abstract description 25
- 239000004094 surface-active agent Substances 0.000 claims abstract description 22
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims abstract description 19
- 239000008367 deionised water Substances 0.000 claims abstract description 18
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 18
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 14
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims abstract description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000007864 aqueous solution Substances 0.000 claims abstract description 9
- 239000003153 chemical reaction reagent Substances 0.000 claims abstract description 7
- 238000007731 hot pressing Methods 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims description 36
- 239000010949 copper Substances 0.000 claims description 36
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 9
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 8
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 8
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical group ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 claims description 6
- 239000005708 Sodium hypochlorite Substances 0.000 claims description 4
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 4
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 4
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 4
- 235000019394 potassium persulphate Nutrition 0.000 claims description 4
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 4
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 4
- 235000011151 potassium sulphates Nutrition 0.000 claims description 4
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 4
- 235000011152 sodium sulphate Nutrition 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical class OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 3
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 claims description 3
- 229910000360 iron(III) sulfate Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 claims description 3
- 239000012756 surface treatment agent Substances 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 abstract description 13
- 229910001416 lithium ion Inorganic materials 0.000 abstract description 13
- 238000004140 cleaning Methods 0.000 abstract description 6
- 238000001035 drying Methods 0.000 abstract 2
- 230000007613 environmental effect Effects 0.000 abstract 1
- 238000002791 soaking Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 239000007788 liquid Substances 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229920000620 organic polymer Polymers 0.000 description 7
- 238000004381 surface treatment Methods 0.000 description 7
- 235000019441 ethanol Nutrition 0.000 description 6
- 238000003672 processing method Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 4
- 238000000921 elemental analysis Methods 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000005030 aluminium foil Substances 0.000 description 3
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 239000004831 Hot glue Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 208000032953 Device battery issue Diseases 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- PRPAGESBURMWTI-UHFFFAOYSA-N [C].[F] Chemical compound [C].[F] PRPAGESBURMWTI-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229940117975 chromium trioxide Drugs 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 238000010129 solution processing Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
- H01M4/043—Processes of manufacture in general involving compressing or compaction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
The invention relates to a method for improving the surface adhesion of a battery hot-melt polymer copper foil and a surface treating agent. The invention belongs to the technical field of lithium ion batteries. The method for improving the surface adhesion of the battery hot-melt polymer copper foil comprises the steps of firstly cleaning the surface of the copper foil by using acetone and deionized water, and drying; secondly, soaking the surface of the copper foil in a surface treating agent or smearing the surface treating agent on the surface of the copper foil until the surface of the copper foil becomes black brown, then cleaning the surface of the copper foil by using deionized water and an alcohol reagent and drying; and finally, covering the surface of the treated copper foil with the hot-melt polymer, and carrying out hot pressing on the hot-melt polymer and the copper foil by using a hot press to bond the hot-melt polymer and the copper foil together. The surface treating agent for improving the surface adhesion of the battery hot-melt polymer copper foil is an aqueous solution consisting of sulfate, persulfate, a surfactant and hypochlorite, and the pH value of the aqueous solution is 11-14. The invention has the advantages of simple formula of water treatment solution, environmental protection, simple and convenient treatment process and the like.
Description
Technical field
The invention belongs to technical field of lithium ion, more particularly to a kind of raising battery hot-melt polymer copper foil table
Face adhesive force method and surface treating agent.
Background technique
Flexible ultra-thin lithium ion battery, can be according to difference because it has the characteristics that good flexibility, thickness ultrathin and high safety
The electronic equipment of shape is flexibly attached or is inlayed installation, is had in the fields such as field of intelligent wear and biologic medical more next
More it is widely applied.In certain flexible ultra-thin lithium ion battery technology of preparing, due to eliminating common flexible packing lithium ion electric
The aluminum plastic film of pond encapsulation, encapsulating structure is formed using hot-melt polymer bonding copper foil and aluminium foil, therefore hot melt polymeric
Object and copper foil aluminium foil Cohesion reliability become the critical issue of battery preparation.The adhesion strength of hot-melt polymer and metal and can
It is extremely important by property, once because bonding part cracking or leakage, then directly result in battery failure.Hot-melt polymer and aluminium foil are viscous
Knotting strength is larger, but due to the chemical inertness of copper foil surface, and hot-melt polymer is difficult have good bonding on copper surface, directly
Hot melt adhesive and copper foil are bonded together by hot press, bond effect is excessively poor and intensity is very low, contact electrolyte or other
Organic solvent is very easy to abutting edge is caused to be come unglued to fall off, therefore must be chemically treated to copper foil surface before bonding, increases
Melten gel is heated to the adhesive strength of copper foil surface.
At present it is known that copper foil surface the chemical treatment method limitation and deficiency had nothing in common with each other, patent
CN1865366A " improving organic polymer coating to the method and composition of copper surface adhesion force " provides a kind of processing copper table
The aqueous solution in face can greatly improve organic polymer coating in the adhesive force on copper surface after processing.The water process that disadvantage is to provide
Solution is made of 6 kinds of chemical substances, and composition is more complex, exists simultaneously strong oxidizer additionally, due in same strong alkali solution
(persulfate) and reproducibility reagent (water-soluble polymer such as polyvinyl alcohol), easily cause the redox reaction inside solution
Treatment fluid is set to fail.Patent CN102354735A " the preparation of Soft Roll or polymer lithium ion power cell aluminium, nickel, copper polar ear
Copper polar ear surface treatment shares acetone cleaning etc. 9 to increase gel in the treatment process of the adhesive force on its surface in method "
Step, copper surface treatment liquid are made of boric acid, sodium fluoride, chromium trioxide and potassium bichromate.After the process, gel
It is good with copper polar ear bonding.The disadvantage is that complex process, cumbersome, and water process liquid contains hexavalent chromium compound and fluoride,
It is more toxic, has biggish potential danger to operator, biggish damage is caused to environment.Patent CN103194743A " one
Surface treatment method of the kind for the nickel metal strip of lithium ionic cell cathode ear pole " provides a kind of lithium ionic cell cathode ear pole
With nickel metallic surface processing method, since nickel is close with copper chemical property, which also can be used as copper process of surface treatment
With reference to.The processing method for the nickel metal surface that the patent provides is divided into two steps, and chemical pretreatment solution used in every step is different, with this
After method handles nickel metal strip, there is good adhesiveness with gel.But its treatment process is more complex, and needs two different
Water process liquid, process for preparation is cumbersome, and treatment fluid also contains hexavalent chromium compound and fluoride, to environment and personnel have compared with
Big harm.
The present invention " improves organic polymer coating to the method and combination of copper surface adhesion force in patent CN1865366A
It is improved on the basis of object ", is allowed to more rationally, eliminate the organic cosolvent, water-soluble polymer and table of reproducibility
Face activating agent, makes that the operation is more convenient, and application field is extended to field of lithium ion battery.Patent is avoided simultaneously
CN102354735A " preparation method of Soft Roll or polymer lithium ion power cell aluminium, nickel, copper polar ear " and patent
Acidity is used in CN103194743A " a kind of surface treatment method of the nickel metal strip for lithium ionic cell cathode ear pole "
Hexavalent chromium compound and fluoride are a kind of environmental-friendly copper process for treating surface.
Summary of the invention
The present invention is to solve technical problem present in well-known technique and provide a kind of raising battery hot-melt polymer copper
Foil surface adhesion force method and surface treating agent.
The present invention provides the processing method of a kind of copper surface processing solution and raising copper surface adhesion force, the processing methods
It can be used for hot melt or thermosetting polymer in the bonding on copper surface.Copper surface of the present invention water treatment solution is by sulfuric acid
Salt, persulfate, surfactant and hypochlorite composition, sulfate can for sodium sulphate, potassium sulfate, ammonium sulfate, ferric sulfate etc.,
Persulfate can be ammonium persulfate, potassium peroxydisulfate, sodium peroxydisulfate etc., and surfactant can be silicon surface active agent, fluorocarbon surface
Activating agent, calgon etc., hypochlorite can for sodium hypochlorite, postassium hypochlorite, hypochlorous acid by etc..Wherein sulphates content
(wt%) between 0.1%-10%, preferably 1%-5%, persulfate content is between 1%-15%, preferably 3%-
10%, surface-active contents are between 0.01%-1%, preferably 0.05%-0.5%, and hypochlorite solutions (v/v%) contain
Amount is between 5%-40%, preferably 10%-30%, and solution ph is preferable between 11-14.
Copper surface treatment method of the present invention are as follows: cleaned first with acetone and deionized water by copper foil table to be processed
Face, spare after dry, the microscopic appearance of untreated copper foil surface is as shown in Figure 1.Secondly at 40-80 DEG C, by copper table
Face, which is soaked in water treatment solution or treatment fluid is applied to copper surface to copper surface, becomes dark brown, then with deionized water and
Alcohol reagent is cleaned copper surface and is dried, and copper foil surface pattern is as shown in Figure 2 after processing.Finally hot-melt polymer is covered
Hot melt organic polymer and copper foil are carried out heat at certain temperature and pressure with hot press by copper surface after treatment
Pressure, by the heat preservation and pressure maintaining of certain time, can firmly bond together hot-melt polymer with copper foil.
Copper foil surface is through aqueous solution processing rear surface pattern as shown in Fig. 2, surface becomes coarse from smooth state
And it is uneven, anchor point of a large amount of copper surfaces in conjunction with organic polymer is increased, organic polymer and copper foil are added significantly to
The bonded area on surface and combine depth;In addition surface is after the oxide etch for the treatment of fluid and cleaning, and surface-element is by fine copper
The mixture for having become copper, copper oxide and cuprous oxide also increases the binding force of organic polymer and copper foil surface.But it handles
There is no copper sulfide presence for copper foil surface afterwards, and the elemental analysis (EDS) of copper foil surface is as shown in Figure 3 after processing.
After the processed copper foil of processing method of the present invention and hot-melt polymer heat pressure adhesive, copper foil and hot melt polymeric
The adhesion strength and reliability of object are significantly increased.Heat will be carried out with hot melt adhesive respectively with untreated copper foil with the present invention is processed
After pressure viscosity is closed, after impregnating room temperature in lithium-ion battery electrolytes 2 weeks or 80 DEG C of 8h, untreated sample adhesive tape is whole
It falls off, and adhesive tape adhesion strength after treatment is basically unchanged.Therefore, the adhesion of copper foil and hot-melt polymer of the invention
Method and copper foil surface processing solution are that effective and reliable and of the invention water process liquid is environmental-friendly, and operation sequence is simple,
It can be applied to field of lithium ion battery.
An object of the present invention, which is to provide one kind, has simple process, easy to operate, and water process liquid is environmental-friendly, can
The raising battery hot-melt polymer copper foil surface adhesive force method for the features such as being widely used in field of lithium ion battery.
The present invention improves battery hot-melt polymer copper foil surface adhesive force method and is adopted the technical scheme that:
A kind of raising battery hot-melt polymer copper foil surface adhesive force method, its main feature is that: it is poly- to improve battery hot melt
Closing object copper foil surface adhesive force method includes following technical process: copper foil surface is cleaned with acetone and deionized water first, it is dry;
Secondly copper foil surface is soaked in the surface treating agent of sulfate, persulfate, surfactant and hypochlorite composition or incited somebody to action
Surface treating agent, which is applied to copper foil surface to copper foil surface, becomes dark brown, then cleans copper table with deionized water and alcohol reagent
It simultaneously dries in face;Finally by the hot-melt polymer copper foil table that is covered on that treated, with hot press by hot-melt polymer and copper foil
Hot pressing is carried out, hot-melt polymer and copper foil are bonded together.
The present invention improves battery hot-melt polymer copper foil surface adhesive force method and can also adopt the following technical scheme that
The raising battery hot-melt polymer copper foil surface adhesive force method, its main feature is that: in 40-80 DEG C of condition
Under, copper foil surface is soaked in the surface treating agent of sulfate, persulfate, surfactant and hypochlorite composition or by table
Surface treatment agent, which is applied to copper foil surface to copper foil surface, becomes dark brown.
Environmental-friendly the second object of the present invention is to provide a kind of water process liquid, formula is simple, and raw material is easy to get, preparation side
Just, the surface of the raising battery hot-melt polymer copper foil surface adhesive force for the features such as can be widely applied to field of lithium ion battery
Inorganic agent.
The present invention improves the technical solution that the surface treating agent of battery hot-melt polymer copper foil surface adhesive force is taken
It is:
A kind of surface treating agent improving battery hot-melt polymer copper foil surface adhesive force, its main feature is that: improve battery
The surface treating agent of hot-melt polymer copper foil surface adhesive force is sulfate, persulfate, surfactant and hypochlorite
The aqueous solution of composition;Sulfate is one or more of sodium sulphate, potassium sulfate, ammonium sulfate or ferric sulfate, and persulfate was
One or more of ammonium sulfate, potassium peroxydisulfate, sodium peroxydisulfate, surfactant are silicon surface active agent, fluoro-carbon surface active
Agent or calgon, hypochlorite be sodium hypochlorite, postassium hypochlorite, hypochlorous acid by one or more of;Sulfuric acid salt quality
Degree is 0.1%-10%, and persulfate mass percentage content is 1%-15%, surfactant qualities percentage
Content is 0.01%-1%, and hypochlorite solutions volume ratio content is 5%-40%, remaining is water, pH value of water solution 11-14.
The surface treating agent that the present invention improves battery hot-melt polymer copper foil surface adhesive force can also use following skill
Art scheme:
The surface treating agent of the raising battery hot-melt polymer copper foil surface adhesive force, its main feature is that: sulfate
Mass percentage content is 1%-5%, and persulfate mass percentage content is 3%-10%, surfactant qualities percentage
Content is 0.05%-0.5%, and hypochlorite solutions volume ratio content is 10%-30%.
The advantages and positive effects of the present invention are:
It is complete due to using the present invention to improve battery hot-melt polymer copper foil surface adhesive force method and surface treating agent
New technical solution, compared with prior art, the invention proposes a kind of copper surface treating aqueous solution of alkalinity and processing method,
Have the characteristics that water treatment solution formula is simple, environmental-friendly, treatment process is easy, hot-melt polymer can be greatly improved in copper
The adhesive strength and reliability on surface.
Detailed description of the invention
Fig. 1 is not surface treated copper surface microscopic topographic;
Fig. 2 is the copper surface microscopic topographic after surface treated;
The elemental analysis on the copper surface after Fig. 3 surface treated.Wherein, the copper surface microscopic shape after Fig. 3 a surface treatment
Looks;Fig. 3 b elemental analysis power spectrum;Fig. 3 c elemental analysis list.
Specific embodiment
In order to further understand the content, features and effects of the present invention, the following examples are hereby given, and cooperate attached drawing
Detailed description are as follows:
Refering to attached drawing 1, Fig. 2 and Fig. 3.
Embodiment 1
A kind of raising battery hot-melt polymer copper foil surface adhesive force method, including following technical process: first with third
Ketone and deionized water clean copper foil surface, dry;Secondly copper foil surface is soaked in surface treating agent or applies surface treating agent
Being put on copper foil surface to copper foil surface becomes dark brown, then cleans copper surface with deionized water and alcohol reagent and dries;Most
Afterwards by the hot-melt polymer copper foil table that is covered on that treated, hot-melt polymer and copper foil are subjected to hot pressing with hot press, general
Hot-melt polymer bonds together with copper foil.Improve battery hot-melt polymer copper foil surface adhesive force surface treating agent be
The aqueous solution that sulfate, persulfate, surfactant and hypochlorite form.Specific implementation process:
(1) water treatment solution is prepared:
By 1g potassium sulfate, 3g potassium peroxydisulfate is dissolved in 100g deionized water, and the inclined phosphorus of 0.2g six is sequentially added after being completely dissolved
Sour sodium, 20ml sodium hypochlorite are after mixing evenly 13 with sodium hydrate regulator solution pH value.
(2) copper foil surface to be treated successively is cleaned with acetone and deionized water, is subsequently placed in 60 DEG C of baking ovens and dries
For use.
(3) copper foil is placed on warm table, adjusting heating platen temperature is 70 DEG C, then takes the processing prepared in (1) step
Liquid is applied to copper foil surface, after waiting 10-30S copper foil surface to become dark brown, removes copper foil, successively uses deionized water and ethyl alcohol
Copper foil surface is cleaned to be placed in 60 DEG C of baking ovens and thoroughly dry after cleaning completely.
(4) copper foil surface after treatment covers polypropylene glue film, with hot press pressure maintaining under the conditions of 180 DEG C, 0.4Mpa
Polypropylene glue film can be bonded together by 5s-10s with copper foil.
Embodiment 2
A kind of raising battery hot-melt polymer copper foil surface adhesive force method, including following technical process: first with third
Ketone and deionized water clean copper foil surface, dry;Secondly copper foil surface is soaked in surface treating agent or applies surface treating agent
Being put on copper foil surface to copper foil surface becomes dark brown, then cleans copper surface with deionized water and alcohol reagent and dries;Most
Afterwards by the hot-melt polymer copper foil table that is covered on that treated, hot-melt polymer and copper foil are subjected to hot pressing with hot press, general
Hot-melt polymer bonds together with copper foil.Improve battery hot-melt polymer copper foil surface adhesive force surface treating agent be
The aqueous solution that sulfate, persulfate, surfactant and hypochlorite form.Specific implementation process:
(1) water treatment solution is prepared:
By 1g sodium sulphate, 5g sodium peroxydisulfate is dissolved in 100g deionized water, and 0.3g fluorine carbon table is sequentially added after being completely dissolved
Face activating agent, 10ml postassium hypochlorite are after mixing evenly 14 with sodium hydrate regulator solution pH value.
(2) copper foil surface to be treated successively is cleaned with acetone and deionized water, is subsequently placed in 60 DEG C of baking ovens and dries
For use.
(3) the water process liquid that (1) is prepared is heated to 60 DEG C in advance, then copper foil is immersed in treatment fluid and waits 10-
After 30S copper foil surface becomes dark brown, copper foil is taken out, successively cleans copper foil surface with deionized water and ethyl alcohol, after cleaning completely,
It is placed in 60 DEG C of baking ovens and thoroughly dries.
(4) copper foil surface after treatment covers polyurethane laminate, with hot press pressure maintaining under the conditions of 160 DEG C, 0.5Mpa
Polyurethane film and copper foil can be bonded together by 10s-20s.
The present embodiment has the sticking method of the copper foil and hot-melt polymer and copper foil surface processing solution is that have
It imitates and reliable, and water process liquid is environmental-friendly, operation sequence is simple, can be widely applied to field of lithium ion battery etc. and actively imitates
Fruit.
Claims (4)
1. a kind of raising battery hot-melt polymer copper foil surface adhesive force method, it is characterized in that: improving battery hot melt polymeric
Object copper foil surface adhesive force method includes following technical process: copper foil surface is cleaned with acetone and deionized water first, it is dry;Its
It is secondary copper foil surface to be soaked in the surface treating agent of sulfate, persulfate, surfactant and hypochlorite composition or by table
Surface treatment agent, which is applied to copper foil surface to copper foil surface, becomes dark brown, then cleans copper surface with deionized water and alcohol reagent
And it dries;Finally by the hot-melt polymer copper foil table that is covered on that treated, with hot press by hot-melt polymer and copper foil into
Row hot pressing, hot-melt polymer and copper foil are bonded together.
2. raising battery hot-melt polymer copper foil surface adhesive force method according to claim 1, it is characterized in that:
Under the conditions of 40-80 DEG C, copper foil surface is soaked in the surface of sulfate, persulfate, surfactant and hypochlorite composition
Surface treating agent is applied to copper foil surface to copper foil surface and becomes dark brown by inorganic agent.
3. a kind of surface treating agent for improving battery hot-melt polymer copper foil surface adhesive force, it is characterized in that: improving battery heat
The surface treating agent of melt polymeric copper foil surface adhesive force is sulfate, persulfate, surfactant and hypochlorite group
At aqueous solution;Sulfate is one or more of sodium sulphate, potassium sulfate, ammonium sulfate or ferric sulfate, and persulfate is over cure
One or more of sour ammonium, potassium peroxydisulfate, sodium peroxydisulfate, surfactant are silicon surface active agent, fluorocarbon surfactant
Or calgon, hypochlorite be sodium hypochlorite, postassium hypochlorite, hypochlorous acid by one or more of;Sulfuric acid salt quality hundred
Dividing than content is 0.1%-10%, and persulfate mass percentage content is 1%-15%, and surfactant qualities percentage contains
Amount is 0.01%-1%, and hypochlorite solutions volume ratio content is 5%-40%, remaining is water, pH value of water solution 11-14.
4. the surface treating agent according to claim 3 for improving battery hot-melt polymer copper foil surface adhesive force, special
Sign is: sulfate mass percentage content is 1%-5%, and persulfate mass percentage content is 3%-10%, surface-active
Agent mass percentage content is 0.05%-0.5%, and hypochlorite solutions volume ratio content is 10%-30%.
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