CN109976100B

CN109976100B - Photoetching system and photoetching method thereof

Info

Publication number: CN109976100B
Application number: CN201711461354.6A
Authority: CN
Inventors: 不公告发明人
Original assignee: Changxin Memory Technologies Inc
Current assignee: Changxin Memory Technologies Inc
Priority date: 2017-12-28
Filing date: 2017-12-28
Publication date: 2021-12-07
Anticipated expiration: 2037-12-28
Also published as: CN109976100A

Abstract

The invention relates to a photoetching system and a photoetching method thereof, wherein the system comprises: the production line is provided with a plurality of process units and is used for carrying out photoetching treatment on the wafer; the detection unit is used for detecting the working state of the process unit in the production line; the control unit is connected with the detection unit, receives the working state signal sent by the detection unit and generates a control signal according to the working state of the process unit in the production line; the dispatching unit is used for conveying the wafer from the production line to another adjacent production line according to the control signal of the control unit. The method comprises the following steps: receiving the working state of the process unit in the production line from the detection unit; judging whether the working state of a process unit in the production line is a fault or not; when the working state of the process unit in the production line is a fault, the control unit generates a first control signal to enable the scheduling unit to convey the wafer from the production line to another adjacent production line. The photoetching system disclosed by the invention is flexible in work and can meet the requirement of batch wafer generation.

Description

Photoetching system and photoetching method thereof

Technical Field

The invention relates to the technical field of photoetching of semiconductor manufacturing processes, in particular to a photoetching system and a photoetching method thereof.

Background

In the prior art, a lithography device is constructed as a continuous production line, and a semiconductor wafer respectively completes the processes of coating, exposure, development and the like on the production line through a compound device and an exposure device. When any equipment or part in the photoetching equipment breaks down, the whole photoetching equipment production line can not work any more, so that the wafers on the whole production line are stopped and cannot be processed continuously, and the wafer output efficiency is influenced.

The above information disclosed in the background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not form the prior art that is known to a person of ordinary skill in the art.

Disclosure of Invention

In view of the above, embodiments of the present invention provide a lithography system and a lithography method thereof, so as to solve or alleviate the technical problems in the prior art, and at least provide a useful choice.

The technical scheme of the embodiment of the invention is realized as follows:

according to an embodiment of the invention, there is provided a lithographic system, including:

at least two production lines, which are provided with a plurality of process units, wherein each process unit is used for carrying out each step of photoetching treatment on the wafer;

the detection unit is used for detecting the working state of the process unit in the production line;

the control unit is in communication connection with the detection unit, receives the working state signal sent by the detection unit, and generates a control signal according to the working state of the process unit in the production line; and

and the scheduling unit is used for conveying the wafer from the production line to another adjacent production line according to the control signal of the control unit so as to continue photoetching on the other production line.

In some embodiments, the production line includes a transfer apparatus for transferring the wafers to each of the process units and for transporting the wafers onto the dispatching unit.

In some embodiments, the dispatching unit includes a transfer rail connected to the transfer devices of two adjacent production lines for transferring the wafers.

In some embodiments, the transfer rails include a first transfer rail and a second transfer rail, the first transfer rail and the second transfer rail are connected to the transfer devices of two adjacent production lines, and the first transfer rail and the second transfer rail are transported in opposite directions to transfer the wafers to and from the two adjacent production lines.

In some embodiments, the dispatching unit further includes a buffer connected to the transfer device and/or the transfer track for temporarily storing the wafer.

In some embodiments, the scheduling unit comprises a grasping arm for grasping the wafer according to the control signal of the control unit.

In some embodiments, a sensor is disposed on the gripper arm for sensing a position at which the gripper arm grips the wafer.

In some embodiments, the dispatching unit includes a reading device for reading the location of the process unit where the wafer is located on the production line.

In some embodiments, the production line comprises a compounding apparatus and an exposure apparatus, wherein the process unit for exposure treatment is located in the exposure apparatus, and the process unit for coating and developing treatment is located in the compounding apparatus.

According to another embodiment of the present invention, there is provided a lithography method implemented in the lithography system described above, including:

receiving the working state of the process unit in the production line from the detection unit;

judging whether the working state of the process unit in the production line is a fault;

when the working state of the process unit in the production line is a fault, the control unit generates a first control signal to enable the scheduling unit to convey the wafer from the production line to another adjacent production line.

In some embodiments, after the control unit generates the first control signal, the photolithography method further includes:

receiving the working state of the process unit in another adjacent production line from the detection unit;

judging whether the working state of the process unit in the other production line is a fault;

when the working state of the process unit in the other production line is a fault, the control unit generates a second control signal to enable the scheduling unit to convey the wafer from the other production line to any adjacent production line.

In some embodiments, further comprising:

receiving the wafer information identified by the scheduling unit;

determining the position information of the wafer according to the wafer information, wherein the position information is used for representing the process unit of the wafer on the production line; and

and generating the first control signal according to the position information so as to enable the dispatching unit to convey the wafer to a corresponding process unit of another adjacent production line.

Due to the adoption of the technical scheme, the embodiment of the invention has the following advantages: the photoetching system comprises a plurality of production lines, the production lines are connected through the scheduling unit, and the detection unit is arranged on each production line, so when one production line has a fault, the wafer on the production line can be transferred to another production line through the scheduling unit for continuous processing, the photoetching system is more flexible, and the requirement of wafer batch production can be met. The production lines are mutually used as standby equipment, so that the fault tolerance rate of the photoetching system is improved, the wafer production efficiency is improved, and the whole photoetching system is prevented from stopping production due to equipment damage.

The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and following detailed description.

Drawings

In the drawings, like reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily to scale. It is appreciated that these drawings depict only some embodiments in accordance with the disclosure and are therefore not to be considered limiting of its scope.

FIG. 1 is a schematic structural diagram of a lithography system according to an embodiment of the invention.

FIG. 2 is a block diagram of a lithography system according to an embodiment of the invention.

FIG. 3 is a schematic side view of a lithography system according to an embodiment of the invention.

Fig. 4 is a schematic structural diagram of a scheduling unit according to an embodiment of the invention.

FIG. 5 is a flowchart of a photolithography method according to an embodiment of the present invention.

FIG. 6 is a schematic diagram of a lithography system according to an embodiment of the invention.

FIG. 7 is a schematic diagram of another photolithography system according to an embodiment of the present invention.

FIG. 8 is a process flow diagram of a photolithography process according to an embodiment of the present invention.

FIG. 9 is a schematic diagram illustrating an embodiment of a photolithography method.

FIG. 10 is a schematic view of another embodiment of the photolithography method according to the present invention.

The reference numbers illustrate:

100-production line; 110-a process unit; 120-a transmitting device;

200 a scheduling unit; 130-a compounding device; 140-an exposure device;

210-a transfer track; 211 — a first transfer track; 212-a second transfer track;

220-a gripper arm; 230-a cache region; 240-a reading device;

300-a detection unit; 400-a control unit; s100-step;

s200-step; s300-step.

Detailed Description

In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "square," and "over" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.

According to an embodiment of the invention, there is provided a lithography system, as shown in fig. 1, 2, comprising:

at least two manufacturing lines 100, the manufacturing line 100 having a plurality of process units 110, each process unit 110 being used for each step of the lithographic processing of the wafers.

The photolithography process includes at least coating, exposure and development. Each production line 100 is capable of performing photolithography processing on several wafers in parallel, i.e., simultaneously performing photolithography processing on several wafers, respectively. The various production lines 100 may be associated or may be relatively independent. Under the condition that the production line 100 is in a normal working state, each production line 100 can independently complete the whole process of the wafer photoetching treatment, and a plurality of production lines 100 can be cooperated to complete the whole process of the wafer photoetching treatment.

The detecting unit 300 is used for detecting the working state of the process units 110 in the production line 100. The working state includes whether each process unit 110 on the production line is normally operated, whether parts of each process unit 110 are damaged, and whether each process unit 110 has a potential working hazard or an alarm condition.

The control unit 400 is communicatively connected to the production line 100, the scheduling unit 200, and the detecting unit 300, receives the operating state signal transmitted by the detecting unit 300, and generates a control signal according to the operating state of the process units 110 in the production line 100.

The dispatching unit 200 is used for transferring the wafer from the production line 100 to another adjacent production line 100 according to the control signal of the control unit 400, so as to continue the lithography process on another production line 100. The dispatching unit 200 is used for transporting the wafers between two adjacent production lines 100.

In one embodiment, the wafer should perform the adhesion process on the process unit 110 in the production line 100, but the detection unit 300 detects that the process unit 110 performing the adhesion process is failed, and the wafer is transported to the process unit 110 performing the adhesion process of another production line 100 through the scheduling unit 200 to continue the processing of the wafer.

In one embodiment, as further shown in FIG. 1, the manufacturing line 100 includes a transfer device 120, the transfer device 120 being coupled to each process unit 110. The dispatching unit 200 is connected to the transmission devices 120 of two adjacent production lines 100, and the transmission devices 120 are used for conveying the wafers on any process unit 110 to the dispatching unit 200. The dispatching unit 200 is connected to the transmission devices 120 of two adjacent production lines 100, and the transmission devices 120 are used for conveying the wafers on any process unit 110 to the dispatching unit 200.

As shown in fig. 1, the production line 100 may further include a complex apparatus 130 and an exposure apparatus 140, wherein the process unit 110 for the exposure process is located in the exposure apparatus 140, and the process unit 110 for the coating and developing process is located in the complex apparatus 130. After the compound device 130 on the production line 100 coats the wafer, the wafer is transported to the exposure device 140 for exposure through the transport device 120, and then the exposed wafer is transported to the compound device 130 for development through the transport device 120.

In one embodiment, as shown in fig. 1 and 3, the dispatching unit 200 may include a transfer rail 210, and the transfer rail 210 is connected to the transfer devices 120 of two adjacent production lines 100 for transferring the wafers. It should be noted that the production line 100 in the embodiment of the present invention is not limited to two production lines 100 and one scheduling unit disposed between the two production lines 100 in the drawings, and the drawings are only for illustration. For example, the number of the production lines 100 may be three or more arranged in parallel, and the scheduling unit 200 is arranged between each two adjacent production lines 100.

In order to facilitate the reciprocating transfer of the wafers between the two production lines 100, the transfer rail 210 includes a first transfer rail 211 and a second transfer rail 212, the first transfer rail 211 and the second transfer rail 212 are connected to the transfer apparatuses 120 of the two adjacent production lines 100, and the transfer directions of the first transfer rail 211 and the second transfer rail 212 are opposite. Namely, the first transfer rail 211 is used for transferring the wafers on one production line 100 to another production line 100, and the second transfer rail 212 is used for transferring the wafers on another production line 100 back to the original production line 100.

In a preferred embodiment, the first transfer rail 211 and the second transfer rail 212 may be disposed in parallel left and right (as shown in fig. 1). The first transfer rail 211 and the second transfer rail 212 may also be arranged in parallel up and down (as shown in fig. 3). The arrangement of the specific transfer rail 211 and the second transfer rail 212 can be adaptively adjusted according to the work requirement, i.e. the layout position of the lithography system. The arrangement of the transfer rail 211 and the second transfer rail 212 is not limited to the above-described arrangement.

In one embodiment, as shown in fig. 4, the scheduling unit 200 includes a gripper arm 220, and the gripper arm 220 is used for gripping the wafer. The gripper arms 220 are electrically connected to a control unit 400 (shown in fig. 2), and the control unit 400 is used for controlling the movement of the gripper arms 220.

In order to ensure that the grasping arm 220 can grasp the wafer accurately, a sensor (not shown) may be disposed on the grasping arm 220, the sensor senses the position information of the wafer and transmits the position information to the control unit 400, and the control unit 400 controls the grasping arm 220 to grasp the wafer accurately according to the position information of the wafer.

When a process unit 110 on one production line 100 fails, there are more wafers located at the failed process unit 110, and there are more wafers processed by the process unit 110 corresponding to the failed process unit 110 on another adjacent production line 100, the wafers may be temporarily stored in the buffer area 230 of the dispatching unit 200. The buffer area 230 is used for temporarily storing wafers to be transferred on the failed production line 100. When the number of wafers being processed in another production line 100 becomes low, the wafers to be transferred temporarily stored in the buffer area 230 may be transferred to another production line 100 for a subsequent photolithography process.

In one embodiment, the buffer 230 may be connected to the transmitting device 120. When there are more wafers on the faulty process unit 110, the production line 100 with the faulty process unit 110 directly transfers the wafers on the faulty process unit 110 to the buffer area 230 for buffering through the transfer device 120, and when the number of wafers being processed by the process unit 110 corresponding to the faulty process unit 100 on another production line 100 becomes smaller, the wafers in the buffer area 230 can be grabbed into the transfer track 210 by the grabbing arm 220 and transferred to another production line 100 through the transfer track 210.

In an alternative embodiment, the buffer 230 may be coupled to the transfer track 210. When there are more wafers on the faulty process unit 110, the production line 100 in which the faulty process unit 110 is located transports the wafers on the faulty process unit 110 to the transport track 210 through the transport device 120, and the transport track 210 transports the wafers to the buffer area 230 for buffering, and when the number of wafers being processed by the process unit 110 corresponding to the faulty process unit 100 on another production line 100 is reduced, the wafers in the buffer area 230 are transported back to the transport track 210 and transported to another production line 100 through the transport track 210.

In another alternative embodiment, the buffer area 230 may be connected to the transfer device 120 and the transfer track 210, when there are more wafers on the faulty process unit 110, the production line 100 in which the faulty process unit 110 is located transfers a part of the wafers on the faulty process unit 110 directly to the buffer area 230 through the transfer device 120, and another part transfers the part of the wafers to the buffer area 230 through the transfer track 210, when there are too many wafers, the problem of jamming when transferring the wafers to the buffer area 230 in a single way can be avoided.

In an alternative embodiment, the dispatching unit 200 may transfer the wafers to another production line 100 via the gripper arms 220 or the transfer track 210, or store the wafers in the buffer 230.

In one embodiment, as shown in FIG. 4, the dispatch unit 200 may include a reading device 240, the reading device 240 being used to read the location of the process unit 110 where the wafer is located on the in-line production line. After the wafer is transferred to the dispatching unit 200 by the transfer device 120, the reading device 240 can directly read the transfer track 210 and directly transfer the wafer to another production line 100. The wafers stored in the buffer area 230 may also be read. And according to the reading result, the wafer is conveyed to a corresponding process unit 110 on another production line unit 100 for further processing.

Another embodiment of the present invention provides a lithography method based on the lithography system, as shown in fig. 5, including the following steps:

step S100: the operating state of the process units 110 in the production line 100 is received from the sensing unit 300.

Step S200: it is determined whether the operating status of the process unit 110 in the production line 100 is faulty.

The detection unit 300 is used for detecting the working state, including detecting whether the performance of the equipment of the process unit 110 is reduced, whether the internal parts are damaged or may be damaged, and the like. The inspection unit 300 may also inspect the quality of the processed wafers in each process unit 110, and when the quality of the processed wafers in a process unit 110 is not satisfactory, the process unit 110 is proved to be faulty.

Step S300: when the operation status of the process unit 110 in the production line 100 is a failure, the control unit 400 generates a first control signal to cause the dispatching unit to transfer the wafer from the production line 100 to another adjacent production line 100.

In one embodiment, the dispatching unit 200 reads the wafer information to be transferred, and determines the position information of the wafer according to the wafer information, wherein the position information is used for indicating the process unit 100 of the wafer on the original production line 100. The control unit 400 causes the dispatching unit 200 to transfer the wafer to the corresponding process unit 110 of another adjacent production line 100 according to the position information to generate the first control signal.

In one embodiment, a reading device 240 may be disposed on the dispatching unit 200, and the reading device 240 is used to read the location of the processing unit 110 where the wafer is located on the original production line. After the wafer is transported to the dispatching unit 200 by the transporting device 120, the reading device 240 can directly read the transporting track 210 and directly transport the wafer to another production line 100; the wafers stored in the buffer area 230 may also be read. And according to the reading result, the wafer is conveyed to a corresponding process unit 110 on another production line unit 100 for further processing.

In one embodiment, the corresponding process unit 110 in another production line continues the photolithography process on the wafer.

In some embodiments, another production line 100 performs all subsequent photolithography processing on the wafer, as shown in fig. 6.

According to an embodiment, after the control unit 400 generates the first control signal, the lithographic method further comprises:

the operation state of the process unit 110 in the adjacent another production line 100 is received from the sensing unit 300.

It is determined whether the operating state of the process unit 110 in the other production line 100 is a failure.

When the operating status of the process unit 110 in another production line 100 is a failure, the control unit 400 generates a second control signal to enable the dispatching unit to transfer the wafers from another production line 100 to any adjacent production line 100 for the remaining portion of the lithography process of each wafer.

Either of the adjacent production lines 100 may be the original production line 100 or another production line 100.

In some embodiments, as shown in fig. 7, after the wafers are processed by photolithography in the corresponding process units 110 in another production line 100, the wafers are transferred back to the original production line 100 by the adjustment unit 200, and the remaining portion of the wafers are processed by photolithography in the process units 110. Or each wafer is transferred to another production line 100 by the dispatching unit 200, and the remaining part of the lithography process is performed on each wafer through each process unit 110.

In one embodiment, as shown in fig. 8, the photolithography process performed on the wafer by the process units 110 of each production line 100 at least includes the following process flows:

the wafer is placed on a station to be processed of the production line 100, and then the wafer is sequentially subjected to cold plate coating, bottom anti-reflection coating, pre-baking, adhesion, plate cooling, coating, pre-baking, plate cooling, immersion top coating, pre-baking, edge exposure, wafer back scrubbing treatment, exposure, immersion post-exposure cleaning, post-exposure baking, plate cooling, development and post-development baking through the process units 110. It should be noted that each process unit 110 corresponds to at least one process described above.

The processes related to the development and coating processes in the above-described process flow are performed in the complex apparatus 130, and the processes related to the exposure processes in the above-described process flow are performed in the exposure apparatus 140.

In a specific embodiment, as shown in fig. 9, two production lines 100 (a first production line 100 and a second production line 100) are included, the two production lines 100 simultaneously perform photolithography processing on a plurality of wafers, and the detection unit 300 detects that a failure occurs in three process units 110, namely, a first cold plate, a first coating, and a first pre-bake, which are located after the first adhesion processing process unit 110 in the first production line 100, and detects that the failure occurs in the remaining process units 110 of the second production line 100 except for the three process units 110, namely, the second cold plate, the second coating, and the second pre-bake, which correspond to the above. At this time, the control unit 400 controls the transfer device 120 on the first production line 100 to transfer all the wafers processed by the first adhesion processing process unit 110 to the second production line 100 through the first transfer rail 211 of the calling unit 200, and the second production line 100 transfers the wafers to the second cold plate, the second coating and the second pre-baking process unit 110 of the second production line 100 through the transfer device 120 to process the wafers. After the wafers are processed by the three process units 110, i.e., the second cold plate, the second coating and the second pre-baking, the wafers are transported back to the first production line 100 through the second transfer rail 212, and the wafers are continuously subjected to the subsequent photolithography process from the first cold plate process unit 110 behind the first pre-baking process unit 110 with the failure in the first production line 100.

In another specific embodiment, as shown in fig. 10, the two production lines 100 are provided, the two production lines 100 simultaneously perform the photolithography process on the plurality of wafers, and the detection unit 300 detects that the wafers after the photolithography process have coating defects, but the production line 100 has a plurality of coating processes and fails to detect each coating process unit 110, and thus determines that the performance of one coating process unit 110 is degraded. Based on the above judgment, the user performs a preliminary judgment, screens out the process units 110 that are considered to be possibly problematic, and performs a verification judgment on whether the judgment is correct through the corresponding process units 110 on the other production line 100. Specifically, when a user considers that the performance of the three process units 110 of the cold plate, the coating and the pre-baking in one production line 100 is degraded, a part of the wafers processed in the production line 100, which need to be continuously subjected to the cold plate, the coating and the pre-baking, is transferred to the three process units 110 of the cold plate, the coating and the pre-baking in another production line 100 through the dispatching unit 200 for processing, another part of the wafers is further processed through the three process units 110 of the cold plate, the coating and the pre-baking, which are considered to have problems in the original production line 100, after the three process units 110 of the two production lines 100 process the wafers, all the wafers are sent to the cold plate process unit 110 after the pre-baking process unit 110 of the original production line 100 for processing, and after the processing, the wafers are detected, if the wafers in one production line 100 have defects and the wafers in the other production line 100 have no defects, the user is proved to be suspected to be correct, the performance degradation of the three process units 110, cold plate, coating and pre-bake, requires repair. The production lines 100 may act as a fault monitoring and troubleshooting device with respect to each other.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various changes or substitutions within the technical scope of the present invention, and these should be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. A lithography system, comprising:

at least two independent parallel production lines, each production line having a plurality of process units, each process unit for performing a respective step of a lithographic process on a wafer;

the scheduling unit is used for conveying the wafer from the faulty process unit on the production line to the corresponding process unit on the other adjacent production line according to the control signal of the control unit so as to continue photoetching on the other production line;

the production line comprises conveying equipment, a dispatching unit and a control unit, wherein the conveying equipment is used for conveying the wafers to each process unit and conveying the wafers to the dispatching unit, the dispatching unit comprises a conveying rail, the conveying rail is connected with the conveying equipment of two adjacent production lines and is used for conveying the wafers, the conveying rail comprises a first conveying rail and a second conveying rail, the first conveying rail and the second conveying rail are both connected with the conveying equipment of two adjacent production lines, and the conveying directions of the first conveying rail and the second conveying rail are opposite, so that the wafers are conveyed to and fro between the two adjacent production lines;

the dispatching unit further comprises a buffer area, the buffer area is connected with the transmission equipment and the transmission track, when the number of wafers on the fault process unit is large, one part of the wafers on the fault process unit is directly transmitted to the buffer area through the transmission equipment by the production line where the fault process unit is located, and the other part of the wafers is transmitted to the buffer area through the transmission track.

2. The lithography system of claim 1, wherein said dispatching unit includes a gripper arm for gripping said wafer in accordance with said control signal of said control unit.

3. The lithography system as claimed in claim 2, wherein said gripper arm is provided with a sensor for sensing a position at which said gripper arm grips said wafer.

4. The lithography system of claim 1, wherein said dispatch unit includes a reading device for reading said process unit location at which said wafer is located on said production line.

5. The lithography system according to any one of claims 1 to 4, wherein said production line comprises a complex apparatus and an exposure apparatus, wherein said process unit for exposure processing is located in said exposure apparatus, and said process unit for coating and developing processing is located in said complex apparatus.

6. A lithographic method implemented in a lithographic system as claimed in claim 1, comprising:

7. The lithographic method of claim 6, wherein after the control unit generates the first control signal, the lithographic method further comprises:

8. The lithographic method of claim 6 or 7, further comprising:

receiving the wafer information identified by the scheduling unit;