CN109968626B

CN109968626B - Quick cooling plastic profile extrusion die for wiping adhesive layer by backflow thimble

Info

Publication number: CN109968626B
Application number: CN201910300166.8A
Authority: CN
Inventors: 谢成宗; 谢萍萍; 张莹
Original assignee: Suzhou Kezhilv Information Technology Co ltd
Current assignee: Suzhou Kezhilv Information Technology Co.,Ltd.
Priority date: 2019-04-15
Filing date: 2019-04-15
Publication date: 2021-05-07
Anticipated expiration: 2039-04-15
Also published as: CN109968626A; CN112976537A

Abstract

The invention discloses a fast cooling plastic section extrusion die for wiping a glue layer by a backflow thimble, which structurally comprises a controller, a forming chamber and a bottom box, wherein the controller is arranged on the forming chamber and is electrically connected with the forming chamber, the forming chamber is locked with the bottom box and consists of a forming frame, a forming inner frame, a backflow pipe and a thimble structure, the forming frame is locked with the forming inner frame, the forming inner frame is meshed with the backflow pipe, the thimble structure is arranged on the forming frame and the forming inner frame, the left end of shaping room is followed to the fashioned die body gets into, and the fashioned die body is come out by the right-hand member, goes up the thimble and realizes wiping the gluey dirt of shaping frame left surface with lower thimble, and the gluey dirt of left part die carrier lower surface is wiped by right part base die carrier, cleans the in-process balloon machine and blows off partial gluey dirt, has assisted the clearance effect that has increased the rubber layer of wiping, and the scrubbing layer forms the cluster form simultaneously, has increased frictional force and will thick dirt layer clearance.

Description

Quick cooling plastic profile extrusion die for wiping adhesive layer by backflow thimble

Technical Field

The invention relates to the field of dies, in particular to a quick cooling plastic profile extrusion die for wiping an adhesive layer by a backflow thimble.

Background

In the processing, the polymer in powder or granular form is usually added into a barrel of an extruder, under the action of a screw or a plunger, the polymer moves forwards along a groove body, under the action of a die, a continuous body which is similar to the shape of a die of the die is formed, and finally, the continuous body is cooled and shaped to form products with required shapes, such as various plastic pipes and bars, sheets, plastic steel doors and windows, films, decorative skirting lines and the like.

When the prior art is processed, the semi-formed die body can be adhered with the glue solution on the forming chamber during the processing and forming on the forming chamber, the glue solution inside the forming chamber can not be effectively cleaned manually, if the glue solution is not cleaned in time, the accumulated glue scale can be thickened, the thick layer of the glue scale is increased when the die in the later stage is formed, the die is in a micro-deformation state, and the quality is unqualified.

Disclosure of Invention

The invention mainly aims to overcome the defects of the prior art and provides a quick cooling plastic profile extrusion die for wiping a glue layer by a backflow thimble, so that the problems that glue is adhered to a forming chamber when a semi-formed die body is formed on the forming chamber in a machining process, the glue on the inner side of the forming chamber cannot be effectively cleaned manually, and accumulated glue scales are thickened in the long term if the glue is not cleaned in time, so that a thick layer of the glue scales is added to the later die for forming, the die is in a micro-deformation state, and the quality is not qualified are solved.

The invention is realized by adopting the following technical scheme: the utility model provides a quick cooling plastic material extrusion die of glue film is cleaned to backward flow thimble, its structure includes controller, forming chamber, under casing, the controller is installed in the forming chamber top and the two electricity is connected, forming chamber and under casing locking, the forming chamber is located the under casing top, the forming chamber comprises forming frame, forming inner tower, back flow, thimble structure, the lower extreme locking is put up with the forming inner tower to the forming frame, the forming inner tower meshes and the two communicates with each other with the back flow, thimble structural mounting is in forming frame left surface, thimble structural mounting is in the forming inner tower bottom.

Preferably, the forming inner frame comprises a vertical mounting frame, a forming die frame and a die supporting plate, the vertical mounting frame is locked with the upper end and the lower end of the forming die frame, and the forming die frame is welded with the upper end and the lower end of the die supporting plate.

Further preferably, the forming die frame comprises a left die frame and a right die frame, the left die frame is connected with the right die frame in a rail mode, and the left die frame is located at the left end of the right die frame.

Further preferably, the left part die carrier is equipped with upper die carrier of left part, left part bottom die carrier, the upper die carrier of left part is connected through the lift post with left part bottom die carrier, the upper die carrier of left part is located left part bottom die carrier top, the right part die carrier is equipped with upper die carrier of right part, right part bottom die carrier, upper die carrier of right part is connected through the lift post with right part bottom die carrier, upper die carrier of right part is located right part bottom die carrier top.

Preferably, the right bottom die frame comprises a die frame, a rubber coating layer and a balloon machine, the balloon machine is arranged on the die frame and is positioned on the same axis, the die frame is connected with the rubber coating layer in a gluing mode, and the rubber coating layer is positioned above the die frame.

Further preferably, the rubber wiping layer comprises a wiping layer, a limiting strip, a pressing rod and a clamping frame, the limiting strip is connected with the bottom of the pressing rod in an adhesive mode, the clamping frame is connected with the limiting strip in a sliding mode through the pressing rod, the limiting strip, the pressing rod and the clamping frame are located below the wiping layer, and the clamping frame is located in front of the limiting strip.

Further preferably, the thimble structure includes last thimble, lower thimble, wheel transmission, go up thimble and thimble down through wheel transmission sliding connection on the installation erects the frame, it is relative with lower thimble to go up the thimble, wheel transmission is located thimble right-hand member down.

Advantageous effects

When the semi-formed die body is processed, the semi-formed die body enters from the left end of the forming chamber and then comes out from the right end, the wheel transmission operation drives the upper ejector pin and the lower ejector pin to move up and down, and the upper ejector pin and the lower ejector pin are inserted into the semi-formed die body during movement, so that the die body leaks air, and the semi-formed die body is prevented from being transferred smoothly due to air pressure when moving; when the wheel transmission runs, the water flow in the forming die frame is driven to flow rightwards, and the smooth forming and cooling effects on the forming of the die body are achieved; in order to prevent the water flow from flowing rightwards, the water flow is extracted by the return pipe and returned to the left end of the forming die carrier, so that the stability of the water flow is ensured, and the forming smoothness is improved; when a single plastic product is finished, the forming die set operates, namely the right bottom die set moves downwards, then the left bottom die set and the right bottom die set move relatively, the ring machine blows out gas in an annular shape to assist a glue wiping layer to wipe the lower surface of the left bottom die set during movement, then the right bottom die set rises to return, and because the left die set of the forming die set is a half-formed die body, and when the die body reaches the right die set, the die body is a formed die body, the lower surface of the left die set needs to be wiped, and the lower surface of the right die set does not need to be wiped; if the adhesive scale is thick in the wiping process of the adhesive wiping layer, the thick layer can press down the wiping layer to drive the pressing rod to move downwards, the pressing rod drives the clamping frame to move upwards to cluster the uniformly distributed wiping layer, and the friction force of the clustered wiping layer is increased to further effectively clean the scale layer.

Compared with the prior art, the invention has the beneficial effects that: when processing man-hour, the left end entering of shaping room is followed to half fashioned die body, and fashioned die body is come out by the right-hand member, goes up the thimble and realizes wiping the gluey dirt of shaping frame left surface with lower thimble, and the gluey dirt of left part die carrier lower surface is wiped by right part bottom die carrier, cleans partial gluey dirt of in-process air ring machine blowdown, and the supplementary clearance effect that has increased the rubber layer of wiping, cleans the layer simultaneously and forms the cluster form, has increased frictional force and will thicker dirt layer clearance.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 shows a schematic structural diagram of a rapid cooling plastic profile extrusion die for wiping an adhesive layer by a backflow thimble according to the invention.

FIG. 2 shows a schematic structural view of a front cut-away view of a forming chamber of the present invention.

Fig. 3 shows a schematic structural view of the molded inner frame of the present invention.

Fig. 4 shows a schematic structural diagram of the forming die carrier of the invention.

Figure 5 shows a structural schematic diagram of the invention in a cut-away view of the left scaffold.

Fig. 6 shows a schematic structural view of the right bottom mold frame of the present invention.

Fig. 7 shows a schematic structural diagram of a of fig. 6 according to the present invention.

FIG. 8 shows a schematic of the structure of A of FIG. 6 of the present invention, also in the form of a tuft of wipe layers.

Fig. 9 shows a schematic structural diagram of B of fig. 2 according to the present invention.

In the figure: the device comprises a control machine 1, a forming chamber 2, a bottom box 3, a forming frame 20, a forming inner frame 21, a return pipe 22, a thimble structure 23, a mounting vertical frame 210, a forming die set 211, a die supporting plate 212, a left die set 2110, a right die set 2111, a left upper die set 21100, a left bottom die set 21101, a right upper die set 21110, a right bottom die set 21111, a die frame 211111, a frictioning layer 211112, a balloon machine 211113, a frictioning layer 2111120, a limiting strip 2111121, a pressure lever 2111122, a clamping frame 2111123, an upper thimble 230, a lower thimble 231 and a wheel transmission 232.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-9, the present invention provides a technical solution of an extrusion mold for a fast cooling plastic profile with a reflowed thimble to wipe a glue layer, comprising: its structure includes controller 1, forming chamber 2, under casing 3, controller 1 installs on forming chamber 2 and the two electricity is connected, forming chamber 2 locks with under casing 3, forming chamber 2 comprises forming frame 20, forming inner frame 21, back flow 22, thimble structure 23, forming frame 20 locks with forming inner frame 21, forming inner frame 21 meshes with back flow 22, thimble structure 23 is installed on forming frame 20, forming inner frame 21, back flow 22 is used for returning the water that flows in forming inner frame 21, realizes that water lasts smooth flow and also is used for supplementary cooling shaping to the die body, and the helical design of back flow 22 realizes the shaping of cooling down to the die body comprehensively simultaneously, forming inner frame 21 is including installation vertical frame 210, forming die carrier 211, mould backup pad 212, installation vertical frame 210 locks with forming die carrier 211, forming die carrier 211 welds with mould backup pad 212, the forming die set 211 is a forming die set of a die body, and the forming die set 211 is divided into a left part and a right part, can be decomposed and moved, can wipe the forming die set when moved, avoids sticking a mold glue to form mold scale, and causes the die body to slightly deform when forming, the forming die set 211 comprises a left die set 2110 and a right die set 2111, the left die set 2110 is connected with a right die set 2111 through a lifting column, the left die set 2110 is connected with a right die set 2111 through a track, the left die set 2110 is provided with a left upper die set 21100 and a left bottom die set 21101, the left upper die set 21100 is connected with the left bottom die set 21101 through a lifting column, the right die set 2111 is provided with a right upper die set 21110 and a right bottom die set 21111, the right upper die set 21110 is connected with the right bottom die set 21111 through a lifting column, the upper end surface of the right bottom die set 21111 can wipe the lower surface of the left bottom die set 21101, and the right bottom die set 21111 comprises, A wipe layer 211112, a balloon machine 211113, the balloon machine 211113 mounted on a former 211111, the model frame 211111 is connected with a frictioning layer 211112, the air ring machine 211113 blows off the part of the rubber layer on the surface of the left bottom model frame 21101 in a rotating air-out mode, the glue wiping layer 211112 is used for wiping the surface of the left bottom mould frame 21101, the frictioning layer 211112 comprises a frictioning layer 2111120, a limiting strip 2111121, a pressure bar 2111122 and a clamping frame 2111123, the limiting strips 2111121 are connected with a pressure rod 2111122 through glue, the clamping frame 2111123 is connected on the limiting strips 2111121 through the pressure rod 2111122 in a sliding way, the thimble structure 23 includes an upper thimble 230, a lower thimble 231, and a wheel transmission 232, the upper thimble 230 and the lower thimble 231 are slidably connected to the mounting vertical frame 210 through a wheel transmission 232, the upper thimble 230 and the lower thimble 231 are used for inserting half-mold bodies into pinholes, the semi-molding die body is used for realizing air discharge and avoiding the influence of the expansion of the die body on the further molding of the die body caused by the air pressure generated by the semi-molding die body during the conveying.

During processing, the semi-formed mold body enters from the left end of the forming chamber 2 and then comes out from the right end, the wheel transmission 232 operates to drive the upper ejector pin 230 and the lower ejector pin 231 to move up and down, and the needle body is inserted into the semi-formed mold body when the upper ejector pin 230 and the lower ejector pin 231 move, so that the mold body leaks air, and the semi-formed mold body is prevented from being transferred smoothly due to air pressure when moving; when the wheel transmission 232 operates, water flow in the forming die holder 211 is driven to flow rightwards, and the forming smoothness and cooling effect on the die body is achieved; in order to prevent the water flow from flowing rightwards, the water flow is extracted by the return pipe 22 and returned to the left end of the forming die carrier 211, so that the stability of the water flow is ensured, and the forming smoothness is improved; when a single plastic product is finished, the forming mold frame 211 operates, namely the mold frame 21111 at the bottom of the right part moves downwards, then the mold frame 21101 at the bottom of the left part and the mold frame 21111 at the bottom of the right part move relatively, the balloon machine 211113 blows air in a ring shape to assist a glue wiping layer 211112 to wipe the lower surface of the mold frame 21101 at the bottom of the left part when moving, then the mold frame 21111 at the bottom of the right part rises to return, and because the mold frame 2110 at the left part of the forming mold frame 211 is a half-formed mold body, and when the mold body reaches the mold frame 2111, the mold body is already a formed mold body 2110, the lower surface at the mold frame at the left part needs to be wiped, and the lower surface of the mold frame; if the adhesive scale is thick in the wiping process of the adhesive wiping layer 211112, the wiping layer 2111120 is pressed down by the thick layer to drive the pressing rod 2111122 to move downwards, the pressing rod 2111122 drives the clamping frame 2111123 to move upwards to cluster the wiping layer 2111120 which is uniformly distributed, and the friction force of the clustered wiping layer 2111120 is increased to further effectively clean the scale layer.

Compared with the prior art, the invention has the technical progress that: when processing, the half-formed die body gets into from the left end of molding chamber 2, the fashioned die body is come out by the right-hand member, go up thimble 230 and thimble 231 and realize wiping the glue dirt of shaping frame 20 left surface, the glue dirt of left part die carrier 2110 lower surface is wiped by right part bottom die carrier 21111, wipe the in-process air ring machine 211113 and blow off partial glue dirt, the supplementary clearance effect that has increased rubber layer 211112, wipe layer 2111120 simultaneously and form the cluster form, increased frictional force and cleared up thicker dirt layer.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a quick cooling plastic material extrusion tooling of glue film is cleaned to backward flow thimble, its structure includes controller (1), forming chamber (2), under casing (3), install on forming chamber (2) and the two electricity is connected in controller (1), forming chamber (2) and under casing (3) locking, its characterized in that:

the forming chamber (2) is composed of a forming frame (20), a forming inner frame (21), a return pipe (22) and an ejector pin structure (23), the forming frame (20) is locked with the forming inner frame (21), the forming inner frame (21) is meshed with the return pipe (22), and the ejector pin structure (23) is installed on the forming frame (20) and the forming inner frame (21);

the forming inner frame (21) comprises a mounting vertical frame (210), a forming die set (211) and a die supporting plate (212), the mounting vertical frame (210) is locked with the forming die set (211), the forming die set (211) is welded with the die supporting plate (212), the forming die set (211) comprises a left die set (2110) and a right die set (2111), and the left die set (2110) is in rail connection with the right die set (2111);

the left mould frame (2110) is provided with a left upper mould frame (21100) and a left bottom mould frame (21101), the left upper mould frame (21100) is connected with the left bottom mould frame (21101) through a lifting column, the right mould frame (2111) is provided with a right upper mould frame (21110) and a right bottom mould frame (21111), and the right upper mould frame (21110) is connected with the right bottom mould frame (21111) through the lifting column;

the right bottom mould frame (21111) comprises a jig (211111), a frictioning layer (211112) and a balloon machine (211113), wherein the balloon machine (211113) is installed on the jig (211111), and the jig (211111) is connected with a frictioning layer (211112) in an adhesive manner;

wipe glue film (211112) including wiping layer (2111120), spacing strip (2111121), depression bar (2111122), holder (2111123), spacing strip (2111121) and depression bar (2111122) glue are connected, sliding connection on spacing strip (2111121) is passed through depression bar (2111122) in holder (2111123), thimble structure (23) are including last thimble (230), lower thimble (231), wheel drive (232), go up thimble (230) and lower thimble (231) through wheel drive (232) sliding connection on installation vertical retort (210).