CN109967551A - It is a kind of to produce bonding tin plating alloy wire integrated apparatus of the high quality containing gold - Google Patents

It is a kind of to produce bonding tin plating alloy wire integrated apparatus of the high quality containing gold Download PDF

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Publication number
CN109967551A
CN109967551A CN201910312321.8A CN201910312321A CN109967551A CN 109967551 A CN109967551 A CN 109967551A CN 201910312321 A CN201910312321 A CN 201910312321A CN 109967551 A CN109967551 A CN 109967551A
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China
Prior art keywords
rodless cylinder
bonding
polishing piece
reservoir
tin plating
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Granted
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CN201910312321.8A
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Chinese (zh)
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CN109967551B (en
Inventor
欧阳艳青
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Jiangxi Fuhong Metal Co Ltd
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Jiangxi Fuhong Metal Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C1/00Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
    • B21C1/02Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/04Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
    • B21C37/042Manufacture of coated wire or bars
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/04Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
    • B21C37/047Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire of fine wires
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/52Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length
    • C21D9/54Furnaces for treating strips or wire
    • C21D9/56Continuous furnaces for strip or wire
    • C21D9/573Continuous furnaces for strip or wire with cooling
    • C21D9/5732Continuous furnaces for strip or wire with cooling of wires; of rods
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/003Apparatus
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08Tin or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36Elongated material
    • C23C2/38Wires; Tubes
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00Apparatus for cleaning or pickling metallic material
    • C23G3/02Apparatus for cleaning or pickling metallic material for cleaning wires, strips, filaments continuously
    • C23G3/021Apparatus for cleaning or pickling metallic material for cleaning wires, strips, filaments continuously by dipping

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

Bonding tin plating alloy wire integrated apparatus of the high quality containing gold is produced the present invention provides a kind of, including actinobacillus wheel and take-up pulley, wire drawing machine, annealing furnace, cooling device, acid dip pickle and tinning stack are disposed between the actinobacillus wheel and the take-up pulley, wiping arrangement is equipped between the acid dip pickle and the tinning stack, wiping can be dried to the bonding line after pickling in the wiping arrangement;The cooling device can voluntarily adjust temperature, and the acid dip pickle can be automatically replenished pickling medical fluid;It can realize the integration production of bonding gold thread and tin plating process, and high degree of automation can effectively improve working efficiency;And tin equipment is improved, tin plating effect can be effectively improved, guarantees product quality.

Description

It is a kind of to produce bonding tin plating alloy wire integrated apparatus of the high quality containing gold
Technical field
The present invention relates to the production equipment fields for being bonded tin plating alloy wire, contain more particularly, to a kind of production high quality The tin plating alloy wire integrated apparatus of bonding of gold.
Background technique
When bonding wire is semiconductor devices and integrated Circuit assembly, for make the input/output bonding point of core on-chip circuit with The micro-wire lead of electrical connection is realized between the interior contact point of lead frame.As bonding lead, it is answered bonding wire Have the following performance: conductivity is high, and conductive capability is strong, and strong with the binding force of conductor material, stable chemical performance will not be formed with Harmful intermetallic compound, plasticity is good, is easy to weld, and is able to maintain certain shape, has defined tensile strength and stretches Long rate etc..At present bonding wire mainly have spun gold, aluminium silicon silk, copper wire and alloy wire etc., wherein spun gold is because it has excellent performance It is widely used in IC lead;Simultaneously existing bonding gold wire in order to preferably apply and, need to carry out tin plating technique in practice, Facilitate subsequent welding;Tin plating technique therein generally comprises wire drawing, annealing, cooling, pickling and tin plating several steps, and in acid It can inevitably be stained with pickling solution on wire after washing, the structure for solving the defect is not had in existing tin equipment, is led It causes pickling solution to enter in liquid tin, influences subsequent tin plating work, it is possible to lead to tin plating incomplete, reduction product quality.
Summary of the invention
In order to overcome the drawbacks of the prior art, technical problem to be solved by the present invention lies in propose a kind of production high quality The tin plating alloy wire integrated apparatus of bonding containing gold can realize the integration production of bonding gold thread and tin plating process, automation Degree is high, can effectively improve working efficiency;And tin equipment is improved, tin plating effect can be effectively improved, guarantees product matter Amount.
For this purpose, the following technical solution is employed by the present invention:
The present invention provides it is a kind of produce high quality containing gold the tin plating alloy wire integrated apparatus of bonding, including actinobacillus wheel and Take-up pulley, be disposed between the actinobacillus wheel and the take-up pulley wire drawing machine, annealing furnace, cooling device, acid dip pickle and Tinning stack is equipped with wiping arrangement, after the wiping arrangement can be to pickling between the acid dip pickle and the tinning stack Wiping is dried in bonding line;The cooling device can voluntarily adjust temperature, and the acid dip pickle can be automatically replenished pickling medical fluid;
The wiping arrangement includes cabinet and is fixed at the intracorporal workbench of the case, the both ends open of the cabinet, Entrance and output for bonding line;The top surface of the workbench is equipped with the first rodless cylinder and the second rodless cylinder, described First rodless cylinder and second rodless cylinder are arranged along same rectilinear direction, first rodless cylinder and second nothing Bar cylinder is mutually closed on close to the one end at the cabinet center;Sliding is equipped with the first sliding block on first rodless cylinder, and described the One sliding block is equipped with the first polishing piece, and the top of first rodless cylinder is equipped with the first push-rod electric machine, the first push rod electricity Machine is fixedly mounted on the wherein open ports on the cabinet and close to the cabinet, the piston rod of first push-rod electric machine It is arranged downward, end is fixed with the first pressing plate, and first pressing plate is equipped with the first polishing piece;On second rodless cylinder Sliding is equipped with the second sliding block, and second sliding block is equipped with the second polishing piece, and the top of second rodless cylinder is equipped with second Push-rod electric machine, second push-rod electric machine is fixedly mounted on another open ports on the cabinet and close to the cabinet, described The piston rod of second push-rod electric machine is arranged downward, and end is fixed with the second pressing plate, and second pressing plate is equipped with the second wiping Part;
The top at the position that first rodless cylinder and second rodless cylinder mutually close on is equipped with frame plate, the frame plate Setting direction is vertical with the setting direction of first rodless cylinder, and the frame plate is fixed on the two opposite side walls of the cabinet On, the bottom surface of the frame plate is equipped with third rodless cylinder, and sliding is equipped with third sliding block on the third rodless cylinder, and described the The bottom surface of three sliding blocks is fixed with mounting plate, and the bottom surface of the mounting plate is fixed with wipes for the first polishing piece of wiper and second Wipe the scraper plate of part;The a plurality of live-roller for bonding line deflecting is additionally provided in the cabinet, bonding line is led a plurality of live-roller Successively pass through from the top surface of the top surface of first polishing piece, the top of the frame plate, second polishing piece downwards.
In preferably technical solution of the invention, first polishing piece includes bottom plate and the peace set on the plate top surface Mounted box, the mounting box are fixedly connected with the bottom plate by screw, the recessed formation mounting groove in the top surface of the mounting box, described Foam-rubber cushion is fixed in mounting groove, the top surface of the foam-rubber cushion is higher than the top surface of the mounting box;Second polishing piece with The first polishing piece structure is identical.
In preferably technical solution of the invention, heat-generating pipe is installed, the bottom of the mounting groove is set in the mounting box There is through-hole, the mounting groove by being connected to inside the through-hole and the mounting box, wipe by second polishing piece and described first It is identical to wipe part structure.
In preferably technical solution of the invention, the cooling device includes the open cooling bath in top, the cooling bath Interior to be equipped with live-roller, bonding line under the guiding of live-roller close to the bottom of the cooling bath through passing through;The bottom of the cooling bath It is embedded with cooling piece, the cooling bath inner wall is equipped with temperature sensor, and the cooling piece and the temperature sensor are with One controller electrically connects.
In preferably technical solution of the invention, the top of the cooling bath is equipped with water inlet pipe, and the water inlet pipe is fixed on On the side wall of the cooling bath and with external source connect, the water inlet pipe be equipped with the first solenoid valve, the cooling bath it is interior Wall is equipped with the first liquid level sensor, and the locating height of first liquid level sensor is higher than live-roller, first level sensing Device and first solenoid valve are electrically connected with first controller;The sidewall bottom connection of the cooling bath is equipped with first row Liquid pipe, first drain pipe are equipped with switch valve.
In preferably technical solution of the invention, the acid dip pickle includes the open reservoir in top, the reservoir Interior to be equipped with live-roller, bonding line under the guiding of live-roller close to the bottom of the reservoir through passing through;The top of the reservoir Equipped with inlet tube, the inlet tube is fixed on the side wall of the reservoir and is connected to extraneous acid solution supply arrangement, it is described into Liquid pipe is equipped with second solenoid valve, and the reservoir inner wall is equipped with the second liquid level sensor and pH value sensor, the pH value Sensor is mounted on the bottom of the reservoir, and the locating height of second liquid level sensor is higher than the height of live-roller, described Second liquid level sensor, the pH value sensor and the second solenoid valve are electrically connected with second controller;The reservoir Sidewall bottom connection be equipped with the second drain pipe, second drain pipe be equipped with switch valve.
In preferably technical solution of the invention, the top side wall connection of the reservoir is equipped with discharger, the spilling Pipe is higher than second liquid level sensor, and the other end of the discharger is connected to fluid reservoir.
The invention has the benefit that
It is provided by the invention it is a kind of produce bonding tin plating alloy wire integrated apparatus of the high quality containing gold, set gradually and phase Wire drawing machine, annealing furnace, cooling device, acid dip pickle, wiping arrangement and the tinning stack mutually cooperated is, it can be achieved that bonding gold thread and plating The integration production of tin process, high degree of automation can effectively improve working efficiency;Wherein the setting of wiping arrangement can be to pickling Wiping is dried in bonding line afterwards, it is ensured that bonding line enters before tinning stack in drying regime, prevents pickling medical fluid from entering Into liquid tin, guarantee being normally carried out for subsequent tin plating work, guarantees product quality;And cooling device can voluntarily adjust temperature Degree, can effectively improve cooling efficiency, and acid dip pickle can be automatically replenished pickling medical fluid, guarantee being normally carried out for acid pickling step, whole Cooperation the degree of automation is done, and can further improve working efficiency.
Detailed description of the invention
Fig. 1 is a kind of tin plating alloy wire one of bonding for producing high quality containing gold provided in specific embodiments of the present invention Disguise the structural schematic diagram set;
Fig. 2 is the structural schematic diagram of the wiping arrangement provided in specific embodiments of the present invention;
Fig. 3 is the structural schematic diagram of the first polishing piece provided in specific embodiments of the present invention;
Fig. 4 is the structural schematic diagram of the cooling device provided in specific embodiments of the present invention;
Fig. 5 is the structural schematic diagram of the acid dip pickle provided in specific embodiments of the present invention.
In figure:
110, actinobacillus wheel;120, take-up pulley;200, wire drawing machine;300, annealing furnace;400, cooling device;410, cooling bath; 420, cooling piece;430, temperature sensor;440, the first controller;450, water inlet pipe;460, the first solenoid valve;470, the first liquid Level sensor;480, the first drain pipe;500, acid dip pickle;510, reservoir;520, inlet tube;530, second solenoid valve; 540, the second liquid level sensor;550, pH value sensor;560, second controller;570, the second drain pipe;580, discharger; 590, fluid reservoir;600, tinning stack;700, wiping arrangement;710, cabinet;720, workbench;730, the first rodless cylinder; 731, the first sliding block;740, the second rodless cylinder;741, the second sliding block;750, the first push-rod electric machine;751, the first pressing plate;760, Second push-rod electric machine;761, the second pressing plate;770, frame plate;780, third rodless cylinder;781, third sliding block;790, mounting plate; 791, scraper plate;810, the first polishing piece;820, the second polishing piece;830, bottom plate;840, mounting box;850, mounting groove;860, extra large Silk floss pad;870, heat-generating pipe;880, through-hole.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
As shown in Figure 1, disclosed in specific embodiments of the present invention it is a kind of produce high quality containing gold bonding plate tin alloy Line integrated apparatus, including actinobacillus wheel 110 and take-up pulley 120, successively set between the actinobacillus wheel 110 and the take-up pulley 120 It is equipped with wire drawing machine 200, annealing furnace 300, cooling device 400, acid dip pickle 500 and tinning stack 600, the acid dip pickle 500 And wiping arrangement 700 is equipped between the tinning stack 600, the wiping arrangement 700 can do the bonding line after pickling Dry wiping;The cooling device 400 can voluntarily adjust temperature, and the acid dip pickle 500 can be automatically replenished pickling medical fluid.
A kind of above-mentioned high quality that produces sets gradually and cooperates containing the golden tin plating alloy wire integrated apparatus of bonding Wire drawing machine 200, annealing furnace 300, cooling device 400, acid dip pickle 500, wiping arrangement 700 and tinning stack 600, it can be achieved that It is bonded the integration production of gold thread and tin plating process, high degree of automation can effectively improve working efficiency;Wherein wiping arrangement Wiping can be dried to the bonding line after pickling in 700 setting, it is ensured that bonding line enters before tinning stack 600 in dry shape State prevents pickling medical fluid from entering in liquid tin, guarantees being normally carried out for subsequent tin plating work, guarantees product quality;And it is cold But device 400 can voluntarily adjust temperature, can effectively improve cooling efficiency, and acid dip pickle 500 can be automatically replenished pickling medical fluid, guarantee Acid pickling step is normally carried out, and overall co-ordination the degree of automation is done, and can further improve working efficiency;It should be noted that putting Line wheel 110, take-up pulley 120, wire drawing machine 200, annealing furnace 300 and tinning stack 600 are production equipments commonly used in the art, It can directly purchase, use on the market.
When carrying out bonding gold thread wire drawing and tin plating integration production using the present invention, gold thread thick line is bonded in wire drawing machine 200 Under the action of form the bonding gold thread of aimed dia, be then bonded gold thread and enter in annealing furnace 300 high temperature and eliminate stress, after annealing Bonding gold thread enter in cooling device 400 and cool off, bonding gold thread after cooling then enters complete in acid dip pickle 500 At pickling;And pickling medical fluid is inevitably stained on the bonding gold thread after pickling, bonding gold thread is by 700 metapedes of wiping arrangement to incite somebody to action Pickling medical fluid wiped clean;Bonding gold thread after drying, which enters in tinning stack 600, to be completed tin plating, and is finally wound in take-up pulley On 120.
Further, as shown in Fig. 2, the wiping arrangement 700 includes cabinet 710 and is fixed in the cabinet 710 Workbench 720, the both ends open of the cabinet 710, for bonding line entrance and output;The top surface of the workbench 720 First rodless cylinder 730 and the second rodless cylinder 740, first rodless cylinder 730 and second rodless cylinder are installed 740 are arranged along same rectilinear direction, and first rodless cylinder 730 and second rodless cylinder 740 are close to the cabinet 710 The one end at center is mutually closed on;Sliding is equipped with the first sliding block 731 on first rodless cylinder 730, sets on first sliding block 731 There is the first polishing piece 810, the top of first rodless cylinder 730 is equipped with the first push-rod electric machine 750, first push-rod electric machine 750 are fixedly mounted on the wherein open ports on the cabinet 710 and close to the cabinet 710, first push-rod electric machine 750 piston rod is arranged downward, and end is fixed with the first pressing plate 751, and first pressing plate 751 is equipped with the first polishing piece 810;Sliding is equipped with the second sliding block 741 on second rodless cylinder 740, and second sliding block 741 is equipped with the second polishing piece 820, the top of second rodless cylinder 740 is equipped with the second push-rod electric machine 760, and second push-rod electric machine 760 is fixedly mounted Another open ports on the cabinet 710 and close to the cabinet 710, the piston rod of second push-rod electric machine 760 is downward Setting, end are fixed with the second pressing plate 761, and second pressing plate 761 is equipped with the second polishing piece 820;
The top at the position that first rodless cylinder 730 and 740 phase of the second rodless cylinder are closed on is equipped with frame plate 770,770 setting direction of frame plate is vertical with the setting direction of first rodless cylinder 730, and the frame plate 770 is fixed on In the two opposite side walls of the cabinet 710, the bottom surface of the frame plate 770 is equipped with third rodless cylinder 780, and the third is without bar Sliding is equipped with third sliding block 781 on cylinder 780, and the bottom surface of the third sliding block 781 is fixed with mounting plate 790, the installation The bottom surface of plate 790 is fixed with the scraper plate 791 for wiper the first polishing piece 810 and the second polishing piece 820;The cabinet 710 It is inside additionally provided with a plurality of live-roller for bonding line deflecting, bonding line is successively wiped from described first under the guiding of a plurality of live-roller Wipe the top surface of part 810, the top of the frame plate 770, second polishing piece 820 top surface pass through.
Above-mentioned wiping arrangement 700 can carry out the dry movement of wiping to the bonding line after pickling, specifically, when bonding When line is entered in cabinet 710, the first sliding block 731 is located at the lower section of the first push-rod electric machine 750, and the first push-rod electric machine 750 Piston rod is in elongation state, so that being bonded to each other between two first polishing pieces 810, bonding line is passed through from bonding position, thus Achieve the effect that wiping is dry;And the second push-rod electric machine 760 is in standby, the second polishing piece 820 on the second pressing plate 761 On impurity fall naturally, and the second sliding block 741 is in the lower section of scraper plate 791, and third rodless cylinder 780 starts, and drives scraper plate The second polishing piece 820 on 791 pair of second sliding block 741 carries out wiper, clears up the impurity on foam-rubber cushion 860;When the first push rod electricity Machine 750 and 730 cooperating of the first rodless cylinder for a period of time after, replaced, the second sliding block 741 at this time is located at the The lower section of two push-rod electric machines 760, the second push-rod electric machine 760, which starts, is bonded two second polishing pieces 820, and bonding line is from patch Coincidence, which is set, to be rushed across, and then the first push-rod electric machine 750 resets, the starting of the first rodless cylinder 730,731 movement value scraper plate of the first sliding block 791 lower sections, third rodless cylinder 780 start, and scraper plate 791 is driven to scrape the first polishing piece 810 on the first sliding block 731 Brush, gap repeat above-mentioned movement, guarantee being normally carried out for para-linkage line wiping work, and ensure wiping effect;It needs to illustrate It is that staff needs to be timed foam-rubber cushion 860 inspection or clears up, even replaces manually.
Further, as shown in figure 3, first polishing piece 810 is including bottom plate 830 and is set to 830 top surface of bottom plate Mounting box 840, the mounting box 840 is fixedly connected with the bottom plate 830 by screw, under the top surface of the mounting box 840 Spill is fixed with foam-rubber cushion 860 at mounting groove 850 in the mounting groove 850, the top surface of the foam-rubber cushion 860 is higher than described The top surface of mounting box 840;Second polishing piece 820 is identical as 810 structure of the first polishing piece;The structure setting can facilitate The replacement of polishing piece or foam-rubber cushion 860 guarantees that para-linkage line carries out lasting and effective wiping action.
Further, heat-generating pipe 870 is installed, the bottom of the mounting groove 850 is equipped with through-hole in the mounting box 840 880, the mounting groove 850 inside the through-hole 880 and the mounting box 840 by being connected to, second polishing piece 820 and institute It is identical to state 810 structure of the first polishing piece;The setting of heat-generating pipe 870 can carry out heating, drying convenient for para-linkage line, and through-hole 880 Setting then can preferably transmit convenient for heat.
Further, as shown in figure 4, the cooling device 400 includes the open cooling bath 410 in top, the cooling bath Live-roller is equipped in 410, bonding line under the guiding of live-roller close to the bottom of the cooling bath 410 through passing through;The cooling bath 410 bottom is embedded with cooling piece 420, and 410 inner wall of cooling bath is equipped with temperature sensor 430, the cooling piece 420 and The temperature sensor 430 is electrically connected with the first controller 440;The setting of cooling piece 420 and temperature sensor 430 can basis The temperature of liquid in cooling bath 410 is freezed, thus accelerate the temperature of the bonding line after annealing, it is convenient followed by pickling Step.
Further, the top of the cooling bath 410 is equipped with water inlet pipe 450, and the water inlet pipe 450 is fixed on the cooling It is connected on the side wall of slot 410 and with external source, the water inlet pipe 450 is equipped with the first solenoid valve 460, the cooling bath 410 Inner wall the first liquid level sensor 470 is installed, the locating height of first liquid level sensor 470 is higher than live-roller, described the One liquid level sensor 470 and first solenoid valve 460 are electrically connected with first controller 440;The cooling bath 410 Sidewall bottom connection is equipped with the first drain pipe 480, and first drain pipe 480 is equipped with switch valve;The 450, first electricity of water inlet pipe The cooperation of magnet valve 460 and the first liquid level sensor 470, it is ensured that the water quantity holding in cooling bath 410 in a certain range, can Ensure that cooling water can flood bonding line, to accelerate cooling effect;Specifically, when the first liquid level sensor 470 detect it is cold But when the water in slot 410 is lower than preset value, 440 the first solenoid valve of coordinated control 460 of the first controller is opened, toward cooling bath A certain amount of clear water of injection in 410.
Further, as shown in figure 5, the acid dip pickle 500 includes the open reservoir 510 in top, the reservoir Live-roller is equipped in 510, bonding line under the guiding of live-roller close to the bottom of the reservoir 510 through passing through;The reservoir 510 top be equipped with inlet tube 520, the inlet tube 520 be fixed on the side wall of the reservoir 510 and with extraneous acid solution Supply arrangement connection, the inlet tube 520 are equipped with second solenoid valve 530, and 510 inner wall of reservoir is equipped with the second liquid level Sensor 540 and pH value sensor 550, the pH value sensor 550 are mounted on the bottom of the reservoir 510, and described second The locating height of liquid level sensor 540 is higher than the height of live-roller, second liquid level sensor 540, the pH value sensor 550 And the second solenoid valve 530 is electrically connected with second controller 560;The sidewall bottom connection of the reservoir 510 is equipped with the Two drain pipes 570, second drain pipe 570 are equipped with switch valve.
Above-mentioned acid dip pickle at work, ensures bonding line close to reservoir 510 under the action of live-roller first Bottom is passed through, wherein the setting of the second liquid level sensor 540 can guarantee the pickling medical fluid minimum flow in reservoir 510, further Ensure that medical fluid can submerge bonding line;And inlet tube 520 and second solenoid valve 530 are then to play supplemental acid wash liquid, It is default that second liquid level sensor 540 detects that liquid volume is higher than lower than the pH value that preset value or pH value sensor 550 detect medical fluid When value, second controller 560 opens coordinated control second solenoid valve 530, pickling medical fluid is injected in reservoir 510, to PH Be worth the detected value of sensor 550 and the second liquid level sensor 540 within a preset range when, close second solenoid valve 530.
Further, the top side wall connection of the reservoir 510 is equipped with discharger 580, and the discharger 580 is higher than institute The second liquid level sensor 540 is stated, the other end of the discharger 580 is connected to fluid reservoir 590;Second liquid level sensor 540 and It ensure that the minimum flow of pickling medical fluid and highest pH value in reservoir 510 under coordination between pH value sensor 550, however not excluded that can The relatively more but more excessively high pH value situation of pickling liquid volume can occur, need to supplement medical fluid in reservoir 510, it is thus possible to can go out The excessive problem of existing pickling liquid volume, and the setting of discharger 580 can prevent the pickling medical fluid in reservoir 510 excessive, and will The medical fluid of spilling is collected, and reduces waste.
The present invention is described with reference to the preferred embodiments, and those skilled in the art know, of the invention not departing from In the case where spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.The present invention is not by this The limitation of specific embodiment disclosed in place, other embodiments fallen into claims hereof belong to protection of the present invention Range.

Claims (7)

1. a kind of produce bonding tin plating alloy wire integrated apparatus of the high quality containing gold, including actinobacillus wheel (110) and take-up pulley (120), be disposed between the actinobacillus wheel (110) and the take-up pulley (120) wire drawing machine (200), annealing furnace (300), Cooling device (400), acid dip pickle (500) and tinning stack (600), it is characterised in that:
Wiping arrangement (700) are equipped between the acid dip pickle (500) and the tinning stack (600), the wiping arrangement (700) wiping can be dried to the bonding line after pickling;The cooling device (400) can voluntarily adjust temperature, the pickling Device (500) can be automatically replenished pickling medical fluid;
The wiping arrangement (700) includes cabinet (710) and the workbench (720) being fixed in the cabinet (710), described The both ends open of cabinet (710), entrance and output for bonding line;The top surface of the workbench (720) is equipped with the first nothing Bar cylinder (730) and the second rodless cylinder (740), first rodless cylinder (730) and second rodless cylinder (740) edge Same rectilinear direction setting, first rodless cylinder (730) and second rodless cylinder (740) are close to the cabinet (710) one end at center is mutually closed on;Sliding is equipped with the first sliding block (731) on first rodless cylinder (730), and described first is sliding Block (731) is equipped with the first polishing piece (810), and the top of first rodless cylinder (730) is equipped with the first push-rod electric machine (750), first push-rod electric machine (750) be fixedly mounted on the cabinet (710) and close to the cabinet (710) its In an open ports, the piston rod of first push-rod electric machine (750) is arranged downward, and end is fixed with the first pressing plate (751), institute The first pressing plate (751) are stated equipped with the first polishing piece (810);Sliding is equipped with the second sliding block on second rodless cylinder (740) (741), second sliding block (741) is equipped with the second polishing piece (820), and the top of second rodless cylinder (740) is equipped with Second push-rod electric machine (760), second push-rod electric machine (760) are fixedly mounted on the cabinet (710) and close to the casees The piston rod of another open ports of body (710), second push-rod electric machine (760) is arranged downward, and end is fixed with the second pressure Plate (761), second pressing plate (761) are equipped with the second polishing piece (820);
The top at the position that first rodless cylinder (730) and second rodless cylinder (740) mutually close on is equipped with frame plate (770), frame plate (770) setting direction is vertical with the setting direction of first rodless cylinder (730), the frame plate (770) it is fixed in the two opposite side walls of the cabinet (710), the bottom surface of the frame plate (770) is equipped with third rodless cylinder (780), sliding is equipped with third sliding block (781) on the third rodless cylinder (780), and the bottom surface of the third sliding block (781) is solid Surely mounting plate (790) are equipped with, the bottom surface of the mounting plate (790) is fixed with for the first polishing piece of wiper (810) and second The scraper plate (791) of polishing piece (820);The a plurality of live-roller for bonding line deflecting, bonding line are additionally provided in the cabinet (710) Successively from the top surface of first polishing piece (810), the top, described of the frame plate (770) under the guiding of a plurality of live-roller The top surface of second polishing piece (820) is passed through.
2. a kind of high quality that produces according to claim 1 is containing the golden tin plating alloy wire integrated apparatus of bonding, feature It is:
First polishing piece (810) include bottom plate (830) and be set to the bottom plate (830) top surface mounting box (840), it is described Mounting box (840) is fixedly connected with the bottom plate (830) by screw, the recessed formation installation in the top surface of the mounting box (840) Slot (850), the mounting groove (850) is interior to be fixed with foam-rubber cushion (860), and the top surface of the foam-rubber cushion (860) is higher than the peace The top surface of mounted box (840);Second polishing piece (820) is identical as the first polishing piece (810) structure.
3. a kind of high quality that produces according to claim 2 is containing the golden tin plating alloy wire integrated apparatus of bonding, feature It is:
It is equipped with heat-generating pipe (870) in the mounting box (840), the bottom of the mounting groove (850) is equipped with through-hole (880), institute Mounting groove (850) are stated by being connected to inside the through-hole (880) and the mounting box (840), second polishing piece (820) and First polishing piece (810) structure is identical.
4. a kind of high quality that produces according to claim 1 is containing the golden tin plating alloy wire integrated apparatus of bonding, feature It is:
The cooling device (400) includes the open cooling bath in top (410), and live-roller, key are equipped in the cooling bath (410) Zygonema is passed through through the bottom under the guiding of live-roller close to the cooling bath (410);The bottom of the cooling bath (410) is embedded with Cooling piece (420), cooling bath (410) inner wall are equipped with temperature sensor (430), the cooling piece (420) and the temperature Degree sensor (430) is electrically connected with the first controller (440).
5. a kind of high quality that produces according to claim 4 is containing the golden tin plating alloy wire integrated apparatus of bonding, feature It is:
The top of the cooling bath (410) is equipped with water inlet pipe (450), and the water inlet pipe (450) is fixed on the cooling bath (410) Side wall on and with external source connect, the water inlet pipe (450) be equipped with the first solenoid valve (460), the cooling bath (410) inner wall is equipped with the first liquid level sensor (470), and the locating height of first liquid level sensor (470) is higher than transmission Roller, first liquid level sensor (470) and first solenoid valve (460) are electrically connected with first controller (440); The sidewall bottom connection of the cooling bath (410) is equipped with the first drain pipe (480), and first drain pipe (480) is equipped with and opens Close valve.
6. a kind of high quality that produces according to claim 1 is containing the golden tin plating alloy wire integrated apparatus of bonding, feature It is:
The acid dip pickle (500) includes the open reservoir in top (510), and live-roller, key are equipped in the reservoir (510) Zygonema is passed through through the bottom under the guiding of live-roller close to the reservoir (510);The top of the reservoir (510) be equipped with into Liquid pipe (520), the inlet tube (520) are fixed on the side wall of the reservoir (510) and connect with extraneous acid solution supply arrangement Logical, the inlet tube (520) is equipped with second solenoid valve (530), and reservoir (510) inner wall is equipped with the second level sensing Device (540) and pH value sensor (550), the pH value sensor (550) is mounted on the bottom of the reservoir (510), described The locating height of second liquid level sensor (540) is higher than the height of live-roller, second liquid level sensor (540), the pH value Sensor (550) and the second solenoid valve (530) are electrically connected with second controller (560);The side of the reservoir (510) The connection of wall bottom is equipped with the second drain pipe (570), and second drain pipe (570) is equipped with switch valve.
7. a kind of high quality that produces according to claim 6 is containing the golden tin plating alloy wire integrated apparatus of bonding, feature It is:
The top side wall connection of the reservoir (510) is equipped with discharger (580), and the discharger (580) is higher than described second The other end of liquid level sensor (540), the discharger (580) is connected to fluid reservoir (590).
CN201910312321.8A 2019-04-18 2019-04-18 Integrated device for producing high-quality gold-containing bonding tinned alloy wire Active CN109967551B (en)

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CN112281101A (en) * 2020-11-28 2021-01-29 齐河承泽环保科技有限公司 Full-automatic hot-dip galvanizing production line and production process
CN113106373A (en) * 2021-04-14 2021-07-13 温州力源铜业有限公司 Anti-bending tinned wire preparation system
CN114150245A (en) * 2021-12-07 2022-03-08 江苏富川机电有限公司 Annealing tinning machine structure with double tin furnaces in design and uniformly distributed furnace temperatures

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JP2015021184A (en) * 2013-07-24 2015-02-02 株式会社ブリヂストン Method of manufacturing metal wire for reinforcement of rubber article, metal wire for reinforcement of rubber article, pneumatic tire using the same and apparatus for manufacturing metal wire for reinforcement of rubber article
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