CN109963411A - A kind of method for adhering film - Google Patents
A kind of method for adhering film Download PDFInfo
- Publication number
- CN109963411A CN109963411A CN201711428112.7A CN201711428112A CN109963411A CN 109963411 A CN109963411 A CN 109963411A CN 201711428112 A CN201711428112 A CN 201711428112A CN 109963411 A CN109963411 A CN 109963411A
- Authority
- CN
- China
- Prior art keywords
- conductive film
- circuit board
- flexibly positioned
- column
- slide glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10462—Flat component oriented parallel to the PCB surface
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Push-Button Switches (AREA)
Abstract
The invention discloses a kind of method for adhering film, for conductive film to be attached to circuit board conductive film, which is characterized in that this method comprises: (1) positions the conductive film；(2) suction is provided, keeps the conductive film smooth for adsorbing the conductive film；(3) circuit board is placed on the conductive film；And (4) provide and compress power, and the circuit board is pressed on the conductive film.A kind of method for adhering film provided by the invention, can solve previous conductive film and is difficult to be aligned and be attached at circuit board, cause the problem that product yield is bad.
Description
Technical field
The present invention relates to conductive film fields, more particularly to a kind of method for adhering film.
Background technique
Currently, miscellaneous electronic product more and more comes into people's lives, also more and more influences and change
Become people's lives.Such as mobile phone, digital camera, music player, electronic dictionary, tablet computer or other electronic equipments,
In all include control panel, usually all there is a conductive film, with so that pressing between key and internal circuit board thereon
Key and internal circuit board are contacted by conductive film generates electric connection, has the function that transmitting control signal with this.
In general, conductive film be one include metal clips plastic film, film surface be an adhered layer and with from
The covering of shape paper, and its metal clips is the key of corresponding electronic equipment, is placed on the conduction region of circuit board.When key by
When pressing, metal clips recessed can touch the conduction region of circuit board, so that forming circuit allows electric current to pass through, pass through metal clips
Conduction, on-off action is generated between user and electronic equipment.Therefore, the patch between conductive film and circuit board can be infered
Attached program will largely effect on the operating experience of electronic equipment key.
Traditional attaching method is to remove the part strippable paper on conductive film first with the adhered layer of exposed parts, then will
The exposed bonding partially layer with its edge alignment circuit plate, then on one side sprawl on circuit boards conductive film and while remove it is surplus
Under strippable paper, after strippable paper is completely exfoliated, conductive film is also attached on circuit board therewith.
But there are still certain problems for traditional attaching method, such as when attaching, it is difficult to which conductive film is perfectly aligned
Circuit board, the conduction region poor contact of metal clips and circuit board, leads to electronic equipment key when this will cause button pressed
Operating experience is poor and causes yields bad.Further, since conductive film has viscosity, if being exposed to overlong time in air,
It may cause foreign matter to be easy to be entrained between conductive film and circuit board.This also leads to adhesiveness decline, causes yields low.
Summary of the invention
To solve existing technical problem, the embodiment of the invention provides a kind of conductive film sticking device and pad pasting sides
Method can at least solve the above-mentioned problems in the prior art.
To achieve the goals above, one aspect of the invention provides a kind of conductive film sticking device, is used for conductive film
It is attached on circuit board conductive film, which includes:
Base station is provided with an at least through-hole；
Slide glass is connect with the base station, and for carrying the conductive film, and the slide glass is provided with multiple stomatas；
Pneumatic unit connect the multiple of at least through-hole and the slide glass for being used for passing through the base station with the base station
Stomata is to adsorb the conductive film；
And the first flexibly positioned column, it is set on the base station for the circuit board to be pressed on the conductive film
On, and when this compresses power and disappears, the first flexibly positioned column makes the conductive film and the circuit board be detached from institute with elastic force
State slide glass.
Preferably, further including driving mechanism, power is compressed so that the circuit board is pressed on the conductive film for providing
On.
Preferably, the slide glass has the first positioning region of the corresponding first flexibly positioned column.
Preferably, further include at least one being set on the base station and flexible second flexibly positioned column, and institute
State the second positioning region that at least one corresponding second flexibly positioned column is additionally provided on slide glass.
Preferably, the first flexibly positioned column and the second flexibly positioned column are taper column structure.
Preferably, the conductive film is additionally provided with first positioning hole and second location hole, the conductive film passes through institute respectively
State first positioning hole, the second location hole is connect with the described first flexibly positioned column, the second flexibly positioned column to position
On the slide glass.
Preferably, the circuit board also has third location hole and the 4th location hole, the circuit board passes through institute respectively
State third location hole, the 4th location hole is connect with the described first flexibly positioned column, the second flexibly positioned column to position
In on the conductive film.
Preferably, the first positioning hole is greater than the third location hole, and the second location hole is greater than the described 4th
Location hole.
Another aspect of the present invention additionally provides a kind of method for adhering film, for conductive film to be attached to circuit board conductive film
On, this method comprises:
(1) conductive film is positioned；
(2) suction is provided, keeps the conductive film smooth for adsorbing the conductive film；
(3) circuit board is placed on the conductive film；
And (4) provide and compress power, and the circuit board is pressed on the conductive film.
Preferably, the side of the conductive film is pasted with an adhesive layer by adhesive layer adhered layer, in the step (2)
It further include removing the adhesive layer to expose the adhered layer.
It is compared to the prior art, conductive film sticking device of the invention and method for adhering film pass through flexible on base station
Conductive film positioning is set on slide glass by the first flexibly positioned flexibly positioned column of column/the second, and by provided by pneumatic unit
Suction is adsorbed in conductive film is smooth on slide glass, then circuit board is covered on the conductive film, so that it is mutually aligned fitting, then
Using compressing power for the press fit of circuit boards on the conductive film, so that the circuit board and conductive film that fit together compress power in this
It can be rebounded by the first flexibly positioned flexibly positioned column of column/the second when disappearance and automatically disengage slide glass.Therefore, the conductive film and the electricity
Road plate can be mutually aligned fitting, can save the alignment fitting time of traditionally circuit board and conductive film, and effectively shorten conductive film
Adhered layer exposure aerial time, avoid adherency foreign matter, be more avoided that the attaching offset of conductive film and circuit board with it is difficult
The problem of to be aligned, and then promote the operating experience of electronic equipment key.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of conductive film sticking device of the invention.
Fig. 2 to Fig. 7 is the method flow schematic diagram that conductive film is attached using conductive film sticking device of the invention.
[primary clustering symbol description]
1 ... base station
12 ... through-holes
The flexibly positioned column of 2a ... first
The flexibly positioned column of 2b ... second
3 ... slide glasses
The first positioning region 31a ...
The second positioning region 31b ...
32 ... stomatas
4 ... pneumatic units
41 ... inlet valves
42 ... tracheaes
5 ... conductive films
50 ... adhered layers
51a ... first positioning hole
51b ... second location hole
52 ... metal clips
53 ... adhesive layers
6 ... circuit boards
60 ... fronts
61a ... third location hole
The 4th location hole of 61b ...
F ... compresses power
F ' ... elastic force
Specific embodiment
Technical solution of the present invention is further described in detail below in conjunction with attached drawing.
As shown in Figure 1, conductive film sticking device of the invention include base station 1, the first flexibly positioned column 2a, slide glass 3 and
Pneumatic unit 4, wherein the conduction film sticking device is circuit board and conductive film to be bonded to each other.
Base station 1 has an at least through-hole 12.As shown in Figure 1, base station 1 is step-like, but the application is not limited to such side
Formula.
First flexibly positioned column 2a is set on the base station 1 and has elasticity, to mention to the conductive film and the circuit board
For elastic force.First flexibly positioned column 2a, which can be used, to be spirally connected or integrally formed mode is set on base station 1, in addition, of the invention leads
Electrolemma adhering device may also include the second flexibly positioned column 2b, is set on the base station 1 and has elasticity.Similarly, second
Flexibly positioned column 2b, which can be used, to be spirally connected or integrally formed mode is set on base station 1.In the present embodiment, first elasticity is fixed
The flexibly positioned column of position column 2a and second flexibly positioned column 2b concretely cone cell, and the two shape can be different or slightly not
Together, however, it is possible to infer, technical scheme is also not limited to such mode.Above-mentioned first flexibly positioned column 2a or second
Flexibly positioned column 2b is at least one, and is positioned with for the conductive film and the circuit board, and pass through the characteristic of its cone cell, with benefit
It compresses and is detached from subsequent.
The slide glass 3 is combined with the base station 1, and so that the conductive film is set on the slide glass 3, and the slide glass 3 has multiple gas
The first positioning region 31a of hole 32 and at least one corresponding first flexibly positioned column 2a, the slide glass 3 pass through first positioning region 31a
And the combination of the first flexibly positioned column 2a and positioning is set to 1 top of base station.Further, slide glass 3 may also include at least
The second positioning region 31b of the one corresponding second flexibly positioned column 2b, the slide glass 3 pass through the second positioning region 31b and second bullet
Property positioning column 2b in conjunction with and position and be set to 1 top of base station.In the present embodiment, which can be elastic foam, and
The first positioning region 31a and the second positioning region 31b can be location hole or limited bayonet, but technical scheme is not limited to this
Kind mode.In addition, the slide glass 3 with for conductive film (not shown) it is first flexibly positioned by this with its conductive film location hole
The flexibly positioned column 2b of column 2a and/or second and be set on the slide glass 3.
The pneumatic unit 4 connects the base station 1, for providing suction, wherein the pneumatic unit 4 includes that inlet valve 41 is gentle
Pipe 42, which connects the base station 1 by the tracheae 42, and the suction passes through an at least through-hole 12 for the base station 1 and is somebody's turn to do
Multiple stomatas 32 of slide glass 3 are allowed to smooth and are placed on the slide glass 3 to adsorb the conductive film, with ought be further by the circuit board
(not shown) is placed in this by the first flexibly positioned flexibly positioned column 2b of column 2a and/or second with the positioning holes on circuit board
When on conductive film, smooth it can be attached on the conductive film.
Further, conductive film sticking device of the invention separately may include driving mechanism, to be placed in this in the conductive film
On slide glass 3 and after the circuit board is placed on the conductive film, one is provided from the circuit board and compresses power so that the circuit board supports
It is pressed on the conductive film, passes through the problem for replacing traditional force manually pressed uneven.In addition, when the driving mechanism removes this
After circuit board, since the first flexibly positioned flexibly positioned column 2b of column 2a and second has elasticity, and leading due to the conductive film
Electrolemma location hole is greater than the positioning holes on circuit board of the circuit board, therefore can make pressing by the elastic-restoring force of above-mentioned locating piece
Conductive film and circuit board can bounce automatically and be detached from the slide glass 3.
When it is implemented, the base station 1, the first flexibly positioned column 2a, the slide glass 3, the pneumatic unit 4 and the driving machine
It sets up on the workbench that there is control switch in one, opening and closing of the control switch to control the pneumatic unit 4.This
Outside, the shape of the slide glass 3 and area are substantially the same with the conductive film, the shape of circuit board and area.
In addition, as shown in Figures 2 to 7, for the method flow for attaching conductive film using conductive film sticking device of the invention
Schematic diagram.
Firstly, conductive film 5 is made to pass through the first flexibly positioned flexibly positioned column 2b of column 2a and second on the base station 1, positioning
It is set on the slide glass 3, as shown in Figure 2.Specifically, the conductive film 5 have first positioning hole 51a and second location hole 51b and
Metal clips 52, the conductive film 5 pass through the first bullet on first positioning hole 51a and second location hole 51b and the base station 1 respectively
Property the flexibly positioned column 2b positioning of positioning column 2a and second be set on the slide glass 3 with positioning.It should be noted that first elasticity
The flexibly positioned column 2b of positioning column 2a and second is tapered structure, the first positioning hole 51a and second location hole 51b of the conductive film 5
The corresponding first flexibly positioned flexibly positioned column 2b of column 2a and second.
Secondly, making the pneumatic unit 4 by multiple stomatas 32 of an at least through-hole 12 and the slide glass 3 for the base station 1, to this
Conductive film 5 provides suction, keeps the conductive film 5 smooth for adsorbing the conductive film 5 and is adsorbed on the slide glass 3.In addition, in this
When conductive film 5 is placed on the slide glass 3 and pneumatic unit 4 carries out air-breathing actuation, the attachment being overlying on the surface of the conductive film 5 is removed
Layer 53, so that the adhered layer 50 of the conductive film 5 is exposed, as shown in Figure 3.
Then, make the circuit board 6 respectively by the on its third location hole 61a and the 4th location hole 61b and the base station 1
The one flexibly positioned flexibly positioned column 2b of column 2a and second and be placed on the conductive film 5, as shown in Figure 4, wherein in the circuit board
Before 6 are set on the conductive film 5, the front 60 of the circuit board 6 is first cleaned, then is set to the circuit board 6 with its front 60
On the adhered layer 50 of the conductive film 5.It should be noted that the third location hole 61a of the circuit board 6 and the 4th 61b pairs of location hole
It should the first flexibly positioned flexibly positioned column 2b of column 2a and second.
Followed by, as shown in figure 5, provide compress power F, which is pressed on the conductive film 5, and further in
When this compresses power F disappearance, since the first flexibly positioned flexibly positioned column 2b of column 2a and second for pyramidal structure and has elasticity,
And the first positioning hole 51a and second location hole 51b of the conductive film 5 are respectively greater than the third location hole 61a and of the circuit board 6
Four location hole 61b, then the first flexibly positioned flexibly positioned column 2b of column 2a and second provides bullet to the conductive film 5 and circuit board 6
Power F ', so that the conductive film 5 and circuit board 6 are detached from the slide glass 3, as shown in Figure 6.
Finally, the circuit board 6 is adhere well on the conductive film 5, as shown in Figure 7.
Therefore, because the conductive film 5 is by pneumatic unit 4 is by through-hole 12 and stomata 32 is smooth is adsorbed on the slide glass 3,
Therefore only need directly to be attached to the circuit board 6 on the conductive film 5, without spending the too many time being aligned the conductive film and be somebody's turn to do
Circuit board 6.
In conclusion conductive film sticking device of the invention and method for adhering film pass through the first elasticity flexible on base station
Conductive film positioning is set on slide glass by the flexibly positioned column of positioning column/the second, and will be led by suction provided by pneumatic unit
Electrolemma is smooth to be adsorbed on slide glass, then circuit board is covered on the conductive film, it is made to be mutually aligned fitting, followed by compressing
Power by the press fit of circuit boards on the conductive film, enable the circuit board to fit together and conductive film when this compresses power and disappears
Slide glass is automatically disengaged by the first flexibly positioned flexibly positioned column rebound of column/the second.Therefore, the conductive film and the circuit board can phases
Mutually alignment fitting, the alignment that can save traditionally circuit board and conductive film are bonded the time, and effectively shorten the adhered layer of conductive film
Exposure aerial time avoids adherency foreign matter, be more avoided that the attaching offset of conductive film and circuit board be difficult to be aligned
Problem, and then promote the operating experience of electronic equipment key.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the scope of the present invention.It is all
The spirit and principles in the present invention it is interior, made any modification, equivalent replacement and improvement etc. should be included in guarantor of the invention
Protect the interior of range.
Claims (2)
1. a kind of method for adhering film, for conductive film to be attached to circuit board conductive film, which is characterized in that this method comprises:
(1) conductive film is positioned；
(2) suction is provided, keeps the conductive film smooth for adsorbing the conductive film；
(3) circuit board is placed on the conductive film；
And (4) provide and compress power, and the circuit board is pressed on the conductive film.
2. method for adhering film as described in claim 1, which is characterized in that pasted by adhesive layer adhered layer the side of the conductive film
It further include removing the adhesive layer to expose the adhered layer with an adhesive layer, in the step (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711428112.7A CN109963411A (en) | 2017-12-26 | 2017-12-26 | A kind of method for adhering film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711428112.7A CN109963411A (en) | 2017-12-26 | 2017-12-26 | A kind of method for adhering film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109963411A true CN109963411A (en) | 2019-07-02 |
Family
ID=67021606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711428112.7A Pending CN109963411A (en) | 2017-12-26 | 2017-12-26 | A kind of method for adhering film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109963411A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117320305A (en) * | 2023-10-26 | 2023-12-29 | 湖北永创鑫电子有限公司 | Flexible circuit board processing equipment and technology based on graphene heating film |
-
2017
- 2017-12-26 CN CN201711428112.7A patent/CN109963411A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117320305A (en) * | 2023-10-26 | 2023-12-29 | 湖北永创鑫电子有限公司 | Flexible circuit board processing equipment and technology based on graphene heating film |
| CN117320305B (en) * | 2023-10-26 | 2024-04-09 | 湖北永创鑫电子有限公司 | Flexible circuit board processing equipment and technology based on graphene heating film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190702 |
|
| WD01 | Invention patent application deemed withdrawn after publication |