CN109957820A - A kind of handware electroplating process for surface - Google Patents
A kind of handware electroplating process for surface Download PDFInfo
- Publication number
- CN109957820A CN109957820A CN201711418470.XA CN201711418470A CN109957820A CN 109957820 A CN109957820 A CN 109957820A CN 201711418470 A CN201711418470 A CN 201711418470A CN 109957820 A CN109957820 A CN 109957820A
- Authority
- CN
- China
- Prior art keywords
- handware
- plating
- pure water
- temperature
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Abstract
The invention discloses a kind of handware electroplating process for surface, its main feature is that, comprising the following steps: after taking out handware, polished with the sundries being sticked on metal the metal of redundance；Handware is rinsed, greasy dirt cleaning is carried out to it；Handware is placed in vacuum environment, by way of distilling or sputtering, so as to uniformly cover one layer of film plating layer on handware；The handware for covering film plating layer is cleaned using pure water, 40-60 DEG C of cleaning temperature；Using cathode copper as anode, handware is cathode, is put into electrolytic cell and is electroplated；Wherein, the electrolyte of plating contains the boric acid of the CuSO45H2O of 50~60g/L, the glyoxalic acid of 70~100mL/L, Cymag 70-85g/L, sodium hydroxide 1-3g/L, the nickel chloride of 20~40g/L, 50~80g/L；It is cleaned again using pure water, 30-50 DEG C of cleaning temperature；It is activated using immersion treatment 12 under mass concentration 3-6% sulfuric acid room temperature；It is cleaned again using pure water, 40-50 DEG C of cleaning temperature.
Description
Technical field
The present invention relates to Hardware fitting field, especially a kind of handware electroplating process for surface.
Background technique
Hardware is traditional hardware, also referred to as " hardware ".Refer to gold, silver, copper, five kinds of iron, tin metals.Through artificial
The arts work such as knife, sword or metal device can be made.Hardware is used widely.If hardware is without plating, easily raw
Rust and aging, surface is not wear-resisting, and also unsightly, plating is a kind of process of surface treatment being in daily use.Plating is former using electrolysis
Reason plates the process of the other metal or alloy of a thin layer on certain metal surfaces, is to make metal or other using electrolysis
The technique of the surface attachment layer of metal film of material prevents from corroding to play, and improves wearability, electric conductivity, reflective
And the effects of having improved aesthetic appearance, copper are widely used in electroplating industry due to excellent electric conductivity, thermal conductivity, plasticity
In.The present invention provides a kind of electroplating technology.
Summary of the invention
The technical problem to be solved by the present invention is in view of the deficiencies of the prior art, propose a kind of handware electroplating surface work
Skill.
The technical problem to be solved by the present invention is to what is be achieved through the following technical solutions, a kind of handware electroplating surface work
Skill, its main feature is that, comprising the following steps:
1) it after taking out handware, is polished with the sundries being sticked on metal the metal of redundance；
2) handware is rinsed, greasy dirt cleaning is carried out to it；
3) handware is placed in vacuum environment, by way of distilling or sputtering, so as to uniformly cover one on handware
Layer film plating layer；
4) handware for covering film plating layer is cleaned using pure water, 40-60 DEG C of cleaning temperature；
5) using cathode copper as anode, handware is cathode, is put into electrolytic cell and is electroplated；Wherein, the electrolyte of plating contains
The CuSO45H2O of 50~60g/L, the glyoxalic acid of 70~100mL/L, Cymag 70-85g/L, sodium hydroxide 1-3g/L, 20~
The boric acid of the nickel chloride of 40g/L, 50~80g/L；
6) it is cleaned again using pure water, 30-50 DEG C of cleaning temperature；
7) it is activated using immersion treatment 12 under mass concentration 3-6% sulfuric acid room temperature；
8) it is cleaned again using pure water, 40-50 DEG C of cleaning temperature；
9) finished product is dried, it is qualified to examine.
Preferably, the pH value of the electrolyte is 4~6.
Preferably, in plating, the temperature of electrolyte is 60~70 DEG C, and the time of plating is 50min, the electric current of plating
Density is gradually reduced within the time of plating from 3.0~2.5A/dm2.
Compared with prior art, the invention has the benefit that hardware electroplating surface of the present invention avoids the pollution of environment,
And greatly improve labor productivity.The technique does not need the chemicals using severe toxicity, has ensured that operating personnel's is strong
Health, it is environmentally protective；And during plating, current density is gradually reduced, and the film layer of acquisition has excellent binding force.
Specific embodiment
A kind of handware electroplating process for surface is present embodiments provided, its main feature is that, comprising the following steps:
1) it after taking out handware, is polished with the sundries being sticked on metal the metal of redundance；
2) handware is rinsed, greasy dirt cleaning is carried out to it；
3) handware is placed in vacuum environment, by way of distilling or sputtering, so as to uniformly cover one on handware
Layer film plating layer；
4) handware for covering film plating layer is cleaned using pure water, 40-60 DEG C of cleaning temperature；
5) using cathode copper as anode, handware is cathode, is put into electrolytic cell and is electroplated；Wherein, the electrolyte of plating contains
The CuSO45H2O of 50~60g/L, the glyoxalic acid of 70~100mL/L, Cymag 70-85g/L, sodium hydroxide 1-3g/L, 20~
The boric acid of the nickel chloride of 40g/L, 50~80g/L；
6) it is cleaned again using pure water, 30-50 DEG C of cleaning temperature；
7) it is activated using immersion treatment 12 under mass concentration 3-6% sulfuric acid room temperature；
8) it is cleaned again using pure water, 40-50 DEG C of cleaning temperature；
9) finished product is dried, it is qualified to examine.
In the present embodiment, further, the pH value of the electrolyte is 4~6.
In the present embodiment, further, in plating, the temperature of electrolyte is 60~70 DEG C, and the time of plating is
The current density of 50min, plating are gradually reduced within the time of plating from 3.0~2.5A/dm2.
Claims (3)
1. a kind of handware electroplating process for surface, which comprises the following steps:
After handware is taken out, polished with the sundries being sticked on metal the metal of redundance；
Handware is rinsed, greasy dirt cleaning is carried out to it；
Handware is placed in vacuum environment, by way of distilling or sputtering, so as to uniformly cover one layer on handware
Film plating layer；
The handware for covering film plating layer is cleaned using pure water, 40-60 DEG C of cleaning temperature；
Using cathode copper as anode, handware is cathode, is put into electrolytic cell and is electroplated；Wherein, the electrolyte of plating contains 50
The CuSO45H2O of~60g/L, the glyoxalic acid of 70~100mL/L, Cymag 70-85g/L, sodium hydroxide 1-3g/L, 20~
The boric acid of the nickel chloride of 40g/L, 50~80g/L；
It is cleaned again using pure water, 30-50 DEG C of cleaning temperature；
It is activated using immersion treatment 12 under mass concentration 3-6% sulfuric acid room temperature；
It is cleaned again using pure water, 40-50 DEG C of cleaning temperature；
Finished product is dried, it is qualified to examine.
2. a kind of hardware processing of surface polishing according to claim 1, it is characterised in that: the pH value of the electrolyte is 4
~6.
3. a kind of hardware processing of surface polishing according to claim 1, it is characterised in that: in plating, the temperature of electrolyte
Degree is 60~70 DEG C, and time of plating is 50min, the current density of plating within the time of plating from 3.0~2.5A/dm2 by
It is decrescence small.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711418470.XA CN109957820A (en) | 2017-12-25 | 2017-12-25 | A kind of handware electroplating process for surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711418470.XA CN109957820A (en) | 2017-12-25 | 2017-12-25 | A kind of handware electroplating process for surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109957820A true CN109957820A (en) | 2019-07-02 |
Family
ID=67020830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711418470.XA Pending CN109957820A (en) | 2017-12-25 | 2017-12-25 | A kind of handware electroplating process for surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109957820A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101204860A (en) * | 2007-12-12 | 2008-06-25 | 山东天诺光电材料有限公司 | Aluminum foil belt of compound metal and preparation method and uses |
| CN104178784A (en) * | 2014-08-15 | 2014-12-03 | 中国海洋大学 | Preparation method of metal surface copper-nickel alloy |
| CN105369305A (en) * | 2014-08-12 | 2016-03-02 | 无锡永发电镀有限公司 | A copper-nickel alloy electroplating solution and an electroplating method thereof |
| CN207918993U (en) * | 2017-12-28 | 2018-09-28 | 广州超邦化工有限公司 | A kind of imitative golden composite plating layer structure of bright Zn-Ni alloy, high tin copper-tin alloy, ormolu |
-
2017
- 2017-12-25 CN CN201711418470.XA patent/CN109957820A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101204860A (en) * | 2007-12-12 | 2008-06-25 | 山东天诺光电材料有限公司 | Aluminum foil belt of compound metal and preparation method and uses |
| CN105369305A (en) * | 2014-08-12 | 2016-03-02 | 无锡永发电镀有限公司 | A copper-nickel alloy electroplating solution and an electroplating method thereof |
| CN104178784A (en) * | 2014-08-15 | 2014-12-03 | 中国海洋大学 | Preparation method of metal surface copper-nickel alloy |
| CN207918993U (en) * | 2017-12-28 | 2018-09-28 | 广州超邦化工有限公司 | A kind of imitative golden composite plating layer structure of bright Zn-Ni alloy, high tin copper-tin alloy, ormolu |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190702 |
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| WD01 | Invention patent application deemed withdrawn after publication |