CN1099546A - Process for preparation of antistatic film for electronic element and device - Google Patents
Process for preparation of antistatic film for electronic element and device Download PDFInfo
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- CN1099546A CN1099546A CN 94106140 CN94106140A CN1099546A CN 1099546 A CN1099546 A CN 1099546A CN 94106140 CN94106140 CN 94106140 CN 94106140 A CN94106140 A CN 94106140A CN 1099546 A CN1099546 A CN 1099546A
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- electronic devices
- components
- antistatic film
- antistatic
- preparation
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Abstract
The process for preparing antistatic film of electronic devices includes the following steps: preparing material of antistatic film, coating and solidification. Prepared conductive antistatic film can short-circuit the both electrodes of static-sensitive channel on device. Prepared insulative antistatic film can prevent electronic device from being damaged by external static electricity. It features firm binding and no influence to welding.
Description
The present invention relates to a kind of antistatic film preparation technology of electronic devices and components antistatic damage, belong to electronic devices and components antistatic damage technical field.
Static has serious harm to electronic devices and components, and data from abroad is pointed out: in the components and parts manufacturing, annual because the caused loss of electrostatic damage accounts for 16%～22% of the gross output value.Can static how have so big harm to electronic devices and components? reason has two: one, and some electronic devices and components antistatic effect is very poor, and for example the static of about 200 volts of GaAs microwave low-noise field effect transistor certain models just can make it Damage and Failure; The 2nd, the generation of external cause static and existence very generally and over the ground have very high current potential, according to Denver factory of U.S. west electrical equipment company to contact maximum people's mensuration with electronic devices and components, be sitting in charged for each person 800 volts that work on the chair, on carpet, walk about charged for each person 15000 volts, high like this static is concerning the electronic devices and components of the volt of anti-hundreds of static only: as not properly protecting, none is not to suffer extremely, run into and die, for this reason, in the electronic devices and components manufacturing, people have thought thousand and one way in recent years, taked many measures to prevent the damage of static to electronic devices and components, yet, the anti-static precautions that present people are taked is not to use inconvenience, be that effect is not ideal, some inspection process as the GaAs microwave low-noise field effect transistor is the way that twines leg that prevents that electrostatic damage from taking, promptly take with wire transistorized three utmost point (S, G, D) short circuit gets up to make its electrode to become the antistatic damage measure of equipotential volume, need before its check components and parts pipe leg twining one by one, also the wire that twines components and parts pipe leg must be removed after having inspected, the leg that twines of components and parts is separated leg and is not only wasted time and energy one by one, and also can cause the electrostatic damage of electronic devices and components in operating process sometimes because of wire and the loose contact of pipe leg; And resembling the apparatus of antistatic bag, antistatic box and so on, they can not be used for checkout procedure, can not be with to weld, and can only play anti-static electrification in the packing and storing transportation, and significant limitation is arranged.
The objective of the invention is to overcome above-mentioned the deficiencies in the prior art, provide a kind of for improving the antistatic effect of electronic devices and components self, and prepare a kind of technology of antistatic film, i.e. the antistatic film preparation technology of electronic devices and components antistatic damage at a certain position of its outside.
The object of the present invention is achieved like this: this for improving the antistatic effect of electronic devices and components self, and prepare a kind of technology of antistatic film at a certain position of its outside, be the antistatic film preparation technology of electronic devices and components antistatic damage, it comprises the preparation of antistatic film material and operations such as coating, curing on electronic devices and components.
And described antistatic film material can be to be the scattered paste shape glue that raw material all mixes preparation with electric conducting material powder, colophony powder and ethanol, and the weight ratio of each material is:
Electric conducting material powder 5
Rosin 3～6
Ethanol 2～6;
It also can be the rosin liquation; Can also be to be the scattered paste shape glue that raw material all mixes preparation with colophony powder and ethanol, the weight ratio of each material be:
Rosin 15
Ethanol 2～6.
And aforesaid be that the antistatic film material (scattered paste shape glue) that raw material all mixes preparation be a conductivity type antistatic film material with electric conducting material powder, colophony powder and ethanol, it is two interpolars that are coated on electronic devices and components electrostatic sensitive passage, solidify afterwards that two interpolars at electronic devices and components electrostatic sensitive passage are formed for the antistatic film of the two poles of the earth short circuit of electronic devices and components electrostatic sensitive passage.
And aforesaid rosin liquation, be that the antistatic film material (scattered paste shape glue) that raw material all mixes preparation is insulated type antistatic film material with colophony powder and ethanol, they are positions of being coated on the electronic devices and components electrostatic sensitive, solidify that the back is formed for the antistatic film of the position insulation sealing of electronic devices and components electrostatic sensitive on the position of electronic devices and components electrostatic sensitive.
And aforesaid antistatic film material cured operation can be the curing of nature airing; Also can be to solidify 50 ℃～60 ℃ drying in oven.
The antistatic film preparation technology of electronic devices and components antistatic damage provided by the present invention, simple, the easily grasp of technology, the antistatic film of preparation utilizes alcohol immersion to remove, remove easily and the insulated type antistatic film of preparation does not also influence welding, have prior art-twine leg position, antistatic bag and antistatic box and so on the incomparable advantage of anti-static precautions such as apparatus.
The present invention is described in further detail below in conjunction with embodiment:
Embodiment 1:
The antistatic film preparation technology of the electronic devices and components antistatic damage that present embodiment provided, it comprises the preparation of antistatic film material and operations such as coating, curing on electronic devices and components, it is to be that raw material all mixes preparation antistatic film material (scattered paste shape glue) with the black powder of electric conducting material powder-stone and colophony powder, ethanol, PF glue at first, and the weight ratio of each material is:
Stone is deceived powder 10
Rosin 9
Ethanol 5
PF glue 3,
Clamp electronic devices and components with the ground connection tweezers again, coating antistatic film material glue (making two short legs roads) between the pipe leg of its electrostatic sensitive and ground connection leg, and then the electronic devices and components that will coat antistatic film material glue are put (50 ℃～60 ℃) baking and curing in the baking oven into and are prepared antistatic film.
Embodiment 2:
The antistatic film preparation technology of the electronic devices and components antistatic damage that present embodiment provided; it comprises preparation, the protectant preparation of PF glue and the operations such as coating, curing on electronic devices and components of antistatic film material; it is at first amber powder all to be sneaked into preparation antistatic film material in the rosin liquation, and the weight ratio of each material is:
Rosin 2
Amber 1;
Prepare PF glue protective agent with ethanol dilution PF glue, the weight ratio of each material is:
PF glue 2
Ethanol 1,
Clamp electronic devices and components with the ground connection tweezers again; the antistatic film material of dipping preparation on the pipe leg of its electrostatic sensitive; dipping PF glue protective agent on the electronic devices and components pipe leg of electronic devices and components dipping antistatic film material again, and then put antistatic film material in the dipping and the protectant electronic devices and components of PF glue in the baking oven (50 ℃～60 ℃) baking and curing and prepare antistatic film.
Embodiment 3:
The antistatic film preparation technology of the electronic devices and components antistatic damage that present embodiment provided, it comprises the preparation of antistatic film material and operations such as coating, curing on electronic devices and components, it is to be that raw material all mixes preparation antistatic film material with colophony powder, amber powder, ethanol and PF glue at first, and the weight ratio of each material is:
Rosin 15
Amber 6
Ethanol 3
PF glue 2,
Clamp electronic devices and components with the ground connection tweezers again, the antistatic film material of dipping preparation on the pipe leg of its electrostatic sensitive, and then put the electronic devices and components of antistatic film material in the dipping in the baking oven (50 ℃～60 ℃) baking and curing and prepare antistatic film.
Claims (8)
1, a kind of antistatic film preparation technology of electronic devices and components antistatic damage is characterized in that:
It comprises the preparation of antistatic film material and operations such as coating, curing on electronic devices and components.
2, the antistatic film preparation technology of electronic devices and components antistatic damage according to claim 1, it is characterized in that: its antistatic film material is the scattered paste shape glue, with electric conducting material powder, colophony powder and ethanol is that raw material all mixes preparation, and the weight ratio of each material is:
Electric conducting material powder 5
Rosin 3～6
Ethanol 2～6;
Be two interpolars that are coated on electronic devices and components electrostatic sensitive passage, solidify that the back is formed for the antistatic film of the two poles of the earth short circuit of electronic devices and components electrostatic sensitive passage at two interpolars of electronic devices and components electrostatic sensitive passage.
3, the antistatic film preparation technology of electronic devices and components antistatic damage according to claim 1, it is characterized in that: its antistatic film material is a rosin solution, be will preparation the antistatic film material be coated on the electronic devices and components electrostatic sensitive the position, solidify the back and on the position of electronic devices and components electrostatic sensitive, be formed for the antistatic film of the position insulation sealing of electronic devices and components electrostatic sensitive.
4, the antistatic film preparation technology of electronic devices and components antistatic damage according to claim 1 is characterized in that: its antistatic film material scattered paste shape glue is that raw material all mixes preparation with colophony powder and ethanol, and the weight ratio of each material is:
Rosin 15
Ethanol 2～6;
Be the position that is coated on the electronic devices and components electrostatic sensitive, solidify that the back is formed for the antistatic film of the position insulation sealing of electronic devices and components electrostatic sensitive on the position of electronic devices and components electrostatic sensitive.
5, the antistatic film preparation technology of electronic devices and components antistatic damage according to claim 2, it is characterized in that: the electric conducting material powder of the antistatic film material of preparation is the black powder of stone, also all be mixed with PF glue in the antistatic film material of preparation, the weight ratio of each material is:
Stone black 10
Rosin 9
Ethanol 5
PF glue 3.
6, the antistatic film preparation technology of electronic devices and components antistatic damage according to claim 3; it is characterized in that: it also comprises operations such as protectant preparation of PF glue and coating; be that the PF glue protective agent that will prepare is coated on the electronic devices and components position that electronic devices and components have been coated with the antistatic film material; and then curing preparation antistatic film; and described PF glue protective agent prepares with ethanol dilution PF glue, and the weight ratio of each material is:
PF glue 2
Ethanol 1.
7, according to the antistatic film preparation technology of claim 3 or 6 described electronic devices and components antistatic damages, it is characterized in that: also all be mixed with amber powder in the antistatic film material-rosin liquation of preparation, the weight ratio of each material is:
Rosin 2
Amber 1.
8, the antistatic film preparation technology of electronic devices and components antistatic damage according to claim 4, it is characterized in that: also all be mixed with amber powder and PF glue in the antistatic film material of preparation, the weight ratio of each material is:
Rosin 15
Amber 6
Ethanol 3
PF glue 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 94106140 CN1099546A (en) | 1994-06-14 | 1994-06-14 | Process for preparation of antistatic film for electronic element and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 94106140 CN1099546A (en) | 1994-06-14 | 1994-06-14 | Process for preparation of antistatic film for electronic element and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1099546A true CN1099546A (en) | 1995-03-01 |
Family
ID=5032417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 94106140 Pending CN1099546A (en) | 1994-06-14 | 1994-06-14 | Process for preparation of antistatic film for electronic element and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1099546A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105848394A (en) * | 2016-05-18 | 2016-08-10 | 京东方科技集团股份有限公司 | Display apparatus and manufacturing method therefor |
-
1994
- 1994-06-14 CN CN 94106140 patent/CN1099546A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105848394A (en) * | 2016-05-18 | 2016-08-10 | 京东方科技集团股份有限公司 | Display apparatus and manufacturing method therefor |
| US10757848B2 (en) | 2016-05-18 | 2020-08-25 | Boe Technology Group Co., Ltd. | Display device and manufacturing method thereof |
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