CN109929450A - The production method of shell and shell - Google Patents

The production method of shell and shell Download PDF

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Publication number
CN109929450A
CN109929450A CN201711350601.5A CN201711350601A CN109929450A CN 109929450 A CN109929450 A CN 109929450A CN 201711350601 A CN201711350601 A CN 201711350601A CN 109929450 A CN109929450 A CN 109929450A
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CN
China
Prior art keywords
parts
heat dissipation
shell
dissipation film
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711350601.5A
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Chinese (zh)
Inventor
姜传华
戴祯仪
肖飞龙
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Shenzhen Futaihong Precision Industry Co Ltd
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Shenzhen Futaihong Precision Industry Co Ltd
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Priority to CN201711350601.5A priority Critical patent/CN109929450A/en
Publication of CN109929450A publication Critical patent/CN109929450A/en
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Abstract

A kind of shell, the shell includes at least substrate and heat dissipation film, the heat dissipation film is formed in the surface of the substrate, wherein, the raw material for forming the heat dissipation film includes: 50-100 parts of macromolecule resin, 5-15 parts of graphene, 1-6 parts of heat conductive graphite powder, 1-5 parts of dispersing agent, the solvent of 1-5 parts of defoaming agent and 100-200 part.The radiating efficiency of the shell is high.The present invention also provides a kind of production methods of shell.

Description

The production method of shell and shell
Technical field
The present invention relates to the production methods of a kind of shell and shell.
Background technique
The main reason for heat dissipation of electronic product is interference scientific and technological progress, it limits the micromation of electronic product, power consumption And performance, therefore the radiating efficiency for improving electronic product is those skilled in the art's urgent problem to be solved.
Summary of the invention
In view of this, it is necessary to a kind of shell that radiating efficiency is high.
The present invention also provides a kind of production methods of shell.
A kind of shell, the shell include at least substrate and heat dissipation film, and the heat dissipation film is formed in the surface of the substrate, Wherein, the raw material for forming the heat dissipation film includes: 50-100 parts of macromolecule resin, 5-15 parts of graphene, 1-6 parts thermally conductive Graphite powder, 1-5 parts of dispersing agent, the solvent of 1-5 parts of defoaming agent and 100-200 part.
A kind of production method of shell comprising following steps:
One substrate is provided;
Heat dissipation film is formed in the substrate surface using spray treatment, wherein the raw material for forming the heat dissipation film includes: 50- 100 parts of macromolecule resin, 5-15 parts of graphene, 1-6 parts of heat conductive graphite powder, 1-5 parts of dispersing agent, 1-5 parts of defoaming Agent and 100-200 parts of solvent.
A kind of shell, the shell include at least substrate, thermally conductive sheet and heat dissipation film, and the thermally conductive sheet is covered on the substrate Surface, the heat dissipation film is formed in the surface of the thermally conductive sheet, wherein the raw material for forming the heat dissipation film includes: 50-100 Part macromolecule resin, 5-15 parts of graphene, 1-5 parts of dispersing agent, the solvent of 1-5 parts of defoaming agent and 100-200 part.
A kind of production method of shell comprising following steps:
One substrate is provided;
Paste thermally conductive sheet;
Heat dissipation film is formed on the surface of the thermally conductive sheet using spray treatment, wherein forming the raw material packet of the heat dissipation film It includes: 50-100 parts of macromolecule resin, 5-15 parts of graphene, 1-5 parts of dispersing agent, 1-5 parts of defoaming agent and 100-200 part Solvent.
In conclusion wherein a shell is by being formed prepared by heat dissipation film in the substrate surface.Wherein, institute is formed State the proportion of the heat radiation coating of heat dissipation film are as follows: 50-100 parts of macromolecule resin, 5-15 parts of graphene, 1-6 parts of thermally conductive stone Ink powder, 1-5 parts of dispersing agent, the solvent of 1-5 parts of defoaming agent and 100-200 part.Another shell is led by pasting on substrate Backing, and be made in formation heat dissipation film on the thermally conductive sheet.Wherein, the thermally conductive sheet is heat conductive graphite piece.Form described dissipate The proportion of the heat radiation coating of hotting mask are as follows: 50-100 parts of macromolecule resin, 5-15 parts of graphene, 1-5 parts of dispersing agent, 1-5 The defoaming agent and 100-200 parts of solvent of part.Above-mentioned shell is using heat conductive graphite as heat-conducting medium, to improve the base The radiating efficiency of material.Meanwhile the production method of the shell is simple to operation, and the heat dissipation performance for the shell being prepared is good It is good.It is also not necessarily to implement under high temperature environment in addition, preparing the shell, to improve the security performance of operation.
Detailed description of the invention
Fig. 1 is a preferred embodiment of the present invention the diagrammatic cross-section of shell.
Fig. 2 is the diagrammatic cross-section of the shell of another preferred embodiment of the present invention.
Main element symbol description
Shell 10
Substrate 101
Heat dissipation film 103
Shell 20
Thermally conductive sheet 203
Heat dissipation film 205
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
It should be noted that it can be directly on another component when component is referred to as " being fixed on " another component Or there may also be components placed in the middle.When a component is considered as " connection " another component, it, which can be, is directly connected to To another component or it may be simultaneously present component placed in the middle.When a component is considered as " being set to " another component, it It can be and be set up directly on another component or may be simultaneously present component placed in the middle.Term as used herein is " vertical ", " horizontal ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases Any and all combinations of the listed item of pass.
Refering to fig. 1, present pre-ferred embodiments provide a kind of diagrammatic cross-section of shell 10.The shell 10 can be hand The shell of the electronic devices such as machine, tablet computer.
The shell 10 includes substrate 101 and heat dissipation film 103.
The material of the substrate 101 is metal (aluminium, stainless steel etc.), glass or plastic cement etc..
The heat dissipation film 103 is formed in the surface of the substrate 101.The heat dissipation film 103 is to improve the substrate 101 Radiating efficiency.Wherein, the thickness of the heat dissipation film 103 is about 30um.
In the present embodiment, the heat radiation coating proportion of the heat dissipation film 103 is formed are as follows: 50-100 parts of macromolecule resin, 5-15 parts of graphene, 1-6 parts of heat conductive graphite powder, 1-5 parts of dispersing agent, 1-5 parts of defoaming agent and 100-200 part it is molten Agent.Wherein, the heat dissipation film 103 is by carrying out spray treatment using surface of the above-mentioned heat radiation coating to the substrate 101 It is formed.
Referring to Fig. 2, the diagrammatic cross-section of the shell 20 of another embodiment of the present invention.The shell 20 include substrate 101, Thermally conductive sheet 203 and heat dissipation film 205.
The material of the substrate 101 is metal (aluminium, stainless steel etc.), glass or plastic cement etc..
The thermally conductive sheet 203 is attached at the surface of the substrate 101.The thickness of the thermally conductive sheet 203 is about 20um.? In the present embodiment, the thermally conductive sheet 203 is heat conductive graphite piece.
Further, the heat dissipation film 205 is formed in 203 surface of thermally conductive sheet.The thickness of the heat dissipation film 103 is about 30um。
In the present embodiment, the heat radiation coating proportion of the heat dissipation film 205 is formed are as follows: 50-100 parts of macromolecule resin, 5-15 parts of graphene, 1-5 parts of dispersing agent, the solvent of 1-5 parts of defoaming agent and 100-200 part.Wherein, the heat dissipation film 205 are formed and carrying out spray treatment using surface of the above-mentioned heat radiation coating to the thermally conductive sheet 203.
The present invention also provides 10 preparation methods of shell comprising following steps:
One substrate 101 is provided.The material of the substrate 101 is metal (aluminium, stainless steel etc.), glass or plastic cement.
Substrate 101 is cleaned, to guarantee the binding force of substrate 101 Yu film layer.Such as at 50-60 DEG C, cleaned using neutrality Agent carries out the substrate 101 ultrasonic cleaning 3-10 minute, to clean the dust on 101 surface of substrate and grease stain or by substrate 101 are put into alcohol and impregnate 3-5 minutes, to clean the dust and grease stain on 101 surface of substrate.
Configure heat radiation coating.Wherein, the heat radiation coating proportion are as follows: 50-100 parts of macromolecule resin, 5-15 parts of stone Black alkene, 1-6 parts of heat conductive graphite powder, 1-5 parts of dispersing agent, the solvent of 1-5 parts of defoaming agent and 100-200 part.
Dilute heat radiation coating.By above-mentioned configured heat radiation coating and organic solvent with the dilution proportion of 2:1.Wherein, institute Stating organic solvent can be one of dehydrated alcohol, isopropanol, ethyl acetate or a variety of.
Spray treatment is carried out to form heat dissipation film 103 to the substrate 101 after cleaning.Specifically, above-mentioned dilution is completed The heat radiation coating is sprayed at the surface of the substrate 101, and stands 1 hour.Wherein, the thickness of the heat dissipation film 103 is about For 30um.
Curing process is carried out in the heat dissipation film 103 that 101 surface of substrate is formed to through spray treatment.It specifically, will be upper It states and is formed with the substrate 101 of heat dissipation film 103 and is put into oven for baking 1 hour of 50~80 DEG C.
The present invention also provides the preparation methods of the shell 20 comprising following steps:
One substrate 101 is provided.The material of the substrate 101 is metal (aluminium, stainless steel etc.), glass or plastic cement.
Clean substrate 101.Such as at 50-60 DEG C, ultrasonic cleaning is carried out to the substrate 101 using neutral cleaners It 3-10 minutes, is impregnated 3-5 minutes with cleaning dust and the grease stain or substrate 101 is put into alcohol on 101 surface of substrate, with clear The dust and grease stain on clean 101 surface of substrate.
Thermally conductive sheet 203 is attached in the surface of the substrate 101.In the present embodiment, the thermally conductive sheet 203 is heat conductive graphite Piece.The thermally conductive sheet 203 with a thickness of 20um.
Configure heat radiation coating.Wherein, the heat radiation coating proportion are as follows: 50-100 parts of macromolecule resin, 5-15 parts of stone Black alkene, 1-5 parts of dispersing agent, the solvent of 1-5 parts of defoaming agent and 100-200 part.
Dilute heat radiation coating.By above-mentioned configured heat radiation coating and organic solvent with the dilution proportion of 2:1.Wherein, institute Stating organic solvent can be one of dehydrated alcohol, isopropanol, ethyl acetate or a variety of.
Spray treatment is carried out in the surface of the thermally conductive sheet 203 to form heat dissipation film 205.Specifically, above-mentioned dilution is complete At heat radiation coating be sprayed at the surface of the thermally conductive sheet 203, and stand 1 hour.Wherein, the thickness of the heat dissipation film 205 is big About 30um.
Curing process is carried out in the heat dissipation film 205 that 203 surface of thermally conductive sheet is formed to through spray treatment.Specifically, will The above-mentioned substrate 101 for being formed with heat dissipation film 205 is put into oven for baking 1 hour of 50~80 DEG C.
The present invention is specifically described below by the example.
Embodiment 1
Substrate 101 used in the present embodiment is aluminium.
It cleans substrate: at 50-60 DEG C, ultrasonic cleaning being carried out to the substrate 101 using neutral cleaners, and described The ultrasonic cleaning time is 5 minutes.
Configure heat radiation coating: the wherein proportion of the heat radiation coating are as follows: 50 parts of macromolecule resins, 5 parts of graphenes, 2 parts are led Hot graphite powder, 2 parts of dispersing agents, 2 parts of defoaming agents and 100 parts of solvents.
Dilution heat radiation coating: heat radiation coating and dehydrated alcohol are diluted with the ratio of 2:1.
Spray treatment: using the heat radiation coating after above-mentioned dilution, the substrate 101 is carried out at spraying by air gun Reason, to form heat dissipation film 103.The heat dissipation film 103 with a thickness of 30um.
It stands: the heat dissipation film 103 for being formed in the substrate 101 after spray treatment is stood 1 hour.
Curing process: the above-mentioned substrate 101 for being formed with heat dissipation film 103 is put into oven for baking 1 hour of 80 DEG C.
Heat dissipation performance test: cured treated that substrate 101 is set on heat source by above-mentioned.Wherein, the temperature of the heat source Degree is 103.90 DEG C.
Specifically, firstly, the substrate 101 is formed with being set on the heat source on one side of heat dissipation film 103.Then, Heat source is opened, Yu Suoshu substrate 101 chooses two point P back to the surface of the heat dissipation film 1031(not shown) and P2(not shown), Carry out temperature test.Wherein, P1Click self-heat power heating region, P2Point is selected from nonthermal source heating region, and and P1Point is apart 50mm.It is most obtained afterwards through detection, the P1The temperature T of point1It is 50.99 DEG C, the P2The temperature T of point2It is 40.87 DEG C, △ T2-T1= 10.12℃.Wherein, the △ T2-T1Equal calorific value is indicated, for characterizing the heat-sinking capability of the substrate 101.The equal calorific value is smaller, table Show that the heat-sinking capability of the substrate 101 is stronger.
Embodiment 2
Substrate 101 used in the present embodiment is aluminium.
It cleans substrate: at 50-60 DEG C, ultrasonic cleaning being carried out to the substrate 101 using neutral cleaners, and described The ultrasonic cleaning time is 5 minutes.
Paste thermally conductive sheet 203: wherein the thermally conductive sheet 203 is heat conductive graphite piece.The thickness of the thermally conductive sheet 203 is about 20um。
Configure heat radiation coating: the wherein proportion of the heat radiation coating are as follows: 50 parts of macromolecule resins, 5 parts of graphenes, 2 parts points Powder, 2 parts of defoaming agents and 100 parts of solvents.
Dilution: heat radiation coating and dehydrated alcohol are diluted with the ratio of 2:1.
Spray treatment: using the heat radiation coating after above-mentioned dilution, thermally conductive sheet 203 is carried out at spraying by air gun Reason, to form heat dissipation film 205.The heat dissipation film 205 with a thickness of 30um.
It stands: the heat dissipation film 205 for being formed in the thermally conductive sheet 203 after spray treatment is stood 1 hour.
Curing process: the above-mentioned substrate 101 for being formed with heat dissipation film 205 is put into oven for baking 1 hour of 80 DEG C.
Heat dissipation performance test: cured treated that substrate 101 is set on heat source by above-mentioned.Wherein, the temperature of the heat source Degree is 104.55 DEG C.
Specifically, firstly, the substrate 101 is formed with being set on the heat source on one side of heat dissipation film 205.Then, Heat source is opened, Yu Suoshu substrate 101 chooses two point P back to the surface of the heat dissipation film 2053(not shown) and P4(not shown), Carry out temperature test.Wherein, P3Click self-heat power heating region, P4Point is selected from nonthermal source heating region, and and P3Point is apart 50mm.It is most obtained afterwards through detection, the P3The temperature T of point3It is 50.82 DEG C, the P4The temperature T of point4It is 41.03 DEG C, △ T4-T3= 9.79℃.Wherein, the △ T4-T3Equal calorific value is indicated, for characterizing the heat-sinking capability of the substrate 101.The equal calorific value is smaller, table Show that the heat-sinking capability of the substrate 101 is stronger.
In conclusion the shell 10/20 is by directly forming heat dissipation film 103 or patch on 101 surface of substrate It is re-formed prepared by heat dissipation film 103 after covering thermally conductive sheet 203, manufacture craft is simple to operation.Wherein, the shell 10 with it is described Shell 20 keeps the heat dissipation performance for the shell 10/20 being prepared good using heat conductive graphite as heat-conducting medium.Meanwhile this skill The formula of art scheme is water paint, more environmentally friendly.In addition, preparing the shell 10/20 also without real under high temperature environment It applies, also improves the security performance of operation.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although referring to preferred embodiment to this hair It is bright to be described in detail, those skilled in the art should understand that, technical solution of the present invention can be repaired Change or equivalent replacement, without departing from the spirit of the technical scheme of the invention and essence.

Claims (10)

1. a kind of shell, it is characterised in that: the shell includes at least substrate and heat dissipation film, and the heat dissipation film is formed in the base The surface of material, wherein the raw material for forming the heat dissipation film includes: 50-100 parts of macromolecule resin, 5-15 parts of graphene, 1- 6 parts of heat conductive graphite powder, 1-5 parts of dispersing agent, the solvent of 1-5 parts of defoaming agent and 100-200 part.
2. a kind of production method of shell, feature include the following steps:
One substrate is provided;
Heat dissipation film is formed in the substrate surface using spray treatment, wherein the raw material for forming the heat dissipation film includes: 50-100 Part macromolecule resin, 5-15 part of graphene, 1-6 parts of heat conductive graphite powder, 1-5 parts of dispersing agent, 1-5 parts of defoaming agent with 100-200 parts of solvent.
3. the production method of shell according to claim 2, it is characterised in that: the production method of the shell further includes step It is rapid: the raw material of the heat dissipation film and organic solvent are diluted processing with the ratio of 2:1.
4. the production method of shell according to claim 3, it is characterised in that: the organic solvent is dehydrated alcohol, different One of propyl alcohol, ethyl acetate are a variety of.
5. the production method of shell according to claim 2, it is characterised in that: the heat dissipation film with a thickness of 30um.
6. a kind of shell, it is characterised in that: the shell includes at least substrate, thermally conductive sheet and heat dissipation film, and the thermally conductive sheet pastes In the surface of the substrate, the heat dissipation film is formed in the surface of the thermally conductive sheet, wherein forms the raw material packet of the heat dissipation film It includes: 50-100 parts of macromolecule resin, 5-15 parts of graphene, 1-5 parts of dispersing agent, 1-5 parts of defoaming agent and 100-200 part Solvent.
7. a kind of production method of shell, feature include the following steps:
One substrate is provided;
Paste thermally conductive sheet;
Heat dissipation film is formed on the surface of the thermally conductive sheet using spray treatment, wherein the raw material for forming the heat dissipation film includes: 50- 100 parts of macromolecule resin, 5-15 parts of graphene, 1-5 parts of dispersing agent, 1-5 parts of defoaming agent and 100-200 part it is molten Agent.
8. the production method of shell according to claim 7, it is characterised in that: the production method of the shell further includes step It is rapid: the raw material of the heat dissipation film and organic solvent are diluted processing with the ratio of 2:1.
9. the production method of shell according to claim 8, it is characterised in that: the organic solvent is dehydrated alcohol, different One of propyl alcohol, ethyl acetate are a variety of.
10. the production method of shell according to claim 7, it is characterised in that: the heat dissipation film with a thickness of 30um.
CN201711350601.5A 2017-12-15 2017-12-15 The production method of shell and shell Pending CN109929450A (en)

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Application Number Priority Date Filing Date Title
CN201711350601.5A CN109929450A (en) 2017-12-15 2017-12-15 The production method of shell and shell

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CN109929450A true CN109929450A (en) 2019-06-25

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009179700A (en) * 2008-01-30 2009-08-13 Teijin Ltd Thermally conductive powder coating composition
CN105273540A (en) * 2015-05-18 2016-01-27 深圳市国创新能源研究院 Graphene heat radiation paint, preparation method and applications
CN107216726A (en) * 2016-03-21 2017-09-29 华越科技股份有限公司 The preparation method of thermal dispersant coatings and its made heat dissipation metal composite membrane

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009179700A (en) * 2008-01-30 2009-08-13 Teijin Ltd Thermally conductive powder coating composition
CN105273540A (en) * 2015-05-18 2016-01-27 深圳市国创新能源研究院 Graphene heat radiation paint, preparation method and applications
CN107216726A (en) * 2016-03-21 2017-09-29 华越科技股份有限公司 The preparation method of thermal dispersant coatings and its made heat dissipation metal composite membrane

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
兰州化学工业公司化工机械研究所: "《石油、化工实用防腐蚀技术 第10册 防腐蚀涂料》", 30 April 1975, 燃料化学工业出版社 *

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