CN109921184B - Substrate integrated electric dipole antenna and array based on low-profile microstrip feed structure - Google Patents
Substrate integrated electric dipole antenna and array based on low-profile microstrip feed structure Download PDFInfo
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Abstract
The invention discloses a substrate integrated electric dipole antenna based on a low-profile microstrip feed structure and an array thereof. A pair of printed electric dipoles is arranged on the top metal layer, the middle metal layer is a grounding layer, rectangular grooves for exciting the printed electric dipoles are etched on the grounding layer, and the printed electric dipoles and the middle metal layer are respectively connected through a pair of metallized semi-blind holes penetrating through the first dielectric layer; the rectangular groove etched on the middle metal layer is positioned in the middle of the metallized semi-blind hole connecting the printed electric dipole and the middle metal layer, the second dielectric layer, the third dielectric layer and the bottom metal layer form a low-profile microstrip feed structure. The invention can obtain impedance bandwidth over 40%, and the in-band gain fluctuation is lower than 3dB, in addition, the direct integration with the radio frequency front end circuit is realized by forming a low-profile microstrip feed structure.
Description
Technical Field
The invention belongs to microwave and millimeter wave communication, and particularly relates to a substrate integrated electric dipole antenna and array based on a low-profile microstrip feed structure.
Background
Millimeter wave technology has received great attention in recent years as a result of various practical and potential applications, such as 5G millimeter wave communications, automotive radar, high resolution imaging and detection, and some others. To achieve high rate transmission in communication systems and high resolution in automotive radar and imaging applications, broadband electronics are necessary. In particular, broadband millimeter wave device antennas, which are key devices in millimeter wave wireless systems, are urgently needed to be developed and designed. Among various millimeter-wave antennas, the planar millimeter-wave array antenna has a great prospect due to the advantages of high gain and direct integration with a radio frequency front end.
Magnetoelectric dipole antennas and arrays have gained much attention due to their characteristics of wide operating band, stable unidirectional radiation patterns, and low cross polarization. Research aiming at the millimeter wave substrate integrated magnetoelectric dipole is widely carried out by experts, scholars and engineering technicians in the related field, and forms a series of technical achievements. The millimeter wave substrate integrated magnetoelectric dipole array antenna has the advantages of the magnetoelectric dipole antenna, and can provide higher antenna gain, which is very favorable for millimeter wave frequency band application with relatively higher air propagation loss. However, with regard to the design of the millimeter wave substrate integrated magnetoelectric dipole that has been reported so far, there are several aspects to be improved. Firstly, when most millimeter wave substrate integrated magnetoelectric dipoles are expanded into an array antenna, the bandwidth of the millimeter wave substrate integrated magnetoelectric dipoles is usually obviously narrowed; secondly, most of the co-fed millimeter wave substrate integrated magnetoelectric dipole array antennas need to adopt more than three layers of dielectric substrates (not containing adhesive dielectric materials), so that the processing complexity is increased; thirdly, most of feed networks of the millimeter wave substrate integrated magnetoelectric dipole antenna array antenna are designed on a thicker dielectric plate, so that direct integration with a millimeter wave front end circuit chip is difficult to realize; in addition, the bandwidth of most millimeter wave substrate integrated magnetoelectric dipole array antennas is lower than 40%, and the space for improvement is still provided.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide a substrate integrated electric dipole antenna based on a low-profile microstrip feed structure, and also provides an antenna array composed of the antenna, so that the impedance bandwidth of the antenna is improved, the complexity of a feed network is reduced, and the thickness of a dielectric substrate used by the feed network is reduced.
The technical scheme is as follows: the invention relates to a substrate integrated electric dipole antenna based on a low-profile microstrip feed structure, which comprises a top metal layer, a first dielectric layer, a middle metal layer, a second dielectric layer, a third dielectric layer and a bottom metal layer which are sequentially arranged from top to bottom, wherein a pair of printed electric dipoles are arranged on the top metal layer, the middle metal layer is a ground layer, rectangular grooves for exciting the printed electric dipoles are etched on the ground layer, and the electric dipoles and the middle metal layer are respectively connected through a pair of metallized semi-blind holes penetrating through the first dielectric layer; the rectangular groove etched on the middle metal layer is positioned in the middle of the metalized semi-blind hole connecting the electric dipole with the middle metal layer. The antenna also comprises a low-profile microstrip feed structure, wherein the low-profile microstrip feed structure comprises a middle metal layer, a second dielectric layer, a third dielectric layer and a bottom metal layer, a fine strip line which is spatially vertical to the rectangular groove is arranged on the bottom metal layer, and the center of the fine strip line is superposed with the center of the rectangular groove in the vertical direction; one end of the fine strip line is open-circuited, the other end of the fine strip line is connected with the 50 ohm microstrip line, and the middle metal layer is used as the common ground of the radiation unit and the microstrip feed structure.
Further, an additional structure can be added between a pair of printed electric dipoles for widening the bandwidth and improving the in-band gain flatness; the additional structure added is composed of a rectangular patch located at the top metal layer and four metallized semi-blind holes connecting the rectangular patch and the middle metal layer, wherein the four metallized semi-blind holes are located at positions close to four corners of the rectangular patch.
Furthermore, the thickness of the first dielectric layer is about a quarter of the guided wave wavelength, the second dielectric layer can be a semi-solidified adhesive dielectric layer, and all the metallized semi-blind hole structures are located in the first dielectric layer.
Furthermore, in the array antenna formed by the substrate integrated electric dipole antenna based on the low-profile microstrip feed structure, four magnetoelectric dipole units are arranged in two rows and two columns, excitation ports of two magnetoelectric dipole units in each row (or each column) are respectively connected to an output port of one-to-two microstrip power divider, and input ports of two one-to-two microstrip power dividers are respectively connected to an output port of the other one-to-two microstrip power divider.
Further, the size of the array antenna can be enlarged to 2N×2N(N.gtoreq.2), expanded squareBy the method, four are 2N-1×2N-1(N is more than or equal to 2) arrays are arranged according to two arrays in each row and column, and then the four arrays 2 are divided by an I-shaped microstrip power dividerN-1×2N-1(N.gtoreq.2) arrays are connected, each 2N-1×2N-1And (N is more than or equal to 2) excitation ports of the array are respectively connected to output ports of the I-shaped power divider.
Has the advantages that: the invention discloses a substrate integrated magnetoelectric dipole antenna based on a low-profile microstrip feed structure and an array thereof.A rectangular patch and four metallized semi-blind holes are introduced into the substrate integrated magnetoelectric dipole antenna to form an extra structure, so that the impedance bandwidth of more than 44% and the gain in a flatter zone can be realized; when the designed substrate integrated magnetoelectric dipole is expanded into an array antenna, the bandwidth of the array antenna is basically consistent with that of an antenna unit, and the phenomenon of obvious bandwidth deterioration can not occur; and the low-profile microstrip feed structure can enable the antenna to be directly integrated with a millimeter wave radio frequency front end circuit.
Drawings
FIG. 1 is a schematic diagram of a hierarchical structure of an antenna according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an antenna unit structure without additional structures according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an antenna unit structure with an additional structure according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a top metal layer of a 2 × 2 array antenna according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a bottom metal layer (feed network) of a 2 × 2 array antenna according to an embodiment of the present invention;
FIG. 6 is a schematic view of an expanded 8X 8 array according to an embodiment of the present invention;
FIG. 7 is a drawing of | S for the case of an antenna element with or without an additional structure in accordance with an embodiment of the present invention11I, a simulation result;
fig. 8 is a gain simulation result in the case of the presence or absence of an additional structure of the antenna unit in the embodiment of the present invention;
FIG. 9 shows simulation results (28GHz) of antenna unit patterns with additional structures in accordance with embodiments of the present invention;
FIG. 10 shows | S of an 8 × 8 array antenna according to an embodiment of the present invention11I, a simulation and test result graph;
fig. 11 is a graph of gain simulation and test results and radiation efficiency simulation results of an 8 × 8 array antenna according to an embodiment of the present invention;
FIG. 12 is a simulation and test result (28GHz) of the XOZ plane pattern of an 8 × 8 array antenna in accordance with an embodiment of the present invention;
fig. 13 shows simulation and test results (28GHz) of the YOZ plane pattern of an 8 x 8 array antenna in accordance with an embodiment of the present invention.
Detailed Description
To further explain the technical solution disclosed in the present invention, the following further introduces the technical solution of the present invention with reference to the detailed description and the accompanying drawings.
The embodiment discloses a substrate integrated magnetoelectric dipole antenna based on a low-profile microstrip feed structure, which comprises a top metal layer 1, a first dielectric layer 2, a middle metal layer 3, a second dielectric layer 4, a third dielectric layer 5 and a bottom metal layer 6 which are sequentially arranged from top to bottom as shown in fig. 1-2, wherein a pair of printed electric dipoles is arranged on the top metal layer 1 and comprises a first group of electric dipoles 7 and a second group of electric dipoles 8, the middle metal layer 3 is a ground layer, rectangular grooves 9 for exciting the printed electric dipoles are etched on the ground layer, the printed first group of electric dipoles 7 and the printed second group of electric dipoles 8 are respectively connected with the middle metal layer 3 through a pair of metallized half blind holes penetrating through the first dielectric layer 2, and the printed first group of metallized half blind holes 10 are connected with the second group of metallized half blind holes 11 as shown in the figure; a rectangular slot 9 etched in the intermediate metal layer 3 is located between the metallized semi-blind holes connecting the printed first and second sets of electric dipoles 7, 8 and the intermediate metal layer 3.
Furthermore, the antenna also comprises a low-profile microstrip feed structure, wherein the low-profile microstrip feed structure comprises a middle metal layer 3, a second dielectric layer 4, a third dielectric layer 5 and a bottom metal layer 6, a fine strip line 12 which is vertical to the rectangular groove 9 is arranged on the bottom metal layer 6 in space, and the center of the fine strip line 12 is superposed with the center of the rectangular groove 9 in the vertical direction; one end of the fine strip line 12 is open-circuited, the other end is connected with the 50 ohm microstrip line 13, and the middle metal layer 3 is used as the common ground of the radiation unit and the microstrip feed structure. The thickness of the first dielectric layer 2 is about a quarter of the guided wave wavelength, the second dielectric layer 4 can be a semi-solidified adhesive dielectric layer, and all the metallized semi-blind hole structures 20 are located in the first dielectric layer 1.
As shown in fig. 3, an additional structure 14 may be added between a pair of printed electrodes to widen the bandwidth and improve the in-band gain flatness; the additional structure 14 added is constituted by a rectangular patch 15 located at the top metal layer 1 and by four metallized half-blind holes, a first metallized half-blind hole 161, a second metallized half-blind hole 162, a third metallized half-blind hole 163 and a fourth metallized half-blind hole 164, shown in fig. 3, connecting this rectangular patch 15 and the intermediate metal layer 3, the four metallized half-blind holes being located close to the four corners of the rectangular patch 15.
As shown in fig. 4, a 2 × 2 array antenna may be formed by arranging four magnetoelectric dipole units in two rows and two columns, where the four magnetoelectric dipole units are shown as a first magnetoelectric dipole unit 171, a second magnetoelectric dipole unit 172, a third magnetoelectric dipole unit 173, and a fourth magnetoelectric dipole unit 174, excitation ports of two magnetoelectric dipole units in each row (or each column) are respectively connected to an output port of one-to-two microstrip power divider, and specifically, in fig. 4, the input ports of two one-to-two microstrip power dividers respectively correspond to the first microstrip power divider 181 and the second microstrip power divider 182, and the input ports of two one-to-two microstrip power dividers are respectively connected to an output port of the one-to-two microstrip power divider 19.
In addition, the size of the array antenna can be enlarged to 2 on the basis of the 2 × 2 arrayN×2N(N is more than or equal to 2), the expanding method is as follows:
four are 2N-1×2N-1(N is more than or equal to 2) the arrays are arranged according to two arrays in each row and column, and then the arrays are in an I shapeThe four 2 are divided by the microstrip power dividerN-1×2N-1(N.gtoreq.2) arrays are connected, each 2N-1×2N-1The excitation ports of the array (N ≧ 2) are respectively connected to the output ports of the I-shaped power divider, and FIG. 5 shows an 8 × 8 array antenna designed by this method.
In order to verify the authenticity and reliability of the broadband array antenna and the array structure thereof provided by the invention, the antenna units with or without the additional structure 14 are firstly simulated respectively, and fig. 7 and fig. 8 show the simulation results of | S11| and gain curves in two cases respectively, and the results show that, under the condition of no additional structure 14, the | S11| < -10dB bandwidth of the antenna unit is about 37.74%, which is greater than that of most millimeter wave substrate integrated magnetoelectric dipole antennas, the bandwidth can be widened to 42.78% even under the condition of adding the additional unit, and the in-band gain variation is also improved remarkably. Fig. 9 shows the simulation result (28GHz) of the pattern of the antenna unit, and it can be observed that the patterns of the XOZ plane and the YOZ plane are relatively symmetrical and the cross polarization is relatively low. According to the scheme and the structure provided by the invention, an embodiment of an 8 × 8 millimeter wave array antenna covering a 22-33GHz frequency band is manufactured for verification, the first dielectric layer 2 of the antenna can adopt a dielectric substrate Taonic TLY-5 with the thickness of 1.52mm, the second dielectric layer 4 can adopt an adhesive sheet Rogers 4450B with the thickness of 0.1mm, and the third dielectric layer 6 can adopt a dielectric substrate Taonic TLY-5 with the thickness of 0.127 mm. Fig. 10-13 show the simulation and test results of the relevant performance of the antenna, and it can be seen from the simulation and test experiment results that the phenomenon of operating bandwidth deterioration does not occur after the antenna unit is expanded into the array antenna. The antenna has the characteristics of compact structure, wide impedance bandwidth (about 44.04%), high gain (about 22-25dBi in band), high orthogonal polarization discrimination (superior to 35dB) and the like. And the feed network adopts a dielectric substrate with the thickness of 0.227mm (0.1mm +0.127mm), and can be directly integrated with a millimeter wave radio frequency front-end chip.
Claims (3)
1. The integrated electric dipole antenna of substrate based on low profile microstrip feed structure, its characterized in that: the metal-clad plate comprises a top metal layer (1), a first dielectric layer (2), a middle metal layer (3), a second dielectric layer (4), a third dielectric layer (5) and a bottom metal layer (6) which are sequentially arranged from top to bottom; a pair of electric dipoles is arranged on the top metal layer (1), the middle metal layer (3) is a ground layer, rectangular grooves (9) for exciting and printing the electric dipoles are etched in the middle metal layer (3), and the first group of electric dipoles (7), the second group of electric dipoles (8) and the middle metal layer (3) are respectively connected through a first pair of metallized semi-blind holes (10) and a second pair of metallized semi-blind holes (11) penetrating through the first dielectric layer (2); the rectangular groove (9) etched on the middle metal layer (3) is positioned in the middle of the metalized semi-blind hole connecting the first group of electric dipoles (7), the second group of electric dipoles (8) and the middle metal layer (3); the antenna also comprises a low-profile microstrip feed structure, wherein the low-profile microstrip feed structure comprises a middle metal layer (3), a second dielectric layer (4), a third dielectric layer (5) and a bottom metal layer (6), a fine strip line (12) which is spatially vertical to the rectangular groove (9) is arranged on the bottom metal layer (6), and the center of the fine strip line (12) is superposed with the center of the rectangular groove (9) in the vertical direction; one end of the fine strip line (12) is open-circuited, the other end of the fine strip line is connected with a 50-ohm microstrip line (13), and the middle metal layer (3) is used as the common ground of the radiation unit and the microstrip feed structure;
the antenna is provided with an additional structure (14) between a pair of electric dipoles for broadening the bandwidth and improving the in-band gain flatness; the additional structure (14) is formed by a rectangular patch (15) located on the top metal layer (1) and four metallized semi-blind holes connecting this rectangular patch (15) and the middle metal layer (3), the four metallized semi-blind holes being located close to the four corners of the rectangular patch (15).
2. The substrate integrated electric dipole antenna based on low-profile microstrip feed structure of claim 1, wherein: the thickness of the first dielectric layer (2) is a quarter of the guided wave wavelength, the second dielectric layer (4) is a semi-solidified adhesive dielectric layer, and the metallized semi-blind hole structures (20) are all located on the first dielectric layer (1).
3. A substrate integrated magnetoelectric dipole array antenna structure based on a low-profile microstrip feed structure is characterized in that: the array antenna structure comprises four magnetoelectric dipole units, the magnetoelectric dipole units are arranged into two rows and two columns, excitation ports of two magnetoelectric dipole units in each row or each column are respectively connected to an output port of one-to-two microstrip power distributor, and input ports of two one-to-two microstrip power distributors are respectively connected to an output port of the other one-to-two microstrip power distributor;
the scale of the array antenna structure can be enlarged to 2 Nx 2N (N is more than or equal to 2);
the array antenna structure comprises four 2N-1 x 2N-1(N is larger than or equal to 2) arrays which are arranged according to two arrays in each row and column, then the four 2N-1 x 2N-1(N is larger than or equal to 2) arrays are connected by an I-shaped microstrip power divider, and the excitation port of each 2N-1 x 2N-1(N is larger than or equal to 2) array is respectively connected to the output port of the I-shaped microstrip power divider for scale enlargement.
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| CN112701462B (en) * | 2020-12-16 | 2022-03-15 | 曲阜师范大学 | SIW (substrate integrated waveguide) circularly polarized low-profile magnetoelectric dipole antenna |
| CN112838379B (en) * | 2020-12-31 | 2022-03-29 | 华南理工大学 | Magnetoelectric dipole antenna array based on 3D printing technology |
| CN112993593B (en) * | 2021-02-10 | 2022-04-08 | 清华大学 | Millimeter wave phased array antenna and mobile terminal |
| CN113708060A (en) * | 2021-08-16 | 2021-11-26 | 中国电子科技集团公司第四十三研究所 | Dipole antenna based on three-dimensional differential feed structure |
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| CN103401068A (en) * | 2013-08-08 | 2013-11-20 | 西安电子科技大学 | High-gain wideband stereoscopic slot Yagi antenna |
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