CN109920645A - Mould release film and used its monolithic ceramic electronic component manufacturing method - Google Patents
Mould release film and used its monolithic ceramic electronic component manufacturing method Download PDFInfo
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- CN109920645A CN109920645A CN201811449423.6A CN201811449423A CN109920645A CN 109920645 A CN109920645 A CN 109920645A CN 201811449423 A CN201811449423 A CN 201811449423A CN 109920645 A CN109920645 A CN 109920645A
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- release layer
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- protrusion
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- 239000000919 ceramic Substances 0.000 title claims abstract description 112
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000945 filler Substances 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims description 29
- 239000002002 slurry Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 230000003746 surface roughness Effects 0.000 claims description 10
- 238000010276 construction Methods 0.000 claims description 6
- 239000010408 film Substances 0.000 abstract description 169
- 239000010409 thin film Substances 0.000 abstract description 15
- 229920002799 BoPET Polymers 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 109
- 239000002585 base Substances 0.000 description 88
- 239000002245 particle Substances 0.000 description 22
- 239000003985 ceramic capacitor Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002671 adjuvant Substances 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical class [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 230000001010 compromised effect Effects 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910002971 CaTiO3 Inorganic materials 0.000 description 1
- 229910002976 CaZrO3 Inorganic materials 0.000 description 1
- 229910002370 SrTiO3 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- IWXBAFPAYLDYOJ-UHFFFAOYSA-N [Pb].[Zr].[Ti] Chemical compound [Pb].[Zr].[Ti] IWXBAFPAYLDYOJ-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 239000005385 borate glass Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 235000011132 calcium sulphate Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The present invention provide it is a kind of without using reduce filler, foreign matter special base film (such as PET film etc.) in the case where, the mould release film (carrier thin film) of the ceramic green sheet of the high quality there is no the thin part of thickness, through hole can be manufactured and used the manufacturing method of the monolithic ceramic electronic component of its high reliablity.Mould release film has: having the base film of multiple protrusions on surface and covers the release layer on its surface, keeps the thickness T1 of the i.e. release layer of size from the surface of release layer until the root of the protrusion of base film bigger than the height H of the i.e. protrusion of size on the direction along direction X from the top of the protrusion of base film until the root of protrusion.In addition, mould release film has: there is the base film of multiple recess portions on surface and cover the release layer on its surface, keep the size i.e. thickness of release layer T2 from the surface of release layer until the bottom surface of the recess portion of base film bigger than the depth D of recess portion.
Description
The application be the applying date be on February 03rd, 2015, application No. is 201510055944.3, entitled " demoulding
Film and used its monolithic ceramic electronic component manufacturing method " application for a patent for invention divisional application.
Technical field
The present invention relates to the manufacturing methods of mould release film and monolithic ceramic electronic component, particularly, are related to forming pottery
Mould release film used in porcelain raw cook and the ceramic green sheet for using the mould release film to be formed is subject to use to manufacture stacking pottery
The method of porcelain electronic component.
Background technique
More ceramic green sheet used in the manufacture of the monolithic ceramic electronic components such as laminated ceramic capacitor is for example to pass through
On the surface of carrier thin film (such as polyethylene terephthalate (PET) film), coated with ceramic slurry is shaped to sheet
Method and make.In addition, as carrier thin film, in the face for forming ceramic green sheet, provided with being formed for being easily peeled off
The carrier thin film (mould release film) of the releasing layer of ceramic green sheet is widely used.
But in the case where being coated to ceramic slurry on the above-mentioned carrier thin film as supporter, if on its surface
(applicator surface) is formed in the position of the ceramic green sheet at the position there are protrusion and is formed in that there is no protrusions there are protrusion
The position at other positions in portion is compared, and thickness may be thinning, or may result in through hole since protrusion penetrates through.
It is laminated in the ceramic green sheet of state that is this locally thinning to thickness or forming through hole to make stacking
In the case where ceramic electronic components, for example, there are easy in the case where monolithic ceramic electronic component is laminated ceramic capacitor
The problem of generation proof voltage failure, short trouble cannot obtain desired characteristic, and reliability reduces.
The method of generation as this protrusion of inhibition to ceramic green sheet, has the PET for reducing and constituting carrier thin film
The amount of the filler, foreign matter that contain in film, or the method without containing filler is (for example, the claim 4 of patent document 1
Deng).
But actually general most of PET film contains filler or foreign matter, filler or few foreign or essence
On the PET film that does not contain be special PET film, due to requiring high-tech in its production, manufacturing cost rises, therefore is high
Valence.
Therefore, it is made by this filler or few foreign or the PET film contained substantially no as carrier thin film
In the case where making monolithic ceramic electronic component, the problem of also increase there are the manufacturing cost of monolithic ceramic electronic component.
Citation
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2013-60555 bulletin
Summary of the invention
The present invention solves the above subject, it is intended that provide it is a kind of without using reduce filler, foreign matter it is special
Base film in the case where, the demoulding of the ceramic green sheet of the high quality there is no the thin part of thickness, through hole can be manufactured
Film (carrier thin film) and used the mould release film high reliablity monolithic ceramic electronic component manufacturing method.
The means to solve the problem-
Mould release film of the invention solves the above subject, which is characterized in that has:
Base film has multiple protrusions on surface；With
Release layer covers the surface of the base film,
From the surface of the release layer until the root of the protrusion of the base film, along with it is described
The thickness T1 of size, the i.e. described release layer on the direction of the orthogonal direction X in the surface of release layer is than from the base film
The top of the protrusion rise size on the direction along the direction X to the root of the protrusion until, i.e. described in
The height H of protrusion is big.
In the present invention, it as the base film, is able to use comprising filler, also, the filler is in substrate
Equally distributed base film on the thickness direction of film.
Using filler equally distributed base film in a thickness direction, although in the table of base film
Face protrusion easy to form, but in the present invention, due to forming release layer on the surface of base film, make the table of mould release film
Face is smoothened, therefore is capable of providing a kind of without using special base film (such as the PET for reducing filler, foreign matter
Film) in the case where, the mould release film of the ceramic green sheet of the high quality there is no the thin part of thickness, through hole can be manufactured
(carrier thin film).
In addition, the thickness T1 of the release layer is preferably 96nm or more bigger than the height H of the protrusion.
By keeping the value of the thickness T1 of release layer 96nm or more bigger than the value of the height H of the protrusion of base film, thus
The excellent mould release film of the flatness on surface can be formed more reliably.
In addition, surface roughness of the surface roughness of the release layer preferably than the base film is small.
By having above structure, the excellent mould release film of the flatness on surface can be reliably formed.Also, by making
With the mould release film, the ceramic green sheet of the high quality there is no the thin part of thickness, through hole can be manufactured.
Furthermore it is preferred that having multiple release layer protrusions on the surface of the release layer, from the release layer protrusion
Play until the root of the release layer protrusion, the size along on the direction of the direction X, the i.e. described release layer in top
The height H2 of protrusion is smaller than the height H of the protrusion of the base film.
By having above structure, the excellent mould release film of the flatness on surface can be reliably formed.Also, by making
With the mould release film, the ceramic green sheet of the high quality there is no the thin part of thickness, through hole can be manufactured.
In addition, mould release film of the invention is characterized in that having:
Base film has multiple recess portions on surface；With
Release layer covers the surface of the base film,
From the surface of the release layer until the bottom surface of the recess portion of the base film, along with it is described de-
The thickness T2 of size, the i.e. described release layer on the direction of the orthogonal direction X in the surface of mold layer is than the table from the base film
Rise until the bottom surface of the recess portion, big along the size on the direction of the direction X, the depth D of the i.e. described recess portion in face.
In the present invention, it as the base film, is able to use containing filler, also, the filler is in substrate
Equally distributed base film on the thickness direction of film.
Using filler equally distributed base film in a thickness direction, although base film is smooth
Property be compromised, in surface recess portion easy to form, but in the present invention, due to the surface of base film formed release layer, make
The surface of mould release film is smoothened, therefore is capable of providing a kind of without using the special substrate for reducing filler, foreign matter
In the case where film (such as PET film), the ceramic green sheet of the high quality there is no the thin part of thickness, through hole can be manufactured
Mould release film (carrier thin film).
In addition, the thickness T2 of the release layer is preferably 50nm or more bigger than the depth D of the recess portion.
By keeping the value of the thickness T2 of release layer 50nm or more bigger than the value of the depth D of the recess portion of base film, so as to
The excellent mould release film of the flatness on surface is enough formed more reliably.
Surface roughness of the surface roughness of the release layer preferably than the base film is small.
By having above structure, the excellent mould release film of the flatness on surface can be reliably formed.Also, by making
With the mould release film, the ceramic green sheet of the high quality there is no the thin part of thickness, through hole can be manufactured.
It is preferred that there are multiple release layer recess portions on the surface of the release layer, to described de- from the surface of the release layer
It is until the bottom surface of mold layer recess portion, compare institute along the depth D2 of size, the i.e. described release layer recess portion on the direction of the direction X
The depth D for stating the recess portion of base film is small.
By having above structure, the excellent mould release film of the flatness on surface can be reliably formed.Also, by making
With the mould release film, the ceramic green sheet of the high quality there is no the thin part of thickness, through hole can be manufactured.
In addition, the manufacturing method of monolithic ceramic electronic component of the invention is characterized in that having:
The coated with ceramic slurry on the mould release film of aforementioned present invention, to form the ceramic green sheet with a thickness of 0.5~2 μm
Process；
The process for forming the laminated body for the construction that there is the ceramic green sheet and interior electrode layer to be laminated；With
It is burnt into the laminated body, the process to make ceramic sintered bodies.
Invention effect-
Since mould release film of the invention has: base film；With cover its surface, have than being present in base film
Protrusion height H big thickness T1 release layer, therefore be capable of providing a kind of without using reducing filler, foreign matter
In the case where special base film (such as PET film), it can manufacture that there is no the high quality of the thin part of thickness, through hole
Ceramic green sheet mould release film (carrier thin film).
That is, according to the present invention, due on the surface of base film there are in the case where protrusion, also by formation
Release layer on the surface of base film reduces filler, foreign matter by the surface smoothing of base film, therefore not using
Special base film in the case where, can also constitute the few mould release film of surface projections (carrier thin film), by using
The mould release film can manufacture the ceramic green sheet of high quality with low cost.
Further, since be configured to have base film and cover its surface, with than being present in the recessed of base film
In the case where the release layer of the depth D in portion big thickness T2, also by the release layer formed on the surface of base film, by recess portion
The surface smoothing of existing base film, thus be capable of providing it is a kind of without using reduce filler, foreign matter it is special
In the case where base film (such as PET film), the ceramics of the high quality there is no the thin part of thickness, through hole can be manufactured
The mould release film (carrier thin film) of raw cook.
Further, since the manufacturing method of monolithic ceramic electronic component of the invention has: being applied in mould release film of the invention
Ceramic slurry is applied, there is ceramic green sheet and interior electrode layer to form the process with a thickness of 0.5~2 μm of ceramic green sheet, be formed
The process and firing laminated body of the laminated body for the construction being laminated, the process to make ceramic sintered bodies, therefore can be efficient
Ground manufactures proof voltage can high, the not high reliablity of short trouble of interior electrode layer etc. monolithic ceramic electronic component.
Detailed description of the invention
Fig. 1 is the front section view of the structure for the mould release film for indicating that embodiments of the present invention are related to.
Fig. 2 is the front section view of the structure for the mould release film for indicating that another embodiment of the present invention is related to.
Fig. 3 is the mould release film for indicating to be related to using embodiments of the present invention and the monolithic ceramic electronic component formed
Front section view.
Symbol description-
1 (1A, 1B) mould release film
10 base films
11 protrusions (protrusion of base film)
12 recess portions (recess portion of base film)
15 fillers (particle)
20 release layers
21 release layer protrusions
22 release layer recess portions
50 laminated ceramic capacitors
51 ceramic layers
52 (2a, 2b) internal electrodes
The end face of 53 (3a, 3b) laminated ceramic elements
54 (4a, 4b) external electrodes
60 laminated ceramic elements (ceramic sintered bodies)
The depth of D recess portion
The depth of D2 release layer recess portion
The height of H protrusion
The height of H2 release layer protrusion
The thickness of T1, T2 mould release film
Direction X orthogonal with the surface of release layer
Specific embodiment
Embodiments of the present invention are expressed below, are illustrated in further detail to as feature place of the invention.
[embodiment]
In the present embodiment, to the first embodiment of the present invention is related to mould release film structure and its manufacturing method
It is illustrated.
As shown in Fig. 1 or Fig. 2, the mould release film 1 (1A, 1B) that embodiment is related to has comprising filler (particle) 15
Base film 10 and be disposed of covering base film 10 surface release layer 20, wherein the base film 10 is on surface
Have protrusion (protrusion of base film) 11 (Fig. 1) or recess portion (protrusion of base film) 12 (Fig. 2).In addition, such as
Shown in Fig. 1 or Fig. 2, the protrusion 11 of so-called base film 10 refers in the thickness direction (side X for observing base film 10
To) section when, by the part for linking the adjacent nethermost line segment of recess portion 12 and the surface of base film 10 impales.This
Outside, the recess portion 12 of so-called base film 10 refers in the section of thickness direction (X-direction) for observing base film 10, by
The part that the surface of the line segment and base film 10 that link the vertex of adjacent protrusion 11 impales.
The mould release film 1 (1A, 1B) is for example made by methods described below.Firstly, passing through the public affairs such as extrusion forming
The method known, using the resin raw material for containing particle (filler), to make the film not extended as base film.So
Afterwards, extend the film not extended, obtain base film 10 (Fig. 1, Fig. 2).
Next, being formed with the surface of the base film 10 of protrusion 11 (Fig. 1) or recess portion 12 (Fig. 2) on surface, apply
The resin material of the uncured state as release layer 20 is applied to form film, by making the curing of coating, thus according to covering
The mode on the surface of base film 10 forms release layer 20 (Fig. 1, Fig. 2).In addition, as the uncured shape for becoming release layer 20
The cured method of the resin material of state, can be exemplified: the methods of heat cure, ultraviolet curing, electron ray curing.Also,
In these methods, the method for heat cure is most preferably.
Then, as needed, further become the uncured state of release layer 20 resin material solidify after substrate
Film extends.In addition, the extending direction of the above-mentioned base film not extended can also with via the resinous wood for making release layer 20
Expect that cured process forms the direction difference of the extension of the mould release film 1 after release layer 20 come the surface in base film.
As described above, forming the structure on the surface that there is release layer 20 to be disposed of covering base film 10, Fig. 1, Fig. 2
Shown in mould release film 1 (1A, 1B).
As the material for constituting base film 10, polyethylene terephthalate (PET) is used as preferred material.But
It is that other materials also can be used.Also, in the base film 10 used in the present embodiment, it is used as film to assign
In the case where easy slip as the main purpose, be mixed with filler (particle) 15.
As the filler (particle) 15 cooperated in the material for constituting base film 10, can be used can assign easy cunning
The particle of a variety of materials of property, type do not restrict particularly.As the preferred example of filler (particle) 15, citing
Have: silica, calcium carbonate, magnesium carbonate, barium carbonate, calcium sulfate, calcium phosphate, magnesium phosphate, clay, aluminium oxide, titanium oxide etc..This
Outside, depending on the situation, the organic filler of heat resistance also can be used as filler (particle) 15.
The shape of filler (particle) 15 does not also restrict especially, and spherical, blocky, rodlike, flat etc. appoint can be used
The particle for shape of anticipating.In addition, these fillers (particle) 15 also can according to need, while using two or more particles.
In base film 10, the amount of filler (particle) 15 is preferably 0.01 mass % or more, 2 mass % or less
Range, more preferably 0.01 mass % or more, 1 mass % or less.The case where the amount of particle is less than 0.01 mass %
Under, the easy slip of film is in the trend become inadequate.On the other hand, more than 2 mass %, film surface
Flatness is in the trend become inadequate.
It restricts the method in base film 10 containing filler (particle) 15 especially, can use well known various
Method.
The material of release layer 20 as the surface for constituting covering base film 10, is able to use silicone resin (silicone tree
Rouge), the resin materials such as other organic resin.
In addition, the outer surface of release layer 20 is the applicator surface of ceramic slurry.Release layer 20 for example can be by thin in substrate
The surface coating of film 10 becomes the uncured resin material of release layer 20 to form film, makes curing of coating to be formed.
In the mould release film 1 of present embodiment, the filler (particle) 15 in base film 10 is in the thickness direction thereof
It is uniformly distributed.It is so-called to be uniformly distributed in a thickness direction, refer to either single layer structure or stepped construction, is filled between each layer
The amount of object (particle) is all identical.The surface of base film 10 has prominent due to the existing influence of filler (particle) 15
It rises portion 11 (referring to Fig.1).In other words, protrusion 11 is mixed at least part of filler (particle) 15.
In the mould release film 1 of present embodiment, due to by the surface of base film 10 formed release layer 20, thus
Being smoothed of surface of mould release film 1, thus do not need in order to reduce the height H of the protrusion 11 on the surface of base film 10 or
The depth D of person's recess portion 12, and reduce the filler (particle) for being formed with the face near zone of release layer 20 of base film 10
Amount, filler (particle) can also be uniformly distributed on the thickness direction of base film 10.Although that is, filling
In a thickness direction in equally distributed base film 10, the flatness on surface is compromised object (particle), protrusion easy to form
11, recess portion 12, but due to that by 20 being smoothed of release layer, can not need using reducing filler (grain
Son), the special base film of foreign matter.
That is, the surface roughness of release layer 20 is configured to smaller than the surface roughness of base film 10.In addition, de-
The height H2 of the protrusion (protrusion of release layer) 21 of mold layer 20 is configured to smaller than the height H of the protrusion 11 of base film 10
(referring to Fig.1).Further, the depth D2 of the recess portion (release layer recess portion) 22 of release layer 20, that is, the table from release layer 20
Face play the bottom surface of release layer recess portion 22 until the direction along direction X on size, i.e. release layer recess portion 22 depth D2
It is configured to (referring to Fig. 2) smaller than the depth D of the recess portion 12 of base film 10.
<manufacturing method of monolithic ceramic electronic component>
Next, manufacturing monolithic ceramic electronic component to above-mentioned mould release film 1 is used (is in the present embodiment tool
Have the laminated ceramic capacitor of structure shown in Fig. 3) method be illustrated.
In addition, laminated ceramic capacitor 50 shown in Fig. 3 has in the mutual of laminated ceramic element (ceramic sintered bodies) 60
Opposed pairs end face 53 (53a, 53b) is equipped with external electrode in the way of with interior electrode layer 52 (52a, 52b) conducting
The structure of 54 (54a, 54b), wherein in the laminated ceramic element 60, be laminated with via the ceramic layer 51 as dielectric layer more
A interior electrode layer 52 (52a, 52b).
When manufacturing the laminated ceramic capacitor 50, firstly, preparing ceramic slurry.As ceramic material, as it is explained in detail hereinafter, root
According to function required by the multilayer ceramic electronic component to be manufactured (being in the present embodiment laminated ceramic capacitor) etc., choosing
Select ceramic material appropriate (for example, barium titanate series dielectric ceramic material).
Then, on above-mentioned Fig. 1 or mould release film shown in Fig. 21, the ceramic slurry prepared is applied, and form
After sheet, it is dried according to necessity.Ceramic green sheet is obtained as a result,.
Later, the conductive paste (such as Ni paste) that interior electrode layer is formed for the ceramic green sheet in formation is printed.
It is used next, the ceramic green sheet for having printed conductive paste and the outer layer portion for not printing conductive paste are formed
Ceramic green sheet be laminated in a prescribed manner, make layered structure by crimping.
Later, the layered structure, and the laminated body (chip) by being fired into are cut as needed, to obtain
Ceramic sintered bodies as laminated ceramic capacitor main body.
In the ceramic sintered bodies, above-mentioned conductive paste constitutes interior electrode layer, is situated between in addition, ceramic green sheet constitutes electricity
Matter layer.
Then, as needed, by coming on the outer surface of ceramic sintered bodies in the way of being connected with interior electrode layer
External electrode is formed, to for example obtain laminated ceramic capacitor shown in Fig. 3 (monolithic ceramic electronic component) 50.
In addition, the present invention by meaningfully be applied to use special requirement mould release film 1 surface flatness, it is thick
Laminated ceramic capacitor for spending thin ceramic green sheet (especially with a thickness of 0.5 μm~2 μm of ceramic green sheet) to be formed etc. is representative
Monolithic ceramic electronic component.
Using mould release film 1 of the invention to make ceramic green sheet, by using silk-screen printing, spraying or
Person is molded the methods of spraying, ceramic slurry is coated in the surface of above-mentioned mould release film 1, so as to obtain good ceramic green
Piece.Additionally, it is preferred that including resin component in above-mentioned ceramic slurry.In addition, as solvent, it is preferable to use organic solvent, water etc..
The material used in the case where making ceramic green sheet as mould release film 1 of the invention is used, in addition to ceramic material
Material, also may include adjuvant for combustion such as Si, glass ingredient etc..The concrete example of glass ingredient as adjuvant for combustion, for example there are: packet
Alkali metal-containing component, the silicate glass of alkaline earth metal component, borate glass, borosilicate glass, phosphate glass etc..
The type of ceramic material can be properly selected according to function required by multilayer ceramic electronic component etc..Example
Such as, in the case where the multilayer ceramic electronic component to be manufactured is laminated ceramic capacitor, dielectric ceramics is used.As electricity
The concrete example of media ceramic, for example there are for example: BaTiO3、CaTiO3、SrTiO3、CaZrO3Deng.It can also be suitable to dielectric ceramics
It adds for example locality: the accessory ingredients such as Mn compound, Fe compound, Cr compound, Co compound, Ni compound.
In addition, in the case where multilayer ceramic electronic component is ceraminator, piezoelectric ceramics, such as PZT (zirconium titanium
Lead plumbate) system's ceramics etc. are used.
In addition, in the case where multilayer ceramic electronic component is thermistor element, semiconductive ceramic, such as spinelle
It is that ceramics etc. are used.
In addition, in the case where multilayer ceramic electronic component is inductance element, magnetic substance ceramics, such as ferrite ceramics
Deng being used.
[embodiment]
In the present embodiment, laminated ceramic capacitor is manufactured by the following method, and has investigated interior electrode layer
The generation rate of short trouble.In the present embodiment, as base film 10, polyethylene terephthalate (PET) has been prepared
Film.
Then, corresponding to the surface of base film 10 protrusion 11 height H and recess portion 12 depth D, make in base
The thickness change of the release layer of surface coating, the formation of material film 10, to have made mould release film (carrier thin film) 1.
Then, the mould release film (carrier thin film) produced, the surface of ceramic slurry should be coated, i.e. release layer
Surface (applicator surface) applies the ceramic slurry for being coated with that barium titanate ceramics powder is main material, and forms ceramic green by dry
Piece.In addition, the average thickness according to the ceramic layer after firing is 1.5nm's in the surface coated with ceramic slurry of mould release film
Mode is applied.So-called " average thickness of the ceramic layer after firing is 1.5nm ", refers to and constitutes ceramic sintered bodies (stacking
Ceramic capacitor body) ceramic layer average thickness be 1.5nm, wherein the ceramic sintered bodies be by via stacking, pressure
The laminated body for connecing the process for the ceramic green sheet being made into and being formed is burnt into obtain.
Next, printing on the ceramic green sheet of formation and drying being used to form after the Ni paste of interior electrode layer, roll up
Around mould release film.
Then, by pulling open the mould release film of winding, the ceramic green sheet for being printed with Ni paste is removed from mould release film, and
Stacking, crimping 400, to obtain layered structure.In addition, specific general, layered structure be upper and lower two main surface side not
The construction that the outer layer of printing Ni paste is stacked with ceramic green sheet.
Later, by the way that the layered structure is cut to each chip (laminated body) and is burnt into, to be become
The ceramic sintered bodies of laminated ceramic capacitor main body.
Next, by applying and being burnt into the conductive paste of external electrode formation in ceramic sintered bodies, to be formed outer
Portion's electrode.The laminated ceramic capacitor 50 with construction shown in Fig. 3 is produced as a result,.
Later, for the laminated ceramic capacitor produced, the generation rate of the short trouble of interior electrode layer has been investigated.
The evaluation of short trouble is the Ultra High Resistance Meter using (strain) ADVANTEST
R8340A is carried out by measuring insulation resistance under conditions of 6.3V, 1 minute, is logIR < 6 at insulation resistance (IR)
In the case where be judged as failure.In addition, sample number is set as 300 in this evaluation.
Short trouble rate is found out by following formulas (1).Short trouble rate (%)=(produce the sample of short trouble
Number/300) × 100
The height H of the protrusion 11 on the surface of base film and the thickness T1 and short trouble of release layer are indicated in table 1
The relationship of rate.Here, as shown in Figure 1, the height H of protrusion 11 is from the top of the protrusion 11 of base film to protrusion
It is until 11 root, along the size on the direction of the direction X orthogonal with the surface of release layer.
In addition, as shown in Figure 1, to the protrusion of base film 10 from the surface of release layer 20 shown in the thickness T1 of release layer
It is until the root in portion 11, along the size on the direction of the direction X orthogonal with the surface of release layer 20.Specifically, it demoulds
The thickness T1 of layer is the length that the line segment on root to the surface of release layer 20 of protrusion 11 of base film 10 is connected on the X of direction
Degree.
In addition, the height H of the protrusion 11 in table 1 and the thickness T1 of release layer 20 are by with Japanese Industrial Standards
(JIS) B0601 comes what defined method was found out.
[table 1]
The sample that upper * is paid in sample number is the sample for not having important document of the invention
As shown in table 1, in the sample that may validate that sample number 2, the case where the height H of protrusion 11 is 365nm
Under, when the thickness T1 of release layer is set as 398nm, that is to say, that release layer thickness T1 value than protrusion 11 height H
Value also big 33nm when, short trouble rate be less than 1.0% 0.9%.
Furthermore, it is possible to confirm: in the sample of the sample number 8 of table 1, the case where the height H of protrusion 11 is 126nm
Under, when the thickness T1 of release layer is set as 222nm, that is to say, that release layer thickness T1 value than protrusion 11 height H
Value also big 96mm when, short trouble rate be less than 1.0% 0.3%.
According to the above results, it may validate that and be judged as in short-circuit fault test in the sample by short trouble rate less than 1%
Qualification, by short trouble rate be 1% or more sample be judged as the failure in short-circuit fault test in the case where, will demould
In the case that the thickness T1 of layer 20 is set as 96nm or more bigger than the height H of protrusion 11, short trouble can be adequately suppressed
It generates.
In addition, indicating the depth D of the recess portion 12 on the surface of base film 10 and the thickness T2 of release layer and short circuit in table 2
The relationship of failure rate.Here, as shown in Fig. 2, the depth D of recess portion 12 is from the surface of base film 10 to the bottom surface of recess portion 12
It is until (the minimum position of bottom), along the size on the direction of the direction X orthogonal with the surface of release layer 20.In addition,
As shown in Fig. 2, the thickness T2 of release layer be from the surface of release layer 20 to the bottom surface of the recess portion 12 of base film 10 (bottom
Minimum position) until, along the size on the direction of the direction X orthogonal with the surface of release layer 20.
In addition, the depth D of the recess portion 12 in table 2 and the thickness T2 of release layer 20 are by being provided with JIS B0601
Method find out.Wherein, for the depth D of the height H of the protrusion of base film 11, recess portion 12, release layer thickness T1,
The base film of actual use, the release layer for being formed in its surface can be considered in T2, sample number etc. for obtaining average value
Property and state, condition suitably determine.
[table 2]
The sample that upper * is paid in sample number is the sample for not having important document of the invention
As shown in table 2, it may validate that in the sample of sample number 12, the case where the depth D of recess portion 12 is 380nm
Under, when the thickness T2 of release layer is set as 398nm, that is to say, that release layer thickness T2 value than recess portion 12 depth D
Value big 18nm when, short trouble rate is 0.9% less than 1.0%.
Furthermore, it is possible to confirm as the sample of the sample number 18 of table 2, the case where the depth D of recess portion 12 is 155nm
Under, when the thickness T2 of release layer is set as 205nm, that is to say, that release layer thickness T2 value than recess portion 12 depth D
Value big 50mm when, short trouble rate is 0.7% less than 1.0%.
In addition, may validate that according to the above results and be judged as short trouble in the sample by short trouble rate less than 1%
Qualification in test, in the case that the sample that short trouble rate is 1% or more is judged as the failure in short-circuit fault test,
In the case that the thickness T2 of release layer is set as 50nm or more bigger than the depth D of recess portion 12, short trouble can be adequately suppressed
Generation.
In addition, though in the above-described embodiment, being illustrated by taking laminated ceramic capacitor as an example, but the present invention can
The various laminated ceramics such as piezoelectric ceramics component, thermistor, inductor applied to the laminated type formed using ceramic green sheet
Electronic component.
The present invention is also not limited to above embodiment, embodiment in other aspects, in the range of invention, can add
Various applications, deformation.
Claims (9)
1. a kind of mould release film, which is characterized in that have:
Base film has multiple protrusions on surface；With
Release layer covers the surface of the base film and is only made of resin,
The thickness T1 of the release layer is bigger than the height H of the protrusion, wherein the release layer with a thickness of from the demoulding
Layer surface rise until the root of the protrusion of the base film along orthogonal with the surface of the release layer
Size on the direction of direction X, the height of the protrusion for from the top of the protrusion of the base film to institute
The size on the direction along the direction X until stating the root of protrusion,
It include filler in the base film, also, the filler is uniformly distributed on the thickness direction of base film.
2. mould release film according to claim 1, which is characterized in that
The thickness T1 of the release layer is 96nm or more bigger than the height H of the protrusion.
3. mould release film according to claim 1, which is characterized in that
The surface roughness of the release layer is smaller than the surface roughness of the base film.
4. mould release film described in any one of claim 1 to 3, which is characterized in that
Have multiple release layer protrusions on the surface of the release layer,
The height H2 of the release layer protrusion is smaller than the height H of the protrusion of the base film, wherein the demoulding
Layer protrusion height be from the top of the release layer protrusion until the root of the release layer protrusion along
Size on the direction of the direction X.
5. a kind of mould release film, which is characterized in that have:
Base film has multiple recess portions on surface；With
Release layer covers the surface of the base film and is only made of resin,
The thickness T2 of the release layer is bigger than the depth D of the recess portion, wherein the release layer with a thickness of from the release layer
Surface rise until the bottom surface of the recess portion of the base film along the direction X orthogonal with the surface of the release layer
Direction on size, the depth of the recess portion is the edge from the surface of the base film until the bottom surface of the recess portion
The size on the direction of the direction X,
It include filler in the base film, also, the filler is uniformly distributed on the thickness direction of base film.
6. mould release film according to claim 5, which is characterized in that
The thickness T2 of the release layer is 50nm or more bigger than the depth D of the recess portion.
7. mould release film according to claim 5, which is characterized in that
The surface roughness of the release layer is smaller than the surface roughness of the base film.
8. the mould release film according to any one of claim 5~7, which is characterized in that
There are multiple release layer recess portions on the surface of the release layer,
The depth D2 of the release layer recess portion is smaller than the depth D of the recess portion of the base film, wherein the release layer is recessed
The depth in portion is the direction along the direction X from the surface of the release layer until the bottom surface of the release layer recess portion
On size.
9. a kind of manufacturing method of monolithic ceramic electronic component, which is characterized in that have:
Coated with ceramic slurry on mould release film described in any one of claim 1~8, to be formed with a thickness of 0.5~2 μm
Ceramic green sheet process；
The process for forming the laminated body for the construction that there is the ceramic green sheet and interior electrode layer to be laminated；With
It is burnt into the laminated body, the process to form ceramic sintered bodies.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-022521 | 2014-02-07 | ||
| JP2014022521 | 2014-02-07 | ||
| JP2014-258829 | 2014-12-22 | ||
| JP2014258829A JP2015164797A (en) | 2014-02-07 | 2014-12-22 | Release film and method for manufacturing multilayer ceramic electronic component using the same |
| CN201510055944.3A CN104835644A (en) | 2014-02-07 | 2015-02-03 | Carrier film and method for manufacturing multilayer ceramic electronic component using the same |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510055944.3A Division CN104835644A (en) | 2014-02-07 | 2015-02-03 | Carrier film and method for manufacturing multilayer ceramic electronic component using the same |
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| CN109920645A true CN109920645A (en) | 2019-06-21 |
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| CN201811449423.6A Pending CN109920645A (en) | 2014-02-07 | 2015-02-03 | Mould release film and used its monolithic ceramic electronic component manufacturing method |
| CN201510055944.3A Pending CN104835644A (en) | 2014-02-07 | 2015-02-03 | Carrier film and method for manufacturing multilayer ceramic electronic component using the same |
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| WO2018159247A1 (en) * | 2017-03-01 | 2018-09-07 | 東洋紡株式会社 | Mold releasing film for manufacturing ceramic green sheet and method for manufacturing mold releasing film |
| JP7231340B2 (en) * | 2018-06-05 | 2023-03-01 | 太陽誘電株式会社 | Ceramic electronic component and manufacturing method thereof |
| KR102566372B1 (en) * | 2019-01-25 | 2023-08-11 | (주)케이에프엠 | a release film and a adhesive tape |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11320524A (en) * | 1998-05-11 | 1999-11-24 | Mitsubishi Kagaku Polyester Film Kk | Release film for forming film green sheet |
| CN1348194A (en) * | 2000-10-06 | 2002-05-08 | 株式会社村田制作所 | Method for producing ceramic wafer and laminated ceramic electronic element |
| CN101909875A (en) * | 2008-01-11 | 2010-12-08 | 帝人杜邦薄膜日本有限公司 | Mould release film |
| WO2013146294A1 (en) * | 2012-03-30 | 2013-10-03 | リンテック株式会社 | Parting film for green sheet production and method for producing parting film for green sheet production |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000338810A (en) * | 1999-05-31 | 2000-12-08 | Ricoh Co Ltd | Heat fixing roll |
| KR20120099546A (en) * | 2011-01-28 | 2012-09-11 | 도레이첨단소재 주식회사 | Polyester release film for forming green sheet |
| JP5825949B2 (en) * | 2011-09-14 | 2015-12-02 | リンテック株式会社 | Release film and manufacturing method thereof |
-
2015
- 2015-02-03 CN CN201811449423.6A patent/CN109920645A/en active Pending
- 2015-02-03 CN CN201510055944.3A patent/CN104835644A/en active Pending
- 2015-02-03 KR KR1020150016801A patent/KR20150093594A/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11320524A (en) * | 1998-05-11 | 1999-11-24 | Mitsubishi Kagaku Polyester Film Kk | Release film for forming film green sheet |
| CN1348194A (en) * | 2000-10-06 | 2002-05-08 | 株式会社村田制作所 | Method for producing ceramic wafer and laminated ceramic electronic element |
| CN101909875A (en) * | 2008-01-11 | 2010-12-08 | 帝人杜邦薄膜日本有限公司 | Mould release film |
| WO2013146294A1 (en) * | 2012-03-30 | 2013-10-03 | リンテック株式会社 | Parting film for green sheet production and method for producing parting film for green sheet production |
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| CN104835644A (en) | 2015-08-12 |
| KR20150093594A (en) | 2015-08-18 |
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