A kind of compound containing pyridine diindyl and its on organic electroluminescence device
Using
Technical field
The present invention relates to technical field of semiconductors, more particularly, to a kind of compound containing pyridine diindyl and its are having
Application in organic electroluminescence devices.
Background technique
Organic electroluminescent (OLED:Organic Light Emission Diodes) device technology can both be used to make
New display product is made, production novel illumination product is can be used for, is expected to substitute existing liquid crystal display and fluorescent lighting,
Application prospect is very extensive.Structure of the OLED luminescent device like sandwich, including electrode material film layer, and it is clipped in different electricity
Organic functional material between the film layer of pole, various different function materials are overlapped mutually depending on the application collectively constitutes OLED hair together
Optical device.As current device, when the two end electrodes application voltage to OLED luminescent device, and pass through electric field action organic layer function
Positive and negative charge in energy film layer, positive and negative charge is further compound in luminescent layer, i.e. generation OLED electroluminescent.
Currently, OLED display technology in smart phone, applied by the fields such as tablet computer, further will also be to electricity
Depending on etc. large scales application field extension, still with actual products application require compare, the luminous efficiency of OLED device, use
The performances such as service life also need further to be promoted.Proposing high performance research for OLED luminescent device includes: to reduce the driving of device
Voltage improves the luminous efficiency of device, improves the service life etc. of device.In order to realize that the continuous of performance of OLED device mentions
It rises, not only needs the innovation from OLED device structure and manufacture craft, constantly study and create with greater need for oled light sulfate ferroelectric functional material
Newly, the functional material of higher performance OLED is formulated out.Oled light sulfate ferroelectric functional material applied to OLED device can be drawn from purposes
It is divided into two major classes, i.e. charge injection transmission material and luminescent material further can also inject charge into transmission material and be divided into electronics
Transmission material, electron-blocking materials, hole injection transmission material and hole barrier materials are injected, luminescent material can also be divided into
Main body luminescent material and dopant material.In order to make high performance OLED luminescent device, it is desirable that various organic functional materials have
Good photoelectric characteristic, for example, as charge transport materials, it is desirable that there is good carrier mobility, high-vitrification conversion
Temperature etc., the material of main part as luminescent layer require material to have good bipolarity, HOMO/LUMO energy rank appropriate etc..
The oled light sulfate ferroelectric functional material film layer for constituting OLED device includes at least two layers or more structure, applies in industry
OLED device structure then includes hole injection layer, hole transmission layer, electronic barrier layer, luminescent layer, hole blocking layer, electronics biography
A variety of film layers such as defeated layer, electron injecting layer, that is to say, that the photoelectric functional material applied to OLED device is infused including at least hole
Enter material, hole mobile material, luminescent material, electron transport material etc., material type and collocation form with rich and more
The characteristics of sample.In addition, used photoelectric functional material has stronger for the collocation of the OLED device of different structure
Selectivity, performance of the identical material in different structure device, it is also possible to completely totally different.Therefore, for current OLED
The industry application requirement of device and the different function film layer of OLED device, the photoelectric characteristic demand of device, it is necessary to which selection is more suitable
It closes, OLED functional material or combination of materials with high performance, is just able to achieve the comprehensive of the high efficiency of device, long-life and low-voltage
Close characteristic.For current OLED shows the actual demand of Lighting Industry, the development of OLED material is also far from enough at present, falls behind
In the requirement of panel manufacturing enterprise, the organic functional material as material enterprise development higher performance is particularly important.
Summary of the invention
In view of the above-mentioned problems existing in the prior art, the application provide a kind of compound containing pyridine diindyl and its
Application on organic electroluminescence device.The compound of the present invention glass transition temperature with higher and molecule thermal stability close
Suitable HOMO and lumo energy, high hole mobility can effectively improve the luminous efficiency of device after being applied to OLED device production
With the service life of OLED device.
Technical scheme is as follows: a kind of compound containing pyridine diindyl, the structure of the compound such as general formula
(1) shown in:
Wherein, X is expressed as singly-bound;I is equal to 0 or 1;
A is expressed as singly-bound, oxygen atom, C1-10Alkylidene, the alkane of alkylidene, aryl substitution that linear or branched alkyl group replaces
One of the imido grpup that the imido grpup or aryl that base replaces replace;
X1、X2、X3、X4、X5、X6、X7、X8Independently be expressed as C-H or N atom, and the quantity of N atom is 0,1 or 2;
M, n, p, q are equal to 0 or 1;And m+n+p+q >=1;
E is optionally by one or more R1Substituted pyrido indolyl radical;
R1It is expressed as substituted or unsubstituted C6To C30Aryl and substituted or unsubstituted C5To C30One of heteroaryl;
The hetero atom is nitrogen, oxygen or sulphur.
On the basis of above scheme, the present invention can also do following improvement.
Preferably, a kind of compound containing pyridine diindyl, the E can be indicated with general formula (2);
Wherein, Ar1It is expressed as Dan Jian, substituted or unsubstituted C6-30Arlydene, substituted or unsubstituted C5-30Heteroarylidene
One of;The hetero atom is nitrogen, oxygen or sulphur;
Ar2It is expressed as substituted or unsubstituted C6-30Aryl, substituted or unsubstituted C5-30One of heteroaryl;It is described
Hetero atom is nitrogen, oxygen or sulphur;
Z is expressed as C-H or N atom, and at least one Z indicates N atom.
Preferably, a kind of compound containing pyridine diindyl, in the general formula (1)It indicates are as follows: Any one of.
Preferably, the structure of a kind of compound containing pyridine diindyl, general formula (2) may be expressed as: In appoint
It is a kind of.
Preferably, a kind of compound containing pyridine diindyl, the Ar1It is expressed as singly-bound, phenylene, naphthylene, Asia
Xenyl, anthrylene, furylidene, sub- carbazyl, sub- naphthyridines base, sub- quinolyl, sub- thienyl, sub-pyridyl group, subunit, Asia
One of 9,9- dimethyl fluorenyl, phenanthrylene, sub- dibenzofuran group, sub- dibenzothiophene;
The Ar2It is expressed as phenyl, naphthalene, xenyl, anthryl, furyl, carbazyl, naphthyridines base, quinolyl, thiophene
One of base, pyridyl group, base, 9,9- dimethyl fluorenyl, phenanthryl, dibenzofuran group, dibenzothiophene.
Preferably, a kind of compound containing pyridine diindyl, the concrete structure formula of the compound are as follows:
In appoint
It is a kind of.
The present invention also provides a kind of preparation method of compound containing pyridine diindyl, the preparation method is related to anti-
Answer equation are as follows:
Specific reaction process are as follows:
Raw material A and intermediate M are dissolved in the mixed solution of toluene and ethyl alcohol, Pd (PPh is added after deoxygenation3)4With
K2CO3, under an inert atmosphere 95~110 DEG C of 10~24 hours of reaction, after raw material fully reacting, cooling is filtered, by filtrate
Revolving removes solvent, and crude product crosses silicagel column, obtains target compound;
Wherein, the dosage of the toluene and ethyl alcohol is that every gram of raw material A uses 30~50mL toluene and 5~10mL ethyl alcohol,
The molar ratio of intermediate M and raw material A is 1~3:1, Pd (PPh3)4Molar ratio with raw material A is 0.006~0.03:1, K2CO3With
The molar ratio of raw material A is 1.5~4.5:1.
The present invention also provides a kind of organic electroluminescence device, the organic electroluminescence device includes at least one layer of function
Layer contains a kind of compound containing pyridine diindyl.
Preferably, a kind of organic electroluminescence device, including hole transmission layer/electronic barrier layer, the hole transmission layer/
Electronic barrier layer contains the compound containing pyridine diindyl.
Preferably, a kind of organic electroluminescence device, including luminescent layer, the luminescent layer, which contains, described contains pyrido
The compound of indoles.
The present invention also provides a kind of illumination or display elements, include the organic electroluminescence device.
The present invention is beneficial to be had the technical effect that
The compounds of this invention molecule has asymmetry, avoids intermolecular aggtegation, the compounds of this invention group is rigid
Property it is stronger, have the characteristics that it is intermolecular be not easy to crystallize, be not easy to assemble, have good filming, with high glass transition temperature and
Thermal stability, so, when the compounds of this invention is applied to OLED device, the membranous layer stability after can keeping material filming is improved
OLED device service life.
The compounds of this invention structure balances electrons and holes more in the distribution of luminescent layer, in appropriate HOMO energy level
Under, improve hole injection/transmission performance;Under suitable lumo energy, and play the role of electronic blocking, promotes exciton
Combined efficiency in luminescent layer;When light emitting functional layer materials'use as OLED luminescent device, the collocation of pyridine diindyl this
Branch in invention scope can effectively improve exciton utilization rate and high fluorescent radiation efficiency, reduce the efficiency rolling under high current density
Drop reduces device voltage, improves current efficiency and the service life of device.
Compound of the present invention has good application effect in OLED luminescent device, before having good industrialization
Scape.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that material cited by the present invention is applied to OLED device;
Wherein, 1 is transparent substrate layer, and 2 be ito anode layer, and 3 be hole injection layer, and 4 be hole transport or electronic blocking
Layer, 5 be luminescent layer, and 6 be electron-transport or hole blocking layer, and 7 be electron injecting layer, and 8 be cathode reflection electrode layer;
Fig. 2 is the curve that current efficiency varies with temperature.
Specific embodiment
Embodiment 1: the synthesis of intermediate M:
(1) raw material B and raw material C are dissolved in the mixed solution of toluene and ethyl alcohol, Pd (PPh is added after deoxygenation3)4With
K2CO3, 95~110 DEG C of 10~24 hours of reaction under an inert atmosphere constantly monitor reaction process with TLC in reaction process, to
After raw material fully reacting, filtrate is rotated and removes solvent by cooling, filtering, and crude product crosses silicagel column, obtains intermediate S;
Wherein, the dosage of the toluene and ethyl alcohol is that every gram of raw material C uses 30~50mL toluene and 5~10mL ethyl alcohol,
The molar ratio of raw material B and raw material C is (1~1.5): 1, Pd (PPh3)4Molar ratio with raw material C is (0.006~0.02): 1,
K2CO3Molar ratio with raw material C is (1.5~2): 1.
(2) under nitrogen protection, it weighs intermediate S 0.01mol to be dissolved in 150mL tetrahydrofuran, is cooled to -78 DEG C, so
The tetrahydrofuran solution of 1.6mol/L n-BuLi is added in backward reaction system, boric acid three is added after 3h is reacted at -78 DEG C
Isopropyl ester reacts 2h, and reaction system is then risen to 0 DEG C, and 10ml 2mol/L hydrochloric acid solution is added, and stirs 3h, fully reacting,
Ether extraction is added, anhydrous magnesium sulfate drying is added in extract liquor, and revolving is recrystallized with alcohol solvent, obtains intermediate M;
Wherein, the molar ratio of the intermediate S and n-BuLi is 1:1~1.5;The intermediate S and three isopropyl of boric acid
The molar ratio of ester is 1:1~1.5.
By taking intermediate M-1 synthesis as an example:
(1) 0.01mol raw material C-1 and 0.012mol raw material B-1 is dissolved in the 150mL (V of toluene and ethyl alcoholToluene: VEthyl alcohol=
5:1) in mixed solution, 0.0002mol Pd (PPh is added after deoxygenation3)4With 0.02mol K2CO3, 110 DEG C under an inert atmosphere
It reacts 24 hours, constantly monitors reaction process with TLC in reaction process, after raw material fully reacting, cooling, filtering will be filtered
Liquid revolving removes solvent, and crude product crosses silicagel column, obtains intermediate S-1;Elemental analysis structure (molecular formula C23H15BrN2): it is theoretical
Value C, 69.19;H,3.79;Br,20.01;N,7.02;Test value: C, 69.23;H,3.82;Br,20.06;N,7.04;ESI-MS
(m/z) (M+): theoretical value 398.04, measured value 398.15.
(2) under nitrogen protection, it weighs intermediate 0.01mol S-1 to be dissolved in 150mL tetrahydrofuran, is cooled to -78 DEG C,
Then the tetrahydrofuran solution of 8ml 1.6mol/L n-BuLi is added into reaction system, is added after reacting 3h at -78 DEG C
0.013mol triisopropyl borate ester reacts 2h, and reaction system is then risen to 0 DEG C, and 10ml 2mol/L hydrochloric acid solution is added, stirs
3h is mixed, ether extraction is added in fully reacting, and anhydrous magnesium sulfate drying is added in extract liquor, and revolving is recrystallized with alcohol solvent, obtained
To intermediate M-1;Elemental analysis structure (molecular formula C23H17BN2O2): theoretical value C, 75.85;H,4.70;B,2.97;N,7.69;
O,8.79;Test value: C, 75.87;H,4.73;B,2.98;N,7.73;O,8.82.ESI-MS(m/z)(M+): theoretical value is
364.14 measured value 364.25.
Intermediate M is prepared with the synthetic method of intermediate M-1, specific structure is as shown in table 1.
Table 1
Embodiment 2: the synthesis of compound 2:
In 250mL there-necked flask, 0.01mol raw material A -1 and 0.012mol raw material B-1 are dissolved in toluene and ethyl alcohol
150mL(VToluene: VEthyl alcohol=5:1) in mixed solution, 0.0002mol Pd (PPh is added after deoxygenation3)4With 0.02mol K2CO3,
Inert atmosphere lower 110 DEG C of 24 hours of reaction constantly monitor reaction process with TLC in reaction process, after raw material fully reacting,
Cooling, filtering, filtrate is rotated and removes solvent, and crude product crosses silicagel column, obtains target product;Elemental analysis structure (molecular formula
C42H28N2): theoretical value C, 89.97;H,5.03;N,5.00;Test value: C, 89.98;H,5.07;N,5.01;ESI-MS(m/z)
(M+): theoretical value 560.23, measured value 560.27.
Embodiment 3: the synthesis of compound 15:
In 250mL there-necked flask, 0.01mol raw material A -2 and 0.012mol raw material B-3 are dissolved in toluene and ethyl alcohol
150mL(VToluene: VEthyl alcohol=5:1) in mixed solution, 0.0002mol Pd (PPh is added after deoxygenation3)4With 0.02mol K2CO3,
Inert atmosphere lower 110 DEG C of 24 hours of reaction constantly monitor reaction process with TLC in reaction process, after raw material fully reacting,
Cooling, filtering, filtrate is rotated and removes solvent, and crude product crosses silicagel column, obtains target product;Elemental analysis structure (molecular formula
C42H28N2): theoretical value C, 89.97;H,5.03;N,5.00;Test value: C, 89.98;H,5.08;N,5.07;ESI-MS(m/z)
(M+): theoretical value 560.23, measured value 560.28.
Embodiment 4: the synthesis of compound 38:
The preparation method of compound 38 is with embodiment 2, the difference is that replacing raw material B-1 with intermediate M-1.Element point
Analyse structure (molecular formula C48H32N2): theoretical value C, 90.54;H,5.07;N,4.40;Test value: C, 90.57;H,5.11;N,
4.43。ESI-MS(m/z)(M+): theoretical value 636.26, measured value 636.27.
Embodiment 5: the synthesis of compound 42:
The preparation method of compound 42, the difference is that replacing raw material A -1 with raw material A -2, uses intermediate with embodiment 2
M-2 replaces raw material B-1.Elemental analysis structure (molecular formula C52H34N2): theoretical value C, 90.93;H,4.99;N,4.08;Test value:
C,90.97;H,5.05;N,4.12.ESI-MS(m/z)(M+): theoretical value 686.27, measured value 686.31.
Embodiment 6: the synthesis of compound 58:
The preparation method of compound 58 is with embodiment 2, the difference is that replacing raw material A -1 with raw material A -3.Elemental analysis
Structure (molecular formula C42H28N2): theoretical value C, 89.97;H,5.03;N,5.00;Test value: C, 90.01;H,5.06;N,5.03.
ESI-MS(m/z)(M+): theoretical value 560.23, measured value 560.27.
Embodiment 7: the synthesis of compound 64:
The preparation method of compound 64 is with embodiment 2, the difference is that raw material A -1 is replaced with raw material A -4, with raw material B-
4 replacement raw material B-1.Elemental analysis structure (molecular formula C42H28N2): theoretical value C, 89.97;H,5.03;N,5.00;Test value: C,
90.03;H,5.07;N,5.02.ESI-MS(m/z)(M+): theoretical value 560.23, measured value 560.29.
Embodiment 8: the synthesis of compound 70:
The preparation method of compound 70, the difference is that replacing raw material A -1 with raw material A -4, uses intermediate with embodiment 2
M-1 replaces raw material B-1.Elemental analysis structure (molecular formula C48H32N2): theoretical value C, 90.54;H,5.07;N,4.40;Test value:
C,90.57;H,5.11;N,4.48.ESI-MS(m/z)(M+): theoretical value 636.26, measured value 636.31.
Embodiment 9: the synthesis of compound 98:
The preparation method of compound 98, the difference is that replacing raw material A -1 with raw material A -4, uses intermediate with embodiment 2
M-2 replaces raw material B-1.Elemental analysis structure (molecular formula C54H34N2): theoretical value C, 90.93;H,4.99;N,4.08;Test value:
C,90.97;H,5.03;N,4.13.ESI-MS(m/z)(M+): theoretical value 686.27, measured value 686.31.
Embodiment 10: the synthesis of compound 102:
In 250mL there-necked flask, 0.01mol raw material A -5 and 0.012mol raw material B-1 are dissolved in toluene and ethyl alcohol
150mL(VToluene: VEthyl alcohol=5:1) in mixed solution, 0.0002mol Pd (PPh is added after deoxygenation3)4With 0.02mol K2CO3,
Inert atmosphere lower 110 DEG C of 24 hours of reaction constantly monitor reaction process with TLC in reaction process, after raw material fully reacting,
Cooling, filtering, filtrate is rotated and removes solvent, and crude product crosses silicagel column, obtains target product;Elemental analysis structure (molecular formula
C42H26N2): theoretical value C, 90.29;H,4.69;N,5.01;Test value: C, 92.31;H,4.74;N,5.08.ESI-MS(m/z)
(M+): theoretical value 558.21, measured value 558.27.
Embodiment 11: the synthesis of compound 134:
The preparation method is the same as that of Example 10 for compound 134, the difference is that changing raw material A -5 with raw material A -6, uses intermediate
M-1 replaces raw material B-1.Elemental analysis structure (molecular formula C48H30N2): theoretical value C, 90.82;H,4.76;N,4.41;Test value:
C,90.85;H,4.79;N,4.44.ESI-MS(m/z)(M+): theoretical value 634.24, measured value 634.27.
Embodiment 12: the synthesis of compound 140:
The preparation method is the same as that of Example 10 for compound 140, the difference is that replacing raw material B-1 with intermediate M-3.Element
Analyze structure (molecular formula C51H31N3): theoretical value C, 89.32;H,4.56;N,6.13;Test value: C, 89.34;H,4.59;N,
6.17。ESI-MS(m/z)(M+): theoretical value 685.25, measured value 685.31.
Embodiment 13: the synthesis of compound 143:
The preparation method is the same as that of Example 10 for compound 143, the difference is that replacing raw material A -5 with raw material A -7.Element point
Analyse structure (molecular formula C45H32N2): theoretical value C, 89.97;H,5.37;N,4.66;Test value: C, 90.02;H,5.41;N,
4.69。ESI-MS(m/z)(M+): theoretical value 600.26, measured value 600.32.
Embodiment 14: the synthesis of compound 155:
The preparation method is the same as that of Example 10 for compound 155, the difference is that replacing raw material A -5 with raw material A -8.Element point
Analyse structure (molecular formula C45H32N2): theoretical value C, 89.97;H,5.37;N,4.66;Test value: C, 90.01;H,5.43;N,
4.69。ESI-MS(m/z)(M+): theoretical value 600.26, measured value 600.33.
Embodiment 15: the synthesis of compound 182:
The preparation method is the same as that of Example 10 for compound 182, the difference is that raw material A -5 is replaced with raw material A -8, with centre
Body M-4 replaces raw material B-1.Elemental analysis structure (molecular formula C51H36N2): theoretical value C, 90.50;H,5.36;N,4.14;Test
Value: C, 90.54;H,5.38;N,4.17.ESI-MS(m/z)(M+): theoretical value 676.29, measured value 676.32.
Embodiment 16: the synthesis of compound 197:
The preparation method of compound 197 is with embodiment 2, the difference is that replacing raw material A -1 with raw material A -9.Element point
Analyse structure (molecular formula C42H28N2O): theoretical value C, 87.47;H,4.89;N,4.86;O,2.77;Test value: C, 87.55;H,
4.93;N,4.88;O,2.81.ESI-MS(m/z)(M+): theoretical value 576.22, measured value 576.31.
Embodiment 17: the synthesis of compound 199:
The preparation method of compound 199 is with embodiment 2, the difference is that replacing raw material A -1 with raw material A -10.Element point
Analyse structure (molecular formula C42H28N2O): theoretical value C, 87.47;H,4.89;N,4.86;O,2.77;Test value: C, 87.54;H,
4.93;N,4.88;O,2.79.ESI-MS(m/z)(M+): theoretical value 576.22, measured value 576.28.
Embodiment 18: the synthesis of compound 201:
201 preparation method of compound is with embodiment 2, the difference is that replacing raw material A -1 with raw material A -11.Elemental analysis
Structure (molecular formula C45H34N2): theoretical value C, 89.67;H,5.69;N,4.65;Test value: C, 89.69;H,5.71;N,4.68.
ESI-MS(m/z)(M+): theoretical value 602.27, measured value 602.29.
Embodiment 19: the synthesis of compound 215:
The preparation method is the same as that of Example 10 for compound 215, the difference is that replacing raw material A -5 with raw material A -12.Element point
Analyse structure (molecular formula C41H25N3): theoretical value C, 87.99;H,4.50;N,7.51;Test value: C, 88.05;H,4.53;N,
7.54。ESI-MS(m/z)(M+): theoretical value 559.20, measured value 559.26.
Embodiment 20: the synthesis of compound 223:
The preparation method is the same as that of Example 10 for compound 223, the difference is that raw material A -5 is replaced with raw material A -13, in
Mesosome M-2 replaces raw material B-1.Elemental analysis structure (molecular formula C51H31N3): theoretical value C, 89.32;H,4.56;N,6.13;It surveys
Examination value: C, 89.34;H,4.62;N,6.15.ESI-MS(m/z)(M+): theoretical value 685.25, measured value 685.31.
Embodiment 21: the synthesis of compound 234:
The preparation method is the same as that of Example 10 for compound 234, the difference is that replacing raw material A -5 with raw material A -14.Element
Analyze structure (molecular formula C40H24N4): theoretical value C, 85.69;H,4.31;N,9.99;Test value: C, 85.73;H,4.33;N,
10.03。ESI-MS(m/z)(M+): theoretical value 560.20, measured value 560.04.
Embodiment 22: the synthesis of compound 243:
The preparation method is the same as that of Example 10 for compound 243, the difference is that raw material A -5 is replaced with raw material A -14, in
Mesosome M-5 replaces raw material B-1.Elemental analysis structure (molecular formula C52H32N4): theoretical value C, 87.62;H,4.52;N,7.86;It surveys
Examination value: C, 87.65;H,4.55;N,7.89.ESI-MS(m/z)(M+): theoretical value 712.26, measured value 712.31.
This organic compound uses in luminescent device, has high Tg (glass transition temperature) temperature and triplet
(T1), suitable HOMO, lumo energy can be used as hole barrier/electron transport material and use, and also can be used as emitting layer material makes
With.Hot property, T1 energy level and the test of HOMO energy level are carried out respectively to the compounds of this invention and current material, as a result such as 2 institute of table
Show.
Table 2
Note: triplet T1 is tested by the F4600 Fluorescence Spectrometer of Hitachi, and the test condition of material is 2*10-5's
Toluene solution;Glass transition temperature Tg is by differential scanning calorimetry (DSC, German Nai Chi company DSC204F1 differential scanning calorimeter)
Measurement, 10 DEG C/min of heating rate;Thermal weight loss temperature Td is the temperature of the weightlessness 1% in nitrogen atmosphere, in Japanese Shimadzu Corporation
TGA-50H thermogravimetric analyzer on be measured, nitrogen flow 20mL/min;Highest occupied molecular orbital HOMO energy level be by
Ionizing energy test macro (IPS3) test, is tested as atmospheric environment.
By upper table data it is found that CBP the and TPBi material that comparison is applied at present, organic compound of the invention have high
Glass transition temperature can be improved material membrane phase stability, further increase device service life;With high triplet state energy
Grade, can stop luminescent layer energy loss, to promote device light emitting efficiency.Material of the present invention and application material have phase simultaneously
As HOMO energy level.Therefore, the present invention contains the organic material of pyridine diindyl in the different function layer for being applied to OLED device
Afterwards, the luminous efficiency and service life of device can be effectively improved.
Below by way of device embodiments 1~21 and device comparative example 1 OLED material that the present invention will be described in detail synthesizes in device
Application effect in part.Device embodiments 2~21 of the present invention, the device compared with device embodiments 1 of device comparative example 1
Manufacture craft it is identical, and use identical baseplate material and electrode material, the film thickness of electrode material is also kept
Unanimously, except that the emitting layer material in 2~13 pairs of devices of device embodiments converts;14~21 pairs of device embodiments
Hole barrier/electron transport layer materials of device convert, the performance test results of each embodiment obtained device such as 3 institute of table
Show.
Device embodiments 1:
As shown in Figure 1, a kind of electroluminescent device, preparation step includes: ITO sun a) cleaned on transparent substrate layer 1
Pole layer 2 is cleaned each 15 minutes with deionized water, acetone, EtOH Sonicate respectively, 2 points is then handled in plasma cleaner
Clock;B) on ito anode layer 2, hole injection layer material HAT-CN is deposited by vacuum evaporation mode, with a thickness of 10nm, this layer
As hole injection layer 3;C) on hole injection layer 3, hole mobile material NPB is deposited by vacuum evaporation mode, with a thickness of
80nm, the layer are hole transmission layer/electronic barrier layer 4;D) luminescent layer 5 is deposited on hole transport/electronic barrier layer 4, it is main
Body material is the compounds of this invention 2 and compound GH, and dopant material is Ir (ppy)3, compound 2, GH and Ir (ppy)3Three's matter
Amount is than being 50:50:10, with a thickness of 40nm;E) on luminescent layer 5, electron transport material is deposited by vacuum evaporation mode
TPBI, with a thickness of 35nm, this layer of organic material is used as hole barrier/electron transfer layer 6;F) it is passed in hole barrier/electronics
On defeated layer 6, vacuum evaporation electron injecting layer LiF, with a thickness of 1nm, which is electron injecting layer 7;G) electron injecting layer 7 it
On, vacuum evaporation cathode Al (100nm), the layer is cathode reflection electrode layer 8;Electroluminescent device is completed according to above-mentioned steps
After production, the driving voltage of measurement device, current efficiency, the result is shown in shown in table 3.The following institute of the molecular machinery formula of associated materials
Show:
Device embodiments 2:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB) (thickness: 40nm, material: compound 15, GH and Ir of/luminescent layer 5
(ppy)3Constituted by weight 50:50:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electricity
Sub- implanted layer 7 (thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 3:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB) (thickness: 40nm, material: compound 38, GH and Ir of/luminescent layer 5
(ppy)3Constituted by weight 50:50:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electricity
Sub- implanted layer 7 (thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 4:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB)/luminescent layer 5 (thickness: 40nm, material: compound 42 and Ir (ppy)3
Constituted by weight 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electron injecting layer 7
(thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 5:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB) (thickness: 40nm, material: compound 58, GH and Ir of/luminescent layer 5
(ppy)3Constituted by weight 50:50:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electricity
Sub- implanted layer 7 (thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 6:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB) (thickness: 40nm, material: compound 64, GH and Ir of/luminescent layer 5
(ppy)3Constituted by weight 50:50:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electricity
Sub- implanted layer 7 (thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 7:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB)/luminescent layer 5 (thickness: 40nm, material: compound 70 and Ir (ppy)3
Constituted by weight 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electron injecting layer 7
(thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 8:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB) (thickness: 40nm, material: compound 98, GH and Ir of/luminescent layer 5
(ppy)3Constituted by weight 50:50:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electricity
Sub- implanted layer 7 (thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 9:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB) (thickness: 40nm, material: compound 102 and Ir of/luminescent layer 5
(ppy)3Constituted by weight 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electronics note
Enter layer 7 (thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 10:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB) (thickness: 40nm, material: compound 134, GH and Ir of/luminescent layer 5
(ppy)3Constituted by weight 50:50:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electricity
Sub- implanted layer 7 (thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 11:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB) (thickness: 40nm, material: compound 197, GH and Ir of/luminescent layer 5
(ppy)3Constituted by weight 50:50:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electricity
Sub- implanted layer 7 (thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 12:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB) (thickness: 40nm, material: compound 199, GH and Ir of/luminescent layer 5
(ppy)3Constituted by weight 50:50:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electricity
Sub- implanted layer 7 (thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 13:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB) (thickness: 40nm, material: compound 201, GH and Ir of/luminescent layer 5
(ppy)3Constituted by weight 50:50:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electricity
Sub- implanted layer 7 (thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 14:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB)/luminescent layer 5 (thickness: 40nm, material: CBP and Ir (ppy)3By weight
Amount is constituted than 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: compound 140)/electron injecting layer 7
(thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 15:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB)/luminescent layer 5 (thickness: 40nm, material: CBP and Ir (ppy)3By weight
Amount is constituted than 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: compound 143)/electron injecting layer 7
(thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 16:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB)/luminescent layer 5 (thickness: 40nm, material: CBP and Ir (ppy)3By weight
Amount is constituted than 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: compound 155)/electron injecting layer 7
(thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 17:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB)/luminescent layer 5 (thickness: 40nm, material: CBP and Ir (ppy)3By weight
Amount is constituted than 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: compound 182)/electron injecting layer 7
(thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 18:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB)/luminescent layer 5 (thickness: 40nm, material: CBP and Ir (ppy)3By weight
Amount is constituted than 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: compound 215)/electron injecting layer 7
(thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 19:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB)/luminescent layer 5 (thickness: 40nm, material: CBP and Ir (ppy)3By weight
Amount is constituted than 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: compound 223)/electron injecting layer 7
(thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 20:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB)/luminescent layer 5 (thickness: 40nm, material: CBP and Ir (ppy)3By weight
Amount is constituted than 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: compound 234)/electron injecting layer 7
(thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device embodiments 21:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB)/luminescent layer 5 (thickness: 40nm, material: CBP and Ir (ppy)3By weight
Amount is constituted than 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: compound 243)/electron injecting layer 7
(thickness: 1nm, material: LiF)/Al (thickness: 100nm).
Device comparative example 1:ITO anode layer 2 (thickness: 150nm)/hole injection layer 3 (thickness: 10nm, material: HAT-
CN)/hole transmission layer 4 (thickness: 80nm, material: NPB)/luminescent layer 5 (thickness: 40nm, material: CBP and Ir (ppy)3By weight
Amount is constituted than 90:10 blending)/hole barrier/electron transfer layer 6 (thickness: 35nm, material: TPBI)/electron injecting layer 7 (thickness
Degree: 1nm, material: LiF)/Al (thickness: 100nm).The detection data of gained electroluminescent device is shown in Table 3.
Table 3
By the result of table 3 can be seen that organic compound of the present invention can be applied to OLED luminescent device production, and with than
It is compared compared with example, either efficiency or service life obtain larger change, the especially service life of device than known OLED material
Obtain biggish promotion.
Work limitation rate is also more stable at low temperature for the OLED device of further material preparation of the present invention, by device reality
It applies example 2,9,17 and device comparative example 1 and carries out efficiency test in -10~80 DEG C of sections, acquired results are as shown in table 4 and Fig. 2.
Table 4
From the data of table 4 and Fig. 2 it is found that device embodiments 2,9,17 are material of the present invention and the device that known materials are arranged in pairs or groups
Structure is compared with device comparative example 1, and not only Efficiency at Low Temperature is high, but also in temperature elevation process, efficiency is steadily increased.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.