CN109909494A - A kind of high thermal conductivity powder and its preparation method and application - Google Patents
A kind of high thermal conductivity powder and its preparation method and application Download PDFInfo
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Abstract
The present invention relates to field of material processings, in particular to a kind of high thermal conductivity powder and its preparation method and application.A kind of high thermal conductivity powder, having inside is aluminium, the powder structure that outer surface is alumina layer, and the sphericity of the high thermal conductivity powder is 88% or more.High thermal conductivity powder provided by the invention, outer layer are alumina layer, and inside is aluminium, the thermal coefficient of aluminium is 300W/ (mK), much higher than the 30W/ (mK) of aluminium oxide, so that high thermal conductivity powder of the invention had both had good insulation performance, and has good heating conduction.
Description
Technical field
The present invention relates to field of material processings, in particular to a kind of high thermal conductivity powder and its preparation method and application.
Background technique
The high thermal conductive silicon film of thermal conductivity commonly used in the trade more than 6W/ (mK), wherein silicon carbide, nitridation can often be added
One or more fillers such as boron, aluminium nitride, carbon nanotube, graphene promote heating conduction, and the price is very expensive for such filler,
Silicon carbide, boron nitride, aluminium nitride additive amount are in 10%-50%, and price is in 300 yuan/kg or more, wherein graphene, carbon nanotube
Additive amount is in 1%-5%, and unit price is in 2000 yuan/kg or more;The high thermal conductive silicon film prepared in this way, every kg price be not low
In 150 yuan, the development of high thermal conductive silicon film is strongly limited.
In view of this, the present invention is specifically proposed.
Summary of the invention
The purpose of the present invention is to provide a kind of conduction powder technologies of preparing of inexpensive high thermal conductivity, to solve the prior art
Present in it is at high cost high, promote the big technical problem of difficulty.
In order to realize above-mentioned purpose of the invention, the following technical scheme is adopted:
A kind of high thermal conductivity powder, having inside is aluminium, the powder structure that outer surface is alumina layer, the high thermal conductivity powder
The sphericity of body is 88% or more.
High thermal conductivity powder provided by the invention, outer layer are alumina layer, and inside is aluminium, and the thermal coefficient of aluminium is 300W/
(mK), much higher than the 30W/ of aluminium oxide (mK), so that high thermal conductivity powder of the invention had both had good insulation performance, and
And has good heating conduction.
Further, hydroxyl is eliminated in the outer surface of the high thermal conductivity powder.
By eliminating the remaining hydroxyl of powder surface, loading of the powder in oleaginous system is promoted.
The present invention also provides above-mentioned high thermal conductivity raw powder's production technologies, comprising the following steps:
(a) aluminium powder processing makes aluminium powder outer surface form alumina layer;
(b) hydroxyl for the powder surface that outer surface is alumina layer is eliminated;
(c) optimize powder shape, so that powder sphericity is higher, oil factor is lower.
High thermal conductivity raw powder's production technology of the invention, by carrying out the Passivation Treatment of safety to aluminium powder, so that outside aluminium powder
Layer has alumina layer, and inside is aluminium, and the thermal coefficient of aluminium is 300W/ (mK), much higher than the 30W/ (mK) of aluminium oxide, so that
High thermal conductivity powder of the invention had both had good insulation performance, and had good heating conduction;Further progress surface
It is modified, effectively promote loading of the powder in oleaginous system.
Further, the aluminium powder selects following ball aluminum powder any one or more of:
Ball aluminum powder 1, D50 are 0.85-2.7 μm, sphericity 86% ± 2%, specific surface area 2.3-4.5m2/g;
Ball aluminum powder 2, D50 are 7.3 ± 0.5 μm, sphericity 90% ± 2%, 0.7 ± 0.1m of specific surface area2/g;
Ball aluminum powder 3, D50 are 41 ± 2 μm, sphericity 94% ± 2%, 0.3 ± 0.1m of specific surface area2/g。
Further, the aluminium powder selects ball aluminum powder 1, ball aluminum powder 2 and ball aluminum powder 3, the ball aluminum powder 1, ball
Shape aluminium powder 2 and ball aluminum powder 3 account for 7%-18/%, 18%-41%, 46%-75% of the aluminium powder total weight respectively.
Further, in step (a), aluminium powder, which is first handled, makes its outer surface form aluminum hydroxide film layer, then reprocesses
The aluminum hydroxide film layer is set to be decomposed into alumina layer.
Further, in step (a), in closed environment, aluminium powder reacts 30min or more at 105 ± 3 DEG C with water, is evaporated
Water, aluminium powder outer surface form aluminum hydroxide film layer.
Further, it is stirred while aluminium powder is reacted with water.
Further, the speed of the stirring is 600 ± 100rpm.
Further, the additive amount of the water is to submerge the aluminium powder.That is just submergence.
Further, it is heated to starting to stir at 80 ± 5 DEG C.
It is carried out in blender as reacted, is heated to opening stirring at 80 ± 5 DEG C.
Further, the powder of aluminum hydroxide film layer forms oxidation in 280 DEG C of ± 10 DEG C of processing 150-200min of temperature
Aluminium layer.
Further, step (b), outer surface are to handle to eliminate appearance through silane coupling agent after the powder of alumina layer disperses
The hydroxyl in face.
Further, the dispersion are as follows: at 80 DEG C ± 5 DEG C, 600 ± 100rpm stirs 30 ± 3min.The step makes gently
The poly- powder of micelle scatter again, in order to subsequent processing.
In the present invention, silane coupling agent is for eliminating powder hydroxyl remained on surface, and lifting powder is in oleaginous system
Loading.
Preferably, step (b), the model KH-560 of the silane coupling agent.
Further, the silane coupling agent in liquid form with powder hybrid reaction.
Further, solvent mixing is added in silane coupling agent, obtains liquid form.
Further, the solvent that silane coupling agent is added is dehydrated alcohol.
Further, the silane coupling agent and dehydrated alcohol are 1-5:1 mixing by weight.
Further, silane coupling agent and dehydrated alcohol mixture are according to the aluminium powder weight that outer surface is alumina layer
0.1%-2% is added.
Further, handling through silane coupling agent is to disperse 50-70min with speed at 80 ± 5 DEG C for 600 ± 100rpm.
Powder surface that step (b) obtains is lipophilic poor, make in this way its loading 90% hereinafter, also, thermal conductivity exist
The left and right 3W/ (mK).
Therefore, the surface texture for also needing to change powder after step (b), viscosifies unobvious when making it as filler.
Further, the optimization powder shape is carried out by the way that long-chain coupling agent processing is added;
The long-chain coupling agent is that titanate coupling agent, stearic acid, carbonic ester coupling agent are any one or more of.
In the present invention, long-chain coupling agent improves morphology microstructure, viscosifies when so that powder is as filler unknown to powder handling
It is aobvious, it can effective lifting powder loading in oleaginous system.
Further, the long-chain coupling agent is titanate coupling agent, the model LD-70 of the titanate coupling agent.
Further, the long-chain coupling agent in liquid form with powder hybrid reaction.
Further, solvent mixing is added in long-chain coupling agent, obtains liquid form.
Further, the solvent that long-chain coupling agent is added is dehydrated alcohol.
Further, the weight ratio of the long-chain coupling agent and dehydrated alcohol is 1-3:1.
Further, the additional amount of long-chain coupling agent and dehydrated alcohol mixture is the powder weight after silane coupling agent is handled
The 0.1%-3% of amount.
Further, it is to disperse 50- with speed at 80 ± 5 DEG C for 600 ± 100rpm that long-chain coupling agent processing, which is added,
70min。
High thermal conductivity raw powder's production technology of the invention, by carrying out reasonable screening collocation, the passivation of safety to aluminium powder
Processing and surface are modified, so that aluminium powder has good insulation performance, and have very high loading in silica gel system.
The present invention also provides a kind of Heat Conduction Materials, contain above-mentioned high thermal conductivity powder.
Further, the Heat Conduction Material is heat conductive silica gel material, and the heat conductive silica gel material is by the high thermal conductivity powder
It is mixed with silica gel.
Further, the high thermal conductivity powder include prepared respectively by ball aluminum powder 1, ball aluminum powder 2 and ball aluminum powder 3 or
Mixture prepared high thermal conductivity powder, the percentage that these three high thermal conductivity powders distinguish the total high thermal conductivity powder weight of Zhan is 7%-
18/%, 18%-41%, 46%-75%.
In the present invention, the powder for being used to prepare heat-conducting silica gel sheet is prepared together after can be the aluminium powder collocation of different parameters
Body;It can also be different the high thermal conductivity powder that the aluminium powder of parameter is prepared respectively to arrange in pairs or groups to obtain again to be used to prepare heat-conducting silica gel sheet
Powder.
Further, the heat conductive silica gel material is heat-conducting silica gel sheet.
The present invention also provides a kind of processing methods of heat-conducting silica gel sheet, and above-mentioned high thermal conductivity powder is mixed with silica gel,
It is two-sided to cover release film, pass through molding or calender and heated oven curing molding, heat-conducting silica gel sheet obtained.
Heat-conducting silica gel sheet provided by the invention has insulation performance (volume resistivity > 1 × 108Ω cm), high thermal conductivity
Performance (thermal conductivity 6.7W/ (mK)), good appearance (between any surface finish and protective film be not present shedding, sizing) and compared with
Low hardness (00 hardness 35-80 of Shao).
Compared with prior art, the invention has the benefit that
(1) high thermal conductivity powder provided by the invention, outer layer are alumina layer, and inside is aluminium, and the thermal coefficient of aluminium is 300W/
(mK), much higher than the 30W/ of aluminium oxide (mK), so that high thermal conductivity powder of the invention had both had good insulation performance, and
And has good heating conduction.
(2) present invention is modified by reasonably screening collocation, the Passivation Treatment of safety and surface to aluminium powder progress, so that
Aluminium powder has good insulation performance, and has very high loading in silica gel system.
(3) conduction powder provided by the invention is cheap, and it is too high and be difficult to push away to efficiently solve high thermal conductivity product cost
Wide problem.
(4) heat-conducting silica gel sheet provided by the invention has insulation performance (volume resistivity > 1 × 108Ω cm), height leads
Hot property (thermal conductivity 6.7W/ (mK)), good appearance (between any surface finish and protective film be not present shedding, sizing) and
Lower hardness (00 hardness 35-80 of Shao).
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described.
Fig. 1 is the variation of the thermal conductivity and breakdown voltage of silica gel piece made from different filling proportions in the embodiment of the present invention 1
Curve graph;
Fig. 2 is the variation of the thermal conductivity and breakdown voltage of silica gel piece made from different filling proportions in the embodiment of the present invention 2
Curve graph;
Fig. 3 is the variation of the thermal conductivity and breakdown voltage of silica gel piece made from different filling proportions in the embodiment of the present invention 3
Curve graph.
Specific embodiment
Embodiment of the present invention is described in detail below in conjunction with embodiment, but those skilled in the art will
Understand, the following example is merely to illustrate the present invention, and is not construed as limiting the scope of the invention.It is not specified in embodiment specific
Condition person carries out according to conventional conditions or manufacturer's recommended conditions.Reagents or instruments used without specified manufacturer is
The conventional products that can be obtained by commercially available purchase.
Embodiment 1
A kind of conduction powder preparation method of low cost high thermal conductivity, process are as follows:
The aluminium powder that sphericity is high, specific surface area is small is chosen, uniformly, typical case's collocation is as shown in table 1 for mixture.
The collocation of 1 aluminium powder of table
Parameter | Aluminium powder 1 | Aluminium powder 2 | Aluminium powder 3 |
Partial size D50 | 0.85 | 7.3 | 41 |
Specific surface area (m2/g) | 4.5 | 0.7 | 0.3 |
Mixed ratio (%) | 13 | 41 | 46 |
Wherein, aluminium powder 1 is ball aluminum powder, sphericity 86%;
Aluminium powder 2 is ball aluminum powder, sphericity 90%;
Aluminium powder 3 is ball aluminum powder, sphericity 94%;
This aluminium powder is placed in closed high-speed mixer, distilled water is added to just submergence aluminium powder;
Heating function is opened, is heated to opening high-speed stirred (600rpm) at 80 DEG C, is continuously heating to 105 DEG C, and keep
Certain time (> 30min), is evaporated water, this step to form one layer of aluminum hydroxide film outside aluminium powder;
This powder is transferred in oven, 280 DEG C of set temperature, takes out cooling after toasting 3h, this step makes hydroxide
Aluminium film is decomposed into aluminium oxide;
It after powder is completely cooling, rejoins in high speed disperser, is heated to 80 DEG C, stir 30min, this step makes
The powder slightly reunited scatter again;
Silane coupling agent (preferably trade mark KH-560) and dehydrated alcohol is uniform according to the ratio mixture of 1:1~5:1, according to
The 0.1%-2% of powder weight is added in high speed disperser, keeps 80 DEG C of high speed dispersion 60min, this step is for eliminating powder
Hydroxyl remained on surface, and loading of the lifting powder in oleaginous system;
The titanate coupling agent or stearic acid or carbonic ester coupling agent (preferably trade mark LD-70) and dehydrated alcohol of long-chain
It is uniform according to the ratio mixture of 1:1~3:1, it is added in high speed disperser according to the 0.1%-3% of powder weight, keeps 80 DEG C of height
Speed dispersion 60min, this step viscosify unobvious for improving morphology microstructure, can effectively promote powder when so that powder is as filler
Material loading in oleaginous system;
Obtain conduction powder.
It is two-sided to cover release film by conduction powder obtained and silica gel according to the weight ratio mixture of 94:6, by molding or
Person's calender and heated oven curing molding, the heat-conducting silica gel sheet of 2mm thickness obtained.
Its index of correlation is detected, specific as follows:
Insulation performance (volume resistivity > 1 × 108Ω cm), it is high thermal conductivity (thermal conductivity 6.7W/ (mK)), good
Appearance (between any surface finish and protective film be not present shedding, sizing) and lower hardness (00 hardness 35-80 of Shao).
Wherein, the thermal conductivity and breakdown voltage of the heat-conducting silica gel sheet of different powder packed ratios, change curve such as Fig. 1 are detected
It is shown.
Embodiment 2
A kind of conduction powder preparation method of low cost high thermal conductivity, process are as follows:
The aluminium powder that sphericity is high, specific surface area is small is chosen, uniformly, typical case's collocation is as shown in table 1 for mixture:
The collocation of 2 aluminium powder of table
Parameter | Aluminium powder 1 | Aluminium powder 2 | Aluminium powder 3 |
Partial size D50 | 2.7 | 7.3 | 41 |
Specific surface area (m2/g) | 2.3 | 0.7 | 0.3 |
Mixed ratio (%) | 18 | 25 | 47 |
Wherein, aluminium powder 1 is ball aluminum powder, sphericity 86%;
Aluminium powder 2 is ball aluminum powder, sphericity 90%;
Aluminium powder 3 is ball aluminum powder, sphericity 94%;
This aluminium powder is placed in closed high-speed mixer, distilled water is added to just submergence aluminium powder;
Heating function is opened, is heated to opening high-speed stirred (600rpm) at 80 DEG C, is continuously heating to 105 DEG C, and keep
Certain time (> 30min), is evaporated water, this step to form one layer of aluminum hydroxide film outside aluminium powder;
This powder is transferred in oven, 280 DEG C of set temperature, takes out cooling after toasting 3h, this step makes hydroxide
Aluminium film is decomposed into aluminium oxide;
It after powder is completely cooling, rejoins in high speed disperser, is heated to 80 DEG C, stir 30min, this step makes
The powder slightly reunited scatter again;
Silane coupling agent (preferably trade mark KH-560) and dehydrated alcohol is uniform according to the ratio mixture of 1:1~5:1, according to
The 0.1%-2% of powder weight is added in high speed disperser, keeps 80 DEG C of high speed dispersion 60min, this step is for eliminating powder
Hydroxyl remained on surface, and loading of the lifting powder in oleaginous system;
The titanate coupling agent or stearic acid or carbonic ester coupling agent (preferably trade mark LD-70) and dehydrated alcohol of long-chain
It is uniform according to the ratio mixture of 1:1~3:1, it is added in high speed disperser according to the 0.1%-3% of powder weight, keeps 80 DEG C of height
Speed dispersion 60min, this step viscosify unobvious for improving morphology microstructure, can effectively promote powder when so that powder is as filler
Material loading in oleaginous system;
Obtain conduction powder.
It is two-sided to cover release film by conduction powder obtained and silica gel according to the weight ratio mixture of 94:6, by molding or
Person's calender and heated oven curing molding, the heat-conducting silica gel sheet of 2mm thickness obtained.
Its index of correlation is detected, specific as follows:
Insulation performance (volume resistivity > 1 × 108Ω cm), it is high thermal conductivity (thermal conductivity 6.7W/ (mK)), good
Appearance (between any surface finish and protective film be not present shedding, sizing) and lower hardness (00 hardness 35-80 of Shao).
Wherein, the thermal conductivity and breakdown voltage of the heat-conducting silica gel sheet of different powder packed ratios, change curve such as Fig. 2 are detected
It is shown.
Embodiment 3
A kind of conduction powder preparation method of low cost high thermal conductivity, process are as follows:
The aluminium powder that sphericity is high, specific surface area is small is chosen, uniformly, typical case's collocation is as shown in table 1 for mixture:
The collocation of 3 aluminium powder of table
Parameter | Aluminium powder 1 | Aluminium powder 2 | Aluminium powder 3 |
Partial size D50 | 2.7 | 7.3 | 41 |
Specific surface area (m2/g) | 2.3 | 0.7 | 0.3 |
Mixed ratio (%) | 7 | 18 | 75 |
Wherein, aluminium powder 1 is ball aluminum powder, and D50 is 0.85-2.7 μm, specific surface area 2.3-4.5m2/ g, sphericity 86%;
Aluminium powder 2 is ball aluminum powder, and D50 is 7.3 μm, specific surface area 0.7m2/ g, sphericity 90%;
Aluminium powder 3 is ball aluminum powder, and D50 is 41 μm, specific surface area 0.3m2/ g, sphericity 94%;
This aluminium powder is placed in closed high-speed mixer, distilled water is added to just submergence aluminium powder;
Heating function is opened, is heated to opening high-speed stirred (600rpm) at 80 DEG C, is continuously heating to 105 DEG C, and keep
Certain time (> 30min), is evaporated water, this step to form one layer of aluminum hydroxide film outside aluminium powder;
This powder is transferred in oven, 280 DEG C of set temperature, takes out cooling after toasting 3h, this step makes hydroxide
Aluminium film is decomposed into aluminium oxide;
It after powder is completely cooling, rejoins in high speed disperser, is heated to 80 DEG C, stir 30min, this step makes
The powder slightly reunited scatter again;
Silane coupling agent (preferably trade mark KH-560) and dehydrated alcohol is uniform according to the ratio mixture of 1:1~5:1, according to
The 0.1%-2% of powder weight is added in high speed disperser, keeps 80 DEG C of high speed dispersion 60min, this step is for eliminating powder
Hydroxyl remained on surface, and loading of the lifting powder in oleaginous system;
The titanate coupling agent or stearic acid or carbonic ester coupling agent (preferably trade mark LD-70) and dehydrated alcohol of long-chain
It is uniform according to the ratio mixture of 1:1~3:1, it is added in high speed disperser according to the 0.1%-3% of powder weight, keeps 80 DEG C of height
Speed dispersion 60min, this step viscosify unobvious for improving morphology microstructure, can effectively promote powder when so that powder is as filler
Material loading in oleaginous system;
Obtain conduction powder.
It is two-sided to cover release film by conduction powder obtained and silica gel according to the weight ratio mixture of 94:6, by molding or
Person's calender and heated oven curing molding, the heat-conducting silica gel sheet of 2mm thickness obtained.
Its index of correlation is detected, specific as follows:
Insulation performance (volume resistivity > 1 × 108Ω cm), it is high thermal conductivity (thermal conductivity 6.7W/ (mK)), good
Appearance (between any surface finish and protective film be not present shedding, sizing) and lower hardness (00 hardness 35-80 of Shao).
Wherein, the thermal conductivity and breakdown voltage of the heat-conducting silica gel sheet of different powder packed ratios, change curve such as Fig. 3 are detected
It is shown.
Comparative example 1
Unlike embodiment 1-3, conduction powder directly is replaced with the aluminium powder of different parameters, prepares the silica gel of 2mm thickness
Piece.
It is as follows to detect silica gel piece correlation performance parameters result:
Do not have insulating properties;Filling up to 90%, when matching filling 90%, thermal conductivity is (2.7-3.0) W/ (m
K), volume resistivity 104Ω cm or so.
Also it just scolds, directly using aluminium powder as material, the volume resistivity of silica gel product obtained is relatively low, and aluminium powder is inhaled
Oil value is high, and loading is low, thermally conductive to be lower than 4w/mk.
Comparative example 2
Unlike embodiment 1-3, conduction powder directly is replaced with the aluminium oxide of different parameters, prepares the silicon of 2mm thickness
Film.
It is as follows to detect silica gel piece correlation performance parameters result:
It is thermally conductive to be not more than 5w/mk, 10 powers of volume resistivity 10.
Also it just scolds, directly using alumina powder as material, the volume resistivity of silica gel product obtained is higher, still,
It is thermally conductive to be lower than 5w/mk.
Filler raw material of the present invention are selected as ball aluminum powder, and price is 20-40 member/kg, through process of the present invention
After obtaining finished product, cost unit price is no more than 60 yuan/kg;And 2 higher cost of comparative example, about 70 yuan/kg;In addition, produced by the present invention
Alternatively existing aluminium nitride namely the silica gel product performance parameter of the two preparation are suitable for conduction powder, and still, aluminium nitride is added
Directly promoted cost, at present in the industry the aluminium nitride in highly heat-conductive material mainly produced in Japan, about thousand yuan of every kg of price.Therefore, originally
The conduction powder that invention provides solves the problems, such as that high thermal conductivity product cost is too high and is difficult to promote.
Although illustrate and describing the present invention with specific embodiment, it will be appreciated that without departing substantially from of the invention
Many other change and modification can be made in the case where spirit and scope.It is, therefore, intended that in the following claims
Including belonging to all such changes and modifications in the scope of the invention.
Claims (10)
1. a kind of high thermal conductivity powder, which is characterized in that it is aluminium, the powder structure that outer surface is alumina layer, institute that it, which has inside,
The sphericity for stating high thermal conductivity powder is 88% or more;
Further, hydroxyl is eliminated in the outer surface of the high thermal conductivity powder.
2. a kind of high thermal conductivity raw powder's production technology, which comprises the following steps:
(a) aluminium powder processing makes aluminium powder outer surface form alumina layer;
(b) hydroxyl for the powder surface that outer surface is alumina layer is eliminated;
(c) optimize powder shape, so that powder sphericity is higher, oil factor is lower.
3. preparation method according to claim 2, which is characterized in that the aluminium powder selects any in following ball aluminum powder
Kind is a variety of:
Ball aluminum powder 1, D50 are 0.85-2.7 μm, sphericity 86% ± 2%, specific surface area 2.3-4.5m2/g;
Ball aluminum powder 2, D50 are 7.3 ± 0.5 μm, sphericity 90% ± 2%, 0.7 ± 0.1m of specific surface area2/g;
Ball aluminum powder 3, D50 are 41 ± 2 μm, sphericity 94% ± 2%, 0.3 ± 0.1m of specific surface area2/g;
Further, the aluminium powder selects ball aluminum powder 1, ball aluminum powder 2 and ball aluminum powder 3, the ball aluminum powder 1, spherical aluminum
Powder 2 and ball aluminum powder 3 account for 7%-18/%, 18%-41%, 46%-75% of the aluminium powder total weight respectively.
4. preparation method according to claim 2, which is characterized in that in step (a), aluminium powder, which is first handled, makes its outer surface shape
At aluminum hydroxide film layer, then reprocessing makes the aluminum hydroxide film layer be decomposed into alumina layer;
Further, in closed environment, aluminium powder reacts 30min or more at 105 ± 3 DEG C with water, is evaporated water, aluminium powder outer surface shape
At aluminum hydroxide film layer;
Further, it is stirred while aluminium powder is reacted with water;
Further, the speed of the stirring is 600 ± 100rpm;
Further, the weight ratio of aluminium powder and water is 4-6:1;
Further, it is heated to starting to stir at 80 ± 5 DEG C.
5. the preparation method according to claim 4, which is characterized in that the powder of aluminum hydroxide film layer is at 280 DEG C of temperature
± 10 DEG C of processing 150-200min form alumina layer.
6. preparation method according to claim 2, which is characterized in that step (b), outer surface are the powder point of alumina layer
The hydroxyl for eliminating outer surface is handled after dissipating through silane coupling agent;
Further, the dispersion are as follows: at 80 DEG C ± 5 DEG C, 600 ± 100rpm stirs 30 ± 3min.
7. preparation method according to claim 6, which is characterized in that step (b), the model KH- of silane coupling agent
560;
Further, the silane coupling agent in liquid form with powder hybrid reaction;
Further, solvent mixing is added in silane coupling agent, obtains liquid form;
Further, the solvent that silane coupling agent is added is dehydrated alcohol;
Further, the silane coupling agent and dehydrated alcohol are 1-5:1 mixing by weight;
Further, silane coupling agent and dehydrated alcohol mixture according to the aluminium powder weight that outer surface is alumina layer 0.1%-
2% is added;
Further, handling through silane coupling agent is to disperse 50-70min with speed at 80 ± 5 DEG C for 600 ± 100rpm.
8. according to the described in any item preparation methods of claim 2-7, which is characterized in that the optimization powder shape passes through addition
Long-chain coupling agent processing carries out;
The long-chain coupling agent is that titanate coupling agent, stearic acid, carbonic ester coupling agent are any one or more of;
Further, the long-chain coupling agent is titanate coupling agent, the model LD-70 of the titanate coupling agent;
Further, the long-chain coupling agent in liquid form with powder hybrid reaction;
Further, solvent mixing is added in long-chain coupling agent, obtains liquid form;
Further, the solvent that long-chain coupling agent is added is dehydrated alcohol;
Further, the weight ratio of the long-chain coupling agent and dehydrated alcohol is 1-3:1;
Further, the additional amount of long-chain coupling agent and dehydrated alcohol mixture is the powder weight after silane coupling agent is handled
0.1%-3%;
Further, it is to disperse 50-70min with speed at 80 ± 5 DEG C for 600 ± 100rpm that long-chain coupling agent processing, which is added,.
9. a kind of Heat Conduction Material, which is characterized in that contain high thermal conductivity powder described in claim 1;
Further, the Heat Conduction Material is heat conductive silica gel material, and the heat conductive silica gel material is by the high thermal conductivity powder and silicon
Glue is mixed;
Further, the high thermal conductivity powder includes being prepared or being mixed respectively by ball aluminum powder 1, ball aluminum powder 2 and ball aluminum powder 3
The high thermal conductivity powder being prepared, the percentage that these three high thermal conductivity powders distinguish the total high thermal conductivity powder weight of Zhan is 7%-
18/%, 18%-41%, 46%-75%;
Further, the heat conductive silica gel material is heat-conducting silica gel sheet.
10. a kind of processing method of heat conductive silica gel material, which is characterized in that by high thermal conductivity powder described in claim 1 and silicon
Glue mixing, it is two-sided to cover release film, pass through molding or calender and heated oven curing molding, heat-conducting silica gel sheet obtained.
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Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1317805A (en) * | 2000-04-10 | 2001-10-17 | 阎宝连 | Thermally conductive silicon powder-base insulator |
TW200427781A (en) * | 2003-02-13 | 2004-12-16 | Dow Corning Toray Silicone | Thermoconductive silicone composition |
CN1910122A (en) * | 2004-01-08 | 2007-02-07 | 昭和电工株式会社 | Inorganic powder, resin composition filled with the powder and use thereof |
CN1989190A (en) * | 2004-07-27 | 2007-06-27 | 3M创新有限公司 | Thermally conductive composition |
CN1990819A (en) * | 2005-12-27 | 2007-07-04 | 信越化学工业株式会社 | Heat conductive silicone grease composition |
JP4112396B2 (en) * | 2003-02-13 | 2008-07-02 | 電気化学工業株式会社 | Resin fillers and applications |
CN101294067A (en) * | 2008-06-20 | 2008-10-29 | 清华大学 | Heat conductive silicone grease composition |
CN101798498A (en) * | 2010-03-19 | 2010-08-11 | 昆明理工大学 | Al/Al2O3 heat storage material and preparation method thereof |
JP4525139B2 (en) * | 2004-03-31 | 2010-08-18 | 住友ベークライト株式会社 | The manufacturing method of the epoxy resin composition for semiconductor sealing. |
CN102046728A (en) * | 2008-05-27 | 2011-05-04 | 道康宁东丽株式会社 | Thermally conductive silicone composition and electronic device |
CN102702652A (en) * | 2012-05-17 | 2012-10-03 | 南昌航空大学 | High-dielectric constant low-loss metal/polymer composite and preparation method thereof |
JP5100254B2 (en) * | 2007-08-24 | 2012-12-19 | 電気化学工業株式会社 | Heat dissipation material |
CN102947430A (en) * | 2010-06-24 | 2013-02-27 | 道康宁东丽株式会社 | Thermally conductive silicone grease composition |
JP5767863B2 (en) * | 2011-06-01 | 2015-08-26 | 電気化学工業株式会社 | Spherical alumina powder, method for producing the same, and composition using the same |
CN104918996A (en) * | 2012-12-14 | 2015-09-16 | Lg伊诺特有限公司 | Epoxy resin composition and printed circuit board using same |
CN105419339A (en) * | 2015-12-01 | 2016-03-23 | 江苏晶河电子科技有限公司 | High-performance silicon-based thermal-conducting gel and preparation method thereof |
CN105566920A (en) * | 2015-12-24 | 2016-05-11 | 平湖阿莱德实业有限公司 | Low-oil-permeability super-soft thermally-conductive silica gel composition and thermally-conductive silica gel gasket and preparation method thereof |
CN106433035A (en) * | 2016-10-18 | 2017-02-22 | 中国科学院深圳先进技术研究院 | Aluminum-based filling heat interface composite material and preparation method and application thereof |
CN106519691A (en) * | 2016-11-01 | 2017-03-22 | 深圳市安品有机硅材料有限公司 | Heat conductive silicone grease composition and preparation method thereof |
CN106660817A (en) * | 2014-07-28 | 2017-05-10 | 电化株式会社 | Spherical alumina powder and resin composition including same |
CN106957519A (en) * | 2017-04-09 | 2017-07-18 | 广州天宸高新材料有限公司 | A kind of heat conduction oil/fat composition volatilized without oligosiloxane and preparation method thereof |
CN107141719A (en) * | 2017-05-27 | 2017-09-08 | 中国科学院深圳先进技术研究院 | Filled-type thermally conductive composite and preparation method thereof |
CN107442658A (en) * | 2017-06-20 | 2017-12-08 | 太仓市兴港金属材料有限公司 | A kind of preparation technology of high-efficiency radiator |
CN107532000A (en) * | 2015-05-22 | 2018-01-02 | 迈图高新材料日本合同公司 | Heat conductivity composition |
CN107555455A (en) * | 2017-08-31 | 2018-01-09 | 天津泽希矿产加工有限公司 | Electronics heat conduction ball-aluminium oxide and manufacture method |
CN109251514A (en) * | 2018-08-15 | 2019-01-22 | 山东大学 | A kind of APU-Al high frequency high-dielectric and low-loss material and preparation method thereof |
-
2019
- 2019-03-14 CN CN201910195327.1A patent/CN109909494B/en active Active
Patent Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1317805A (en) * | 2000-04-10 | 2001-10-17 | 阎宝连 | Thermally conductive silicon powder-base insulator |
TW200427781A (en) * | 2003-02-13 | 2004-12-16 | Dow Corning Toray Silicone | Thermoconductive silicone composition |
JP4112396B2 (en) * | 2003-02-13 | 2008-07-02 | 電気化学工業株式会社 | Resin fillers and applications |
CN1910122A (en) * | 2004-01-08 | 2007-02-07 | 昭和电工株式会社 | Inorganic powder, resin composition filled with the powder and use thereof |
JP4525139B2 (en) * | 2004-03-31 | 2010-08-18 | 住友ベークライト株式会社 | The manufacturing method of the epoxy resin composition for semiconductor sealing. |
CN1989190A (en) * | 2004-07-27 | 2007-06-27 | 3M创新有限公司 | Thermally conductive composition |
CN1990819A (en) * | 2005-12-27 | 2007-07-04 | 信越化学工业株式会社 | Heat conductive silicone grease composition |
JP5100254B2 (en) * | 2007-08-24 | 2012-12-19 | 電気化学工業株式会社 | Heat dissipation material |
CN102046728A (en) * | 2008-05-27 | 2011-05-04 | 道康宁东丽株式会社 | Thermally conductive silicone composition and electronic device |
CN101294067A (en) * | 2008-06-20 | 2008-10-29 | 清华大学 | Heat conductive silicone grease composition |
CN101798498A (en) * | 2010-03-19 | 2010-08-11 | 昆明理工大学 | Al/Al2O3 heat storage material and preparation method thereof |
CN102947430A (en) * | 2010-06-24 | 2013-02-27 | 道康宁东丽株式会社 | Thermally conductive silicone grease composition |
JP5767863B2 (en) * | 2011-06-01 | 2015-08-26 | 電気化学工業株式会社 | Spherical alumina powder, method for producing the same, and composition using the same |
CN102702652A (en) * | 2012-05-17 | 2012-10-03 | 南昌航空大学 | High-dielectric constant low-loss metal/polymer composite and preparation method thereof |
CN104918996A (en) * | 2012-12-14 | 2015-09-16 | Lg伊诺特有限公司 | Epoxy resin composition and printed circuit board using same |
CN106660817A (en) * | 2014-07-28 | 2017-05-10 | 电化株式会社 | Spherical alumina powder and resin composition including same |
CN107532000A (en) * | 2015-05-22 | 2018-01-02 | 迈图高新材料日本合同公司 | Heat conductivity composition |
CN105419339A (en) * | 2015-12-01 | 2016-03-23 | 江苏晶河电子科技有限公司 | High-performance silicon-based thermal-conducting gel and preparation method thereof |
CN105566920A (en) * | 2015-12-24 | 2016-05-11 | 平湖阿莱德实业有限公司 | Low-oil-permeability super-soft thermally-conductive silica gel composition and thermally-conductive silica gel gasket and preparation method thereof |
CN106433035A (en) * | 2016-10-18 | 2017-02-22 | 中国科学院深圳先进技术研究院 | Aluminum-based filling heat interface composite material and preparation method and application thereof |
CN106519691A (en) * | 2016-11-01 | 2017-03-22 | 深圳市安品有机硅材料有限公司 | Heat conductive silicone grease composition and preparation method thereof |
CN106957519A (en) * | 2017-04-09 | 2017-07-18 | 广州天宸高新材料有限公司 | A kind of heat conduction oil/fat composition volatilized without oligosiloxane and preparation method thereof |
CN107141719A (en) * | 2017-05-27 | 2017-09-08 | 中国科学院深圳先进技术研究院 | Filled-type thermally conductive composite and preparation method thereof |
CN107442658A (en) * | 2017-06-20 | 2017-12-08 | 太仓市兴港金属材料有限公司 | A kind of preparation technology of high-efficiency radiator |
CN107555455A (en) * | 2017-08-31 | 2018-01-09 | 天津泽希矿产加工有限公司 | Electronics heat conduction ball-aluminium oxide and manufacture method |
CN109251514A (en) * | 2018-08-15 | 2019-01-22 | 山东大学 | A kind of APU-Al high frequency high-dielectric and low-loss material and preparation method thereof |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114149617A (en) * | 2021-09-26 | 2022-03-08 | 广东长鹿精细化工有限公司 | High-thermal-conductivity composition in high-molecular compound, and preparation method and application thereof |
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