CN109905503A - Shell, electronic device and the method for preparing shell - Google Patents
Shell, electronic device and the method for preparing shell Download PDFInfo
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- CN109905503A CN109905503A CN201910153161.7A CN201910153161A CN109905503A CN 109905503 A CN109905503 A CN 109905503A CN 201910153161 A CN201910153161 A CN 201910153161A CN 109905503 A CN109905503 A CN 109905503A
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Abstract
This application discloses a kind of shells comprising: first base material layer；Second substrate layer is stacked in first base material layer side, and the second substrate layer is different from the density of first base material layer；Binder course, between first base material layer and the second substrate layer, binder course welds conversion zone so that first base material layer and the second substrate layer form one as first base material layer and helping for the second substrate layer.Using the above structure, binder course is to help weldering conversion zone, is chemically reacted respectively with first base material layer and the second substrate layer in the welding process, so that first base material layer and the second substrate layer are combined into firm one using the technique of welding by binder course.In addition there are two the different substrates of density to be formed for shell, and one of substrate can select the smaller material of density, so that weight is smaller under equal volume, and then reduces overall weight.The application also provides a kind of electronic device including above-mentioned shell, and the method for preparing shell.
Description
Technical field
This application involves electronic communication technology fields, more particularly to a kind of shell, electronic device and prepare shell
Method.
Background technique
The electronic devices such as mobile phone, tablet computer are equipped with shell, and for proof strength, shell generally uses a kind of metal material
Matter integrated molding is made, but often than heavier, the overall quality of electronic device is caused to increase.
Summary of the invention
The application provides a kind of shell, electronic device and the method for preparing shell.
In order to solve the above technical problems, the technical solution that the application uses is: providing a kind of shell comprising:
First base material layer；
Second substrate layer is stacked in first base material layer side, and second substrate layer and first base
The density of material layer is different；
Binder course, between the first base material layer and second substrate layer, the binder course is as described first
Substrate layer and helping for second substrate layer weld conversion zone so that the first base material layer and second substrate layer form one
Body.
The application also provides a kind of electronic device comprising:
Shell described above.
The application also provides a kind of method for preparing shell, this method comprises:
First base material layer and the second substrate layer are provided；
Binder course is set between the first base material layer and second substrate layer, by welding the first base material
Layer is combined together with second substrate layer, so that the binder course and the first base material layer and second substrate layer
A part occur chemical reaction so that the first base material layer, the binder course and the second substrate layer form integrated conduct
Demarcate shell；
Punching press and numerical control processing are carried out to the calibration shell, so that the calibration shell changes shape and becomes target shell
Body.
The second substrate layer that in above scheme, shell includes first base material layer, is connect with first base material layer, and it is located at the
Binder course between one substrate layer and the second substrate layer.First base material layer is different from the density of the second substrate layer, binder course conduct
First base material layer and helping for the second substrate layer weld conversion zone so that first base material layer and second substrate layer form one.It adopts
With the above structure, binder course is provided between two substrates, binder course is to help weldering conversion zone, can be in the production process of shell
Play the role of reinforcing welding effect, wherein binder course occurs with first base material layer and the second substrate layer respectively in process of production
Chemical reaction, so that first base material layer and the second substrate layer are combined into firm one using the technique of welding by binder course.
In addition there are two the different substrates of density to be formed for shell, and one of substrate can select the smaller material of density, so that
Under equal volume, weight is smaller, and then reduces overall weight.
Detailed description of the invention
Fig. 1 is the amplification schematic perspective view of one embodiment of the application shell；
Fig. 2 is the structural schematic diagram of one embodiment of the application electronic device；
Fig. 3 is the structural schematic diagram that the application shell does not ultimately form an embodiment also；
Fig. 4 is the schematic diagram of the section structure in the application shell direction a-a as shown in Figure 1；
Fig. 5 is the structural schematic diagram that the application shell does not ultimately form another embodiment also；
Fig. 6 is the flow diagram for one embodiment of method that the application prepares shell；
Fig. 7 is the structure distribution schematic diagram in the application shell preparation process.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description.It is understood that specific embodiment described herein is only used for explaining the application, rather than to the limit of the application
It is fixed.It also should be noted that illustrating only part relevant to the application for ease of description, in attached drawing and not all knot
Structure.Based on the embodiment in the application, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
The application provides a kind of shell 100, the electronic device 200 including the shell 100.Referring to Fig. 1 and Fig. 2, wherein Fig. 1
For the structural schematic diagram of one embodiment of the application shell, Fig. 2 is the structural representation of electronic device 200 in one embodiment of the application
Figure.Specifically, the electronic device 200 can be various types of computer systems that are mobile or portable and executing wireless communication
Any one of equipment (only illustratively shows a kind of form) in Fig. 2.Specifically, electronic device 200 can be movement
Phone or smart phone (for example, being based on iPhone TM, the phone based on Android TM), portable gaming device (such as
Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), electricity on knee
Brain, PDA, portable Internet appliance, music player and data storage device, other handheld devices and such as wear-type
Earphone etc., electronic device 200 can also need the wearable device to charge (for example, such as electronics bracelet, electron term to be other
The headset equipment (HMD) of chain, electronic equipment or smartwatch).
Electronic device 200 can also be that any one of multiple electronic equipments, multiple electronic equipments include but is not limited to
Cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players, sound
Happy logger, video recorder, other medium recorders, radio, Medical Devices, vehicle transport instrument, calculator, programmable telemetry
It is device, pager, laptop computer, desktop computer, printer, netbook computer, personal digital assistant (PDA), portable
Multimedia player (PMP), Motion Picture Experts Group (MPEG-1 or MPEG-2) audio layer 3 (MP3) player, portable medical
The equipment such as equipment and digital camera and combinations thereof.
In some cases, electronic device 200 can execute multiple functions and (for example, playing music, show video, storage
Picture and send and receive call).If desired, electronic device 200 can be such as cellular phone, media play
Device, other handheld devices, watch equipment, pendant equipment, the equipment of receiver device or other compact portables.
Referring also to Fig. 3 and Fig. 4, shell 100 provided by the present application include first base material layer 10, are stacked in the first base
Second substrate layer 20 of 10 side of material layer, and the binder course 30 being arranged between first base material layer 10 and the second substrate layer 20.
It should be understood that term " first ", " second ", " third " in the application are used for description purposes only, and cannot manage
Solution is indication or suggestion relative importance or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " first ",
The feature of " second ", " third " can explicitly or implicitly include at least one of the features.
Specifically, shell 100 is the rear shell or center of electronic device 200 in different embodiments, wherein rear shell is electricity
The shell at 200 back side of sub-device, one side appearance are naked are exposed on the external.Center major part volume is located inside electronic device 200,
Marginal position is naked to be exposed on the external, and is used for bearer circuit mainboard, flexible print circuit board, the carrier of electronic component etc..Wherein
The a part of rear shell or the exposed part outside electronic device 200 of center as 200 outer surface of electronic device.One embodiment
In, first base material layer 10 and the second substrate layer 20 are different materials, and two kinds of materials weld by binder course 30 and form one.It can
Selection of land, in an embodiment, first base material layer 10 is to have part of the partial denudation outside electronic device 200 in shell 100.Therefore
First base material layer 10 also needs to consider appearance and etch-proof factor when selecting.Second substrate layer 20 is stacked
It, will not the exposed outside in electronic device 200 as the internal surface layer of shell 100 on first base material layer 10.
Binder course 30 is located between first base material layer 10 and the second substrate layer 20, and binder course 30 is used as 10 He of first base material layer
Second substrate layer 20 helps weldering conversion zone so that first base material layer 10 and the second substrate layer 20 form one.Specifically, first
The form of 20 most original of substrate layer 10 and the second substrate layer is sheet, and shell 100 is the component with certain shapes and radian,
First base material layer 10 and the second substrate layer 20 form calibration shell after linking together, calibration shell also need through punching press or
Person's numerically-controlled machine tool is processed, and the target shell for meeting product requirement is formed.Assuming that if by first base material layer 10 and the second base
Material layer 20 bonded by adhesive layer it is together then very insecure, be formed by this way calibration shell cannot pass through subsequent punching
The techniques such as pressure and numerically-controlled machine tool are further processed.In the application, first base material layer 10 and the second substrate layer 20 pass through weldering
The mode connect links together, and wherein binder course 30 is as the middle layer for helping weldering, in first base material layer 10 and the second substrate layer 20
During welding, binder course 30 pressurizes while heated or heated, so that first base material layer 10 and/or the second substrate layer
20 a part is chemically reacted with binder course 30, so that first base material layer 10 and the second substrate layer 20 are securely joined with
Form one.Optionally, in different embodiments, binder course 30 includes at least one of tin and nickel or other can be
Wlding material is helped with what first base material layer 10 and/or the second substrate layer 20 chemically reacted during processing, this does not do
It is specific to limit.
Optionally, in an embodiment, the technique of first base material layer 10 and the welding of the second substrate layer 20 is diffusion welding (DW).Specifically
, diffusion welding (DW) refers to pressurizes workpiece at high temperature, but does not generate the solid-state soldering method of visible deformation and relative movement.Diffusion welding (DW)
It is particularly suitable for the engagement of the new materials such as different metal materials, heat-resisting alloy and ceramics, intermetallic compound, composite material.Other
In embodiment, the welding of first base material layer 10, the second substrate layer 20 and binder course 30 can also pass through other welding procedures, example
Such as melting welding and soldering, as long as first base material layer 10 and the second substrate layer 20 is enabled to chemistry can to occur with binder course 30
Reaction, this is not specifically limited.
First base material layer 10 and the second substrate layer 20, which are formed by binder course 30 using welding procedure, demarcates shell (such as Fig. 3
It is shown) after, eventually formed using the processing technology of punching press and numerically-controlled machine tool meet product requirement target shell such as Fig. 1 and
Shown in Fig. 4, shell is further hereafter prepared by other embodiments explanation method.The application using the above structure, the first base
Material layer 10 and the second substrate layer 20 pass through binder course 30 and form a firm entirety, and shell 100 is different by two density
Substrate is formed, and one of substrate can select the smaller material of density, so that weight is smaller under equal volume, in turn
Reduce overall weight.
Optionally, in an embodiment, on the surface that first base material layer 10 and the second substrate layer 20 be combined with each other at least one
Many places recessed portion 40 is set, to increase the contact area of first base material layer 10 or the second substrate layer 20 and binder course 30.Specifically
, grain pattern etc. can be set on that surface that first base material layer 10 and/or the second substrate layer 20 are contacted with binder course 30,
So that with binder course 30 more sufficient chemical reaction can occur for first base material layer 10, the second substrate layer 20, and then make
It obtains first base material layer 10 and the second substrate layer 20 and more firm one is formed by binder course 30.
Optionally, in an embodiment, the density of the second substrate layer 20 is less than the density of first base material layer 10.It is understood that
, internal surface layer of second substrate layer 20 as shell 100 will not be exposed outside electronic device 200, there is first base material 10 work layer by layer
For protective layer, therefore requirement of second substrate layer 20 to anti-corrosive properties can be lower, and it is small to can choose density ratio first base material layer 10
Material reduce the overall weight of shell 100, and then reduce electronic device and then under the premise of guaranteeing 100 thickness of shell
200 overall weight.For example, the density of the second substrate layer 20 is the 2/3 of 10 density of first base material layer in an embodiment, other
In embodiment, it is also possible to other ratios, as long as the weight of shell 100 can be reduced.
It should be understood that requirement of second substrate layer 20 to anticorrosive property is relatively low, but have centainly to hardness and strength
Requirement.Therefore the second substrate layer 20 is being required with lesser density, while there is lighter weight, to the second substrate layer
20 intensity has certain requirement.Optionally, in an embodiment, the specific strength of the second substrate layer 20 is greater than first base material layer 10
Specific strength.Specifically, specific strength is the intensity (power suffered by unit area when disconnection) of material divided by its apparent density, i.e. material
Tensile strength and the ratio between material apparent density be called specific strength.In the present embodiment, the specific strength of the second substrate layer 20 is greater than the
There is better intensity while the specific strength of one substrate layer 10 makes the second substrate layer 20 with lighter amount, and then guarantee whole
The intensity of a shell 100 will not deform or damaged easily.
Optionally, in an embodiment, first base material layer 10 is aluminium alloy, and the second substrate layer 20 is magnesium alloy.More than
Structure, using aluminium alloy as the appearance of shell 100.Magnesium alloy is located at the non-appearance face of shell 100, the guarantor with aluminium alloy
Shield, can preferably prevent magnesium alloy oxidation by air.In the above structure, magnesium alloy density only has the 2/3 of aluminium alloy, can reach
Reduce the purpose of entire case weight under equal volume.It simultaneously can be as the metal or alloy of structural member, magnesium compared to other
Alloy is the highest metal of specific strength, such as common AZ91D magnesium alloy is about 6061 series alloys ratios in electronic device 200
1.5 times of intensity, are remarkably improved the intensity of equal quality lower case 100.
Optionally, processing is carried out to aluminium alloy using anodic oxidation in an embodiment and forms oxide layer, so that shell 100 has
There is preferable appearance and preferably protects internal magnesium alloy.
In other embodiments, first base material layer 10 or other materials, such as steel or copper.Second substrate layer 20
It is also possible to other materials, as long as the specific strength of the second substrate layer 20 is greater than the specific strength of first base material layer 10, this is not done
It is specific to limit.
Referring to Fig. 5, optionally, in an embodiment, the thickness of the second substrate layer 20 is greater than the thickness of first base material layer 10, with
Enhance the intensity of shell 100.In other embodiments, being also possible to the second substrate layer 20 and first base material layer 10 has same thickness
The thickness of degree or the second substrate layer 20 is less than the thickness of first base material layer 10.As long as the integral strength of shell 100 can reach
Product quality requirement, this is not specifically limited.
The application also provides a kind of method for preparing the shell that above embodiments are introduced, and is the application preparation referring to Fig. 6
The flow diagram of the method first embodiment of shell, the method comprising the steps of 101 to step 103, referring also to Fig. 1, Fig. 3 and
Fig. 4, in which:
Step 101: first base material layer 10 and the second substrate layer 20 are provided.
First base material layer 10 provided in step 101 and the second substrate layer 20 are plate, specifically, in an embodiment,
First base material layer 10 is aluminium alloy, and the second substrate layer 20 is magnesium alloy.It is also possible to other materials in other embodiments, specifically
The embodiment of details 100 structure of shell as described above is consistent, this is without repeating.
Step 102: binder course being set between first base material layer 10 and the second substrate layer 20, by welding first base material
Layer 10 is combined together with the second substrate layer 20, so that one of binder course 30 and first base material layer 10 and the second substrate layer 20
Distribute biochemical reaction so that first base material layer 10, binder course 30 and the second substrate layer 20 form one as calibration shell
Body.
Specifically, soldering appliance acts on a part of binder course 30, first base material layer 10 and the second substrate layer 20, so that
A part of binder course 30, first base material layer 10 and the second substrate layer 20 is in the higher environment of temperature, so that in welding
In the process, the part that first base material layer 10, the second substrate layer 20 are contacted with binder course 30 chemically reacts, so that first
Substrate layer 10, binder course 30 and the second substrate layer 20 form one as calibration shell.Optionally, in an embodiment, first
Substrate layer 10 and the technique of the second substrate layer 20 welding are diffusion welding (DW).Workpiece is pressurizeed at high temperature specifically, diffusion welding (DW) refers to,
But the solid-state soldering method of visible deformation and relative movement is not generated.Diffusion welding (DW) be particularly suitable for different metal materials, heat-resisting alloy and
The engagement of the new materials such as ceramics, intermetallic compound, composite material.In other embodiments, first base material layer 10, the second substrate layer
20 and the welding of binder course 30 can also be by other welding procedures, such as melting welding and soldering etc., as long as enabling to first
Substrate layer 10 and the second substrate layer 20 can be chemically reacted with binder course 30, this is not specifically limited.
It should be understood that calibration shell or plate, do not meet the shape of product requirement of shell also.
Step 103 is then further processed calibration shell, so that calibration shell becomes target shell after processing.
Step 103: punching press and numerical control processing being carried out to calibration shell, so that calibration shell, which changes shape, becomes target shell
Body.
By step 102, first base material layer 10 is combined formation one with the second substrate layer 20, and step 103 is first to calibration
Shell carries out punching press, so that forming the approximate shape of target shell after punching press.Specifically, punching press is depended on pressure machine and mold pair
Plate, band, tubing and profile etc. apply external force, are allowed to generate plastic deformation to the workpiece of shape and size needed for acquisition
The forming technique of (stamping parts).Numerical control processing is carried out (also referred to as by punching press and then the calibration shell after pressing through that liquidates
CNC processing), i.e., it is further processed by the computer digital control precision machinery calibration shell after pressing through that liquidates, with right
The size and shape of calibration shell are compared fine amendment and adjustment.Such as the edge for demarcating shell formation is conformed to
The amplitude asked, or certain specific positions etc. are removed in the inner surface of calibration shell, and then finally meet the shape of product requirement
Shape and size become target shell.
In the scheme that first embodiment is illustrated, a kind of situation is the size of first base material layer 10 and the second substrate layer 20
Quite, after first base material layer 10 and the combination of the second substrate layer 20 form one, symbol can be formed after punching press and numerical control processing
Close the target shell of product requirement.In the above this scheme, one piece of shell 100 of every preparation, i.e., in first base material layer 10 and second
One layer of binder course 30, the sizableness of first base material layer 10 and the second substrate layer 20 is arranged in substrate layer 20.
Referring to Fig. 7, in another embodiment, the volume of the second substrate layer of volume ratio 20 of first base material layer 10 is big, i.e., and first
The length of substrate layer 10 than the second substrate layer 20 grow up or the length of first base material layer 10 and wide longer than the second substrate layer 20
With it is roomy.In the embodiment, binder course is set between first base material layer 10 and the second substrate layer 20, by welding the first base
The step of material layer 10 and the second substrate layer 20 are combined together includes: the multiple binder courses of interval setting on first base material layer 10
30, the second substrate layer 20 is welded on each binder course 30 by welding and forms default shell.Include on default shell
One piece of first base material layer 10, the second substrate layer of muti-piece 20.Machine is enabled to be arranged one by one whithin a period of time using the technique
Second substrate layer 20, then another one is placed on binder course 30, is finally welded again by many binder courses 30.Technique step
In rapid, binder course 30 is set every time, places that the second substrate layer 20, that welding can make machine repeat whithin a period of time is identical
Movement, and then improve product production efficiency.
Specifically, punching press and numerical control processing are being carried out to calibration shell, so that calibration shell changes shape in the embodiment
Before the step of as target shell further include: according to the size of the second substrate layer 20 to default shell carry out forging and stamping formed it is multiple
Demarcate shell.Default shell after will welding is forged and pressed, and shell is demarcated in formation one by one, finally again to each calibration shell
Punching press and numerical control processing are carried out, and then forms the target shell for meeting product requirement.It should be understood that in the description of the present application,
The meaning of " plurality " is at least two, such as two, three etc., unless otherwise specifically defined.It should be noted that forging
The process of pressure can also make the calibration of forging and stamping formation in addition to enabling to default shell to separate to form multiple calibration shells
The middle first base material layer 10 of shell and the second substrate layer 20 combine more secured and close.
The application uses above scheme, enables to shell to have better intensity, while mitigating the weight of shell, in turn
Mitigate the overall weight of the electronic device 200 using the shell 100.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (14)
1. a kind of shell characterized by comprising
First base material layer；
Second substrate layer is stacked in first base material layer side, and second substrate layer and the first base material layer
Density it is different；
Binder course, between the first base material layer and second substrate layer, the binder course is as the first base material
Layer and helping for second substrate layer weld conversion zone so that the first base material layer and second substrate layer form one.
2. shell according to claim 1, which is characterized in that the density of second substrate layer is less than the first base material
The density of layer.
3. shell according to claim 2, which is characterized in that the density of second substrate layer is the first base material layer
The 2/3 of density.
4. shell according to claim 2, which is characterized in that the specific strength of second substrate layer is greater than first base
The specific strength of material layer.
5. shell according to claim 1, which is characterized in that the thickness of second substrate layer is greater than the first base material
The thickness of layer.
6. shell according to claim 1, which is characterized in that the binder course includes at least one of tin and nickel.
7. shell according to claim 1, which is characterized in that the first base material layer is mutually tied with second substrate layer
On the surface of conjunction at least one setting many places recessed portion, with increase the first base material layer or second substrate layer with it is described
The contact area of binder course.
8. shell according to claim 1-7, which is characterized in that the first base material layer be aluminium alloy, second
Substrate layer is magnesium alloy.
9. shell according to claim 1-7, which is characterized in that the first base material layer is steel or copper.
10. shell according to claim 1-7, which is characterized in that the shell is shell or center.
11. a kind of electronic device, which is characterized in that including the described in any item shells of claim 1-10.
12. a kind of method for preparing shell, which is characterized in that the described method includes:
First base material layer and the second substrate layer are provided；
Binder course is set between the first base material layer and second substrate layer, by welding by the first base material layer with
Second substrate layer is combined together, so that the one of the binder course and the first base material layer and second substrate layer
Chemical reaction occurs for part so that the first base material layer, the binder course and the second substrate layer form one as calibration
Shell；
Punching press and numerical control processing are carried out to the calibration shell, so that the calibration shell changes shape and becomes target shell.
13. the method according to claim 12 for preparing shell, which is characterized in that the volume ratio institute of the first base material layer
The volume for stating the second substrate layer is big, described that binder course is arranged between the first base material layer and second substrate layer, passes through
The step of first base material layer is combined together by diffusion welding (DW) with second substrate layer include:
Multiple binder courses are arranged in interval on the first base material layer, are welded on each binder course by diffusion welding (DW)
Second substrate layer forms default shell；
It is described that punching press and numerical control processing are carried out to the calibration shell, so that the calibration shell changes shape and becomes target shell
The step of before further include:
Forging and stamping are carried out to the default shell according to the size of second substrate layer and form multiple calibration shells.
14. the method for shell is prepared described in 2 or 13 according to claim 1, which is characterized in that the first base material layer is aluminium
Alloy, second substrate layer are magnesium alloy.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910153161.7A CN109905503A (en) | 2019-02-28 | 2019-02-28 | Shell, electronic device and the method for preparing shell |
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| CN201910153161.7A CN109905503A (en) | 2019-02-28 | 2019-02-28 | Shell, electronic device and the method for preparing shell |
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Cited By (1)
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|---|---|---|---|---|
| CN114375114A (en) * | 2020-10-15 | 2022-04-19 | 华为技术有限公司 | Aluminum-magnesium double alloy composite, terminal metal case, and method for manufacturing same |
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| 杨世洲，王艳，廖东波: "《金属液态成型理论与技术基础》", 28 February 2013, 西南交通大学出版社 * |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114375114A (en) * | 2020-10-15 | 2022-04-19 | 华为技术有限公司 | Aluminum-magnesium double alloy composite, terminal metal case, and method for manufacturing same |
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