CN109904350A - A kind of package substrate, encapsulating structure and OLED device - Google Patents
A kind of package substrate, encapsulating structure and OLED device Download PDFInfo
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- CN109904350A CN109904350A CN201910231300.3A CN201910231300A CN109904350A CN 109904350 A CN109904350 A CN 109904350A CN 201910231300 A CN201910231300 A CN 201910231300A CN 109904350 A CN109904350 A CN 109904350A
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- package substrate
- mesoporous material
- material layer
- substrate
- encapsulating structure
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Abstract
The embodiment of the present invention provides a kind of package substrate, encapsulating structure and OLED device, is related to field of display technology, the encapsulating structure thickness for being able to solve existing OLED device is larger, cannot achieve the lightening problem of display device.At least one surface of the package substrate is provided with mesoporous material layer；Mesoporous material layer is for adsorbing steam and oxygen.The present invention is used for the encapsulation of OLED device.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of package substrates, encapsulating structure and OLED device.
Background technique
Organic electroluminescence device (Organic Light Emitting Device, abbreviation OLED) is in recent years gradually
The display illuminating device to grow up, due to its have many advantages, such as high response, high contrast, can flexibility, be considered as possessing extensively
General application prospect.But since OLED device is under the action of steam and oxygen, it may appear that the phenomenon that corrosion and damage, therefore,
Select preferable packaged type particularly important for OLED device.
Currently, thin-film package is a kind of packaged type being widely used in OLED display production, i.e., had using inorganic
Machine pile stack structure covers OLED device, to achieve the purpose that obstruct water oxygen.It, can be with to further increase encapsulation performance
Desiccant layer is set in inorganic barrier layer, in inorganic barrier layer or on the inside of package substrate.However such packaged type makes
Entire encapsulating structure thickness is larger, cannot achieve the lightening of display device, to influence product competitiveness.
Summary of the invention
The embodiment of the present invention provides a kind of package substrate, encapsulating structure and OLED device, is able to solve existing OLED dress
The encapsulating structure thickness set is larger, cannot achieve the lightening problem of display device.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that
On the one hand, the embodiment of the present invention provides a kind of package substrate, at least one surface of the package substrate is provided with
Mesoporous material layer；The mesoporous material layer is for adsorbing steam and oxygen.
Optionally, the making material of the mesoporous material layer includes the mesoporous material by surface chemical modification.
Optionally, the mesoporous material is mesoporous silicon oxide.
Optionally, the mesoporous material layer is adhered on the surface of the package substrate by bonding agent.
Optionally, the mesoporous material layer is also used to absorb organic molecule.
On the other hand, the embodiment of the present invention provides a kind of encapsulating structure, comprising: substrate, and cooperate shape with the substrate
At the package substrate of closed cavity；Part to be packaged is placed in the closed cavity；The package substrate is described in any of the above-described kind
Package substrate；The surface opposite with the substrate is provided with the mesoporous material layer on the package substrate.
Optionally, the inner surface of the package substrate is provided with the mesoporous material layer.
Optionally, the outside at the package substrate and the substrate contact interface is provided with sealant in one week.
In another aspect, the embodiment of the present invention provides a kind of OLED device, including described in part to be packaged and any of the above-described kind
Encapsulating structure；Wherein, the part to be packaged is OLED main structure.
Package substrate, encapsulating structure and OLED device provided in an embodiment of the present invention, the package substrate at least one
Surface is provided with mesoporous material layer；Mesoporous material layer is for adsorbing steam and oxygen.Compared to the prior art, the embodiment of the present invention
In by the way that mesoporous material layer is arranged on package substrate, the mesoporous material in mesoporous material layer can adsorb water oxygen, play very well
Desiccation, and the large specific surface area of mesoporous material, compared to tradition setting inorganic-organic barrier layer and desiccant layer institute
The ability of the same absorption water oxygen obtained, the setting thickness of mesoporous material layer can be thinner, can reduce encapsulating structure in this way
Thickness realizes the lightening of display device, is conducive to promote product competitiveness.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is package substrate construction schematic diagram provided in an embodiment of the present invention；
Fig. 2 is package structure diagram provided in an embodiment of the present invention；
Fig. 3 be another embodiment of the present invention provides package structure diagram.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of package substrate 11, as shown in Figure 1, at least one surface of package substrate 11 is arranged
There is mesoporous material layer 12；Mesoporous material layer 12 is for adsorbing steam and oxygen.
Wherein, mesoporous material layer 12 is made of mesoporous material.The active site that mesoporous material channel surfaces have can be to change
The mode fixed trapped object of key is learned on duct, not will lead to secondary release.Simultaneously as mesoporous dimensional effect, in duct
The interior diffusion for carrying out that gas molecule can be limited when binding reaction, reduces water oxygen molecule and organic material contact.Thus, mesoporous material
Material can not only adsorb water oxygen, moreover it is possible to and organic molecule is captured, mesoporous material layer 12 is set in this way on package substrate 11, it can be to prevent
Part to be packaged is encroached on and polluted to sealing oxygen and organic molecule impurity.
The embodiment of the present invention for mesoporous material layer 12 setting thickness and setting shape etc. without limitation, this field skill
Art personnel can set according to the actual situation.In practical applications, it can set non-for the surface of mesoporous material layer 12
Plane (such as honeycomb face, wavy surface), can increase the contact area of mesoporous material layer 12 Yu water oxygen in this way, further enhance Jie
The ability of the absorption water oxygen of Porous materials layer 12.
So, compared to the prior art, by the way that mesoporous material layer is arranged on package substrate in the embodiment of the present invention,
Mesoporous material in mesoporous material layer can adsorb water oxygen, play good desiccation, and the specific surface area of mesoporous material
Greatly, the ability of same absorption water oxygen obtained compared to tradition setting inorganic-organic barrier layer and desiccant layer, mesoporous material
The setting thickness of layer can be thinner, can reduce the thickness of encapsulating structure in this way, realize the lightening of display device, be conducive to mention
Rise product competitiveness.
It, can be to for making mesoporous material layer 12 in order to further enhance the water oxygen adsorption capacity of mesoporous material layer 12
Mesoporous material first carries out surface chemical modification, and increase active group makes hydrone be easier to pass through chemical action such as Si-OH group
Power and mesoporous material adsorption.
The embodiment of the present invention for make mesoporous material layer 12 mesoporous material concrete type without limitation, it is exemplary,
The mesoporous material can be mesoporous silicon oxide.Activity can produce by chemical modification in mesoporous silicon oxide channel surfaces,
Such as hydrophily, oxidation-reduction quality grafts functional group etc., and such active surface removes foreign gas after being conducive to packaging technology.
In practical applications, mesoporous material layer 12 can be adhered on the surface of package substrate 11 by bonding agent.Example
, 11 surface of package substrate can be handled first with bonding agent, mesoporous material is then sprayed on treated envelope
The surface of substrate 11 is filled, to form mesoporous material layer 12.
Another embodiment of the present invention provides a kind of encapsulating structures, as shown in Figures 2 and 3, comprising: substrate 13, and with lining
Bottom 13 cooperatively forms the package substrate 11 of closed cavity；Part 14 to be packaged is placed in the closed cavity；The package substrate is above-mentioned
Any package substrate 11；The surface opposite with substrate 13 is provided with mesoporous material layer 12 on package substrate 11.
The package substrate 11 is used in encapsulating structure, relative to traditional desiccant, is provided bigger with water oxygen
Contact area can fully absorb the water oxygen around part 14 to be packaged in time in this way, while reduce the thickness of encapsulating structure, realize
Product it is lightening.
In other embodiments of the invention, refering to what is shown in Fig. 3, the inner surface of package substrate 11 be provided with it is mesoporous
Material layer 12.The setting area of mesoporous material layer 12 is increased in this way, that is, increases the contact surface of mesoporous material layer 12 Yu water oxygen
Product, thus it is provided with better water oxygen adsorption capacity.
Shown in referring to figs. 2 and 3, there is steam to permeate risk on package substrate 11 and 13 contact interface of substrate in order to prevent,
It can be in the one week setting sealant 15 in outside of package substrate 11 and 13 contact interface of substrate.
Yet another embodiment of the invention provides a kind of OLED device, including encapsulation described in part 14 to be packaged and any of the above-described kind
Structure；Wherein, part 14 to be packaged is OLED main structure.
Due to being provided with mesoporous material layer on the package substrate of the encapsulating structure of the embodiment of the present invention, in mesoporous material layer
Mesoporous material can adsorb water oxygen, play good desiccation, and the large specific surface area of mesoporous material, set compared to tradition
The ability of inorganic-organic barrier layer and desiccant layer same absorption water oxygen obtained is set, the setting thickness of mesoporous material layer can
With thinner, the thickness of encapsulating structure can be reduced in this way, realizes the lightening of display device, be conducive to promote product competitiveness.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by those familiar with the art, all answers
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be with the scope of protection of the claims
It is quasi-.
Claims (9)
1. a kind of package substrate, which is characterized in that
At least one surface of the package substrate is provided with mesoporous material layer；
The mesoporous material layer is for adsorbing steam and oxygen.
2. package substrate according to claim 1, which is characterized in that the making material of the mesoporous material layer includes passing through
The mesoporous material of surface chemical modification.
3. package substrate according to claim 2, which is characterized in that the mesoporous material is mesoporous silicon oxide.
4. package substrate according to claim 1, which is characterized in that the mesoporous material layer is adhered to institute by bonding agent
It states on the surface of package substrate.
5. package substrate according to claim 1, which is characterized in that the mesoporous material layer is also used to absorb organic point
Son.
6. a kind of encapsulating structure characterized by comprising
Substrate, and cooperatively form with the substrate package substrate of closed cavity；Part to be packaged is placed in the closed cavity；
The package substrate is package substrate described in any one of claims 1 to 5；On the package substrate with the substrate
Opposite surface is provided with the mesoporous material layer.
7. encapsulating structure according to claim 6, which is characterized in that the inner surface of the package substrate is respectively provided with
Give an account of Porous materials layer.
8. encapsulating structure according to claim 6, which is characterized in that the package substrate and the substrate contact interface
Outside is provided with sealant in one week.
9. a kind of OLED device, which is characterized in that including encapsulation knot described in any one of part to be packaged and claim 6 to 8
Structure；Wherein, the part to be packaged is OLED main structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910231300.3A CN109904350A (en) | 2019-03-25 | 2019-03-25 | A kind of package substrate, encapsulating structure and OLED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910231300.3A CN109904350A (en) | 2019-03-25 | 2019-03-25 | A kind of package substrate, encapsulating structure and OLED device |
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| Publication Number | Publication Date |
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| CN109904350A true CN109904350A (en) | 2019-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910231300.3A Pending CN109904350A (en) | 2019-03-25 | 2019-03-25 | A kind of package substrate, encapsulating structure and OLED device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289367A (en) * | 2019-06-24 | 2019-09-27 | 京东方科技集团股份有限公司 | Encapsulate film layer, display panel and production method |
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| CN1592514A (en) * | 2003-08-26 | 2005-03-09 | 三星Sdi株式会社 | Organic electroluminescent device and method of manufacturing the same |
| CN1669362A (en) * | 2002-07-08 | 2005-09-14 | 大尼克株式会社 | Hygroscopic molding |
| JP2006130889A (en) * | 2004-11-09 | 2006-05-25 | National Institute Of Advanced Industrial & Technology | Transparent inorganic porous coating film and its manufacturing method |
| US20070248808A1 (en) * | 2006-04-21 | 2007-10-25 | Samsung Electronics Co., Ltd | Passivation film for electronic device and method of manufacturing the same |
| JP2007324037A (en) * | 2006-06-02 | 2007-12-13 | Kyodo Printing Co Ltd | Transparent adsorbent, manufacturing method of transparent adsorbent and organic el element |
| CN208271950U (en) * | 2018-05-14 | 2018-12-21 | 云谷（固安）科技有限公司 | Thin-film packing structure and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1669362A (en) * | 2002-07-08 | 2005-09-14 | 大尼克株式会社 | Hygroscopic molding |
| CN1536938A (en) * | 2003-04-12 | 2004-10-13 | ����Sdi��ʽ���� | Organic electroluminescent display device and mfg. method thereof |
| CN1592514A (en) * | 2003-08-26 | 2005-03-09 | 三星Sdi株式会社 | Organic electroluminescent device and method of manufacturing the same |
| JP2006130889A (en) * | 2004-11-09 | 2006-05-25 | National Institute Of Advanced Industrial & Technology | Transparent inorganic porous coating film and its manufacturing method |
| US20070248808A1 (en) * | 2006-04-21 | 2007-10-25 | Samsung Electronics Co., Ltd | Passivation film for electronic device and method of manufacturing the same |
| JP2007324037A (en) * | 2006-06-02 | 2007-12-13 | Kyodo Printing Co Ltd | Transparent adsorbent, manufacturing method of transparent adsorbent and organic el element |
| CN208271950U (en) * | 2018-05-14 | 2018-12-21 | 云谷（固安）科技有限公司 | Thin-film packing structure and display device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289367A (en) * | 2019-06-24 | 2019-09-27 | 京东方科技集团股份有限公司 | Encapsulate film layer, display panel and production method |
| CN110289367B (en) * | 2019-06-24 | 2021-11-02 | 京东方科技集团股份有限公司 | Packaging film layer, display panel and manufacturing method |
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Application publication date: 20190618 |
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