CN109904345A - Encapsulating structure and its display device - Google Patents
Encapsulating structure and its display device Download PDFInfo
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- CN109904345A CN109904345A CN201910151380.1A CN201910151380A CN109904345A CN 109904345 A CN109904345 A CN 109904345A CN 201910151380 A CN201910151380 A CN 201910151380A CN 109904345 A CN109904345 A CN 109904345A
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Abstract
The present invention provides a kind of encapsulating structure and its display device, and the encapsulating structure is provided with oxygen-absorbing material and water-absorbent material for absorbing water oxygen for coating OLED display layer in the encapsulation film layer of the encapsulating structure.It has the beneficial effect that compared to existing encapsulating structure and its display device, the WVTR of encapsulating structure can be improved, enhance the ability that OLED display panel obstructs extraneous water oxygen, it is ensured that its better seal packaging effect, and then extend the service life of OLED display panel；The technical issues of existing encapsulating structure and its display device are solved because packaging effect is bad, water oxygen erosion is in turn resulted in, influences display device service life.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of encapsulating structure and its display devices.
Background technique
With the continuous development of display technology, Organic Light Emitting Diode is also known as Organic Electricity laser display
(OrganicLight-Emitting Diode, OLED), gradually substitutes traditional LCD technology.OLED shows skill
Art has the advantages that much to protrude: self-luminous, high contrast, wide viewing angle, can be used for Flexible Displays etc. at low energy consumption.OLED is aobvious
Show that technology has very big development potentiality, it is considered to be the next-generation display technology of LCD technology can be substituted.
In OLED display technology flexible package structure traditional at present, use is all CVD (chemical vapor deposition) 1+
The encapsulating structure of IJP (inkjet printing)+CVD2, wherein the general institute's film forming layer of CVD1 is SiNx (silicon nitride) or SiON (nitrogen oxidation
Silicon)；IJP is the organic film of inkjet printing, mostly acrylic material；The general institute's film forming layer of CVD2 is SiNx, due in CVD1
Particle (particle) is inevitably generated with the chemical vapor deposition processes of the inorganic film forming of CVD2, inoranic membrane is will lead to and goes out
The path now passed through for steam, causes OLED material to be oxidized, and influences the service life of OLED display device, so improving
It is aobvious that the WVTR (water vapor transmission rate, water vapor transmittance) of OLED encapsulating structure can extend OLED
Show the service life of device.The present invention is exactly the encapsulating structure by improving OLED display panel, is shown to reach extension OLED
The effect of device service life.
Summary of the invention
The present invention provides a kind of encapsulating structure, improves the WVTR of encapsulating structure, and enhancing OLED display panel obstructs outside water
The ability of oxygen, to solve existing encapsulating structure because OLED material is oxidized so that the reduced service life of OLED display device
Technical problem.
To solve the above problems, technical solution provided by the invention is as follows:
The present invention provides a kind of encapsulating structure, for coating OLED display layer, comprising:
Inorganic layer, organic layer, and at least one layer of auxiliary encapsulated layer, the auxiliary encapsulated layer are located at the inorganic layer and institute
It states between organic layer, the outermost layer and innermost layer of the encapsulating structure are all inorganic layer；
Wherein, oxygen-absorbing material and water-absorbent material are provided in the auxiliary encapsulated layer.
According to one preferred embodiment of the present invention, the auxiliary encapsulated layer is the film layer that thicknesses of layers is 1-5nm.
According to one preferred embodiment of the present invention, the main component of the oxygen-absorbing material is graphene, alkali metal, alkaline earth gold
One of category, molecular sieve or active metal are a variety of.
According to one preferred embodiment of the present invention, the main component of the water-absorbent material is metal oxide, the metal oxygen
Compound is potassium oxide, barium monoxide, one of calcium oxide, sodium oxide molybdena, lithia or a variety of.
According to one preferred embodiment of the present invention, the oxygen-absorbing material is nanoscale reproducibility powder, the water-absorbent material
For finely ground particle substance.
According to one preferred embodiment of the present invention, the auxiliary encapsulated layer includes drying layer and reduction zone, the drying layer position
Between the outermost inorganic layer and the organic layer, the reduction zone is located at the nothing of the organic layer and the innermost layer
Between machine layer.
According to one preferred embodiment of the present invention, the manufacturing method of the auxiliary encapsulated layer includes printing, spin coating, pad pasting, object
One of physical vapor deposition or chemical vapor deposition.
According to one preferred embodiment of the present invention, the auxiliary encapsulated layer is transparent material.
A kind of encapsulating structure, for coating OLED display layer characterized by comprising inorganic layer and organic layer, the envelope
The outermost layer and innermost layer of assembling structure are all inorganic layer；
Wherein, oxygen-absorbing material and water-absorbent material are provided in the organic layer.
Above-mentioned purpose according to the present invention proposes a kind of display device, including above encapsulating structure.
The invention has the benefit that compared to existing encapsulating structure and its display device, encapsulating structure of the invention
And its display device can improve the WVTR of encapsulating structure, increase by the way that oxygen-absorbing material and water-absorbent material is arranged in encapsulation film layer
Strong OLED display panel obstructs the ability of extraneous water oxygen, it is ensured that its better seal packaging effect, and then it is aobvious to extend OLED
Show the service life of panel；Existing encapsulating structure and its display device are solved because packaging effect is bad, in turn results in water oxygen
The technical issues of corroding, influencing display device service life.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is a kind of the schematic diagram of the section structure of encapsulating structure provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram of the section structure of another encapsulating structure provided in an embodiment of the present invention；
Description of symbols: 11- underlay substrate；12-OLED display layer；The first inorganic layer of 13-；14- organic layer；15-
Two inorganic layers；
21- underlay substrate；22-OLED display layer；The first inorganic layer of 23-；24- assists encapsulated layer (reduction zone)；25- is organic
Layer；26- assists encapsulated layer (drying layer)；The second inorganic layer of 27-.
Specific embodiment
The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the present invention
Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is with being given the same reference numerals in the figure.
The present invention is directed to existing encapsulating structure and its display device because packaging effect is bad, in turn results in water oxygen erosion,
The technical issues of influencing display device service life, the present embodiment is able to solve the defect.
As shown in Figure 1, a kind of application scenarios of encapsulating structure provided in an embodiment of the present invention, including underlay substrate 11,
OLED display layer 12 and the encapsulating structure, the encapsulating structure include the first inorganic layer 13, organic layer 14 and the second inorganic layer
15。
Wherein, the OLED display layer 12 is arranged on the underlay substrate 11, and the encapsulating structure is arranged in the lining
On substrate 11 and coat the OLED display layer 12, first inorganic layer 13, the organic layer 14 and described second inorganic
15 alternately laminated setting of layer, and first inorganic layer 13 and second inorganic layer 15 are located at the innermost layer of encapsulating structure
And outermost layer, the organic layer 14 are layered in 13 top of the first inorganic layer of the innermost layer.
The underlay substrate 11 can be used a variety of materials such as glass, plastics, silicon or metal and be formed, it is preferable that use
Glass is as underlay substrate；Al2O3 (aluminium oxide), MgO (oxygen can be used in first inorganic layer 13 and second inorganic layer 15
Change magnesium), TiO2 (titanium dioxide), ZrO2 (zirconium dioxide), SiO2 (silica), any material is made in SiNx, SiOxNy
For its film layer, its film layer can also be compounded to form using above-mentioned multiple material；Polyvinyl alcohol, poly- ammonia can be used in the organic layer 14
Ester, epoxy resin, acrylate, any material in organosilicon can also select above-mentioned multiple material multiple as its film layer
Conjunction forms its film layer；Preferably, first inorganic layer 13 selects SiON film layer, and second inorganic layer 15 selects SiNx film
Layer, the organic layer 14 select acrylic plastics.
Production method refers to the production method of organic layer 14, in the way of inkjet printing IJP, in Acrylic material
Mixing can be absorbed the material of water oxygen and is coated, and film layer keeps transparent, be provided in the organic layer 14 oxygen-absorbing material and
Water-absorbent material, the oxygen-absorbing material are that oxygen is gone out or limited oxygen molecule intrusion by the mode of chemical absorbing, and main component is graphite
One of alkene, alkali metal, alkaline-earth metal, molecular sieve or active metal are a variety of；The water-absorbent material is to utilize material itself
It is invaded with water reactive absorption steam or the sufficiently stable steam that can completely cut off itself, main component is metal oxide, the metal
Oxide is potassium oxide, barium monoxide, one of calcium oxide, sodium oxide molybdena, lithia or a variety of.Wherein, the water-absorbent material
Existing forms be finely ground particle substance, the oxygen-absorbing material existing forms be nanoscale reducing metal powder, be set to
The benefit of nanoscale reducing metal powder is that the water sucting surface product contacted with oxygen is increased when oxygen penetrates into；According to active gold
Belong to and be used as oxygen-absorbing material, when penetrating into a small amount of oxygen in encapsulating structure, active metal chemically reacts therewith, generates metal
Oxide can further be reacted with steam, and product property, which is stablized, helps to completely cut off water oxygen, and the active metal in the present embodiment is
Refer to the metal for being easy to react with oxygen, such as common are copper, iron, aluminium, the oxygen in the present embodiment includes oxygen molecule, oxygen atom
And oxygen, active metal can be chemically reacted with oxygen existing for any form, oxygen removed.
As shown in Fig. 2, the application scenarios of another kind encapsulating structure provided in an embodiment of the present invention, including underlay substrate 21,
OLED display layer 22 and the encapsulating structure, the encapsulating structure include the first inorganic layer 23, auxiliary encapsulated layer (reduction zone) 24,
Organic layer 25, auxiliary encapsulated layer (drying layer) 26 and the second inorganic layer 27.
Wherein, the OLED display layer 22 is arranged on the underlay substrate 21, and the encapsulating structure is arranged in the lining
On substrate 21 and the OLED display layer 22 is coated, first inorganic layer 23 and second inorganic layer 27 are located at envelope
The innermost layer and outermost layer of assembling structure, at least one layer auxiliary encapsulated layer is between the inorganic layer and the organic layer.
The underlay substrate 21 can be used a variety of materials such as glass, plastics, silicon or metal and be formed, it is preferable that use
Glass is as underlay substrate；Al2O3 (aluminium oxide), MgO (oxygen can be used in first inorganic layer 23 and second inorganic layer 25
Change magnesium), TiO2 (titanium dioxide), ZrO2 (zirconium dioxide), SiO2 (silica), any material is made in SiNx, SiOxNy
For its film layer, its film layer can also be compounded to form using above-mentioned multiple material；Polyvinyl alcohol, poly- ammonia can be used in the organic layer 25
Ester, epoxy resin, acrylate, any material in organosilicon can also select above-mentioned multiple material multiple as its film layer
Conjunction forms its film layer；Preferably, first inorganic layer 23 selects SiON film layer, and second inorganic layer 27 selects SiNx film
Layer, the organic layer 25 select acrylic plastics.
Preferably, the auxiliary encapsulated layer includes reduction zone 24 and drying layer 26, and the drying layer 26 is located at outermost
Between second inorganic layer 27 and the organic layer 25, it is provided with the water-absorbent material, the reduction zone 24 has positioned at described
Between machine layer 25 and first inorganic layer 23 of innermost layer, it is provided with the oxygen-absorbing material；The manufacture of the auxiliary encapsulated layer
Method includes one of printing, spin coating, pad pasting, physical vapour deposition (PVD) or chemical vapor deposition, and the auxiliary encapsulated layer is film
Thickness degree is the film layer of 1-5nm, and the auxiliary encapsulated layer keeps transparent；Oxygen-absorbing material, institute are provided in the reduction zone 24
It states and is provided with water-absorbent material in drying layer 26, the oxygen-absorbing material is that oxygen is gone out or limited oxygen molecule and invades by the mode of chemical absorbing
Enter, main component is one of graphene, alkali metal, alkaline-earth metal, molecular sieve or active metal or a variety of；The water-absorption material
Material is invaded using material itself and water reactive absorption steam or the sufficiently stable steam that can completely cut off itself, and main component is metal
Oxide, the metal oxide are potassium oxide, barium monoxide, one of calcium oxide, sodium oxide molybdena, lithia or a variety of.Wherein,
The existing forms of the water-absorbent material be finely ground particle substance, the oxygen-absorbing material existing forms be nanoscale reducing metal powder
End, the benefit for being set to nanoscale reducing metal powder are to increase the water sucting surface contacted with oxygen when oxygen penetrates into
Product；According to active metal as oxygen-absorbing material, when penetrating into a small amount of oxygen in encapsulating structure, active metal is changed therewith
Reaction is learned, metal oxide is generated, can further be reacted with steam, product property, which is stablized, to be helped to completely cut off water oxygen, this implementation
Active metal in example refers to the metal for being easy to react with oxygen, such as common are copper, iron, aluminium, the oxygen in the present embodiment
Including oxygen molecule, oxygen atom and oxygen, active metal can be chemically reacted with oxygen existing for any form, and oxygen is removed
It goes.
Working principle of the working principle of the display device of this preferred embodiment with the encapsulating structure of above preferred embodiment
Unanimously, the working principle for specifically referring to the encapsulating structure of above preferred embodiment, no longer repeats herein.
The invention has the benefit that compared to existing encapsulating structure and its display device, encapsulating structure of the invention
And its display device can improve the WVTR of encapsulating structure, increase by the way that oxygen-absorbing material and water-absorbent material is arranged in encapsulation film layer
Strong OLED display panel obstructs the ability of extraneous water oxygen, it is ensured that its better seal packaging effect, and then it is aobvious to extend OLED
Show the service life of panel；Existing encapsulating structure and its display device are solved because packaging effect is bad, in turn results in water oxygen
The technical issues of corroding, influencing display device service life.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of encapsulating structure, for coating OLED display layer characterized by comprising
Inorganic layer, organic layer, and at least one layer of auxiliary encapsulated layer, the auxiliary encapsulated layer are located at the inorganic layer and described have
Between machine layer, the outermost layer and innermost layer of the encapsulating structure are all inorganic layer；
Wherein, oxygen-absorbing material and water-absorbent material are provided in the auxiliary encapsulated layer.
2. encapsulating structure according to claim 1, which is characterized in that the auxiliary encapsulated layer is that thicknesses of layers is 1-5nm
Film layer.
3. encapsulating structure according to claim 1, which is characterized in that the main component of the oxygen-absorbing material be graphene,
The combination of one of alkali metal, alkaline-earth metal, molecular sieve or active metal or multiple material.
4. encapsulating structure according to claim 1, which is characterized in that the main component of the water-absorbent material is metal oxidation
Object, the metal oxide are potassium oxide, barium monoxide, one of calcium oxide, sodium oxide molybdena, lithia or a variety of.
5. encapsulating structure according to claim 1, which is characterized in that the oxygen-absorbing material is nanoscale reproducibility powder
Last, the described water-absorbent material is finely ground particle substance.
6. encapsulating structure according to claim 1, which is characterized in that the auxiliary encapsulated layer includes drying layer and reduction
Layer, the drying layer is provided with the water-absorbent material between the outermost inorganic layer and the organic layer, described to go back
Former layer is provided with the oxygen-absorbing material between the organic layer and the inorganic layer of the innermost layer.
7. encapsulating structure according to claim 1, which is characterized in that the manufacturing method of the auxiliary encapsulated layer includes print
One of brush, spin coating, pad pasting, physical vapour deposition (PVD) or chemical vapor deposition.
8. encapsulating structure according to claim 1, which is characterized in that the auxiliary encapsulated layer is transparent material.
9. a kind of encapsulating structure, for coating OLED display layer characterized by comprising inorganic layer and organic layer, the encapsulation
The outermost layer and innermost layer of structure are all inorganic layer；
Wherein, oxygen-absorbing material and water-absorbent material are provided in the organic layer.
10. a kind of display device, which is characterized in that including underlay substrate, OLED display layer and as claim 1-9 is any one
Encapsulating structure described in.
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Cited By (4)
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| CN110620189A (en) * | 2019-09-26 | 2019-12-27 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and display device |
| CN113097421A (en) * | 2021-04-14 | 2021-07-09 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| WO2022001478A1 (en) * | 2020-07-03 | 2022-01-06 | 昆山国显光电有限公司 | Display panel and manufacturing method therefor |
| CN114267809A (en) * | 2021-12-15 | 2022-04-01 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
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Application publication date: 20190618 |